Wafer wire bonding jig and wire bonding machine equipment

Abstract

The utility model provides a wafer wire bonding jig and wire bonding machine equipment. The wafer wire bonding jig comprises a bearing platform, a vacuum channel device and a vacuum control device. The bearing platform comprises a top surface and a bottom surface which are oppositely arranged, the bearing platform has a thickness between the top surface and the bottom surface, the bearing platform is provided with a plurality of vacuum holes, and the vacuum holes extend into the bearing platform from the top surface along the thickness direction. The vacuum channel device comprises a plurality of vacuum channels, the vacuum channels are arranged between the top face and the bottom face of the bearing platform and extend in a plane perpendicular to the thickness, and each vacuum channel is communicated with the vacuum holes. The vacuum control device comprises a plurality of vacuum controllers which are connected with the vacuum channels in a one-to-one correspondence mode. When the vacuum control device is started, negative pressure can be formed at the vacuum hole of the bearing platform, and a product is firmly adsorbed. Through independent control of a plurality of vacuum controllers, the universality of the wafer wire bonding jig to various different wafer products is realized.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, specifically to a wafer bonding fixture and bonding machine. Background Technology

[0002] Traditional wire bonding products, including leadframes and COB products, are typically designed with production efficiency and ease of assembly in mind, thus limiting their overall width to under 100mm. This dimensional constraint facilitates efficient and stable bonding operations on existing automated production lines, while also simplifying subsequent assembly and testing processes. This standardized design not only optimizes the production process but also reduces production costs and improves overall production efficiency.

[0003] However, with the rapid development of technology and the continuous changes in market demand, we face new challenges due to the ever-expanding range of product sizes. The size of individual products has gradually evolved from the traditional 50*50mm to 120*160mm and even larger. These large-sized, non-standard shaped products pose a severe challenge to traditional wire bonding operations. Traditional wire bonding fixtures are often designed based on fixed dimensions and layouts, making it difficult to flexibly adapt to diverse product needs. Faced with these large-sized, non-standard shaped products, traditional fixtures are inadequate, not only inefficient but also prone to errors during operation due to size mismatches or inaccurate positioning, thus affecting product yield and reliability. This not only limits product design innovation but also brings enormous pressure and challenges to the company's production operations. Utility Model Content

[0004] In view of the problems existing in the prior art described above, this application provides a wafer wire bonding fixture and a wire bonding machine. It has high flexibility and versatility, can adapt to products of different sizes and shapes, and not only greatly improves production efficiency but also significantly enhances product quality, thus winning more market opportunities and competitive advantages for enterprises.

[0005] To achieve the above and other related objectives, this utility model provides a wafer bonding fixture, comprising:

[0006] The support platform includes a top surface and a bottom surface that are arranged opposite to each other. The support platform has a thickness between the top surface and the bottom surface. The support platform is provided with a plurality of vacuum holes, which extend from the top surface along the thickness direction into the interior of the support platform.

[0007] The vacuum channel device includes multiple vacuum channels, which are disposed between the top and bottom surfaces of the support platform and extend in a plane perpendicular to the thickness. Each vacuum channel connects to multiple vacuum holes.

[0008] The vacuum control device includes multiple vacuum controllers, each of which is connected to a corresponding vacuum channel.

[0009] Optionally, the vacuum channel device further includes: connecting pipes connecting the vacuum controller and the vacuum channel, with multiple connecting pipes corresponding to multiple vacuum controllers and multiple vacuum channels.

[0010] Optionally, the vacuum channel device further includes: multiple air pipe connectors, one end of which is connected to the vacuum channel and the other end is connected to a connecting pipe.

[0011] Optionally, each vacuum channel is connected end to end to form a closed loop channel. The vacuum channel is equipped with an outlet interface, which is connected to a gas pipe connector.

[0012] Optionally, the bottom surface of the support platform is provided with a groove, the depth of which is less than the minimum distance between the vacuum channel and the bottom surface.

[0013] Optionally, the width of the support platform is between 100mm and 160mm.

[0014] Optionally, the vacuum hole is a circular hole with a diameter between 20 μm and 100 μm.

[0015] Optionally, the wafer bonding fixture may also include: mounting components disposed on the bottom surface of the support platform.

[0016] Optionally, the spacing between any two adjacent vacuum holes is between 3 mm and 20 mm.

[0017] Another aspect of this utility model provides a wire bonding machine, which includes a wire bonding fixture, including the wafer wire bonding fixture described above.

[0018] As described above, the wafer bonding fixture and bonding machine provided by this utility model have at least the following beneficial technical effects:

[0019] This invention relates to a wafer bonding fixture comprising a support platform, a vacuum channel device, and a vacuum control device. The support platform includes a top surface and a bottom surface arranged opposite each other, with a thickness between the top and bottom surfaces. The support platform has multiple vacuum holes extending from the top surface along the thickness direction into the interior of the support platform. The vacuum channel device includes multiple vacuum channels disposed between the top and bottom surfaces of the support platform and extending in a plane perpendicular to the thickness. Each vacuum channel connects to multiple vacuum holes. The vacuum control device includes multiple vacuum controllers, each connected to a corresponding vacuum channel. Thus, when the vacuum control device is activated, air can be extracted through the vacuum channels, vents, and vacuum holes, creating a negative pressure at the vacuum holes of the support platform, firmly adhering to the product. Through the coordinated operation of the support platform, vacuum channel device, and vacuum control device, this wafer bonding fixture effectively fixes wafer products, improving the accuracy and efficiency of the bonding operation. By using multiple vacuum controllers for independent control, the wafer bonding fixture of this application is applicable to a variety of wafer products that require precise bonding operations, thus achieving versatility for multiple different wafer products. Attached Figure Description

[0020] Figure 1 The image shown is a top view of a wafer bonding fixture according to an optional embodiment of this utility model.

[0021] Figure 2 This utility model is shown. Figure 1 A cross-sectional view of the support platform of the provided wafer bonding fixture.

[0022] Figure 3 The image shown is a top view of a wafer bonding fixture according to another optional embodiment of this utility model.

[0023] Figure 4 The image shown is a top view of a wafer wire bonding fixture, which is another optional embodiment provided in Embodiment 1 of this utility model.

[0024] Figure Labels

[0025] 1. Supporting platform; 11. Vacuum hole; 12. Top surface; 13. Bottom surface; 131. Groove; 14. Front; 15. Rear; 16. Thickness; 2. Vacuum channel device; 21. Vacuum channel; 211. Vent hole; 212. Outlet interface; 22. Connecting pipe; 23. Gas pipe connector; 3. Vacuum control device; 31. Vacuum controller; 4. Mounting components. Detailed Implementation

[0026] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0027] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Although the illustrations only show components related to this utility model and are not drawn according to the actual number, shape and size of the components, the shape, quantity, positional relationship and proportion of each component can be arbitrarily changed under the premise of realizing the technical solution of this utility model, and the layout of the components may also be more complex.

[0028] For leadframe and COB products, designers often prioritize improving production efficiency and ease of assembly. Therefore, the overall width of these products is generally limited to 100 mm or less. This size constraint ensures that the product can smoothly and stably complete the bonding process on existing automated production lines, while also simplifying subsequent assembly and testing. This standardized design approach not only optimizes the entire production process but also effectively reduces production costs and significantly improves production efficiency.

[0029] However, with the rapid development of technology and the continuous evolution of market demands, we are facing a new challenge: the ever-expanding range of product sizes. Traditional wire bonding fixtures, often designed based on fixed dimensions and layouts, struggle to flexibly adapt to diverse product requirements. Faced with these large-sized, varied-shaped products, traditional fixtures prove inadequate, not only inefficient but also prone to errors during operation due to size mismatches or positioning inaccuracies, thus negatively impacting product yield and reliability.

[0030] To address the above problems, this application provides a wafer bonding fixture and bonding machine, achieving versatility for multiple different wafer products. A detailed description is now provided with reference to the following embodiments and accompanying drawings.

[0031] Example 1

[0032] This embodiment provides a wafer bonding fixture, such as Figure 1 As shown, the wafer bonding fixture in this embodiment includes a support platform 1, a vacuum channel device 2, and a vacuum control device 3.

[0033] Specifically, refer to Figure 1 and Figure 2The support platform 1 includes a top surface 12 and a bottom surface 13 arranged opposite to each other, as well as a front surface 14 and a rear surface 15 arranged opposite to each other. To facilitate the placement and support of the wafer product to be operated, the flatness of both the top surface 12 and the bottom surface 13 should be less than 50 micrometers. For ease of understanding, the following explanation of flatness less than 50 micrometers will be given using the top surface 12 as an example. Several points are randomly selected on the top surface 12, and the height values ​​of these points are measured. The maximum value is subtracted from the minimum value; the difference should be within 50 micrometers.

[0034] like Figure 1 and Figure 2 As shown, the width of the support platform 1 is between 100mm and 160mm. This size range makes the wafer bonding fixture of this application suitable for handling wafer products with a width or diameter between 100mm and 160mm. The wafer bonding fixture of this application is also suitable for standard-sized wafer products without back-side components, wafer products without back-side components, and unpackaged wafer products. Further, the width of the support platform 1 is between 1200mm and 160mm. In this embodiment, the width of the support platform 1 is 150mm and the length is 200mm. (Refer to...) Figure 2 A thickness 16 is provided between the top surface 12 and the bottom surface 13, the thickness 16 being between 6mm and 13mm, and more specifically, between 10mm and 13mm. In this embodiment, the thickness 16 is 12mm. This thickness not only provides sufficient structural strength to ensure the stability and durability of the supporting platform 1, but also allows sufficient space between the top surface 12 and the bottom surface 13 for subsequent installation.

[0035] Reference Figure 1 and Figure 2 The support platform 1 is provided with multiple vacuum holes 11, which extend from the top surface 12 along the thickness 16 into the interior of the support platform 1. In this embodiment, for example, the vacuum holes 11 are circular holes with a diameter between 20 μm and 100 μm. This range provides sufficient adsorption force while avoiding clogging due to holes that are too small or insufficient adsorption force due to holes that are too large. The shape of the vacuum holes 11 is not limited here; for example, the vacuum holes 11 can also be square holes or other shapes. The distance between any two adjacent vacuum holes 11 is between 3 mm and 20 mm. This distance is chosen to ensure a uniform distribution of adsorption force on the support platform 1 while avoiding a decrease in adsorption force due to the interaction between the vacuum holes 11. An appropriate hole spacing can also improve the overall strength and stability of the support platform 1.

[0036] like Figure 1 and Figure 2As shown, the vacuum channel device 2 includes multiple vacuum channels 21, which are disposed between the top surface 12 and the bottom surface 13 of the support platform 1 and extend in a plane perpendicular to the thickness 16. Each vacuum channel 21 connects to multiple vacuum holes 11. In an optional embodiment of this example, for example... Figure 1 As shown, the vacuum channel device 2 includes five vacuum channels 21, which are evenly arranged side-by-side between the top surface 12 and the bottom surface 13, and are positioned perpendicular to the front surface 14. Each vacuum channel 21 is connected end-to-end to form a closed loop, ensuring a uniform distribution of vacuum suction. In another optional embodiment of this invention, for example... Figure 3 As shown, the vacuum channel device 2 also includes five vacuum channels 21, which are evenly arranged side by side between the top surface 12 and the bottom surface 13. The vacuum channels 21 are arranged in a direction perpendicular to the front surface 14, and each vacuum channel 21 is connected end to end to form a closed loop channel. In another optional embodiment of this embodiment, for example... Figure 4 As shown, ten vacuum channels 21 are evenly arranged between the top surface 12 and the bottom surface 13, and the vacuum channels 21 are arranged in a direction perpendicular to the front surface 14. In another optional embodiment of this example, ten vacuum channels 21 are evenly arranged between the top surface 12 and the bottom surface 13, and the vacuum channels 21 are arranged in a direction parallel to the front surface 14. Of course, the number, specific connection method, and arrangement of the vacuum channels 21 are not limited to this. As long as multiple vacuum channels 21 are arranged between the top surface 12 and the bottom surface 13 of the support platform 1 and extend in any plane perpendicular to the thickness 16, and each of the multiple vacuum channels 21 connects to multiple vacuum holes 11, this embodiment does not limit the specific connection method and arrangement of the vacuum channels 21.

[0037] The vacuum channel 21 is equipped with an outlet interface 212. This design allows the vacuum channel device 2 to smoothly expel the gas or air generated during the adsorption process, thereby maintaining a continuous negative pressure state inside the vacuum channel 21, which is key to achieving efficient adsorption. The vacuum channel 21 is equipped with vent holes 211 that correspond one-to-one with the vacuum holes 11. This precise correspondence ensures that when the product to be wired is placed on the support platform 1, each position that needs to be fixed receives precise vacuum suction support, greatly improving the stability and reliability of adsorption.

[0038] Reference Figures 1 to 4The vacuum controller 31 plays a crucial role in the vacuum channel device, controlling the opening and closing of the vacuum channel 21 to precisely adjust the negative pressure. To achieve more refined vacuum control, the vacuum control device 3 includes multiple vacuum controllers 31, each connected to a corresponding vacuum channel 21. The number of vacuum controllers 31 matches the number of vacuum channels 21. Each vacuum controller 31 has an independent electronic switch, and each vacuum controller 31 has a suction force exceeding 500 Pa. Each vacuum controller 31 operates independently via its own electronic switch. This design not only facilitates management and maintenance but also provides greater flexibility and adaptability. For example, if the product requiring bonding is small, with its lower surface area smaller than the upper surface area of ​​three vacuum channels 21 but larger than the upper surface area of ​​two vacuum channels 21, then only three vacuum channels 21 need to be opened by the vacuum controller 31 to adsorb the product, saving energy and simplifying later maintenance. In addition, each vacuum controller 31 has a vacuum suction force of over 500Pa. This powerful suction force is sufficient to firmly hold various products that need to be wired, whether they are thin and light small parts or heavy large components, ensuring stability and safety during the processing.

[0039] Vacuum controller 31 controls the opening and closing of vacuum channel 21, thereby adjusting the negative pressure. By adjusting vacuum controller 31, operators can quickly respond to actual needs, optimize adsorption conditions, and improve production efficiency and product quality. Vacuum channel 21 serves as an airflow path, connecting the vacuum port 11 of the support platform 1 and the vacuum control device 3. (Refer to...) Figure 1 The vacuum channel device 2 also includes multiple connecting pipes 22 and air pipe connectors 23. The connecting pipes 22 connect the vacuum controller 31 and the vacuum channel 21, with each connecting pipe 22 corresponding to one of the vacuum controllers 31. This design ensures that each vacuum channel 21 can independently receive commands from the vacuum controller 31, achieving precise on / off control. Simultaneously, the selection of the connecting pipes 22 also considers durability and sealing to ensure no leakage or damage occurs during long-term use, thus maintaining the continuity and stability of negative pressure adsorption. One end of the air pipe connector 23 connects to the vacuum channel 21 via an outlet interface 212, and the other end connects to the connecting pipe 22, ensuring smooth airflow and sealing. The design of the air pipe connector 23 also considers ease of use and durability, allowing operators to easily install and replace it, while also withstanding certain pressure and wear to ensure long-term stable operation of the system.

[0040] like Figure 1 and Figure 2As shown, the design of the wafer bonding fixture not only considers product fixation and bonding operations but also its integration and application on the production line. Besides the core component, the carrier platform 1, the wafer bonding fixture also includes a mounting component 4 and a groove 131. The mounting component 4 and the groove 131 are located on the bottom surface 13 of the carrier platform 1. To ensure that the vacuum channel 21 does not affect the formation of the vacuum environment and does not penetrate the carrier platform 1, the depth of the groove 131 is less than the minimum distance between the vacuum channel 21 and the bottom surface 13. Through the mounting component 4 and the groove 131, the wafer bonding fixture can easily interface and be fixed with the host computer without additional adaptation or adjustment. At the same time, the design of the mounting component 4 and the groove 131 also fully considers the interfaces and installation standards of different host computers, enabling the wafer bonding fixture to be widely used in various production environments, enhancing its versatility and compatibility.

[0041] By coordinating the support platform 1, the vacuum channel device 2, and the vacuum control device 3, wafer products can be effectively fixed, improving the accuracy and efficiency of wire bonding operations. Through independent control by multiple vacuum controllers 31, the wafer wire bonding fixture of this application is applicable to a variety of wafer products requiring precise wire bonding operations, achieving versatility for multiple different wafer products.

[0042] Example 2

[0043] This embodiment provides a wire bonding machine, including the wafer wire bonding fixture of Embodiment 1, which also possesses the aforementioned technical effects. The wire bonding machine also includes a wire bonding device. After the wafer wire bonding fixture picks up the product to be wire bonded, the operator starts the wire bonding device to perform the wire bonding operation on the product.

[0044] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A wafer wire bonding tool, characterized in that, The application relates to a wafer wire-bonding device. The wafer wire-bonding device comprises a supporting platform, a vacuum channel device and a vacuum control device. The supporting platform comprises a top surface and a bottom surface arranged oppositely, and has a thickness between the top surface and the bottom surface. The supporting platform is provided with a plurality of vacuum holes extending from the top surface to the inside of the supporting platform along the thickness direction.

2. The wafer wire bonding tool according to claim 1, wherein, The vacuum channel device comprises a plurality of vacuum channels arranged between the top surface and the bottom surface of the supporting platform and extending in a plane perpendicular to the thickness.

3. The wafer wire bonding tool of claim 2, wherein, Each of the vacuum channels is connected with one of the vacuum holes.

4. The wafer wire bonding tool of claim 3, wherein, The vacuum control device comprises a plurality of vacuum controllers corresponding to the vacuum channels.

5. The wafer wire bonding tool of claim 1, wherein, The vacuum channel device further comprises a plurality of connecting pipes connecting the vacuum controllers and the vacuum channels.

6. The wafer wire bonding tool of claim 1, wherein, The vacuum channel device further comprises a plurality of air pipe joints, one end of each of the air pipe joints being connected with the vacuum channels and the other end being connected with the connecting pipes.

7. The wafer wire bonding tool of claim 1, wherein, Each of the vacuum channels is connected at the head and the tail to form a closed loop channel.

8. The wafer wire bonding tool of claim 1, wherein, The vacuum channels are provided with leading interfaces connected with the air pipe joints. The bottom surface of the supporting platform is provided with a groove, and the depth of the groove is less than the minimum distance between the vacuum channels and the bottom surface.

9. The wafer wire bonding tool of claim 1, wherein, The width of the supporting platform is between 100mm and 160mm.

10. A wire bonder apparatus, characterized by, The vacuum holes are circular holes, and the diameter of the vacuum holes is between 20um and 100um. The wafer wire-bonding device further comprises a mounting component arranged on the bottom surface of the supporting platform. The interval distance between any two adjacent vacuum holes is between 3mm and 20mm. The wafer wire-bonding device comprises a wire-bonding jig, and the wire-bonding jig comprises the wafer wire-bonding jig according to any one of claims 1 to 9.

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