Combination structure of carrying platform and ejector pin

Abstract

The utility model discloses a combined structure of a carrying platform and an ejector pin. The combined structure comprises a carrying platform structure and an ejector pin structure arranged below the carrying platform structure, the carrying table structure comprises a carrying table top and a ceramic heat insulation plate arranged below the carrying table top, and heat transfer holes are distributed in the ceramic heat insulation plate. The ejector pin structure comprises an ejector pin mounting piece and an ejector pin arranged on the ejector pin mounting piece; the ejector pin installation piece and the bearing table top do not coincide in the vertical direction. The temperature control difficulty is reduced, and meanwhile the influence of the ejector pin structure on the process temperature is relieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor equipment especially relates to a combination structure of carrier platform and thimble. BACKGROUND

[0002] In the semiconductor manufacturing process, the carrier platform and thimble structure need to cooperate with the wafer pick-up fork action to transfer the wafer from the wafer pick-up fork to the carrier platform. Then, the wafer on the carrier platform is heated by the heating equipment in the reaction chamber to ensure that the process temperature is reached, thereby realizing the wafer coating process.

[0003] Usually, heat transfer is completed through the carrier platform metal material bearing platform. However, in practical application, although the metal material bearing platform has excellent heat conduction performance, its high thermal conductivity leads to rapid temperature rise, which is not conducive to process temperature control and increases the difficulty of process control.

[0004] In addition, the thimble structure between the carrier platform and the heating equipment also cannot be ignored in terms of heat transfer and will affect the process temperature and overall process control. SUMMARY

[0005] The utility model provides a combination structure of carrier platform and thimble to reduce the temperature control difficulty and reduce the influence of thimble structure on process temperature.

[0006] In order to achieve the above purpose, the technical scheme of the utility model is:

[0007] A combination structure of carrier platform and thimble, comprising: a carrier platform structure and a thimble structure arranged below the carrier platform structure;

[0008] The carrier platform structure comprises a bearing platform and a ceramic heat insulation plate arranged below the bearing platform, and the ceramic heat insulation plate is provided with heat transfer holes;

[0009] The thimble structure comprises a thimble mounting part and a thimble arranged on the thimble mounting part;

[0010] The thimble mounting part and the bearing platform do not coincide in the vertical direction.

[0011] Further, the heat transfer holes on the ceramic heat insulation plate are distributed in a sieve shape.

[0012] Further, the thimble mounting part is provided with a receiving hole, and the inner diameter of the receiving hole is greater than the outer diameter of the bearing platform.

[0013] Further, it further comprises a thermocouple, and the probe of the thermocouple is arranged on the bearing platform.

[0014] Further, the ceramic support arm is arranged below the ceramic heat insulation plate, one end of the ceramic support arm is connected to the bearing table, and the other end of the ceramic support arm is connected to the transmission rod, the transmission rod is capable of being connected to the lifting structure, and the lead of the thermocouple is arranged in the ceramic support arm.

[0015] Further, the metal protection pipe is sleeved on the outer periphery of the lead of the thermocouple, and the metal protection pipe is grounded.

[0016] Further, the bottom of the bearing table is provided with a matching part, and the ceramic heat insulation plate is provided with a matching hole through which the matching part passes.

[0017] Further, the ceramic protection ring is sleeved on the matching part passing through the matching hole, and the ceramic protection ring, the matching part and the matching hole form a containing cavity containing the probe of the thermocouple.

[0018] Further, the ceramic support arm is arranged below the ceramic heat insulation plate, one end of the ceramic support arm is connected to the bearing table, and the other end of the ceramic support arm is connected to the transmission rod, the transmission rod is capable of being connected to the lifting structure, and the lead of the thermocouple is arranged in the ceramic support arm.

[0019] The fixing block can press the metal protection pipe on the pressing part.

[0020] Further, the fixed screw is provided, one end of the fixed screw is fixed on the matching part, the other end of the fixed screw passes through the through hole arranged on the ceramic support arm and the fixing block, and the fixed screw is sleeved with a first nut and a second nut.

[0021] The first nut is tightened, and the ceramic support arm can press the ceramic protection ring on the ceramic heat insulation plate.

[0022] The second nut is tightened, and the fixing block can press the metal protection pipe on the pressing part.

[0023] Further, one end of the metal protection pipe is provided with a semicircular pipe, the fixing block is provided with a semicircular pipe positioning groove and a wiring groove in communication with each other, the semicircular pipe positioning groove can accommodate the semicircular pipe, and the wiring groove can accommodate the lead of the thermocouple.

[0024] Beneficial effects: the combination structure of the bearing table and the ejector pin provided by the utility model, by configuring the ceramic heat insulation plate with the heat transfer hole below the bearing table, the heat radiation of the heating device no longer directly acts on the bearing table, but is blocked by the ceramic heat insulation plate, heat transfer is carried out through the heat transfer hole on the ceramic heat insulation plate, so that the temperature rising rate of the bearing table is slowed down while heat is transferred, and the difficulty of temperature control is reduced.

[0025] By making the needle mounting piece of the needle structure not coincide with the bearing table in the vertical direction, the shielding of the needle structure to the upper table structure is reduced, the interference of the needle structure to heat transfer is reduced, and the influence of the needle structure on the process temperature is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings described below are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0027] Figure 1 A structural schematic view of a combination structure of a table and a needle of the present application is shown in the figure.

[0028] Figure 2 A top view of a combination structure of a table and a needle of the present application is shown in the figure.

[0029] Figure 3 A structural view of a needle structure of a combination structure of a table and a needle of the present application is shown in the figure.

[0030] Figure 4 A structural schematic view of a table structure of a combination structure of a table and a needle of the present application is shown in the figure.

[0031] Figure 5 A side view of a table structure of a combination structure of a table and a needle of the present application is shown in the figure.

[0032] Figure 6 A top view of a table structure of a combination structure of a table and a needle of the present application is shown in the figure.

[0033] Figure 7 A Figure 6 A-A sectional view of the figure.

[0034] Figure 8 A Figure 7 An enlarged view of C of the figure.

[0035] Figure 9 A Figure 6 B-B sectional view of the figure.

[0036] Figure 10 A structural schematic view of a bearing table of a combination structure of a table and a needle of the present application is shown in the figure.

[0037] Figure 11 A structural schematic view of a ceramic heat insulation plate of a combination structure of a table and a needle of the present application is shown in the figure.

[0038] Figure 12 This is a schematic diagram of the main body of a ceramic support arm with a combined structure of a platform and an ejector pin disclosed in this utility model.

[0039] Figure 13 This is a schematic diagram of the structure of a metal protective tube with a combined structure of a platform and an ejector pin disclosed in this utility model.

[0040] Figure 14 This is a structural diagram of a fixing block for a combined structure of a platform and a pin disclosed in this utility model.

[0041] In the picture:

[0042] 1. Supporting platform; 101. Mating part; 102. Clamping part; 103. Ejector pin through hole;

[0043] 2. Ceramic heat insulation board; 201. Heat transfer hole; 202. Mating hole;

[0044] 3. Thermocouple;

[0045] 4. Ceramic support arm; 401. Positioning groove; 402. Main body; 403. Partition plate; 404. Stop pin;

[0046] 5. Metal protective pipe; 501 semi-circular pipe;

[0047] 6. Ceramic protective ring;

[0048] 7. Fix the screw;

[0049] 8. Fixing block; 801. Semi-circular tube positioning groove; 802. Cable routing groove;

[0050] 9. First nut;

[0051] 10. Second nut;

[0052] 11. Threshold;

[0053] 12. Ejector pin mounting component;

[0054] 13. Transmission rod. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0056] The embodiment provides a combination structure of a carrier and a pin, which comprises a carrier structure and a pin structure arranged below the carrier structure. Figure 1 and Figure 2 The carrier structure comprises a carrier platform and a ceramic heat insulation plate arranged below the carrier platform.

[0057] The carrier platform comprises a carrier platform and a ceramic heat insulation plate arranged below the carrier platform. Figures 4 to 6 The ceramic heat insulation plate is provided with heat transfer holes. Figure 11 The ceramic heat insulation plate is provided with heat transfer holes.

[0058] The pin structure comprises a pin mounting member and a pin arranged on the pin mounting member. Figure 3 The pin structure comprises a pin mounting member and a pin arranged on the pin mounting member.

[0059] The pin mounting member is not vertically overlapped with the carrier platform. Figure 2 The pin mounting member is not vertically overlapped with the carrier platform.

[0060] The combination structure of the carrier and the pin is characterized in that the ceramic heat insulation plate with the heat transfer holes is arranged below the carrier platform, so that the heat radiation of the heating device no longer directly acts on the carrier platform but is blocked by the ceramic heat insulation plate, and the heat is transferred through the heat transfer holes on the ceramic heat insulation plate, so that the temperature rising rate of the carrier platform is slowed down during the heat transfer, and the difficulty of temperature control is reduced.

[0061] The pin mounting member of the pin structure is not vertically overlapped with the carrier platform, so that the pin structure shields the upper carrier structure, the interference of the pin structure on the heat transfer is reduced, and the influence of the pin structure on the process temperature is reduced.

[0062] In specific embodiments, the heat transfer holes on the ceramic heat insulation plate are distributed in a sieve shape, and the ceramic heat insulation plate is provided with multiple circumferential rows of heat transfer holes from the center to the periphery, and small holes are arranged in the area where large holes cannot be arranged, so that each area of the ceramic heat insulation plate is provided with holes, and the heat transfer is ensured. Figure 11 In specific embodiments, the pin mounting member is provided with a receiving hole, and the inner diameter of the receiving hole is greater than the outer diameter of the carrier platform.

[0063] Figure 3 The shape of the pin mounting member is preferably a C shape or a ring shape, so that the receiving hole on the pin mounting member reduces the shielding of the heating device arranged below the reaction chamber.

[0064] The shape of the pin mounting member is preferably a C shape or a ring shape, so that the receiving hole on the pin mounting member reduces the shielding of the heating device arranged below the reaction chamber. The pin mounting member is a C shape, and the transmission rod is located at one end of the C shape to form a cantilever structure.

[0065] In specific embodiments, as shown in Figure 8 The thermocouple 3 has a probe arranged on the bearing platform 1.

[0066] In specific embodiments, as shown in Figure 5 The ceramic support arm 4 is arranged below the ceramic heat insulation plate 2, one end of the ceramic support arm 4 is connected to the bearing platform 1, and the other end of the ceramic support arm 4 is connected to the transmission rod 13 through a bolt, the transmission rod 13 can be connected to a lifting mechanism, and the lifting mechanism drives the bearing platform 1 to rise and fall through the transmission rod 13. The wire of the thermocouple 3 is arranged in the ceramic support arm 4 to avoid being exposed to the outside, and the wire passes through the hollow transmission rod 13 as shown in Figure 7 After that, it is connected to the measuring device to transmit the temperature signal.

[0067] In this embodiment, as shown in Figure 3 The transmission rod 13 is arranged at one end of the needle mounting member 12, so that the transmission rod 13 and the needle mounting member 12 form a cantilever structure, thereby reducing the space occupation and facilitating the layout of other components in the reaction chamber.

[0068] In specific embodiments, as shown in Figure 13 The metal protective tube 5 is arranged on the wire of the thermocouple 3, and the metal protective tube 5 is grounded through a ground wire.

[0069] The ceramic material can resist high temperature and corrosion, but cannot block the influence of radio frequency in the reaction chamber on the wire, and the radio frequency will seriously affect the service life of the wire, causing the thermocouple 3 to fail. The radio frequency is led out through the grounded metal protective tube 5 to avoid direct influence of the radio frequency on the wire.

[0070] In specific embodiments, as shown in Figure 10 The bottom of the bearing platform 1 is provided with a matching part 101, as shown in Figure 11 The ceramic heat insulation plate 2 is provided with a matching hole 202 through which the matching part 101 passes.

[0071] As shown in Figure 8 And Figure 9 The ceramic protective ring 6 is arranged on the matching part 101 passing through the matching hole 202, and the ceramic protective ring 6, the matching part 101 and the matching hole 202 form a containing cavity containing the probe of the thermocouple 3.

[0072] In specific embodiments, as shown in Figure 8 And Figure 9As shown, the ceramic support arm 4 is provided with a fixed block 8 inside, and the fixed block 8 is provided with a matching part 101 on one end, and the matching part 101 is provided with a pressing part 102 on the bottom. Figure 10 As shown, the ceramic support arm 4 is provided with a fixed block 8 inside, and the fixed block 8 is provided with a matching part 101 on one end, and the matching part 101 is provided with a pressing part 102 on the bottom. Figure 12 As shown, the ceramic support arm 4 is provided with a fixed block 8 inside, and the fixed block 8 is provided with a matching part 101 on one end, and the matching part 101 is provided with a pressing part 102 on the bottom.

[0073] The fixed block 8 can press the metal protective tube 5 on the pressing part 102.

[0074] In a specific embodiment, as shown, the ceramic support arm 4 is provided with a fixed block 8 inside, and the fixed block 8 is provided with a matching part 101 on one end, and the matching part 101 is provided with a pressing part 102 on the bottom. Figure 9 As shown, the ceramic support arm 4 is provided with a fixed block 8 inside, and the fixed block 8 is provided with a matching part 101 on one end, and the matching part 101 is provided with a pressing part 102 on the bottom.

[0075] Tighten the first nut 9, and the ceramic support arm 4 can press the ceramic protective ring 6 on the ceramic heat insulation plate 2.

[0076] Tighten the second nut 10, and the fixed block 8 can press the metal protective tube 5 on the pressing part 102.

[0077] In a specific embodiment, as shown, the ceramic support arm 4 is provided with a fixed block 8 inside, and the fixed block 8 is provided with a matching part 101 on one end, and the matching part 101 is provided with a pressing part 102 on the bottom. Figure 13 As shown, the ceramic support arm 4 is provided with a fixed block 8 inside, and the fixed block 8 is provided with a matching part 101 on one end, and the matching part 101 is provided with a pressing part 102 on the bottom. Figure 14 As shown, the ceramic support arm 4 is provided with a fixed block 8 inside, and the fixed block 8 is provided with a matching part 101 on one end, and the matching part 101 is provided with a pressing part 102 on the bottom.

[0078] In this embodiment, one end of the metal protective tube 5 provided with the semicircular tube 501 is pressed between the fixed block 8 and the pressing part 102, and the other end is inserted into the insertion hole provided on the transmission rod 13, so as to constrain the two ends of the metal protective tube 5 respectively.

[0079] In a specific embodiment, as shown, the ceramic support arm 4 is provided with a fixed block 8 inside, and the fixed block 8 is provided with a matching part 101 on one end, and the matching part 101 is provided with a pressing part 102 on the bottom. Figure 9 As shown, the ceramic support arm 4 is provided with a fixed block 8 inside, and the fixed block 8 is provided with a matching part 101 on one end, and the matching part 101 is provided with a pressing part 102 on the bottom.

[0080] The main body 402 and the partition plate 403 are both ceramic materials, the main body 402 and the partition plate 403 enclose a cavity for accommodating the fixed block 8, and the stop pin 404 passes through the pin hole provided on the main body 402 to block the partition plate 403 from separating from the main body 402, and the main body 402 and the partition plate 403 are manufactured separately to reduce the production difficulty.

[0081] In a specific embodiment, as shown, the ceramic support arm 4 is provided with a fixed block 8 inside, and the fixed block 8 is provided with a matching part 101 on one end, and the matching part 101 is provided with a pressing part 102 on the bottom. Figure 10As shown, the carrier mesa 1 is provided with a needle through hole 103 allowing the needle to pass through, and the ceramic heat insulation plate 2 is provided with a hole corresponding to the needle through hole 103, so that the needle 11 of the needle structure arranged below the carrier mesa structure can pass through the needle through hole 103, and the needle 11 can cooperate with the wafer fork action to transfer the wafer from the wafer fork to the carrier mesa 1 or from the carrier mesa 1 to the wafer fork.

[0082] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A combination of a carrier and a needle, characterized in that, The utility model relates to a kind of ceramic support arm and ceramic protection ring, ceramic support arm and ceramic protection ring are set in the ceramic support arm of ceramic protection ring, ceramic protection ring is set on the ceramic support arm, and the probe of thermocouple is set on the ceramic protection ring, the probe of thermocouple is protected by ceramic support arm and ceramic protection ring, and the probe of thermocouple is protected from the damage of external environment. The utility model relates to a kind of ceramic support arm and ceramic protection ring, ceramic support arm and ceramic protection ring are set in the ceramic support arm of ceramic protection ring, ceramic protection ring is set on the ceramic support arm, and the probe of thermocouple is set on the ceramic protection ring, the probe of thermocouple is protected by ceramic support arm and ceramic protection ring, and the probe of thermocouple is protected from the damage of external environment. The utility model relates to a kind of ceramic support arm and ceramic protection ring, ceramic support arm and ceramic protection ring are set in the ceramic support arm of ceramic protection ring, ceramic protection ring is set on the ceramic support arm, and the probe of thermocouple is set on the ceramic protection ring, the probe of thermocouple is protected by ceramic support arm and ceramic protection ring, and the probe of thermocouple is protected from the damage of external environment. The utility model relates to a kind of ceramic support arm and ceramic protection ring, ceramic support arm and ceramic protection ring are set in the ceramic support arm of ceramic protection ring, ceramic protection ring is set on the ceramic support arm, and the probe of thermocouple is set on the ceramic protection ring, the probe of thermocouple is protected by ceramic support arm and ceramic protection ring, and the probe of thermocouple is protected from the damage of external environment. The utility model relates to a kind of ceramic support arm and ceramic protection ring, ceramic support arm and ceramic protection ring are set in the ceramic support arm of ceramic protection ring, ceramic protection ring is set on the ceramic support arm, and the probe of thermocouple is set on the ceramic protection ring, the probe of thermocouple is protected by ceramic support arm and ceramic protection ring, and the probe of thermocouple is protected from the damage of external environment.

2. The carrier and stylus combination of claim 1, wherein, The utility model relates to a kind of ceramic support arm and ceramic protection ring, ceramic support arm and ceramic protection ring are set in the ceramic support arm of ceramic protection ring, ceramic protection ring is set on the ceramic support arm, and the probe of thermocouple is set on the ceramic protection ring, the probe of thermocouple is protected by ceramic support arm and ceramic protection ring, and the probe of thermocouple is protected from the damage of external environment.

3. The carrier and needle assembly of claim 1 wherein, The utility model relates to a kind of ceramic support arm and ceramic protection ring, ceramic support arm and ceramic protection ring are set in the ceramic support arm of ceramic protection ring, ceramic protection ring is set on the ceramic support arm, and the probe of thermocouple is set on the ceramic protection ring, the probe of thermocouple is protected by ceramic support arm and ceramic protection ring, and the probe of thermocouple is protected from the damage of external environment.

4. The carrier and needle assembly of claim 1 wherein, The utility model relates to a kind of ceramic support arm and ceramic protection ring, ceramic support arm and ceramic protection ring are set in the ceramic support arm of ceramic protection ring, ceramic protection ring is set on the ceramic support arm, and the probe of thermocouple is set on the ceramic protection ring, the probe of thermocouple is protected by ceramic support arm and ceramic protection ring, and the probe of thermocouple is protected from the damage of external environment.

5. The carrier and needle assembly of claim 4, wherein, The utility model relates to a kind of ceramic support arm and ceramic protection ring, ceramic support arm and ceramic protection ring are set in the ceramic support arm of ceramic protection ring, ceramic protection ring is set on the ceramic support arm, and the probe of thermocouple is set on the ceramic protection ring, the probe of thermocouple is protected by ceramic support arm and ceramic protection ring, and the probe of thermocouple is protected from the damage of external environment.

6. The carrier and peg assembly of claim 5, wherein, The utility model relates to a kind of ceramic support arm and ceramic protection ring, ceramic support arm and ceramic protection ring are set in the ceramic support arm of ceramic protection ring, ceramic protection ring is set on the ceramic support arm, and the probe of thermocouple is set on the ceramic protection ring, the probe of thermocouple is protected by ceramic support arm and ceramic protection ring, and the probe of thermocouple is protected from the damage of external environment.

7. The carrier and needle assembly of claim 6, wherein, The utility model relates to a kind of ceramic support arm and ceramic protection ring, ceramic support arm and ceramic protection ring are set in the ceramic support arm of ceramic protection ring, ceramic protection ring is set on the ceramic support arm, and the probe of thermocouple is set on the ceramic protection ring, the probe of thermocouple is protected by ceramic support arm and ceramic protection ring, and the probe of thermocouple is protected from the damage of external environment. ​ 8. The carrier and peg assembly of claim 7, wherein, ​ ​ 9. The carrier and needle assembly of claim 8, wherein, ​ ​ ​ 10. The carrier and peg assembly of claim 8, wherein, One end of the metal protection pipe (5) is provided with a semicircular pipe (501), the fixing block (8) is provided with a semicircular pipe positioning groove (801) and a wiring groove (802) which are communicated with each other, the semicircular pipe positioning groove (801) can accommodate the semicircular pipe (501), and the wiring groove (802) can accommodate the lead wire of the thermocouple (3).

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