Chip clamping device and chip cleaning water stain removing device

Abstract

The utility model belongs to the technical field of drying, and particularly relates to a chip clamping device and a chip cleaning water stain removing device, and the clamping device comprises a plurality of fixing mechanisms which are respectively arranged in corresponding drying boxes; the drying boxes are arranged on the support, and openings of the drying boxes face downwards. Each fixing mechanism comprises a clamping seat, and a bottom clamping piece is slidably connected to the interior of each clamping seat. And at least one pair of horizontal clamping pieces. Wherein the bottom clamping piece is suitable for moving downwards after the chips are placed on the corresponding clamping seats so as to drive the two horizontal clamping pieces to clamp the two sides of the chips, through the arrangement of the fixing mechanism, when an operator places a plurality of chips in the corresponding drying boxes, the chips are located on the clamping seats, the bottom clamping piece is triggered through the dead weight of the chips, and the chips are clamped by the two horizontal clamping pieces. And the two horizontal clamping pieces are driven to clamp the two sides of the chip, so that the phenomenon that the chip shakes and falls off and is damaged when airflow flows through the chip is avoided.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the drying technical field, and specifically relates to a chip clamping device and a water stain removal device for chip cleaning. BACKGROUND

[0002] During production and use, the surface of a semiconductor chip can be contaminated with various impurities, such as particles, organic matter, metal ions, etc. The presence of these impurities can affect the performance and reliability of the chip, so the chip needs to be cleaned.

[0003] The current more convenient way is to use a manual CDA (Clean Dry Air) air gun to blow off excess water stains to dry the chip quickly, but this operation is low in chip drying efficiency, and the impact of the CDA air gun is large, which can cause the chip to shake and fall off and be damaged during air flow drying.

[0004] Therefore, a chip clamping device and a water stain removal device for chip cleaning are designed to solve the technical problem of chip falling off and being damaged due to excessive air flow impact when removing water stains from the surface of the chip by blowing air.

[0005] It should be noted that the above information disclosed in the background section is only used to understand the background of the present application, and therefore, the above description is not considered to constitute prior art information. CONTENT OF THE UTILITY MODEL

[0006] The present disclosure provides at least a chip clamping device and a water stain removal device for chip cleaning.

[0007] In a first aspect, the present disclosure provides a chip clamping device, comprising:

[0008] A plurality of fixing mechanisms are arranged inside the corresponding drying boxes.

[0009] Each drying box is arranged on a support, and the opening of each drying box faces downward.

[0010] Each fixing mechanism comprises a clamping seat, and a bottom clamping piece is slidably connected inside the clamping seat.

[0011] At least one pair of horizontal clamping pieces.

[0012] The bottom clamping piece is adapted to move downward after the chip is prevented on the corresponding clamping seat, thereby driving the two horizontal clamping pieces to clamp the two sides of the chip.

[0013] In an optional embodiment, a groove is formed in the upper end surface of the bottom clamping piece to accommodate the bottom of the chip, and a vertical rebound cavity is formed in the inside of the bottom clamping piece.

[0014] The interior of the vertical rebound cavity is provided with a vertical rebound plate; wherein

[0015] The vertical rebound plate is provided with a vertical rebound piece, one end of which is connected with the vertical rebound plate and the other end is connected with the bottom clamping piece.

[0016] In an alternative embodiment, the interior of the clamping seat is horizontally slidingly connected with at least two trigger pieces, and the interior of each trigger piece is provided with a horizontal rebound cavity;

[0017] The two trigger pieces are located below the bottom clamping piece and are engaged with the bottom clamping piece, so that when the bottom clamping piece slides downward, the two trigger pieces move away from each other;

[0018] The horizontal rebound cavity is provided with a horizontal rebound plate; wherein

[0019] The horizontal rebound plate is provided with a horizontal rebound piece, one end of which is connected with the horizontal rebound plate and the other end is connected with the corresponding trigger piece.

[0020] In an alternative embodiment, the interior of the clamping seat is horizontally slidingly connected with at least two trigger pieces, and the interior of each trigger piece is provided with a horizontal rebound cavity;

[0021] Each sliding piece is slidingly connected with the corresponding horizontal clamping piece; wherein

[0022] Each horizontal clamping piece is configured to be pushed by the corresponding driven rod to abut each other when the corresponding trigger pieces move away from each other, thereby clamping the two side walls of the chip.

[0023] In an alternative embodiment, the interior of each drying box is provided with a sliding guide rod; wherein

[0024] Each sliding guide rod penetrates through the corresponding horizontal clamping piece to guide the sliding direction of the horizontal clamping piece.

[0025] In a second aspect, the embodiments of the present disclosure also provide a water stain removal device for chip cleaning, comprising:

[0026] A hollow plate, the interior of which is provided with an airflow channel; wherein

[0027] The airflow channel is connected with the interior of each drying box;

[0028] When external airflow flows into the air inlet end of the airflow channel and flows out of the air outlet end, negative pressure is generated in the interior of each drying box to remove the water stains on the surface of the chip located in the drying box; and

[0029] A chip clamping device, comprising:

[0030] a plurality of fixing mechanisms, respectively arranged in the interior of the corresponding drying box;

[0031] Each of the drying boxes is arranged on a support, and the opening of each of the drying boxes faces downward; wherein

[0032] Each of the fixing mechanisms comprises a clamping seat, and a bottom clamping piece is slidably connected in the interior of the clamping seat; and

[0033] at least one pair of horizontal clamping pieces; wherein

[0034] The bottom clamping piece is adapted to move downward after the chip is prevented on the corresponding clamping seat, thereby driving the two horizontal clamping pieces to clamp the two sides of the chip.

[0035] In an alternative embodiment, a groove is formed in the upper end surface of the bottom clamping piece to accommodate the bottom of the chip, and a vertical rebound cavity is formed in the interior of the bottom clamping piece;

[0036] A vertical rebound plate is arranged in the interior of the vertical rebound cavity; wherein

[0037] The vertical rebound plate is provided with a vertical rebound piece, one end of which is connected to the vertical rebound plate and the other end is connected to the bottom clamping piece.

[0038] In an alternative embodiment, at least two trigger pieces are horizontally slidably connected in the interior of the clamping seat, and a horizontal rebound cavity is formed in the interior of each of the trigger pieces;

[0039] The two trigger pieces are located below the bottom clamping piece and are engaged with the bottom clamping piece, thereby moving away from each other when the bottom clamping piece slides downward;

[0040] A horizontal rebound plate is arranged in the horizontal rebound cavity; wherein

[0041] The horizontal rebound plate is provided with a horizontal rebound piece, one end of which is connected to the horizontal rebound plate and the other end is connected to the corresponding trigger piece.

[0042] In an alternative embodiment, a driven rod is bearing-connected on one side of each of the trigger pieces in the interior of the clamping seat, and a sliding piece is hingedly connected to the driven rod; and

[0043] Each of the sliding pieces is slidably connected to the corresponding horizontal clamping piece; wherein

[0044] Each of the horizontal clamping pieces is configured to be pushed by the corresponding driven rod to abut each other when the corresponding trigger pieces move away from each other, thereby clamping the two side walls of the chip.

[0045] In an alternative embodiment, each of the drying boxes is internally provided with a sliding guide rod; wherein

[0046] Each sliding guide rod penetrates through the corresponding horizontal clamping piece to guide the sliding direction of the horizontal clamping piece.

[0047] The beneficial effects of the present application are that, when the operator places the chips in the corresponding drying boxes, the chips are located on the clamping seat, the bottom clamping piece is triggered by the self-weight of the chip, and then the two horizontal clamping pieces clamp the two sides of the chip, so as to avoid the chip from shaking and falling off and being damaged when the airflow flows through.

[0048] Other features and advantages of the present application will be described in the following description, and some of them will become apparent from the description, or will be understood from the practice of the present application. The purposes and other advantages of the present application are achieved and obtained by the structures specifically pointed out in the specification, claims and drawings.

[0049] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0050] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed in the specific embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0051] Figure 1 The overall perspective view provided by the embodiment of the present disclosure;

[0052] Figure 2 The overall cross-sectional structure schematic view provided by the embodiment of the present disclosure;

[0053] Figure 3 The overall perspective view of the chip clamping device provided by the embodiment of the present disclosure;

[0054] Figure 4 The cross-sectional structure schematic view of the chip clamping device provided by the embodiment of the present disclosure.

[0055] In the drawings:

[0056] 1, hollow board; 10, airflow channel; 11, air inlet end; 12, air outlet end;

[0057] 2, fixing mechanism; 20, drying box; 21, chip placing port; 22, clamping seat; 221, horizontal rebounding plate; 220, vertical rebounding plate; 23, bottom clamping piece; 230, vertical rebounding cavity; 231, vertical rebounding piece; 24, horizontal clamping piece; 25, sliding piece; 26, triggering piece; 260, horizontal rebounding cavity; 261, horizontal rebounding piece; 27, driven rod; 28, sliding guide rod. DETAILED DESCRIPTION

[0058] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0059] In this document, when a first component is referred to as being "on" a second component, it can be directly on the second component or intervening components can be present. In addition, in the drawings, the thickness of components can be exaggerated or reduced for effective description.

[0060] In this document, when an element or layer is referred to as being "on", "engaged to", "connected to", "attached to", or "coupled to" another element or layer, it can be directly on, engaged, connected, attached, or coupled to the other element or layer, or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on", "directly engaged to", "directly connected to", "directly attached to", or "directly coupled to" another element or layer, there are no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., "between" versus "directly between", "adjacent" versus "directly adjacent", etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0061] In this document, example embodiments of the disclosure will be described in greater detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of", when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list. For example, the expression "at least one of a, b, and c" should be understood as including only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0062] The terminology used herein is for the purpose of describing particular example configurations only and is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" can be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having," are inclusive and therefore specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order

[0063] As used herein, the phrases "in an embodiment," "according to an embodiment," "in some embodiments," and the like generally mean the particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of the present disclosure. Thus, appearances of such phrases in various places throughout this specification do not necessarily all refer to the same embodiment. As used herein, the terms "for example," "e.g.," and the like indicate that the named item is one of a possible plurality of alternatives. As used herein, the term "example" and the like are utilized to merely indicate an example of the item being described, and not a preference or a requirement. Thus, the use of such terms is not intended to foreclose others aspects or examples that are otherwise

[0064] It is found through research that the current more convenient way is to use a manual CDA air gun to blow off excess water stains to quickly remove water stains from the chip for drying, however, this operation is low in efficiency for drying a large number of chips, and the impact of the CDA air gun is large, and the chip will produce a large swing during the air flow drying process and cause damage.

[0065] Based on the above research, the chip clamping device and the water stain removal device for chip cleaning provided by the embodiments of the present disclosure are provided. When the operator places a plurality of chips in the corresponding drying box, the chip is located on the clamping seat, the bottom clamping piece is triggered by the self-weight of the chip, and then the two horizontal clamping pieces clamp the two sides of the chip, so as to avoid the chip from being shaken and damaged due to the airflow.

[0066] The defects of the above solutions are the results of the inventors after practice and careful research, therefore, the discovery process of the above problems and the solutions proposed by the present disclosure to the above problems in this paper should be the contribution of the inventors to the present disclosure in the process of the present disclosure.

[0067] It should be noted that like reference numerals and letters refer to like items throughout the several views, and once an item is defined in one view, it should not require further defining and explaining in the subsequent views.

[0068] Some embodiments of the present application will be described in detail with reference to the drawings below. The following embodiments and features of the embodiments can be combined with each other in the case of no conflict.

[0069] In some embodiments, as shown in Figure 1 The openings of the drying boxes 20 are directed towards the airflow channel 10 formed on the hollow plate 1, and the flowing air for drying is introduced from one end of the airflow channel 10 and flows out from the other end. When the airflow passes through the lower ports of the drying boxes 20, negative pressure is generated in the interiors of the drying boxes 20, and air flow is generated in the interiors of the drying boxes 20 to dry the chips 3 in the interiors of the drying boxes 20.

[0070] To ensure that the flowing air can generate a large enough pressure difference in the interiors of the drying boxes 20, a vacuum suction device is preferably arranged at one end of the hollow plate 1. The vacuum suction device is used to generate a large enough pressure difference in the interiors of the drying boxes 20 by performing vacuum suction on the interiors of the hollow plate 1, so as to suck the water droplets on the surfaces of the chips 3 in the interiors of the drying boxes 20.

[0071] In some embodiments, as shown in Figure 2 The top of each drying box 20 is provided with a chip placing opening 21. When the chip 3 is placed on the clamping seat 22 in the interior of the drying box 20, the chip placing opening 21 is closed, the airflow flows into the airflow channel 10 from the air inlet end 11 and flows out from the air outlet end 12, and the chip 3 in the interior of the drying box 20 is dried.

[0072] In some embodiments, as shown in Figure 3 When the chip 3 is placed on the clamping seat 22, the chip 3 is first clamped with the bottom clamping piece 23 arranged on the upper end face of the clamping seat 22, and then the chip 3 slides downward on the clamping seat 22 by relying on the self-weight to trigger the horizontal clamping pieces 24 on both sides to clamp the two end faces of the chip 3.

[0073] In some embodiments, as shown in Figure 4As shown, when the chip 3 is engaged with the bottom clamping piece 23, the bottom clamping piece 23 is slid down in the clamping seat 22, at this time the vertical elastic member 231 is compressed, as shown, the two trigger members 26 are engaged with the bottom clamping piece 23, at this time the two trigger members 26 are pushed to slide away in the inside of the clamping seat 22, and synchronously, the horizontal elastic member 261 is compressed, when the two trigger members 26 move away, the driven rod 27 connected with the bearing of the clamping seat 22 is pushed to deflect around the bearing connection with the clamping seat 22, and then drives the sliding member 25 connected with the bearing on the driven rod 27 to deflect, since the sliding member 25 is slidably connected with the horizontal clamping piece 24, at this time, with the deflection of the driven rod 27, the sliding member 25 slides down on the horizontal clamping piece 24, and pushes the two horizontal clamping pieces 24 to move relative to each other, until the two horizontal clamping pieces 24 clamp the two sides of the chip 3, in order to ensure the moving direction of the two horizontal clamping pieces 24, at least one sliding guide rod 28 is fixed in the inside of the drying box 20, the sliding guide rod 28 passes through the two horizontal clamping pieces 24, and then the moving direction of the horizontal clamping piece 24 can be limited.

[0074] When the water stains on the surface of the chip 3 are removed, the operator only needs to open the chip placing opening 21, when the upper end face of the chip 3 is no longer limited by the opening and closing plate at the chip placing opening 21, the vertical elastic member 231 rebounds, and then the horizontal elastic member 261 also rebounds, so that the whole component is reset, as an optimization, the vertical elastic member 231 and the horizontal elastic member 261 all include but are not limited to springs.

[0075] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, can be fixedly connected, or can be detachably connected, or integrally connected, can be mechanically connected, or can be electrically connected, can be directly connected, or indirectly connected through an intermediate medium, can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0076] In the description of the utility model, it is necessary to explain, the term "center", "upper", "lower", "left", "right", "vertical", "horizontal", "internal", "external" and so on indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawing, only for the convenience of describing the utility model and simplifying the description, and not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the utility model. In addition, terms such as "first", "second" and other numerical terms are used in this text, and do not imply order or sequence unless the text is explicitly indicated. Therefore, the above-discussed first element, component, area, layer or section can be referred to as the second element, component, area, layer or section without departing from the teachings of the example embodiments.

[0077] Spatially relative terms, such as "internal", "external", "lower", "under", "bottom", "top", "above", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms can be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0078] In the above discussion, unless otherwise stated, the terms "about", "approximately", "substantially" and the like, when used in describing a numerical value, mean a variation of + / - 10% of the value.

[0079] With the above ideal embodiments according to the utility model as the inspiration, through the above description, relevant staff can definitely make various changes and modifications without deviating from the technical thought of the utility model. The technical scope of the utility model is not limited to the content in the specification, and the technical scope must be determined according to the scope of claims.

Claims

1. A chip clamping device, characterized by The chip clamping device comprises a plurality of fixing mechanisms (2) respectively arranged in the interiors of corresponding drying boxes (20); each of the drying boxes (20) is arranged on a support, and the opening of each of the drying boxes (20) faces downward; each of the fixing mechanisms (2) comprises a clamping seat (22), and a bottom clamping piece (23) is slidably connected to the interior of the clamping seat (22); and at least one pair of horizontal clamping pieces (24) are arranged; wherein the bottom clamping piece (23) is adapted to prevent the chip (3) from moving downward after being clamped on the corresponding clamping seat (22), thereby driving the two horizontal clamping pieces (24) to clamp the two sides of the chip (3).

2. The chip clamping device according to claim 1, wherein an upper end surface of the bottom clamping piece (23) is provided with a groove for accommodating the bottom of the chip (3), and a vertical rebound cavity (230) is arranged in the interior of the bottom clamping piece (23); a vertical rebound plate (220) is arranged in the interior of the vertical rebound cavity (230); wherein a vertical rebound piece (231) is arranged on the vertical rebound plate (220), one end of the vertical rebound piece (231) is connected to the vertical rebound plate (220), and the other end is connected to the bottom clamping piece (23).

3. The chip clamping device according to claim 2, wherein at least two trigger pieces (26) are horizontally slidably connected to the interior of the clamping seat (22), and a horizontal rebound cavity (260) is arranged in the interior of each of the trigger pieces (26); the two trigger pieces (26) are located below the bottom clamping piece (23) and are fitted with the bottom clamping piece (23), thereby moving away from each other when the bottom clamping piece (23) slides downward; a horizontal rebound plate (221) is arranged in the horizontal rebound cavity (260); wherein a horizontal rebound piece (261) is arranged on the horizontal rebound plate (221), one end of the horizontal rebound piece (261) is connected to the horizontal rebound plate (221), and the other end is connected to the corresponding trigger piece (26).

4. The chip clamping device according to claim 3, wherein a driven rod (27) is bearing-connected to one side of each of the trigger pieces (26) in the interior of the clamping seat (22), and a sliding piece (25) is hingedly connected to the driven rod (27); and each of the sliding pieces (25) is slidably connected to the corresponding horizontal clamping piece (24); wherein each of the horizontal clamping pieces (24) is configured to be pushed by the corresponding driven rod (27) to abut each other when the corresponding trigger pieces (26) move away from each other, thereby clamping the two side walls of the chip (3).

5. The chip clamping device according to claim 4, wherein a sliding guide rod (28) is arranged in the interior of each of the drying boxes (20); and each of the sliding guide rods (28) penetrates through the corresponding horizontal clamping piece (24) to guide the sliding direction of the horizontal clamping piece (24). The hollow plate (1) is provided with an airflow channel (10) in the interior thereof; wherein the airflow channel (10) is connected with the interiors of the drying boxes (20). ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 6. A water mark removing device for chip cleaning, characterized by, ​ ​ ​ ​ When the external airflow flows into the air inlet end (11) of the airflow channel (10) and flows out of the air outlet end (12), a negative pressure is generated in the interior of each drying box (20) to remove the water stains on the surface of the chip located in the drying box (20); And The chip clamping device comprises: A plurality of fixing mechanisms (2) are respectively arranged in the interior of the corresponding drying box (20); Each drying box (20) is arranged on a support, and the opening of each drying box (20) faces downward; wherein Each fixing mechanism (2) comprises a clamping seat (22), and a bottom clamping piece (23) is slidably connected in the interior of the clamping seat (22); and At least one pair of horizontal clamping pieces (24); wherein The bottom clamping piece (23) is adapted to prevent the chip (3) from moving downward after being clamped on the corresponding clamping seat (22), thereby driving the two horizontal clamping pieces (24) to clamp the two sides of the chip (3).

7. The water stain removal device for chip cleaning according to claim 6, wherein A groove is formed in the upper end surface of the bottom clamping piece (23) to accommodate the bottom of the chip (3), and a vertical rebound cavity (230) is formed in the interior of the bottom clamping piece (23); A vertical rebound plate (220) is arranged in the interior of the vertical rebound cavity (230); wherein A vertical rebound piece (231) is arranged on the vertical rebound plate (220), one end of the vertical rebound piece (231) is connected with the vertical rebound plate (220), and the other end is connected with the bottom clamping piece (23).

8. The water stain removal device for chip cleaning according to claim 7, wherein At least two trigger pieces (26) are horizontally slidably connected in the interior of the clamping seat (22), and a horizontal rebound cavity (260) is formed in the interior of each trigger piece (26); The two trigger pieces (26) are located below the bottom clamping piece (23) and are engaged with the bottom clamping piece (23), thereby moving away from each other when the bottom clamping piece (23) slides downward; A horizontal rebound plate (221) is arranged in the horizontal rebound cavity (260); wherein A horizontal rebound piece (261) is arranged on the horizontal rebound plate (221), one end of the horizontal rebound piece (261) is connected with the horizontal rebound plate (221), and the other end is connected with the corresponding trigger piece (26).

9. The water stain removal device for chip cleaning according to claim 8, wherein A driven rod (27) is bearing-connected on one side of each trigger piece (26) in the interior of the clamping seat (22), and a sliding piece (25) is hingedly connected on the driven rod (27); and Each sliding piece (25) is slidably connected with the corresponding horizontal clamping piece (24); wherein Each horizontal clamping piece (24) is configured to be pushed by the corresponding driven rod (27) to abut against each other when the corresponding trigger pieces (26) move away from each other, thereby clamping the two side walls of the chip (3).

10. The water stain removal device for chip cleaning according to claim 9, wherein A sliding guide rod (28) is arranged in the interior of each drying box (20); wherein Each sliding guide rod (28) penetrates through the corresponding horizontal clamping piece (24) to guide the sliding direction of the horizontal clamping piece (24).

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