Pick-up mechanism and chip feeding device
By introducing elastic elements and sliding components into the pickup mechanism, the problem of chip damage caused by excessive ejection force is solved, and buffering and avoidance are achieved during the ejection process to protect the chip from damage.
Patent Information
- Application Number
- CN202520066496.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-01-13
AI Technical Summary
In the prior art, the ejection mechanism is prone to chip damage when the ejection force is too large, and the existing picking mechanism cannot effectively buffer and avoid it.
A pickup mechanism comprising a main body, a sliding component, an elastic element, and an adsorption structure is designed. The sliding component extends due to the elastic force of the elastic element, and there is a certain gap between the adsorption structure and the main body. When the push-out force is too large, the sliding component and the adsorption structure retract, which plays a buffering and avoidance role and prevents damage to the chip.
It effectively prevents chip damage during ejection by using the buffering and avoidance function of the elastic component to reduce the risk of chip damage.
Smart Images
Figure CN223743645U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip bonding technical field especially relates to a pickup mechanism and chip feeding device. BACKGROUND
[0002] In the chip pickup feeding process, the ejection mechanism is used to lift the chip bottom, so that it is separated from the bottom blue film, and the pickup mechanism is used to pick up the chip from the top, and the chip is moved to the feeding position.
[0003] In the prior art, the ejection mechanism is used to eject the chip and pierce the blue film at the bottom of the chip, and the pickup mechanism is used to suck the chip from the top; in the chip ejection and pickup process, the pickup mechanism sucks the top of the chip, and the ejection mechanism is on the bottom of the chip, if the ejection force of the ejection mechanism is too large when picking up, it is easy to cause damage to the chip.
[0004] Therefore, it is urgent to provide a pickup mechanism and chip feeding device to buffer and avoid when the ejection force of the ejection mechanism is too large, so as to prevent the chip from being damaged. UTILITY MODEL CONTENTS
[0005] The utility model aims at providing a pickup mechanism and chip feeding device to buffer and avoid when the ejection force of the ejection mechanism is too large, so as to prevent the chip from being damaged.
[0006] To achieve this purpose, the utility model adopts the following technical scheme:
[0007] The utility model provides a pickup mechanism, the pickup mechanism includes:
[0008] The main body has an accommodating space with an open bottom end;
[0009] The sliding assembly is connected with the main body and arranged in the accommodating space;
[0010] The elastic member is arranged at the top wall and the sliding assembly in the main body respectively;
[0011] The adsorption structure is connected with the sliding assembly for adsorbing the chip, and the sliding assembly can be partially extended from the opening under the action of the elastic member, so that the adsorption structure has a certain interval with the main body.
[0012] As an optional technical scheme of the pickup mechanism, the sliding assembly includes:
[0013] The pressure bearing piece is arranged on one side of the elastic member;
[0014] The sliding piece is connected with the main body and fixed on the other side of the pressure bearing piece, and the sliding piece is connected with the adsorption structure.
[0015] As an optional technical scheme of the pickup mechanism, the pickup mechanism further comprises a first guide cylinder fixed in the main body, and the sliding member slides through the first guide cylinder.
[0016] A main cylinder body, the sliding member is fixedly inserted in the main cylinder body, and the elastic member is sleeved outside the main cylinder body;
[0017] A pressing ring connected and radially protruding from the main cylinder body, and the elastic member is arranged between the inner top wall of the main body and the pressing ring.
[0018] As an optional technical scheme of the pickup mechanism, the main body is provided with a limiting surface, the limiting surface is arranged in opposite spacing with the inner top wall of the main body, one side of the elastic member abuts against the pressing ring, and the other side of the pressing ring is attached to the limiting surface.
[0019] As an optional technical scheme of the pickup mechanism, the main body comprises:
[0020] A hollow base body, the sliding assembly is slidingly arranged in the hollow base body;
[0021] An upper cover, which is detachably arranged on the top of the hollow base body, and the elastic member abuts against the upper cover.
[0022] The utility model provides a chip loading device, the chip loading device includes base, ejection mechanism and above -mentioned pickup mechanism, the ejection mechanism and pickup mechanism all are arranged on the base, and the pickup mechanism is located above -mentioned ejection mechanism.
[0023] As an optional technical scheme of the chip loading device, the ejection mechanism comprises an ejection assembly and a driving assembly, the driving assembly is used for driving the ejection assembly to move towards the direction close to the pickup mechanism, and the driving assembly is a voice coil motor.
[0024] As an optional technical scheme of the chip loading device, the ejection mechanism further comprises a base plate and a quick release assembly, and the ejection assembly is slidingly arranged on the base plate through the quick release assembly.
[0025] As an optional technical scheme of the chip loading device, the ejection mechanism is slidingly arranged on the base in a first direction;
[0026] And / or, the chip loading device further comprises an auxiliary member, the pickup mechanism is slidingly arranged on the auxiliary member in a first direction, and the auxiliary member is slidingly arranged on the base in a second direction.
[0027] Beneficial effects:
[0028] The utility model provides a pickup mechanism, this pickup mechanism includes main part, sliding assembly, elastic member and adsorption structure, main part has the containing space of bottom end opening, sliding assembly is connected with main part sliding and sets up in the containing space, elastic member both ends respectively resist and press main part in top wall and sliding assembly, adsorption structure is connected in sliding assembly for adsorbing chip, under the action of elastic member sliding assembly can part from opening place stretch out, make adsorption structure with main part have certain interval. Through setting up elastic member in the containing space, utilize the elastic force of elastic member, make sliding assembly part from opening place stretch out, make adsorption structure with main part have certain interval, once the ejector mechanism ejector force is too big, through chip transmits force to adsorption structure and sliding assembly, make sliding assembly and adsorption structure move upwards and retract from opening place and extrude elastic member, the interval between adsorption structure and main part gradually reduces, thereby plays the role of buffering avoidance, effectively prevents chip damage.
[0029] The utility model provides a chip loading device, the chip loading device includes base, ejector mechanism and above -mentioned pickup mechanism, and the pickup mechanism is located above the ejector mechanism, and the pickup mechanism is located above the ejector mechanism. Through setting up the pickup mechanism with elastic member, can play the role of buffering avoidance in the process that chip ejects and picks up, prevents chip damage. BRIEF DESCRIPTION OF DRAWINGS
[0030] Figure 1 It is the partial structure schematic diagram of first visual angle of chip loading device provided by the utility model embodiment;
[0031] Figure 2 It is the partial structure schematic diagram of second visual angle of chip loading device provided by the utility model embodiment;
[0032] Figure 3 It is the structure schematic diagram of pickup mechanism provided by the utility model embodiment;
[0033] Figure 4 It is the sectional view of pickup mechanism provided by the utility model embodiment;
[0034] Figure 5 It is the structure schematic diagram of ejector mechanism provided by the utility model embodiment;
[0035] Figure 6 It is the sectional view of ejector mechanism provided by the utility model embodiment.
[0036] In the drawing:
[0037] 1, pickup mechanism;11, main part;111, hollow base body;112, upper cover;12, sliding assembly;121, pressure bearing piece;122, sliding piece;13, adsorption structure;131, base;132, adsorption subassembly;14, elastic member;15, first guide cylinder;17, rotating assembly;
[0038] 2, ejection mechanism; 21, ejection assembly; 211, ejector pin; 212, ejector rod; 213, lifting platform; 214, lifting plate; 22, driving assembly; 23, base plate; 24, quick release assembly; 25, blue film vacuum; 26, shell; 27, second guide cylinder;
[0039] 3, base; 4, auxiliary piece. DETAILED DESCRIPTION
[0040] The utility model will be described in further detail below in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the utility model and are not limited to the utility model. In addition, it should be noted that only the parts related to the utility model are shown in the drawings for ease of description, not all the structures.
[0041] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0042] In the utility model, unless otherwise explicitly specified and limited, the first feature "on" or "below" the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0043] In the description of the embodiment, the terms "up", "down", "left", "right" and other orientation or position relationship are based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the utility model. In addition, the terms "first" and "second" are only used to distinguish in description and have no special meaning.
[0044] As Figures 1 to 6As shown, the embodiment provides a pickup mechanism and a chip feeding device, the chip feeding device comprises a base 3, an ejection mechanism 2 and a pickup mechanism 1, the ejection mechanism 2 and the pickup mechanism 1 are both arranged on the base 3, and the pickup mechanism 1 is located above the ejection mechanism 2.
[0045] The pickup mechanism 1 comprises a main body 11, a sliding assembly 12, an elastic member 14 and a suction structure 13, the main body 11 has an accommodating space with an open bottom end, the sliding assembly 12 is in sliding connection with the main body 11 and is arranged in the accommodating space, the elastic member 14 has two ends respectively abutting against an inner top wall of the main body 11 and the sliding assembly 12, and the suction structure 13 is connected to the sliding assembly 12 for suction of a chip. Under the action of the elastic member 14, the sliding assembly 12 can partially extend out of the opening, so that the suction structure 13 has a certain interval with the main body 11.
[0046] By arranging the pickup mechanism 1 with the elastic member 14, the elastic force of the elastic member 14 is utilized to make the sliding assembly 12 partially extend out of the opening, so that the suction structure 13 has a certain interval with the main body 11. Once the ejection force of the ejection mechanism 2 is too large, the force is transmitted to the suction structure 13 and the sliding assembly 12 through the chip, so that the sliding assembly 12 and the suction structure 13 move upward to retract from the opening and press the elastic member 14. With the sliding assembly 12, the suction structure 13 gradually retracts, and the interval between the suction structure 13 and the main body 11 gradually decreases, thereby playing a buffering and avoiding role and effectively preventing the chip from being damaged.
[0047] In the embodiment, the first direction is a vertical direction, and the second direction is a horizontal direction. The pickup mechanism 1 and the ejection mechanism 2 are arranged in the first direction, and the pickup mechanism 1 is located directly above the ejection mechanism 2.
[0048] Optionally, the pickup mechanism 1 further comprises a rotating assembly 17 connected to the main body 11. The pickup mechanism 1 picks up the chip from above, then needs to drive the chip to rise and turn over 180°, and then moves the chip to a feeding position. By arranging the rotating assembly 17, under the action of the rotating assembly 17, the main body 11 can be turned over, and the sliding assembly 12, the suction structure 13 and the elastic member 14 and the like will be turned over with the main body 11, thereby completing the turning over operation of the chip.
[0049] Further, the main body 11 comprises a hollow base body 111 and an upper cover 112, the sliding assembly 12 is slidingly arranged in the hollow base body 111, the upper cover 112 is detachably arranged on the top of the hollow base body 111, and the elastic member 14 abuts against the upper cover 112. By arranging the detachable hollow base body 111 and the upper cover 112, it is convenient to install the elastic member 14 and the sliding assembly 12 in the main body 11.
[0050] In the embodiment, the hollow base body 111 is provided with a top opening and a bottom opening; the sliding assembly 12 is capable of moving up and down along the first direction; and the upper cover 112 is fixed to the top of the hollow base body 111 by means of bolts.
[0051] Further, the sliding assembly 12 comprises a pressure-bearing piece 121 and a sliding piece 122, the elastic piece 14 is arranged on one side of the pressure-bearing piece 121; the sliding piece 122 is slidably connected with the main body 11 and is fixed to the other side of the pressure-bearing piece 121, and the sliding piece 122 is connected with the adsorption structure 13. By arranging the elastic piece 14 and the sliding piece 122 on the two sides of the pressure-bearing piece 121 respectively, the sliding piece 122 is slidably connected with the main body 11, and the elastic force of the elastic piece 14 is used to press the pressure-bearing piece 121, so that the sliding piece 122 can partially extend out of the opening of the main body 11.
[0052] Optionally, the pickup mechanism 1 further comprises a first guide cylinder 15, which is fixed in the main body 11, and the sliding piece 122 is slidably arranged in the first guide cylinder 15. By arranging the first guide cylinder 15 in the main body 11, the first guide cylinder 15 and the sliding piece 122 are slidably connected to limit the sliding direction of the sliding piece 122.
[0053] In the embodiment, the hollow base body 111 is provided with an internal space in the shape of an I-beam in cross section, the first guide cylinder 15 is embedded and fixed in the hollow base body 111, the sliding piece 122 is slidably arranged in the first guide cylinder 15 and coincides with the axis of the first guide cylinder 15; the first guide cylinder 15 is placed into the bottom opening of the hollow base body 111, and the first guide cylinder 15 is fixed to the inner wall of the hollow base body 111 by means of bolts.
[0054] Optionally, the pressure-bearing piece 121 comprises a main cylinder and a pressing ring, the sliding piece 122 is inserted and fixed to the main cylinder, and the elastic piece 14 is arranged outside the main cylinder; the pressing ring is connected with and radially protrudes from the main cylinder, and the elastic piece 14 is arranged between the top wall of the main body 11 and the pressing ring. By arranging the main cylinder and the pressing ring, the sliding piece 122 is inserted and fixed to the main cylinder, so that the relative position of the main cylinder and the sliding piece 122 can be ensured, the pressing ring is radially protruded from the main cylinder, the elastic piece 14 is arranged outside the main cylinder and abuts against the pressing ring, so that the arrangement position of the elastic piece 14 can be ensured, and the pressure-bearing piece 121 can move smoothly in the main body 11.
[0055] In the embodiment, the main cylinder and the pressing ring are in an integrated structure, and the pressure-bearing piece 121 is in the shape of a U-beam in cross section; and the main cylinder and the sliding piece 122 are connected by means of bolts.
[0056] In order to limit the position of the pressure-bearing part 121, a limiting surface is arranged on the main body 11, the limiting surface is arranged in spaced relation to the inner top wall of the main body 11, the elastic part 14 abuts against one side of the pressure ring, and the other side of the pressure ring abuts against the limiting surface. By arranging the limiting surface in the main body 11, the inner top wall and the limiting surface limit the pressure-bearing part 121 from above and below respectively, the elastic part 14 is in a compressed state, the elastic part 14 abuts the pressure ring against the limiting surface, and once the ejecting force of the ejecting mechanism 2 is too large, the force is transmitted to the adsorbing structure 13 and the sliding assembly 12 through the chip, the sliding assembly 12 and the adsorbing structure 13 move upward and retract from the opening, the pressure ring can be separated from the limiting surface and move toward the inner top wall of the main body 11 to further compress the elastic part 14.
[0057] Optionally, the adsorbing structure 13 comprises a base 131 and an adsorbing assembly 132, one side of the base 131 is connected to the bottom end of the sliding part 122, and the adsorbing assembly 132 is arranged on the other side of the base 131 for adsorbing the chip, and the base 131 can close the bottom end opening of the hollow base body 111. By arranging the base 131 and the adsorbing assembly 132, the sliding assembly 12 extends out of the main body 11 under the action of the elastic part 14, at this time, a gap is formed between the base 131 and the hollow base body 111; once the ejecting force of the ejecting mechanism 2 is too large, the force is transmitted to the adsorbing structure 13 and the sliding assembly 12 through the chip, the pressure ring can be separated from the limiting surface and move toward the inner top wall of the main body 11 to further compress the elastic part 14, and the gap B disappears, at this time, the base 131 can close the bottom end opening of the hollow base body 111, and the upper cover 112, the hollow base body 111 and the base 131 enclose a closed space, which can effectively prevent impurities from entering and play a role in protecting internal components.
[0058] In the embodiment, the adsorbing assembly 132 comprises a chip tool for picking up a chip of a specific size, and a chip vacuum is arranged at the center position of the chip tool, and the chip vacuum can suck the chip.
[0059] Referring to Figure 1 and Figure 2 , the ejecting mechanism 2 is arranged on the base 3 in sliding mode along a first direction; the chip feeding device further comprises an auxiliary part 4, and the picking mechanism 1 is arranged on the auxiliary part 4 in sliding mode along the first direction, and the auxiliary part 4 is arranged on the base 3 in sliding mode along a second direction. By arranging the ejecting mechanism 2 and the picking mechanism 1 in sliding mode, the relative positions of the picking mechanism 1 and the ejecting mechanism 2 can be adjusted, which facilitates the ejecting and picking of the chip.
[0060] In the embodiment, the auxiliary part 4 is in the form of a plate, the picking mechanism 1 is arranged on one side of the auxiliary part 4 in sliding mode along the first direction, and the other side of the auxiliary part 4 is connected to the base 3 in sliding mode along the second direction; the chip feeding device further comprises a support arm, one end of the support arm is connected to the ejecting mechanism 2, and the other end of the support arm is connected to the base 3 in sliding mode along the first direction.
[0061] Referring toFigure 5 and Figure 6 The ejection mechanism 2 comprises an ejection assembly 21 and a driving assembly 22, the driving assembly 22 is used to drive the ejection assembly 21 to move in the direction of the pickup mechanism 1, and the driving assembly 22 is a voice coil motor.
[0062] In the prior art, the ejection mechanism usually adopts a cam structure to realize lifting movement, the ejection force is large, and friction debris is generated in the movement process, which is easy to cause the chip to be broken; when encountering motion fluctuation, the ejection assembly is easily worn and the chip is easily damaged. In the embodiment, the voice coil motor is used as the driving assembly 22, the driving assembly 22 drives the ejection assembly 21 to move in the first direction, instead of the cam structure for jacking up, on the one hand, the force is elastically variable, on the other hand, the voice coil motor driving is floating driving, the voice coil motor driving itself can realize the monitoring of the ejection force, and the size of the ejection force can be adaptively adjusted; once the abnormal overpressure occurs, the voice coil motor can be controlled to make the ejection assembly 21 quickly retreat.
[0063] When the chip is over-pressured in the ejection and pickup process, the pickup mechanism 1 can provide a certain avoidance space, and the ejection mechanism 2 can make the ejection assembly 21 quickly retreat through the control of the voice coil motor, that is, the pickup mechanism 1 and the ejection mechanism 2 can quickly play a protective role and minimize the damage to the chip.
[0064] Specifically, the ejection mechanism 2 comprises a housing 26 and a base plate 23, the housing 26 is arranged on the top of the base plate 23, the driving assembly 22 is arranged on the base plate 23, the ejection assembly 21 is arranged in the housing 26, and a blue film vacuum 25 is arranged on the top of the housing 26 and used to adsorb the chip.
[0065] In the embodiment, the ejection assembly 21 comprises a top pin 211, a top rod 212 and a jacking table 213, the top rod 212 is slidingly arranged in the housing 26, the top rod 212 is provided with the top pin 211 on the top, and the jacking table 213 is connected to the driving assembly 22 and located below the top rod 212; the ejection assembly 21 further comprises a lifting plate 214, and the driving assembly 22 drives the jacking table 213 to move in the first direction through the lifting plate 214. The driving assembly 22 controls the jacking table 213 to gradually approach the bottom of the top rod 212 in the first direction, and then the jacking table 213 jacks up the top rod 212 and the top pin 211.
[0066] Optionally, the ejection mechanism 2 further comprises a second guide cylinder 27, the second guide cylinder 27 is embedded and fixed in the housing 26, and the top rod 212 is slidingly arranged in the second guide cylinder 27; the ejection mechanism 2 further comprises a quick release assembly 24, the top rod 212 is slidingly matched with the quick release assembly 24 and connected to the base plate 23 through the quick release assembly 24. By arranging the second guide cylinder 27, the movement direction of the top rod 212 can be accurately limited; by arranging the quick release assembly 24, the top rod 212 and the top pin 211 can be flexibly replaced, and the ejection mechanism 2 is suitable for feeding different chips.
[0067] The specific use process of the pickup mechanism 1 and the chip feeding device is as follows:
[0068] The driving assembly 22 is started, the lifting platform 213 is driven to ascend in the first direction, the lifting platform 213 lifts the jacking rod 212, the ejector pin 211 is driven to ascend, and the blue film vacuum 25 sucks the chip from below; the sliding assembly 12 of the pickup mechanism 1 is partially extended from the lower end of the main body 11 under the action of the elastic member 14, the suction assembly 132 sucks and picks up the chip from above, the ejector pin 211 slightly lifts the chip from below, so that the chip is separated from the bottom blue film; once the ejecting mechanism 2 has excessive ejecting force or fluctuation in the process, the force is transmitted to the sliding assembly 12 through the chip, the sliding assembly 12 drives the suction structure 13 to move towards the direction close to the main body 11 (i.e. gradually retracts), and the elastic member 14 is pressed, so that a certain avoiding space can be provided, and the chip can be effectively prevented from being damaged; after the chip and the bottom blue film are separated, the pickup mechanism 1 rotates the chip by using the rotating assembly 17, turns over the chip by 180°, and then moves the chip to the feeding position.
[0069] Obviously, the above embodiments of the utility model are merely examples for clearly illustrating the utility model, and are not a limitation on the embodiments of the utility model. For ordinary skilled in the art, various obvious changes, re-adjustments and replacements can be made without departing from the protection scope of the utility model. Here, all the embodiments need not and cannot be exhausted. Any modification, equivalent replacement and improvement within the spirit and principle of the utility model should be included in the protection scope of the utility model claim.
Claims
1. A pick-up mechanism characterised in that, The chip pick-up mechanism comprises: a main body (11) having an open-ended containing space; a sliding assembly (12) slidably connected to the main body (11) and arranged in the containing space; a resilient member (14) having two ends respectively abutting against an inner top wall of the main body (11) and the sliding assembly (12); an adsorption structure (13) connected to the sliding assembly (12) for adsorbing a chip, and the sliding assembly (12) can partially extend out of the opening under the action of the resilient member (14), so that the adsorption structure (13) has a certain interval with the main body (11).
2. The pick-up mechanism according to claim 1, characterized in that The sliding assembly (12) comprises: a pressure bearing member (121) abutted by one side of the resilient member (14); a sliding member (122) slidably connected to the main body (11) and fixed to the other side of the pressure bearing member (121), and the sliding member (122) is connected to the adsorption structure (13).
3. The pick-up mechanism according to claim 2, wherein The chip pick-up mechanism further comprises a first guide cylinder (15) fixed in the main body (11), and the sliding member (122) slides through the first guide cylinder (15).
4. The pick-up mechanism of claim 2, wherein The pressure bearing member (121) comprises: a main cylinder body in which the sliding member (122) is inserted and fixed, and the resilient member (14) is sleeved outside the main cylinder body; a pressure ring connected to and radially protruding from the main cylinder body, and the resilient member (14) is arranged between the inner top wall of the main body (11) and the pressure ring.
5. The pick-up mechanism according to claim 4, characterized in that A limiting surface is arranged on the main body (11), and the limiting surface is arranged in a spaced relationship with the inner top wall of the main body (11), one side of the pressure ring is abutted by the resilient member (14), and the other side of the pressure ring is attached to the limiting surface.
6. The pick-up mechanism of claim 1, wherein The main body (11) comprises: a hollow base body (111) in which the sliding assembly (12) is slidably arranged; an upper cover (112) detachably arranged on the top of the hollow base body (111), and the resilient member (14) abuts against the upper cover (112).
7. An on-chip material loading device, characterized by The chip pick-up device comprises a base (3), an ejection mechanism (2) and the chip pick-up mechanism according to any one of claims 1-6, the ejection mechanism (2) and the chip pick-up mechanism are both arranged on the base (3), and the chip pick-up mechanism is located above the ejection mechanism (2).
8. The on-chip material loading device of claim 7, wherein, The ejection mechanism (2) comprises an ejection assembly (21) and a driving assembly (22), the driving assembly (22) is used for driving the ejection assembly (21) to move towards a direction close to the chip pick-up mechanism, and the driving assembly (22) is a voice coil motor.
9. The on-chip material loading device of claim 8, wherein, The ejection mechanism (2) further comprises a base plate (23) and a quick release assembly (24), and the ejection assembly (21) is slidably arranged on the base plate (23) through the quick release assembly (24).
10. The on-chip material loading device of claim 7, wherein, The ejection mechanism (2) is slidably arranged on the base (3) in a first direction; And / or, the chip pick-up device further comprises an auxiliary member (4), the chip pick-up mechanism is slidably arranged on the auxiliary member (4) in a first direction, and the auxiliary member (4) is slidably arranged on the base (3) in a second direction.