Heat dissipation structure for Schottky diode and Schottky diode

Abstract

The utility model discloses a Schottky diode and a heat dissipation structure for the Schottky diode, and relates to the technical field of diode heat dissipation, the heat dissipation structure for the Schottky diode comprises a metal plate and a heat dissipation insertion sheet, the metal plate is used for arranging a diode chip, and the metal plate is provided with an insertion hole; a plurality of heat dissipation insertion sheets are arranged; in the initial state, the heat dissipation insertion pieces and the metal plate are arranged in a split mode. And in an assembly state, the bottom of the heat dissipation insertion sheet is inserted and fixed in the insertion hole. According to the scheme provided by the utility model, the production cost can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to diode heat dissipation technical field, in particular to a kind of heat dissipation structure and Schottky diode for Schottky diode. BACKGROUND

[0002] Schottky diode is the core component of photovoltaic junction box, Schottky diode is referred to as diode below, diode has two functions in photovoltaic module, one is current conduction, the other is to protect module, reduce hot spot effect.Diode generates heat in working process, and the diodes of different types of photovoltaic modules have different junction temperatures when the same diode is configured on the diode.The demand of different types of photovoltaic modules on diode heat dissipation performance is different in order to meet the diode junction temperature within the specified range.In the prior art, different molds or processes are usually used to produce diodes with different heat dissipation performance, which increases the production cost. SUMMARY

[0003] The utility model discloses a kind of heat dissipation structure and Schottky diode for Schottky diode, to solve the problems existing in the above prior art, reduce production cost.

[0004] To achieve the above object, the utility model provides the following scheme:

[0005] The utility model provides a kind of heat dissipation structure for Schottky diode, comprising: metal plate and heat dissipation insert piece, metal plate is used to set diode chip, the metal plate is provided with insertion hole;Heat dissipation insert piece is provided with several;Initial state, the heat dissipation insert piece and the metal plate are set apart;Assembly state, the bottom of the heat dissipation insert piece is inserted and fixed in the insertion hole.

[0006] Preferably, the heat dissipation insert piece is inserted in the state of the insertion hole, and the heat dissipation insert piece is perpendicular to the metal plate.

[0007] Preferably, the heat dissipation insert piece is provided with two;The insertion hole is provided with two groups;One group of the insertion hole corresponds to one heat dissipation insert piece;The bottom of the heat dissipation insert piece is structured with plug, and the plug can be inserted into the insertion hole.

[0008] Preferably, each group of the insertion hole includes two insertion holes;The bottom of each heat dissipation insert piece is structured with two plugs.

[0009] Preferably, two groups of the insertion hole are respectively arranged on the opposite sides of the diode chip.

[0010] Preferably, the metal plate is of brass material.

[0011] Preferably, the heat dissipation insert piece is of brass material.

[0012] This utility model also provides a Schottky diode, including a diode chip and a heat dissipation structure for a Schottky diode as described above; the diode chip is disposed on a metal plate.

[0013] Preferably, the metal plate is provided with two solder pads.

[0014] Preferably, the diode chip is encapsulated in an epoxy resin molding compound.

[0015] The present invention achieves the following technical advantages over the prior art:

[0016] This invention utilizes a metal plate and heat sinks to dissipate heat from the diode chip. The heat dissipation performance of the diode can be adjusted by changing the number of heat sinks on the metal plate, thereby meeting the requirements for transmitting different currents generated by different photovoltaic modules. Diodes with different heat dissipation performances can be manufactured without changing the diode manufacturing process and mold. Therefore, the solution provided by this invention can reduce the manufacturing cost of diodes. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of a heat dissipation structure for a Schottky diode and a Schottky diode containing the heat dissipation structure provided in this embodiment of the present invention;

[0019] Figure 2 for Figure 1 Exploded view of the structure;

[0020] In the diagram: 1-Metal plate; 2-Heat sink; 3-Epoxy resin molding compound; 4-Solder pad; 5-Socket; 6-Plug. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] First, some technical terms involved in the embodiments of this application will be introduced.

[0024] Diode junction temperature: The highest temperature of the internal chip of a Schottky diode when the current generated by a photovoltaic module (cell) flows through it.

[0025] Hot spot effect: When a cell or cell group in a photovoltaic module is shaded or damaged, the operating current exceeds the reduced short-circuit current of that cell or cell group, causing hot spot heating in the module. At this time, the affected cell or cell group is placed in a reverse bias state, consuming power, thereby causing the module to overheat.

[0026] In related technologies, it is common to adjust the junction temperature of the diode inside the junction box by designing junction box housings of different sizes, changing the shape and structure of the heat dissipation structure for the Schottky diode, and changing the internal chip structure and size of the Schottky diode. However, the above three methods are relatively expensive.

[0027] The following is combined Figures 1 to 2 The following describes embodiments of the present invention.

[0028] This utility model provides a heat dissipation structure for Schottky diodes, including: a metal plate 1 and heat dissipation fins 2. The metal plate 1 is used to mount the diode chip and has sockets 5. Several heat dissipation fins 2 are provided. In the initial state, the heat dissipation fins 2 and the metal plate 1 are separately arranged. In the assembled state, the bottom of the heat dissipation fins 2 are inserted and fixed in the sockets 5. During assembly, the number of heat dissipation fins 2 can be adjusted according to the required heat dissipation performance. When the heat dissipation performance requirement is low, the heat dissipation fins 2 can even be omitted from the metal plate 1, and the metal plate 1 can be directly used as the heat dissipation structure for the Schottky diode.

[0029] This invention utilizes a metal plate 1 to dissipate heat from the diode chip, and adjusts the heat dissipation performance of the diode by changing the number of heat dissipation fins 2 on the metal plate 1. This allows for the transmission of different currents generated by different photovoltaic modules. Diodes with different heat dissipation performance can be manufactured without changing the diode manufacturing process and mold, and the redundancy of heat dissipation performance is reduced. Therefore, the solution provided by this invention can reduce the manufacturing cost of diodes.

[0030] Understandably, in related technologies, a mold or process can be developed to produce a larger metal plate 1 to meet the needs of different photovoltaic modules. However, when the current inside the photovoltaic module is small, this solution will waste heat dissipation performance. Even if the heat dissipation performance is redundant, the diode produced by this solution is large and difficult to install. Correspondingly, the solution of developing a larger junction box and chip also has the above problems.

[0031] In some embodiments, when the heat sink 2 is inserted into the socket 5, the heat sink 2 is perpendicular to the metal plate 1.

[0032] This embodiment makes the structure composed of metal plate 1 and heat sink 2 a three-dimensional structure, which does not increase the area occupied by the heat dissipation structure for Schottky diodes and makes full use of the idle space on both sides of the chip.

[0033] In some embodiments, there are two heat sinks 2; there are two sets of sockets 5; one set of sockets 5 corresponds to one heat sink 2; the bottom of the heat sink 2 is provided with a plug 6, which can be inserted into the socket 5.

[0034] This embodiment achieves the purpose of detachably inserting the heat sink 2 onto the metal plate 1.

[0035] In some embodiments, each set of sockets 5 includes two sockets 5; the bottom of each heat sink 2 is configured with two plugs 6.

[0036] In this embodiment, the plug 6 can be snapped into the socket 5. If the plug 6 is regarded as a rivet, the snapping process can be called cold riveting. In some examples, the plug 6 at the bottom of the heat sink 2 can also be clearance-fitted with the socket 5.

[0037] In some embodiments, the two sets of sockets 5 are respectively disposed on opposite sides of the diode chip.

[0038] In some embodiments, the metal plate 1 is made of brass. H62 brass is preferred.

[0039] In some embodiments, the heat sink 2 is made of brass. H62 brass is preferred.

[0040] This utility model also provides a Schottky diode, including a diode chip and a heat dissipation structure for a Schottky diode as described above; the diode chip is disposed on a metal plate 1.

[0041] This embodiment possesses all the advantages of the above embodiments, and will not be repeated here.

[0042] In some embodiments, the metal plate 1 is provided with two pads 4.

[0043] In this embodiment, the two pads 4 serve as connection points to an external battery (power source). The two pads 4 are connected to the positive and negative terminals of the battery via solder. It can be understood that the positive and negative terminals of the battery are connected by conductive wires. The connection between the two pads 4 and the conductive wires achieves the purpose of indirect connection with the positive and negative terminals of the battery.

[0044] In some embodiments, the diode chip is encapsulated in an epoxy resin molding compound 3.

[0045] When manufacturing Schottky diodes, the required heat dissipation performance is determined based on the maximum current that the photovoltaic module can generate. That is, the greater the maximum current that the photovoltaic module can generate, the higher the requirement for the heat dissipation performance of the diode. Therefore, more heat sinks 2 need to be installed on the heat dissipation structure of the Schottky diode to improve the heat dissipation performance.

[0046] Diode chip heating principle: When a diode is connected to the positive and negative terminals of a battery, it begins to work when forward-biased. The chip starts to operate and heats up under the influence of the current. If the battery current increases, the chip power increases, and the chip temperature gradually rises. The diode's original heat dissipation capacity is slower than the chip's heating rate. When the chip reaches 200℃, it enters its intrinsic state, eventually burning out over time, which can lead to damage to the junction box or a fire in the photovoltaic module.

[0047] This utility model uses specific examples to illustrate its principles and implementation methods. The above description of the embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the idea of ​​this utility model. In summary, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A heat dissipating structure for a Schottky diode, characterized by: The application relates to a Schottky diode heat dissipation structure, which comprises the following parts: a metal plate, on which a diode chip is arranged, and on which a socket is arranged; and a plurality of heat dissipation plugs, which are arranged separately from the metal plate in an initial state and are fixedly inserted into the socket in an assembled state.

2. The heat dissipating structure for a Schottky diode according to claim 1, characterized by: In the state that the heat dissipation plugs are inserted into the socket, the heat dissipation plugs are perpendicular to the metal plate.

3. The heat dissipating structure for a Schottky diode according to claim 2, characterized by: The heat dissipation plugs are arranged in two groups; one group of the sockets corresponds to one heat dissipation plug; the bottom of the heat dissipation plug is provided with a plug which can be inserted into the socket.

4. The heat dissipating structure for a Schottky diode according to claim 3, characterized by: Each group of the sockets comprises two sockets; the bottom of each heat dissipation plug is provided with two plugs.

5. The heat dissipating structure for a Schottky diode according to claim 3, characterized by: The two groups of sockets are arranged on the opposite sides of the diode chip.

6. The heat dissipating structure for a Schottky diode according to claim 1, characterized by: The metal plate is made of brass.

7. The heat dissipating structure for a Schottky diode according to Claim 1, characterized by: The heat dissipation plugs are made of brass.

8. A Schottky diode characterized by: The application further relates to a Schottky diode heat dissipation structure which comprises a diode chip and the Schottky diode heat dissipation structure as claimed in any one of claims 1 to 7; the diode chip is arranged on the metal plate.

9. The Schottky diode of claim 8, wherein: Two pads are arranged on the metal plate.

10. The Schottky diode of claim 8, wherein: The diode chip is wrapped with an epoxy resin plastic sealing member.

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