Automobile electronic device lead frame for TO-252 packaging

Abstract

The utility model provides an automotive electronic device lead frame for TO-252 packaging. The automotive electronic device lead frame comprises a frame; the plurality of frame units are arranged at the top of the frame, each frame unit comprises a frame base island, a waterproof groove, a first inner pin, a second inner pin, a third inner pin, a groove plastic edge and a hard spot, the frame base island is arranged at the top of the frame, the waterproof groove is formed in the top of the frame base island, and the first inner pin, the second inner pin, the third inner pin, the groove plastic edge and the hard spot are arranged in the waterproof groove. The first inner pin is arranged on one side of the frame base island, and the second inner pin is arranged on one side of the first inner pin. According to the automobile electronic device lead frame for TO-252 packaging provided by the utility model, the pocking marks are additionally arranged at the frame base island, and the groove plastic edge at the edge of the frame base island is deepened to 1.7 times of the original design, so that the glue locking capability of the frame base island is greatly improved, and the layering probability under high-temperature and high-humidity conditions is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to lead frame technical field especially relates to a kind of for TO-252 package's automobile electronic device lead frame. BACKGROUND

[0002] Automobile electronic device, as its name implies, is the chip specially applied in the field of automobile. Compared with the chip used in consumer goods and industrial products, automobile electronic device has higher requirements on reliability, which is embodied in the following aspects: wider working temperature range, to adapt to the cold and heat changes under complex working conditions of automobile; stronger working stability, to ensure continuous and accurate work under conditions such as long-time operation and complex electromagnetic environment; and extremely low defect rate, to ensure the safety and stability of the overall operation of automobile. The differences in product grade of such chips are mainly achieved by precise and complex chip design and strict control of production process, so as to realize different performance in key aspects such as working temperature range and stability.

[0003] The basic structure of TO-252 4R frame in current automobile electronic device includes a base island and two pins, but there is a serious delamination problem in the base island part.

[0004] Therefore, it is necessary to provide a lead frame for TO-252 package automobile electronic device to solve the above technical problems. SUMMARY

[0005] The utility model provides a kind of for TO-252 package's automobile electronic device lead frame, solve the problem of delamination in base island part.

[0006] To solve the above technical problems, the utility model provides a kind of for TO-252 package's automobile electronic device lead frame, comprising:

[0007] frame;

[0008] a plurality of frame units, a plurality of the frame units are arranged on the top of the frame, and the plurality of frame units each include a frame base island, a waterproof groove, a first inner pin, a second inner pin, a third inner pin, a groove plastic edge and a pimple, the frame base island is arranged on the top of the frame, the waterproof groove is opened on the top of the frame base island, the first inner pin is arranged on one side of the frame base island, the second inner pin is arranged on one side of the first inner pin, the third inner pin is arranged on one side of the second inner pin, the groove plastic edge is opened on one side of the bottom of the frame base island, and the pimple is arranged on the top of the frame base island.

[0009] Preferably, the first inner pin, the second inner pin and the third inner pin are connected with the frame base island.

[0010] Preferably, the first inner pin, the second inner pin and the third inner pin are arranged opposite to the waterproof groove.

[0011] Preferably, the top of the frame is provided with a plurality of mounting holes.

[0012] Compared with the prior art, the automobile electronic device lead frame for TO-252 packaging has the following beneficial effects:

[0013] The automobile electronic device lead frame for TO-252 packaging of the utility model provides a new dot design at the frame base island, and the frame base island edge groove plastic edge is deepened to 1.7 times of the original design, which greatly improves the glue locking capacity of the frame base island, thereby reducing the delamination probability under high temperature and high humidity conditions. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 A preferred embodiment structure diagram of the automobile electronic device lead frame for TO-252 packaging is shown in the drawings;

[0015] Figure 2 A preferred embodiment structure diagram of the automobile electronic device lead frame for TO-252 packaging is shown in the drawings; Figure 1 A frame local structure diagram is shown in the drawings;

[0016] Figure 3 A frame local structure diagram is shown in the drawings; Figure 2 A frame base island side cross-sectional structure diagram is shown in the drawings.

[0017] In the drawings, 1 is a frame, 2 is a mounting hole, 3 is a frame unit, 31 is a frame base island, 32 is a waterproof groove, 33 is a first inner pin, 34 is a second inner pin, 35 is a third inner pin, 36 is a groove plastic edge, and 37 is a dot. DETAILED DESCRIPTION

[0018] The utility model will be further described below in combination with the drawings and embodiments.

[0019] Please refer to Figure 1 , Figure 2 , Figure 3 Among them, Figure 1 A preferred embodiment structure diagram of the automobile electronic device lead frame for TO-252 packaging is shown in the drawings; Figure 2 A preferred embodiment structure diagram of the automobile electronic device lead frame for TO-252 packaging is shown in the drawings; Figure 1 A frame local structure diagram is shown in the drawings; Figure 3 A frame local structure diagram is shown in the drawings; Figure 2 A frame base island side cross-sectional structure diagram is shown in the drawings. The automobile electronic device lead frame for TO-252 packaging comprises a frame 1;

[0020] A plurality of frame units 3, a plurality of the frame units 3 are arranged on the top of the frame 1, a plurality of the frame units 3 all include frame base island 31, waterproof groove 32, first inner pin 33, second inner pin 34, third inner pin 35, groove plastic edge 36 and pimple 37, the frame base island 31 is arranged on the top of the frame 1, the waterproof groove 32 is opened in the top of the frame base island 31, the first inner pin 33 is arranged on one side of the frame base island 31, the second inner pin 34 is arranged on one side of the first inner pin 33, the third inner pin 35 is arranged on one side of the second inner pin 34, the groove plastic edge 36 is opened in one side of the bottom of the frame base island 31, and the pimple 37 is arranged on the top of the frame base island 31.

[0021] A plurality of frame units 3 are arranged on the top of the frame 1, each group of frame units 3 is composed of four frame units 3, and is vertically arranged on the top of the frame 1;

[0022] The groove plastic edge 36 on the edge of the frame base island 31 is deepened, and the bonding capacity of resin and the frame is enhanced.

[0023] The pimple 37 is designed on the surface of the frame base island 31, and the bonding capacity of resin and the frame is enhanced.

[0024] The first inner pin 33, the second inner pin 34 and the third inner pin 35 are connected with the frame base island 31.

[0025] The first inner pin 33, the second inner pin 34 and the third inner pin 35 are arranged opposite to the waterproof groove 32.

[0026] A plurality of mounting holes 2 are opened on the top of the frame 1.

[0027] A brand-new coating process is provided, and the material used is a plastic sealing material and an IC frame tacky coating. The coating material has the advantages that 1. it can be stored at room temperature, which is convenient to use; 2. it has better ability to soak inorganic materials, and has better surface smoothness; 3. it has excellent adhesion with epoxy plastic sealing material and IC frame, effectively solving the peeling problem of epoxy plastic sealing material and the support; 4. it is colorless and transparent, and the reinforced material is clearer and more transparent;

[0028] The use steps are as follows: 1. two bottles of solution are directly mixed; 2. the mixed solution is placed for 1 h; 3. the solution after standing is sprayed on the frame surface after die bonding wire by using a glue spraying gun or a glue spraying machine (note: the nozzle is an atomizing nozzle; due to the large air pressure of the manual spraying gun, the distance between the glue spraying head and the frame is preferably 20-30 cm, so as to avoid damage to the chip caused by large air pressure); 4. the frame surface after glue spraying can be directly subjected to subsequent mold pressing packaging.

[0029] Compared with the related art, the automobile electronic device lead frame for TO-252 package has the following beneficial effects:

[0030] By adding the pinhole 37 at the frame base island 31 and deepening the frame base island 31 edge groove plastic edge 36 to 1.7 times of the original design, the locking glue capacity of the frame base island 31 is greatly improved, thereby reducing the delamination probability under the high temperature and high humidity conditions.

[0031] The above is only an embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structure or equivalent process transformation using the utility model specification and the attached drawing contents, or direct or indirect application in other related technical fields, are also included in the patent protection range of the utility model.

Claims

1. An automotive electronics lead frame for TO-252 package, characterized by, Comprising: a frame; a plurality of frame units, the plurality of frame units are arranged on the top of the frame, the plurality of frame units each comprises a frame base island, a waterproof groove, a first inner pin, a second inner pin, a third inner pin, a groove plastic edge and a pimple, the frame base island is arranged on the top of the frame, the waterproof groove is opened on the top of the frame base island, the first inner pin is arranged on one side of the frame base island, the second inner pin is arranged on one side of the first inner pin, the third inner pin is arranged on one side of the second inner pin, the groove plastic edge is opened on one side of the bottom of the frame base island, and the pimple is arranged on the top of the frame base island.

2. The leadframe for automotive electronics of TO-252 package according to claim 1, wherein, The first inner pin, the second inner pin and the third inner pin are connected with the frame base island.

3. The leadframe for automotive electronics of TO-252 package according to claim 1, wherein, The first inner pin, the second inner pin and the third inner pin are arranged opposite to the waterproof groove.

4. The leadframe for automotive electronics of TO-252 package according to claim 1, wherein, A plurality of mounting holes are opened on the top of the frame.

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