Non-contact chip flip packaging substrate strip
By setting positioning holes and positioning blocks on the non-contact chip flip packaging substrate strip, combined with heat sinks and heat sinks, the problems of inaccurate positioning and insufficient heat dissipation in the prior art are solved, achieving high-precision, high-consistency and stable electrical connection, and improving packaging quality and efficiency.
Patent Information
- Application Number
- CN202520046507.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-01-09
AI Technical Summary
Existing non-contact chip flip-chip substrate strips lack precise positioning structures and auxiliary marking methods, leading to chip position misalignment, affecting electrical connection stability and production efficiency. They also require highly skilled operators, and the packaging precision and consistency result in poor packaging stability and reliability, making it difficult to meet the high precision and high consistency requirements of modern electronic equipment.
The epoxy resin tape is equipped with positioning holes and positioning blocks, combined with positioning pins to achieve precise positioning and assist in marking the chip position. Heat dissipation efficiency is improved through heat sinks and heat sinks, graphene nanomaterials are used to enhance heat conduction, buffer layers reduce stress transmission, and insulating tape prevents short circuits, ensuring stable electrical connections.
It achieves precise positioning of the chip and substrate strip, improves packaging accuracy and consistency, enhances heat dissipation, ensures electrical connection stability, and improves production efficiency and product quality.
Smart Images
Figure CN223743668U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to non -contact chip structure field especially, relates to a non -contact chip upside -down package substrate strip. BACKGROUND
[0002] In the modern electronic technology field, non -contact chip technology has been widely used, such as non -contact smart card, radio frequency identification label etc., these non -contact chip plays an important role in data storage, identification, security authentication etc., non -contact chip upside -down package substrate strip as the important component of non -contact chip, its performance and structure have the vital influence to the overall function of chip, it provides electrical connection, physical support and protection etc.
[0003] Some existing non -contact chip upside -down package substrate strip is usually constituted by simple insulating material layer and circuit layer, in the chip packaging process, mainly rely on the experience of operating personnel and simple mark to determine the position of chip on the substrate strip, then welding package, this mode lacks accurate positioning structure and auxiliary mark means, and the skill requirement of operating personnel is higher, and it is difficult to guarantee the precision and consistency of packaging in large -scale production.
[0004] However, the existing substrate strip mainly relies on manual experience or simple mark mode when packaging non -contact chip, there are obvious defects, due to lack of accurate positioning mechanism, chip position deviation may occur in the chip packaging process, leading to unstable electrical connection between chip and substrate strip, thereby affecting the performance and reliability of chip, and the operation difference of different operating personnel may lead to inconsistent packaging precision, reduce the overall quality and production efficiency of product, it is difficult to meet the demand of modern electronic equipment on high precision, high consistency packaging of non -contact chip. UTILITY MODEL CONTENTS
[0005] In order to make up for the above insufficient, the utility model provides a non -contact chip upside -down package substrate strip, aims at improving the existing substrate strip when packaging non -contact chip, mainly relying on manual experience and simple mark mode, there are obvious defects, and then leading to unstable electrical connection between chip and substrate strip, thereby affecting the performance and reliability of chip.
[0006] In order to achieve the above object, the utility model provides the following technical scheme: A non - contact chip reverse package substrate strip, including epoxy resin material band, the surface fixed connection of epoxy resin material band has circuit layer, the inside of epoxy resin material band is equipped with the piece groove, the inside of epoxy resin material band is provided with positioning assembly, the positioning assembly is used for chip and substrate strip accurate positioning, the positioning assembly includes locating hole no.
[0007] Further, the inside of the epoxy resin material band is provided with a cutting port, and the cutting port is used to provide a cutting inlet.
[0008] Further, the epoxy resin material band is fixedly connected with a heat sink inside, and the heat sink is provided with a heat dissipation groove.
[0009] Further, the heat sink can cooperate with the heat dissipation groove to assist in heat dissipation of the chip.
[0010] Further, the lower surface of the epoxy resin material band is fixedly connected with a buffer layer, and the buffer layer is made of a high-molecular material with good elasticity.
[0011] Further, the lower surface of the buffer layer is fixedly connected with a metal conductive material band, and the lower surface of the metal conductive material band is fixedly connected with an insulating material band.
[0012] Further, the insulating material band is made of polyethylene, and the insulating material band is used to prevent short circuit between wires.
[0013] Further, the epoxy resin material band is internally added with graphene nanomaterial.
[0014] The utility model has the advantages of:
[0015] 1、In the utility model, through the setting of locating hole no. 1 and locating hole no. 2, and the cooperation of positioning pin and locating hole, the unique position of the substrate strip on the plane can be determined, the position of the substrate strip in the chip mounting area is assisted to be clear, and through the auxiliary marking effect of the positioning block, the operator can more intuitively confirm the placement position of the chip in the operation process, so that the chip can be ensured to be in the predetermined position during packaging, accurate positioning of the chip and the substrate strip is realized, and the packaging precision and consistency are improved.
[0016] 2. In this utility model, the heat sink is designed to transfer heat through the circuit layer to the heat sink. The heat sink grooves increase the heat dissipation area, which is beneficial for heat dissipation and improves the heat dissipation efficiency of the chip. At the same time, the addition of graphene nanomaterials to the epoxy resin strip helps heat conduction and further improves the heat dissipation effect. Attached Figure Description
[0017] Figure 1 This is a three-dimensional structural diagram of a non-contact chip flip-chip substrate strip proposed in this utility model;
[0018] Figure 2 for Figure 1 Enlarged view of point A in the middle;
[0019] Figure 3 This is a schematic diagram of the circuit layer structure of a non-contact chip flip-chip substrate strip proposed in this utility model;
[0020] Figure 4 for Figure 3 Enlarged view of point B in the middle.
[0021] Legend:
[0022] 1. Epoxy resin tape; 2. Circuit layer; 3. Positioning hole one; 4. Segmentation groove; 5. Positioning hole two; 6. Cutting opening; 7. Positioning block; 8. Buffer layer; 9. Conductive metal tape; 10. Insulating tape; 11. Heat dissipation groove; 12. Heat sink. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0024] Reference Figure 1 - Figure 3The utility model provides an embodiment: a kind of non-contact chip inverted packaging substrate strip, including epoxy resin material strip 1, the upper surface of epoxy resin material strip 1 is fixedly connected with circuit layer 2, the wire and circuit layout being arranged in circuit layer 2 can be used to be welded with chip inside, to realize the convenient packaging to chip, chip can be more accurately aligned with substrate, improve the precision and consistency of packaging, epoxy resin material strip 1 is internally provided with chip slot 4, epoxy resin material strip 1 is provided with positioning assembly, positioning assembly is used to accurately position chip with substrate strip, first, substrate strip is placed on the workbench of packaging equipment, then positioning pin is accurately inserted into positioning hole one 3 and positioning hole two 5, positioning hole one 3 is internally provided in epoxy resin material strip 1, the position and quantity of positioning hole one 3 and the special position design of positioning hole two 5 in chip slot 4, positioning hole two 5 is located in the middle of chip slot 4, jointly determine the only position of substrate strip on plane, can further assist to determine the position of substrate strip in chip mounting area, ensure that chip is accurately located on predetermined position when packaging, epoxy resin material strip 1 upper surface is fixedly connected with positioning block 7, positioning block 7 is used to assist marking, again in conjunction with the function of positioning block 7 auxiliary mark, it is more intuitive to confirm the placement position of chip in the operation process of operator, to realize the accurate positioning alignment of chip and substrate strip, cutting port 6 is internally provided in epoxy resin material strip 1, cutting port 6 is used to provide cutting entry, when needing to cut substrate strip into single chip module, cutting port 6 provides cutting entry, operator can use cutting tool to cut substrate strip along cutting port 6, conveniently and quickly divide it into required size and shape, satisfy different packaging needs.
[0025] With reference to Figure 2 - Figure 4The heat dissipation fin 12 is fixedly connected inside the epoxy resin material belt 1, and heat is generated during the working process of the chip, at which time the heat is transmitted to the heat dissipation fin 12 through the line layer 2 by the arrangement of the heat dissipation fin 12, the heat dissipation groove 11 is arranged inside the heat dissipation fin 12, and the heat dissipation area is increased by the arrangement of the heat dissipation groove 11, which is beneficial to heat dissipation and improves the heat dissipation efficiency of the chip, in addition, the high-thermal-conductivity ceramic micropowder or graphene nanometer material added in the epoxy resin material belt 1 also helps heat conduction, further improving the heat dissipation effect, the heat dissipation fin 12 can cooperate with the heat dissipation groove 11 to assist the chip in dissipating heat, the buffer layer 8 is fixedly connected to the lower surface of the epoxy resin material belt 1, the buffer layer 8 is made of a high-molecular material with good elasticity, and when the chip is impacted by external force or expands due to temperature change, the stress transmission between the metal conductive material belt 9 and the chip can be effectively reduced, the metal conductive material belt 9 is fixedly connected to the lower surface of the buffer layer 8, and the metal conductive material belt 9 is responsible for transmitting electrical signals between the chip and the external circuit, ensuring the normal electrical connection and signal transmission of the chip, and the insulating material belt 10 is fixedly connected to the lower surface of the metal conductive material belt 9, and the insulating material belt 10 is made of polyethylene and is located below the metal conductive material belt 9, effectively preventing short circuit between the wires.
[0026] Working principle: when the non-contact chip is packaged, first, the substrate strip is placed on the workbench of the packaging equipment, then the positioning pin is accurately inserted into the positioning hole one 3 and the positioning hole two 5, the unique position of the substrate strip on the plane is determined by the position and number of the positioning hole one 3 and the special position of the positioning hole two 5 in the middle of the chip slot 4, which can further assist in determining the position of the substrate strip in the chip mounting area, ensuring that the chip is accurately located on the predetermined position during packaging, and combining the function of the positioning block 7 for auxiliary marking, it is convenient for the operator to more intuitively confirm the placement position of the chip during operation, so as to realize the accurate positioning of the chip and the substrate strip, then the wires and circuit layout arranged inside the line layer 2 are welded with the solder inside the chip, so as to realize the convenient packaging of the chip, which can more accurately align the chip and the substrate, improve the packaging precision and consistency, when the substrate strip needs to be cut into a single chip module, the cutting port 6 provides a cutting entrance, and the operator can use a cutting tool to cut the substrate strip along the cutting port 6, which is convenient and fast to cut it into the required size and shape, meeting different packaging needs;
[0027] In the process of chip work, heat will be generated, at this time, through the setting of the heat sink 12, the heat will be transmitted to the heat sink 12 through the circuit layer 2, and through the setting of the heat sink groove 11, the heat dissipation area is increased, which is conducive to the dissipation of heat and improves the heat dissipation efficiency of the chip. In addition, the addition of high-thermal-conductivity ceramic micro powder or graphene and other nanometer materials in the epoxy resin material belt 1 also helps the conduction of heat, further improves the heat dissipation effect, the buffer layer 8 is made of a high-molecular material with good elasticity, when the chip is impacted by external force or thermal expansion and cold contraction occurs due to temperature change, the stress transmission between the metal conductive material belt 9 and the chip can be effectively reduced, the insulating material belt 10 is made of polyethylene, which is located below the metal conductive material belt 9, effectively preventing short circuit between the wires, at the same time, the metal conductive material belt 9 is responsible for transmitting electrical signals between the chip and the external circuit, ensuring the normal electrical connection and signal transmission of the chip.
[0028] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and not for limiting the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, should be included in the protection scope of the present application.
Claims
1. A non-contact chip flip-chip package substrate tape comprising an epoxy resin tape (1), characterized in that: The upper surface of the epoxy material belt (1) is fixedly connected with a circuit layer (2), the epoxy material belt (1) is internally provided with a slicing groove (4), and the epoxy material belt (1) is internally provided with a positioning assembly. The positioning assembly comprises a positioning hole one (3), the positioning hole one (3) is internally provided in the epoxy material belt (1), the epoxy material belt (1) is internally provided with a positioning hole two (5), the positioning hole two (5) is located in the middle of the slicing groove (4), and the upper surface of the epoxy material belt (1) is fixedly connected with a positioning block (7).
2. The non-contact chip flip-chip package substrate strip of claim 1, wherein: The epoxy material belt (1) is internally provided with a cutting port (6), and the cutting port (6) is used for providing a cutting entrance.
3. The non-contact die flip chip substrate strip of claim 1, wherein: The epoxy material belt (1) is internally fixedly connected with a heat dissipation fin (12), and the heat dissipation fin (12) is internally provided with a heat dissipation groove (11).
4. The non-contact chip flip-chip package substrate strip of claim 3, wherein: The heat dissipation fin (12) can cooperate with the heat dissipation groove (11) to assist in heat dissipation of the chip.
5. The non-contact die flip chip substrate strip of claim 1, wherein: The lower surface of the epoxy material belt (1) is fixedly connected with a buffer layer (8), and the buffer layer (8) is made of a high-molecular material with good elasticity.
6. The non-contact chip flip-chip package substrate strip of claim 5, wherein: The lower surface of the buffer layer (8) is fixedly connected with a metal conductive material belt (9), and the lower surface of the metal conductive material belt (9) is fixedly connected with an insulating material belt (10).
7. The non-contact chip flip-chip package substrate strip of claim 6, wherein: The insulating material belt (10) is made of polyethylene, and the insulating material belt (10) is used for preventing short circuit between wires.
8. The non-contact chip flip-chip package substrate strip of claim 1, wherein: The epoxy material belt (1) is internally added with graphene nanometer material.