Burning connecting seat of tiny chip

Abstract

The utility model discloses a burning connecting seat of an extremely small chip, which structurally comprises a burner, a burning seat PCB (printed circuit board), a Connecter connector and a test Socket end seat, the burner is provided with a communication pin, the burning seat PCB and the test Socket end seat are fixed through screws, the burning seat PCB is connected with the burner communication pin through the Connecter connector, the burning seat PCB is connected with the burner communication pin through the Connecter connector, and the burning seat PCB is connected with the test Socket end seat through the Connecter connector. The test Socket end seat is connected with a high-frequency probe, and the burner is conducted with the high-frequency probe through a PCB (Printed Circuit Board). The utility model belongs to the field of chip processing, and particularly relates to a burning connecting seat of an extremely small chip.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the chip processing field, specifically point to a kind of extremely small chip's burning connection seat. BACKGROUND

[0002] With the rise of wearable devices, wearable devices are small in size, low in power consumption and require long-term stable operation, which requires semiconductor chips to have small size and low power consumption. The biggest feature of WLCSP wafer-level chip packaging is to effectively reduce the packaging size. The high integration of WLCSP chip volume determines that WLCSP chip must use high-precision burning test seat to ensure the positioning accuracy of chip solder BallPad and test pin, reduce WLCSP chip solder ball damage, and improve the yield of WLCSP chip burning and testing. Currently, the market can realize offline burning and testing of WLCSP chip size, and the size is usually greater than 2mmx2mm, which is difficult to install and disassemble small size chips for subsequent offline burning and testing. SUMMARY

[0003] The technical problem to be solved by the utility model is that it is difficult to realize offline burning and testing of small size WLCSP8 (0.672mmX1.227).

[0004] To solve the above problems, the technical scheme adopted by the utility model is as follows: the burning connection seat of extremely small chip provided by the utility model, including burner, communication pin is provided on the burner, further comprising: burning seat PCB board, Connecter connector and test Socket end seat, the burning seat PCB board and test Socket end seat are fixedly connected by screws, the burning seat PCB board is connected with communication pin through Connecter connector, the test Socket end seat is connected with high-frequency probe, and the burner is in conduction with high-frequency probe through PCB board.

[0005] Further, the diameter of the high-frequency probe is 0.25mm.

[0006] Further, the test Socket end seat comprises a top cover, a base, a floating plate and a probe hole, the top cover and the base are slidably connected at the upper portion, and the top cover and the base are both provided as a mouth-shaped frame structure.

[0007] Further, the connection between the base and the top cover is fixed as a layered plate.

[0008] Further, a limiting guide groove is formed in the middle of the base, and the floating plate and the limiting guide groove are slidably connected at the lower portion.

[0009] Further, the base is rotatably connected with a pressure buckle on the left and right sides. Further, the base is rotatably connected with a pressure buckle on the left and right sides.

[0010] Further, the base lower part is slidably connected with a bottom plate, the bottom plate upper end abuts against the floating plate lower part, the probe holes and the high-frequency probes are slidably connected, and the probe holes are provided with eight groups and sequentially penetrate the bottom plate and the floating plate.

[0011] The beneficial effects achieved by the utility model are as follows:

[0012] The extremely small chip burning connecting seat provided by the scheme can complete the installation and dismounting of small size WLCSP8 (0.672mmX1.227) chips by pressing the top cover through the design of the test Socket end seat, is convenient for subsequent offline burning and testing, is convenient to use, and has high practicability. BRIEF DESCRIPTION OF DRAWINGS

[0013] Fig. 1 It is a first overall structure schematic view of the test Socket end seat of the utility model;

[0014] Fig. 2 It is an internal structure schematic view of the test Socket end seat of the utility model;

[0015] Fig. 3 It is a second overall structure schematic view of the test Socket end seat of the utility model.

[0016] 1, top cover, 2, base, 3, pressing buckle, 4, layered plate, 5, limiting guide groove, 6, floating plate, 7, bottom plate, 8, probe hole.

[0017] The drawings are used to provide further understanding of the utility model, and constitute a part of the specification, are used together with the embodiments of the utility model to explain the utility model, and do not constitute the limitation of the utility model. DETAILED DESCRIPTION

[0018] The technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model, obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments; based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor fall within the protection scope of the utility model.

[0019] As Figs. 1-3As shown, the utility model provides a kind of burning connection seat of minimum chip, including burner, and communication pin is equipped on burner, further include: burning seat PCB board, Connecter connector and test Socket end seat, burning seat PCB board and test Socket end seat are fixed using screw, burning seat PCB board is connected with the communication pin of burner by Connecter connector, test Socket end seat is connected with high-frequency probe, burner output SDA\SCL signal is communicated with high-frequency probe by PCB board sub, and the diameter of high-frequency probe is 0.25mm.

[0020] As Figs. 1-3 As shown, test Socket end seat includes top cover 1, base 2, floating plate 6 and probe hole 8, top cover 1 and base 2 upper portion slidingly embedded connection, top cover 1 and base 2 are all provided as mouth type frame structure, base 2 and top cover 1 connecting place are fixed as layered board 4, limit guide slot 5 is formed in the middle of base 2, floating plate 6 and limit guide slot 5 lower portion are slidingly embedded connection, base 2 left and right sides are rotatably connected with pressure buckle 3, base 2 lower portion slidingly embedded connection has bottom plate 7, and the upper end of bottom plate 7 and the lower portion of floating plate 6 are abutted, probe hole 8 and high-frequency probe are slidingly embedded connection, and probe hole 8 is provided with eight groups, and sequentially penetrates bottom plate 7 and floating plate 6.

[0021] Specification:

[0022] Insulation resistance is 100mohm or less than 1A (initial);Insulation withstand voltage: 100VAC per minute;Insulation resistance is 1000mohm or more;Working temperature is -40℃ to +125℃, and maximum covering force is 3kgf.

[0023] Specific use, test Socket end seat is fixed on burning seat PCB board using screw, and burning seat PCB board is connected with the communication pin of burner by Connector connector.Burner output SDA\SCL signal is communicated with high-frequency probe by burning seat PCB board, and small size chip is burned and tested.

[0024] Chip insertion operation is first pushed down (4mm) to top cover 1, until it stops, then the chip is inserted into the top of No.1 burner, then loosen top cover 1, and the chip is fixed in place.

[0025] Chip disassembly operation, push down (4mm) to top cover 1 until it stops, then take out the chip (when top cover 1 is pushed down, the chip can be pulled out using vacuum method.).

[0026] The above has described the utility model and its implementation mode, which is not restrictive, and the drawings only show one of the implementation modes of the utility model, and the actual structure is not limited thereto. In summary, if a person skilled in the art is inspired thereby, without departing from the creative purpose of the utility model, similar structural modes and embodiments are not creatively designed, which should belong to the protection scope of the utility model.

Claims

1. A burning connection seat of a very small chip, comprising a burner, wherein a communication pin is arranged on the burner. Also include: The burning seat PCB board, the connector and the test socket, the burning seat PCB board and the test socket are fixedly connected through the screw, the burning seat PCB board is connected with the communication pin through the connector, the test socket is connected with the high frequency probe, the burner is conducted through the PCB board and the high frequency probe.

2. The programming socket of claim 1, wherein: The diameter of the high frequency probe is 0.25mm.

3. The programming socket of claim 2, wherein: The test socket includes a top cover, a base, a floating plate and a probe hole, the top cover and the base are slidably connected, and the top cover and the base are provided as a mouth type frame structure.

4. The programming socket of claim 3, wherein: The connecting part of the base and the top cover is fixed as a layered plate.

5. The programming socket of claim 4, wherein: The middle part of the base is provided with a limiting guide groove, and the floating plate and the lower part of the limiting guide groove are slidably connected.

6. The programming socket of claim 5, wherein: The base is rotatably connected with a pressure buckle on the left and right sides.

7. The programming socket of claim 6, wherein: The base is slidably connected with a bottom plate at the lower part, the upper end of the bottom plate abuts against the lower part of the floating plate, the probe hole is slidably connected with the high frequency probe, and eight groups of probe holes are provided and sequentially penetrate the bottom plate and the floating plate.

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