Overheat protection circuit and sound equipment

Abstract

The utility model relates to the technical field of electronic circuits, and discloses an overheat protection circuit and sound equipment, the overheat protection circuit comprises a power supply end, a relay driving module, a temperature sensing module and a heat dissipation module, the relay driving module and the heat dissipation module are both connected with the power supply end, and the relay driving module is connected with the temperature sensing module. The temperature sensing module is connected with the relay driving module and the heat dissipation module, and the temperature sensing module is used for sensing the circuit temperature and controlling the relay driving module and the heat dissipation module to be connected or disconnected. Through the design of the temperature sensing module, the internal temperature of the electronic equipment can be monitored in real time, when the temperature is too high, the heat dissipation module is started or the relay driving module is switched off in time, the electronic equipment is effectively prevented from being damaged due to overheating, the stability of the electronic equipment is improved, and the service life of the electronic equipment is prolonged.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electronic circuits, and particularly relates to an overheat protection circuit and a sound equipment. BACKGROUND

[0002] With the increasing richness of functions of electronic devices such as sound equipment, in order to achieve the required power effect, the number of power transistors or the parallel use of load impedance can be increased, which increases the power consumption and the heat generation.

[0003] However, the internal space of the electronic device is often limited, which may not be able to dissipate heat in time, thereby causing the electronic device to overheat, and in severe cases, causing damage to the electronic device and affecting the normal service life and performance of the device.

[0004] Therefore, designing an effective overheat protection circuit is crucial for the stable operation of the electronic device. CONTENT OF THE INVENTION

[0005] In order to solve the problems of the prior art, the application provides an overheat protection circuit and a sound equipment, which can monitor the internal temperature of the electronic device in real time through the design of the temperature sensing module, and start the heat dissipation module or disconnect the relay driving module in time when the temperature is too high, thereby effectively preventing the electronic device from being damaged due to overheating and improving the stability and service life of the electronic device.

[0006] The technical effects achieved by the application are realized through the following aspects:

[0007] In a first aspect, the application provides an overheat protection circuit, which comprises a power supply end, a relay driving module, a temperature sensing module and a heat dissipation module, the relay driving module and the heat dissipation module are connected with the power supply end, and the temperature sensing module is connected with the relay driving module and the heat dissipation module, the temperature sensing module is used for sensing the circuit temperature and controlling the conduction or disconnection of the relay driving module and the heat dissipation module.

[0008] In some implementations, the temperature sensing module comprises a voltage comparison unit U1, a thermistor R11, a resistor R10, a resistor R8 and a resistor R12.

[0009] The thermistor R11 is connected with the positive terminal of the voltage comparison unit U1, the resistors R10 and R8 are respectively connected with the negative terminal of the voltage comparison unit U1, the resistor R12 is connected between the output terminal of the voltage comparison unit U1 and the relay driving module, and the heat dissipation module is connected with the output terminal of the voltage comparison unit U1.

[0010] In some implementations, the heat dissipation module includes a transistor Q5, a fan motor M1, and a resistor R17.

[0011] The base of the transistor Q5 is connected to the output of the voltage comparison unit U1, the collector of the transistor Q5 is connected to one end of the fan motor M1, the other end of the fan motor M1 is connected to the resistor R17, and the resistor R17 is connected between the emitter of the transistor Q5 and the ground.

[0012] In some implementations, the relay drive module includes a transistor Q4, a resistor R6, a transistor Q2, a resistor R3, a composite transistor, and a relay K1.

[0013] The base of the transistor Q4 is connected to the output of the voltage comparison unit U1.

[0014] The resistor R6 is connected between the collector of the transistor Q4 and the base of the transistor Q2.

[0015] The collector of the transistor Q2 is connected to the emitter of the transistor Q4.

[0016] The resistor R3 is connected between the emitter of the transistor Q2 and the resistor R6.

[0017] The emitter of the transistor Q2 is connected to the base of the composite transistor, and the collector of the composite transistor is connected to the relay K1.

[0018] In some implementations, the composite transistor includes a transistor Q1 and a transistor Q3, the emitter of the transistor Q1 is connected to the base of the transistor Q3, and the emitter of the transistor Q3 is connected to the ground; the collector of the transistor Q1 and the collector of the transistor Q3 are connected, and both the collector of the transistor Q1 and the collector of the transistor Q3 are connected to the relay K1.

[0019] The resistor R4 is connected between the base of the transistor Q1 and the emitter of the transistor Q2.

[0020] In some implementations, a first rectifier filter unit is provided between the power supply end and the relay drive module.

[0021] In some implementations, the first rectifier filter unit includes a diode D1 and a capacitor EC1, the anode of the diode D1 is connected to the power supply end, the cathode of the diode D1 is respectively connected to the relay drive module, one end of the capacitor EC1, and the other end of the capacitor EC1 is connected to the ground.

[0022] In some implementations, the heat dissipation module further comprises an anti-interference unit and a second rectifier filter unit, the anti-interference unit is connected to both ends of the fan motor M1, the second rectifier filter unit is connected between the anti-interference unit and the emitter of the transistor Q5, and the second rectifier filter unit is grounded.

[0023] In some implementations, the anti-interference unit comprises a resistor R13 and a capacitor C2 connected in parallel; and the second rectifier filter unit comprises a voltage stabilizing diode Z1 and a capacitor EC3 connected in parallel, the anode of the voltage stabilizing diode Z1 is grounded, and the cathode of the voltage stabilizing diode Z1 is connected with the resistor R17.

[0024] In a second aspect, the present application provides a sound equipment comprising the overheat protection circuit as described above.

[0025] In summary, the present application has at least the following advantages:

[0026] The overheat protection circuit provided by the present application can sense the temperature inside the equipment and output a corresponding voltage signal by using a temperature sensing module, and compare the voltage signal with the threshold value of a comparison circuit, thereby controlling the heat dissipation module to be turned on, so as to dissipate the heat inside the circuit. When affected by more heat, the phase voltage of the temperature sensing module is higher by one step, thereby controlling the relay driving module to be turned off, so as to protect the driving equipment and the load equipment, effectively ensure the timeliness of heat dissipation, avoid causing overheating damage, and ensure the safe and stable operation of the circuit. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 Fig. 1 is a structure diagram of an overheat protection circuit in an embodiment of the present application. Figure 1 .

[0028] Figure 2 Fig. 1 is a structure diagram of an overheat protection circuit in an embodiment of the present application. Figure 2 .

[0029] Figure 3 Fig. 2 is a structure diagram of an overheat protection circuit in another embodiment of the present application.

[0030] Figure 4 Fig. 3 is a structure diagram of a sound equipment in a third embodiment of the present application.

[0031] Markings in the figure:

[0032] 100, overheat protection circuit, AC_VCC, power supply end, 1, relay driving module, 2, temperature sensing module, 3, heat dissipation module, 31, anti-interference unit, 32, second rectifier filter unit, 4, first rectifier filter unit; 200, sound equipment. DETAILED DESCRIPTION

[0033] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. The described embodiments are part of the embodiments of the present application, rather than all the embodiments of the present application.

[0034] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art without creative labor based on the embodiments in the present application belong to the scope of protection of the present application.

[0035] Embodiment 1:

[0036] Please refer to the drawings Figures 1-2 A kind of overheat protection circuit of the present application, including power supply end AC_VCC, relay drive module 1, temperature sensing module 2 and heat dissipation module 3, relay drive module 1, heat dissipation module 3 are connected with power supply end AC_VCC, and temperature sensing module 2 is connected with relay drive module 1, heat dissipation module 3, temperature sensing module 2 is used to sense circuit temperature and control the conduction or disconnection of relay drive module 1, heat dissipation module 3 respectively.

[0037] Power supply end AC_VCC is used to power supply for load. Temperature sensing module 2 is used to sense the temperature inside the device, and the corresponding voltage signal is compared with the threshold value of comparison circuit, and the corresponding drive signal is output according to the comparison result to control the conduction or disconnection of the following relay drive module 1, heat dissipation module 3.

[0038] Temperature sensing module 2 includes voltage comparison unit U1, thermistor R11, resistance R10, resistance R8 and resistance R12;Thermistor R11 is connected with the positive terminal of voltage comparison unit U1, resistance R10, resistance R8 is connected with the negative terminal of voltage comparison unit U1 respectively, resistance R12 is connected between the output terminal of voltage comparison unit U1 and relay drive module 1, heat dissipation module 3 is connected with the output terminal of voltage comparison unit U1.

[0039] The heat dissipation module 3 includes transistor Q5, fan motor M1 and resistance R17;The base of transistor Q5 is connected with the output terminal of voltage comparison unit U1, the collector of transistor Q5 is connected with one end of fan motor M1, the other end of fan motor M1 is connected with resistance R17, and resistance R17 is connected between the emitter of transistor Q5 and ground.

[0040] The overheat protection circuit 100 in the embodiment, when the thermistor R11 is affected by temperature, the resistance value changes, the voltage enters the positive terminal of the voltage comparison unit U1, through the effect of the resistance R10, the resistance R8 and the resistance R12, the voltage comparison unit U1 outputs high potential, so that the transistor Q5 of the heat dissipation module 3 is turned on, and then the fan motor M1 is driven to work, the heat dissipation module 3 performs heat dissipation operation on the circuit, effectively ensures the heat dissipation performance, avoids damage of the electronic equipment due to overheating, and ensures the stable operation of the circuit.

[0041] The relay driving module 1 comprises a transistor Q4, a resistance R6, a transistor Q2, a resistance R3, a composite transistor and a relay K1; the base of the transistor Q4 is connected with the output end of the voltage comparison unit U1; the resistance R6 is connected between the collector of the transistor Q4 and the base of the transistor Q2; the collector of the transistor Q2 is connected with the emitter of the transistor Q4; the resistance R3 is connected between the emitter of the transistor Q2 and the resistance R6; the emitter of the transistor Q2 is connected with the base of the composite transistor, and the collector of the composite transistor is connected with the relay K1.

[0042] Specifically, the composite transistor is a Darlington tube, and the composite transistor comprises a transistor Q1 and a transistor Q3; the emitter of the transistor Q1 is connected with the base of the transistor Q3, and the emitter of the transistor Q3 is connected with the ground; the collector of the transistor Q1 and the collector of the transistor Q3 are connected, and both the collector of the transistor Q1 and the collector of the transistor Q3 are connected with the relay K1; the resistance R4 is connected between the base of the transistor Q1 and the emitter of the transistor Q2.

[0043] In the overheat protection circuit 100 of the embodiment, when the thermistor R11 is affected by higher temperature, the resistance value changes again, so that the phase voltage of the voltage comparison unit U1 increases by one step, and then the voltage comparison unit U1 outputs high potential to the resistance R10, the transistor Q2 and the transistor Q4 are turned on, and the composite transistor is disconnected, so that the connection is cut off, the driving equipment and the load equipment are protected, the timeliness of heat dissipation is effectively ensured, the damage caused by overheating is avoided, and the stability and service life of the electronic equipment are improved.

[0044] Embodiment 2:

[0045] The difference between the embodiment and the embodiment 1 is that, as shown in Figure 3 , the first rectifier filter unit 4 is arranged between the power supply end AC_VCC and the relay driving module 1.

[0046] Specifically, the first rectifier filter unit 4 includes a diode D1 and a capacitor EC1, the anode of the diode D1 is connected with the power terminal AC_VCC, the cathode of the diode D1 is connected with the relay drive module 1 and one end of the capacitor EC1 respectively, and the other end of the capacitor EC1 is grounded. Through the setting, the current can be rectified and filtered, the stability of the power supply is ensured, and the power supply quality is ensured.

[0047] In some embodiments, the heat dissipation module 3 further includes an anti-interference unit 31 and a second rectifier filter unit 32, the anti-interference unit 31 is connected to both ends of the fan motor M1, the second rectifier filter unit 32 is connected between the anti-interference unit 31 and the emitter of the transistor Q5, and the second rectifier filter unit 32 is grounded.

[0048] Specifically, the anti-interference unit 31 includes a resistor R13 and a capacitor C2 in parallel; the second rectifier filter unit 32 includes a zener diode Z1 and a capacitor EC3 in parallel, the anode of the zener diode Z1 is grounded, and the cathode of the zener diode Z1 is connected with the resistor R17.

[0049] Through the setting of the anti-interference unit 31, the fan motor M1 can be prevented from interfering with the ground, and the stable operation of the fan is ensured. And through the setting of the second rectifier filter unit 32, the output voltage is basically maintained constant, the influence of the ripple on the circuit is reduced, the voltage is more stable, and the normal work of the heat dissipation module 3 is ensured.

[0050] Embodiment 3:

[0051] Based on the above-mentioned embodiments, the sound equipment 200 is provided, which includes the overheat protection circuit 100 as mentioned above. Figure 4

[0052] The sound equipment 200 in the embodiment can ensure that the heat generated by high power is dissipated in time, effectively avoids damage to the sound equipment 200 caused by overheating, enhances the protection capability of the sound equipment 200, and at the same time improves the service life and safety of the sound equipment 200.

[0053] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances.

[0054] ​In the description of the application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the application is usually placed, and are only used to facilitate the description of the application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0055] In addition, the terms "horizontal", "vertical", "overhang", and the like do not mean that the component must be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0056] In this application, unless otherwise explicitly specified and limited, the first feature above or below the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature above, above and above the second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the horizontal height of the first feature is higher than that of the second feature. The first feature below, below and below the second feature includes that the first feature is directly below and obliquely below the second feature, or only means that the horizontal height of the first feature is less than that of the second feature.

[0057] Although the description of the application is made in conjunction with the above specific embodiments, it is obvious that those skilled in the art can make many substitutions, modifications and changes based on the above content. Therefore, all such alternatives, improvements and changes are included in the spirit and scope of the appended claims.

Claims

1. An overheat protection circuit, characterized by, The temperature sensing module is used for sensing the circuit temperature and respectively controlling the turn-on or turn-off of the relay driving module and the heat dissipation module.

2. The overheat protection circuit of claim 1, wherein The temperature sensing module comprises a voltage comparison unit U1, a thermistor R11, a resistor R10, a resistor R8 and a resistor R12. The thermistor R11 is connected with the positive terminal of the voltage comparison unit U1, the resistor R10 and the resistor R8 are respectively connected with the negative terminal of the voltage comparison unit U1, the resistor R12 is connected between the output terminal of the voltage comparison unit U1 and the relay driving module, and the heat dissipation module is connected with the output terminal of the voltage comparison unit U1.

3. The overheat protection circuit of claim 2, wherein, The heat dissipation module comprises a transistor Q5, a fan motor M1 and a resistor R17. The base of the transistor Q5 is connected with the output terminal of the voltage comparison unit U1, the collector of the transistor Q5 is connected with one end of the fan motor M1, the other end of the fan motor M1 is connected with the resistor R17, and the resistor R17 is connected between the emitter of the transistor Q5 and the ground.

4. The overheat protection circuit of claim 2, wherein The relay driving module comprises a transistor Q4, a resistor R6, a transistor Q2, a resistor R3, a compound transistor and a relay K1. The base of the transistor Q4 is connected with the output terminal of the voltage comparison unit U1. The resistor R6 is connected between the collector of the transistor Q4 and the base of the transistor Q2. The collector of the transistor Q2 is connected with the emitter of the transistor Q4. The resistor R3 is connected between the emitter of the transistor Q2 and the resistor R6. The emitter of the transistor Q2 is connected with the base of the compound transistor, and the collector of the compound transistor is connected with the relay K1.

5. The overheat protection circuit of claim 4, wherein, The compound transistor comprises a transistor Q1 and a transistor Q3, the emitter of the transistor Q1 is connected with the base of the transistor Q3, and the emitter of the transistor Q3 is connected with the ground; the collector of the transistor Q1 and the collector of the transistor Q3 are connected, and the collector of the transistor Q1 and the collector of the transistor Q3 are both connected with the relay K1. The resistor R4 is connected between the base of the transistor Q1 and the emitter of the transistor Q2.

6. The overheat protection circuit of claim 1, wherein The first rectification filtering unit is arranged between the power supply end and the relay driving module.

7. The overheat protection circuit of claim 6, wherein The first rectification filtering unit comprises a diode D1 and a capacitor EC1, the anode of the diode D1 is connected with the power supply end, the cathode of the diode D1 is respectively connected with the relay driving module and one end of the capacitor EC1, and the other end of the capacitor EC1 is connected with the ground.

8. The overheat protection circuit of claim 3, wherein, The heat dissipation module further comprises an anti-interference unit and a second rectification filter unit, the anti-interference unit is connected to both ends of the fan motor M1, the second rectification filter unit is connected between the anti-interference unit and the emitter of the transistor Q5, and the second rectification filter unit is grounded.

9. The overheat protection circuit of claim 8, wherein, The anti-interference unit comprises a resistor R13 and a capacitor C2 connected in parallel; the second rectification filter unit comprises a voltage stabilizing diode Z1 and a capacitor EC3 connected in parallel, the anode of the voltage stabilizing diode Z1 is grounded, and the cathode of the voltage stabilizing diode Z1 is connected with the resistor R17.

10. Sound apparatus, characterized in that A circuit for overheat protection as claimed in any one of claims 1-9.

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