Gigabit multichannel ONU equipment

Abstract

The utility model discloses gigabit multichannel ONU equipment, belongs to the technical field of ONU equipment, and solves the problem that the existing gigabit ONU equipment cannot work efficiently due to insufficient heat dissipation. The ONU equipment comprises an ONU equipment main body, the ONU equipment main body comprises an upper shell and a lower shell, the peripheries of the upper shell and the lower shell are provided with a plurality of heat dissipation channels, a circuit board is arranged between the upper shell and the lower shell, a first heat dissipation device and a second heat dissipation device are arranged above and below the circuit board respectively, and the circuit board is provided with a plurality of through holes used for communicating the upper shell and the lower shell. According to the ONU equipment, heat in the upper shell and the lower shell can be mutually transferred through the plurality of through holes in the circuit board, the phenomenon of non-uniform heat in the upper shell and the lower shell is avoided, synchronous heat dissipation of the upper shell and the lower shell can be realized through the first radiator and the second radiator, the heat dissipation efficiency of the ONU equipment main body is improved, and the service life of the ONU equipment main body is prolonged. And the device can efficiently and stably work for a long time.

Description

Technical Field

[0001] This utility model relates to the field of ONU equipment technology, specifically to a gigabit multi-channel ONU device. Background Technology

[0002] ONU (Optical Network Unit) devices are commonly referred to as "optical modems" or "fiber optic modems." Gigabit ONU devices offer advantages such as high bandwidth, low latency, and strong connectivity, enabling individual users to enjoy a faster internet experience while also providing robust communication support for businesses and organizations, thus promoting the development of the digital economy. However, gigabit ONU devices are prone to overheating, which can affect performance.

[0003] To address the aforementioned issues, prior art, such as CN218276715U, discloses a multi-structure heat dissipation ONU, which includes a lower housing, an upper housing on top of the lower housing, and a wiring board at the rear of both the lower and upper housings; a base is located at the bottom of the ONU device, and a protective frame is installed on the exterior of the ONU device. This invention facilitates real-time monitoring of the temperature within the space above and below the control circuit board by using temperature sensors and detectors mounted on the upper part of the control circuit board. This allows for the control of four sets of second and first temperature-controlled turbine fans to rapidly dissipate heat from the space above and below the control circuit board. Furthermore, two sets of ventilation slots at the bottom of the ONU device further facilitate heat dissipation.

[0004] However, the multi-structure heat dissipation ONU dissipates heat from the upper and lower housings through the second temperature-controlled turbo fan and the first temperature-controlled turbo fan, respectively. The heat between the upper and lower housings cannot be effectively conducted to each other, resulting in the inability to dissipate heat between the upper and lower housings simultaneously. Therefore, the heat dissipation performance of the multi-structure heat dissipation ONU is still insufficient. Utility Model Content

[0005] To address the aforementioned problems in the prior art, this utility model provides a gigabit multi-channel ONU device, which solves the problem that existing gigabit ONU devices cannot work efficiently due to insufficient heat dissipation.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] A gigabit multi-channel ONU device is provided, including an ONU device body. The ONU device body includes an upper shell and a lower shell with multiple heat dissipation channels on all four sides. A circuit board is disposed between the upper shell and the lower shell. A first heat sink and a second heat sink are disposed above and below the circuit board, respectively. The circuit board has multiple through holes for connecting the upper shell and the lower shell.

[0008] The beneficial effects of this utility model are as follows: In this solution, the multiple through holes provided on the circuit board enable the heat in the upper and lower housings to be transferred to each other, which not only avoids the uneven heat distribution in the upper and lower housings, but also enables the synchronous heat dissipation of the upper and lower housings through the first and second heat sinks, thereby improving the heat dissipation efficiency of the ONU device body and enabling it to work efficiently and stably for a long time.

[0009] Furthermore, multiple components are disposed on the upper surface of the circuit board, and thermal pads are disposed on the top of the components and on the lower surface of the circuit board. The placement of the thermal pads can effectively conduct the heat generated by the components to the first or second heat sink, thereby improving heat dissipation efficiency.

[0010] Furthermore, the second heat sink includes two stacked pin-type heat sinks, with a power board electrically connected to the circuit board, the first heat sink, and the two pin-type heat sinks positioned between them. The two stacked pin-type heat sinks increase the heat dissipation area and improve heat dissipation efficiency. Positioning the power board between the two pin-type heat sinks not only optimizes the internal space layout but also allows the heat from the power board to be dissipated more evenly, further enhancing the heat dissipation effect.

[0011] Furthermore, the multiple heat dissipation channels on the lower housing are all vertical strip-shaped holes arranged along the thickness direction of the lower housing.

[0012] Furthermore, multiple vertical strip holes are arranged in two layers on the lower housing, with the two layers of vertical strip holes located around the two pin-type heat sinks respectively.

[0013] Furthermore, the multiple heat dissipation channels on the upper casing are all horizontal strip-shaped holes. The horizontal strip-shaped holes facilitate natural air convection, helping to remove heat more quickly and thus enhancing the heat dissipation effect.

[0014] Furthermore, the length of the horizontal strip hole is less than the length of the vertical strip hole.

[0015] Furthermore, the thickness of the lower casing is greater than that of the upper casing. This design of the lower casing thickness provides more internal space for accommodating the second heat sink, thereby improving heat dissipation performance.

[0016] Furthermore, the length and width of the upper shell are greater than those of the lower shell, and the lower shell is fixed at the exact center of the upper shell. This arrangement of the lower and upper shells helps to concentrate and guide heat outward, promoting better air circulation and enhancing heat dissipation efficiency.

[0017] Furthermore, the upper housing includes a top shell, and the bottom of the top shell is provided with an inner shell for fixing the first radiator. The inner shell facilitates fixing the first radiator. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a gigabit multi-channel ONU device;

[0019] Figure 2 A cross-sectional view of a gigabit multi-channel ONU device;

[0020] The components are: 1. Lower housing; 2. Power board; 3. Second heat sink; 4. Thermal pad; 5. Components; 6. Circuit board; 7. First heat sink; 8. Inner housing; 9. Upper housing; 10. Heat dissipation channel. Detailed Implementation

[0021] The specific embodiments of this utility model are described below to enable those skilled in the art to understand this utility model. However, it should be understood that this utility model is not limited to the scope of the specific embodiments. For those skilled in the art, as long as various changes are within the spirit and scope of this utility model as defined and determined by the appended claims, these changes are obvious. All utility model creations utilizing the concept of this utility model are within the scope of protection.

[0022] Furthermore, the following descriptions of the embodiments are made with reference to the accompanying illustrations, which illustrate specific embodiments in which the invention can be implemented. Directional terms used in this invention, such as "up," "down," "front," "rear," "left," "right," "inner," "outer," and "side," are merely directional references to the accompanying illustrations. Therefore, the directional terms used are for better and clearer explanation and understanding of the invention, and are not intended to indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0023] This embodiment provides a gigabit multi-channel ONU device, the purpose of which is to solve the problem that existing gigabit ONU devices cannot work efficiently due to insufficient heat dissipation. It will be shown in detail below.

[0024] refer to Figure 1 and Figure 2 The gigabit multi-channel ONU device includes an ONU device body, which comprises an upper housing 9 and a lower housing 1 fixedly connected together. Both the upper housing 9 and the lower housing 1 are rectangular structures. The length and width of the upper housing 9 are greater than the length and width of the lower housing 1, respectively, and the lower housing 1 is fixed at the center of the upper housing 9. Multiple heat dissipation channels 10 are provided on the four sides of both the upper housing 9 and the lower housing 1.

[0025] A circuit board 6 is disposed between the upper housing 9 and the lower housing 1. A first heat sink 7 and a second heat sink 3 are respectively disposed above and below the circuit board 6, and the circuit board 6 has multiple through holes for connecting the upper housing 9 and the lower housing 1. The multiple through holes on the circuit board 6 allow heat to be transferred between the upper housing 9 and the lower housing 1, which not only avoids uneven heat distribution between the upper housing 9 and the lower housing 1, but also enables synchronous heat dissipation of the upper housing 9 and the lower housing 1 through the first heat sink 7 and the second heat sink 3, thereby improving the heat dissipation efficiency of the ONU device body and enabling it to work efficiently and stably for a long time.

[0026] To facilitate fixing the first radiator 7, the upper housing 9 includes a top housing, and the bottom of the top housing is provided with an inner housing 8 for fixing the first radiator 7.

[0027] To improve heat dissipation efficiency, multiple components 5 are disposed on the upper surface of the circuit board 6, and thermal pads 4 are disposed on the top of the components 5 and on the lower surface of the circuit board 6. The thermal pads 4 are high-performance gap-filling thermally conductive materials, mainly used as the interface between electronic devices and heat sinks or product housings. They possess good adhesion, flexibility, good compressibility, and excellent thermal conductivity, significantly increasing heat dissipation. In this embodiment, the thermal pads 4 on the lower surface of the circuit board 6 can be disposed in sections or as a single piece, with multiple holes on the single thermal pad 4 corresponding one-to-one with multiple through holes on the circuit board 6.

[0028] Specifically, as the specific structure of the first heat sink 7 and the second heat sink 3, the first heat sink 7 is a pin-type heat sink, and the second heat sink 3 includes two stacked pin-type heat sinks, with a power board 2 that is electrically connected to the circuit board 6, the first heat sink 7 and the two pin-type heat sinks between the two pin-type heat sinks.

[0029] In this embodiment, the circuit board 6 is a PCB board, and the lower housing 1 is provided with an interface that is electrically connected to the circuit board 6. The circuit board 6, the power board 2, and the interface are all existing technologies. Since they are all existing technologies, this embodiment will not elaborate on their specific working principles and connection relationships.

[0030] As a further embodiment, the lower housing 1 is installed inside the wall. The thickness of the lower housing 1 is greater than the thickness of the upper housing 9. The multiple heat dissipation channels 10 on the lower housing 1 are all vertical strip holes arranged along the thickness direction of the lower housing 1. The multiple vertical strip holes are arranged in two layers on the lower housing 1, and the two layers of vertical strip holes are located around the two pin-type heat sinks respectively. The multiple heat dissipation channels 10 on the upper housing 9 are all horizontal strip holes.

[0031] The heat dissipation principle of this solution is as follows:

[0032] The lower housing 1 is fixed inside the wall. Some of the heat generated by the components 5 on the circuit board 6 is conducted to the second heat sink 3 through the thermal pad 4 and through holes. The second heat sink 3 evens out the heat and then radiates the heat to the wall through multiple vertical strip holes.

[0033] Another portion of the heat generated by the components 5 on the circuit board 6 is conducted to the first heat sink 7 through the thermal pad 4 and through conduction. The first heat sink 7 dissipates heat to the atmosphere through natural convection through multiple horizontal strip holes.

[0034] Although the specific embodiments of the utility model have been described in detail with reference to the accompanying drawings, this should not be construed as limiting the scope of protection of this patent. Various modifications and variations that can be made by those skilled in the art without inventive effort within the scope described in the claims still fall within the scope of protection of this patent.

Claims

1. A gigabit multi-channel ONU device, characterized by, The application relates to an ONU device body which comprises an upper shell (9) and a lower shell (1) provided with a plurality of heat dissipation channels (10) around the periphery, a circuit board (6) arranged between the upper shell (9) and the lower shell (1), a first heat sink (7) and a second heat sink (3) arranged above and below the circuit board (6) respectively, and a plurality of through holes for connecting the upper shell (9) and the lower shell (1) are formed in the circuit board (6).

2. The gigabit multi-lane ONU device of claim 1, wherein, A plurality of components (5) are arranged on the upper surface of the circuit board (6), and a heat conduction pad (4) is arranged on the top of each component (5) and the lower surface of the circuit board (6).

3. The gigabit multi-lane ONU device of claim 1, wherein, The second heat sink (3) comprises two stacked needle-shaped heat sinks, and a power board (2) electrically connected with the circuit board (6), the first heat sink (7) and the two needle-shaped heat sinks is arranged between the two needle-shaped heat sinks.

4. The gigabit multi-lane ONU device of claim 3, wherein, The plurality of heat dissipation channels (10) on the lower shell (1) are vertical strip holes arranged along the thickness direction of the lower shell (1).

5. The gigabit multi-lane ONU device of claim 4, wherein, The plurality of vertical strip holes are arranged on the lower shell (1) in a two-layer arrangement mode, and the two layers of vertical strip holes are located around the two needle-shaped heat sinks.

6. The gigabit multi-lane ONU device of claim 4, wherein, The plurality of heat dissipation channels (10) of the upper shell (9) are horizontal strip holes.

7. The gigabit multi-lane ONU device of claim 6, wherein, The length of the horizontal strip hole is smaller than that of the vertical strip hole.

8. The gigabit multi-channel ONU device of claim 1, wherein, The thickness of the lower shell (1) is greater than that of the upper shell (9).

9. The gigabit multi-lane ONU device of claim 1, wherein, The length and width of the upper shell (9) are greater than those of the lower shell (1), and the lower shell (1) is fixed at the center of the upper shell (9).

10. The gigabit multi-channel ONU device of claim 1, wherein, The upper shell (9) comprises a top shell, and an inner shell (8) for fixing the first heat sink (7) is arranged at the bottom of the top shell.

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