Chip circuit board structure

Abstract

The utility model relates to the technical field of circuit boards, in particular to a chip circuit board structure which comprises a fixing assembly used for fixing, a heat dissipation assembly used for heat dissipation and a circuit board used for installing the fixing assembly and the heat dissipation assembly. A plurality of pins are arranged on the two sides of the mounting plate, contact holes are formed in the tops of one ends of the pins, the pins are L-shaped, limiting grooves are formed in the two sides of the top of the mounting plate, a circuit board is placed on a horizontal table top, the mounting plate is pressed downwards, the limiting buckles are extruded towards the two sides through the bottom of the mounting plate, and the telescopic rods and the limiting springs are extruded towards the two sides through the limiting buckles; the bottom of the mounting plate is in contact with the circuit board, the limiting buckles are pushed into the limiting grooves in the two sides of the top of the mounting plate through the reset elastic force of the limiting springs, fixing is achieved, the mounting plate and the chip can be assembled and disassembled conveniently, and efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field, and specifically is a chip circuit board structure. BACKGROUND

[0002] Through the search, the utility model discloses a kind of circuit board structure facilitating welding chip with announcement No.CN215499759U, including chip, chip includes core plate, several evenly arranged pin on the both sides of core plate;Chip is close to lower end and is provided with the circuit board that can be fixed with pin insertion;The upper surface of circuit board is provided with several insertion slots matched with pin insertion, and several insertion slots are single-face opening structure;Pin is inserted into the inside of corresponding insertion slot one by one, and chip plate is pressed down, so that pin is completely inserted into the inside of insertion slot, and in the process of pressing, by the cooperation of protruding block and card slot, pin and circuit board are fixed and installed between.

[0003] The above-mentioned circuit board structure facilitating welding chip is welded to the upper surface of metal plate and the connecting part of pin by welding device, and the single-face opening structure of insertion slot is set, the mechanical tight fitting inlay method between pin and insertion slot is used to embed chip on circuit board, and the device is directly through wave peak welding, which saves reflow soldering or red glue process, but in the above-mentioned technology, the device needs to be welded to realize circuit communication and fixation during installation, which consumes more manpower, and it is not easy to replace when chip is damaged.

[0004] In view of the above, we provide a kind of chip circuit board structure. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of chip circuit board structure to solve the problems raised in the above background.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0007] A kind of chip circuit board structure, comprising:

[0008] Fixing assembly for fixing and heat dissipation assembly for heat dissipation, and circuit board for installing fixing assembly and heat dissipation assembly;

[0009] The top of the circuit board is provided with a mounting plate, the inside of the mounting plate is provided with a chip, the two sides of the mounting plate are provided with a plurality of pins, one end of the pin is provided with a contact hole at the top, the pin is in the shape of "L", and the top of the mounting plate is provided with a limiting slot on both sides.

[0010] Preferably, the fixing assembly comprises fixing plates, the front and rear sides of the mounting plate are provided with fixing plates, the inner side of the fixing plate is provided with a movable slot, the inside of the movable slot is provided with a limiting buckle, the limiting buckle and the limiting slot are connected, and the limiting buckle is in the shape of "L".

[0011] Preferably, the bottom end of the limiting buckle is movably connected with the inner wall of the movable slot, the inside of the movable slot is provided with a telescopic rod, the two ends of the telescopic rod are fixedly connected with the limiting buckle and the fixing plate respectively, and the outer side of the telescopic rod is sleeved with a limiting spring.

[0012] Preferably, the top of the circuit board is symmetrically provided with two fixing frames, a corresponding number of placing slots are formed in the top of the fixing frame and correspond to the positions of the pins, and the inside of the placing slot is provided with a contact point matched with the contact hole.

[0013] Preferably, the heat dissipation assembly comprises a heat dissipation fan, and the bottom end of the circuit board is provided with a through groove, and the outer side of the bottom end of the through groove is provided with the heat dissipation fan.

[0014] The working principle and beneficial effects of the utility model are as follows:

[0015] The utility model discloses a circuit board is placed on the horizontal desktop, and the mounting plate is pressed downward, the limiting buckle is extruded to the both sides through the bottom of the mounting plate, the telescopic rod and the limiting spring are extruded to the both sides through the limiting buckle, the bottom of the mounting plate is contacted with the circuit board, the limiting buckle is pushed into the limiting slot of the both sides of the top of the mounting plate through the elastic force of the reset of the limiting spring, realizes fixed, and the mounting plate and the chip are assembled and disassembled, and the efficiency is improved.

[0016] The utility model discloses opening the heat dissipation fan, rotating through the heat dissipation fan, and the heat of the chip is discharged to the rear through the through groove, and the heat dissipation fan is used for the heat dissipation of the chip, avoids the chip overheating and leads to the service life to reduce. ACCOUNT OF DRAWINGS

[0017] Figure 1 It is the external structure schematic diagram of the utility model;

[0018] Figure 2 It is the mounting plate structure schematic diagram of the utility model;

[0019] Figure 3 It is the through groove structure schematic diagram of the utility model;

[0020] Figure 4 It is the heat dissipation fan structure schematic diagram of the utility model;

[0021] Figure 5 It is the utility model Figure 1 It is the structure schematic diagram of the utility model in A place.

[0022] In the figure: 1, circuit board; 2, through slot; 3, heat dissipation fan; 4, mounting plate; 5, pin; 6, contact hole; 7, fixed frame; 8, placing groove; 9, contact point; 10, fixed plate; 11, movable slot; 12, limit buckle; 13, telescopic rod; 14, limit spring; 15, limit slot; 16, chip. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0024] As shown in Figures 1-5 A chip circuit board structure, characterized in that, comprising:

[0025] A fixed assembly for fixing and a heat dissipation assembly for heat dissipation, and a circuit board 1 for mounting the fixed assembly and the heat dissipation assembly;

[0026] The top of the circuit board 1 is provided with a mounting plate 4, the inside of the mounting plate 4 is provided with a chip 14, and the two sides of the mounting plate 4 are provided with a plurality of pins 5. One end of the pin 5 is provided with a contact hole 6 at the top, the pin 5 is in the shape of "L", and the top of the mounting plate 4 is provided with a limit slot 15 on both sides.

[0027] As shown in Figure 1 and Figure 2 The fixed assembly comprises a fixed plate 10, the front and rear sides of the mounting plate 4 are provided with the fixed plate 10, the inside of the fixed plate 10 is provided with a movable slot 11, the inside of the movable slot 11 is provided with a limit buckle 12, the limit buckle 12 is connected with the limit slot 15, and the limit buckle 12 is in the shape of "L";

[0028] The bottom end of the limit buckle 12 is movably connected with the inner wall of the movable slot 11, the inside of the movable slot 11 is provided with a telescopic rod 13, the two ends of the telescopic rod 13 are fixedly connected with the limit buckle 12 and the fixed plate 10 respectively, and the outside of the telescopic rod 13 is provided with a limit spring 14.

[0029] In the embodiment, the circuit board 1 is placed on a horizontal desktop, the mounting plate 4 is pressed downward, the limit buckle 12 is extruded to the two sides through the bottom of the mounting plate 4, the limit buckle 12 extrudes the telescopic rod 13 and the limit spring 14 to the two sides, the bottom of the mounting plate 4 is in contact with the circuit board 1, the limit buckle 12 is pushed into the limit slot 15 on both sides of the top of the mounting plate 4 through the elastic force of the limit spring 14 reset, the fixing is realized, the mounting plate 4 and the chip 16 are convenient to assemble and disassemble, and the efficiency is improved.

[0030] As Figure 2 and Figure 3 shown, the top of the circuit board 1 is symmetrically provided with two fixing frames 7, and the top of the fixing frame 7 is provided with a corresponding number of placing grooves 8 corresponding to the position of the pin 5, and the inside of the placing groove 8 is provided with a contact point 9 matched with the contact hole 6;

[0031] The heat dissipation assembly includes a heat dissipation fan 3, and the bottom end of the circuit board 1 is provided with a through groove 2, and the outer side of the bottom end of the through groove 2 is provided with the heat dissipation fan 3.

[0032] In this embodiment, the heat dissipation fan 3 is opened, the heat dissipation fan 3 is rotated, the heat emitted by the chip 14 is discharged to the rear through the through groove 2, and the chip 14 is cooled by the heat dissipation fan 3, so that the service life of the chip 14 is not shortened due to overheating.

[0033] In summary, the working principle is:

[0034] For such a chip circuit board structure, first, the circuit board 1 is placed on the horizontal desktop, the mounting plate 4 is pressed downward, the mounting plate 4 is pressed to the left and right through the bottom of the mounting plate 4, the limiting buckle 12 is pressed to the left and right, the telescopic rod 13 and the limiting spring 14 are stretched, and the bottom of the mounting plate 4 is in contact with the circuit board 1;

[0035] Secondly, the pins 5 on both sides of the mounting plate 4 are matched with the placing grooves 8 above the fixing frame 7, the contact holes 6 are matched and installed with the contact points 9, the limiting buckle 12 is pushed into the limiting groove 15 on the top of the mounting plate 4 through the elastic force of the limiting spring 14 reset, the fixing is realized, and the mounting plate 4 and the chip 16 are assembled and disassembled, and the efficiency is improved;

[0036] Then, the heat dissipation fan 3 is opened, the heat dissipation fan 3 is rotated, the heat emitted by the chip 14 is discharged to the rear through the through groove 2, and the chip 14 is cooled by the heat dissipation fan 3, so that the service life of the chip 14 is not shortened due to overheating.

[0037] Finally, when the mounting plate 4 and the chip 16 need to be disassembled, the limiting buckle 12 is pushed to the left and right, the top end of the limiting buckle 12 moves out of the limiting groove 15, the telescopic rod 13 and the limiting spring 14 are pressed to the left and right, and the mounting plate 4 is taken out, so that the disassembly and replacement are facilitated.

[0038] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A chip-on-board structure, characterized by comprising: Include: The fixed component for fixing and the heat dissipation component for heat dissipation, and the circuit board (1) for installing the fixed component and the heat dissipation component; The top of the circuit board (1) is provided with a mounting plate (4), the inside of the mounting plate (4) is provided with a chip (14), and the two sides of the mounting plate (4) are provided with a plurality of pins (5), one end of the pin (5) is provided with a contact hole (6) at the top, the pin (5) is "L" shaped, and the top of the mounting plate (4) is provided with a limiting groove (15).

2. A chip-on-board structure according to claim 1, wherein: The fixed component includes a fixed plate (10), the front and rear sides of the mounting plate (4) are provided with a fixed plate (10), the inside of the fixed plate (10) is provided with a movable slot (11), the inside of the movable slot (11) is provided with a limiting buckle (12), the limiting buckle (12) and the limiting groove (15) are connected, and the limiting buckle (12) is "L" shaped.

3. A chip-on-board structure according to claim 2, wherein: The bottom end of the limiting buckle (12) is movably connected with the inner wall of the movable slot (11), the inside of the movable slot (11) is provided with a telescopic rod (13), the two ends of the telescopic rod (13) are respectively fixedly connected with the limiting buckle (12) and the fixed plate (10), and the outside of the telescopic rod (13) is sleeved with a limiting spring (14).

4. The chip-on-board structure of claim 1, wherein: The top of the circuit board (1) is symmetrically provided with two fixing frames (7), the top of the fixing frame (7) is provided with a corresponding number of placing grooves (8) corresponding to the position of the pin (5), and the inside of the placing groove (8) is provided with a contact point (9) matched with the contact hole (6).

5. The chip-on-board structure of claim 1, wherein: The heat dissipation component includes a heat dissipation fan (3), the bottom end of the circuit board (1) is provided with a through groove (2), and the outside of the bottom end of the through groove (2) is provided with a heat dissipation fan (3).

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