Local composite heat dissipation PCB (printed circuit board)

Abstract

The utility model relates to the technical field of circuit boards, and discloses a local composite heat dissipation PCB circuit board, which comprises a circuit board and a heat dissipation assembly, the heat dissipation assembly wraps the side part of the circuit board, a heating element is fixed on the circuit board, the heat dissipation assembly is formed by splicing a frame plate, a bottom plate and a side edge plate, the frame plate and the bottom plate are oppositely arranged, and the side edge plate is fixed on the side edge plate. A side edge plate is fixed to the side edge, and a circulating groove is formed in the side portion of the side edge plate. Heat dissipation holes communicated with internal metal sheets are formed in the bottom of a circuit board, a bottom plate is additionally arranged at the bottom of the circuit board, through holes opposite to the heat dissipation holes are formed in the bottom plate, a silica gel gasket is additionally arranged between the bottom plate and the circuit board, and air flow cools the internal silica gel gasket through the through holes. And cold air generated by the silica gel gasket enters the circuit board from the heat dissipation holes to cool the metal sheet at the bottom of the heating element, so that the heat dissipation effect on the heating element is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a partially composite heat dissipation PCB circuit board. Background Technology

[0002] A multilayer circuit board (MWB) is a printed circuit board composed of multiple circuit patterns, typically used in high-density, high-performance electronic devices. Compared to single-sided and double-sided circuit boards, MWBs have more circuit layers, enabling more complex circuit designs and higher functional integration. They are an indispensable basic component in modern electronics technology, supporting higher-performance and more complex devices through the stacking and meticulous design of multiple circuits. Although their manufacturing cost is higher and their design is more challenging, they offer irreplaceable advantages in improving circuit performance, reducing size, and increasing integration.

[0003] Currently, existing PCB circuit boards are usually directly installed inside the mounting bracket. By installing heat dissipation components inside the mounting bracket, the heat dissipation components generate airflow when they operate, and the airflow blows onto the circuit board to dissipate heat. However, this does not have a significant heat dissipation effect on the heat-generating components on the circuit board, resulting in a short service life for the circuit board and certain defects. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a locally composite heat dissipation PCB circuit board, which has the advantages of improving the heat dissipation effect of heat-generating components on the circuit board and increasing the service life of the circuit board. It solves the problem that the current method of using heat dissipation components to heat the circuit board results in insufficient heat dissipation of heat-generating components, leading to a short service life of the circuit board.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a partially composite heat dissipation PCB circuit board, comprising a circuit board and a heat dissipation component, wherein the heat dissipation component covers the side of the circuit board, a heat-generating element is fixed on the circuit board, and the heat dissipation component can dissipate heat and cool down the heat-generating element on the circuit board.

[0006] The heat dissipation assembly is composed of a frame plate, a bottom plate, and side plates. The frame plate and the bottom plate are arranged opposite each other, and a side plate is fixed to the side. A flow groove is opened on the side of the side plate. The frame plate is attached to the top of the circuit board, the bottom plate is attached to the bottom of the circuit board, and the side plate is attached to the side of the circuit board to cover the circuit board. Airflow is blown into the heat dissipation assembly through the flow groove to dissipate heat from the heat-generating components on the circuit board.

[0007] As a further improvement to the above solution, the circuit board is provided with positioning holes, and a positioning rod is inserted into the positioning holes. The two ends of the positioning rod are fixed to the frame plate and the base plate.

[0008] With the above technical solution, positioning holes are provided at the four directional corner positions on the circuit board, and a positioning rod is inserted into each positioning hole. The positioning rod passes through the corresponding positions of the frame plate and the base plate, thereby improving the stability between the circuit board and the frame plate and the base plate.

[0009] As a further improvement to the above solution, the bottom of the circuit board is provided with heat dissipation holes, and a through hole is provided through the bottom plate, with the through hole corresponding to the heat dissipation holes.

[0010] With the above technical solution, the heat dissipation hole at the bottom of the circuit board is semi-hole shaped. The heat dissipation hole is connected to the metal layer inside the circuit board and is also connected to the through hole on the base plate, so that the airflow enters the heat dissipation hole from the through hole to dissipate heat and cool down the internal metal sheet, thereby quickly reducing the temperature of the heat-generating component.

[0011] As a further improvement to the above solution, a rubber ring is fixed inside the heat dissipation hole, and a collar is fixed at the edge of the through hole interface, with the collar movably fitted inside the rubber ring.

[0012] With the above technical solution, when the base plate and the circuit board are closed, the collar passes through the heat dissipation hole and is pressed against the rubber ring. Under the elastic force of the rubber ring, it is tightly attached to the side of the collar, which improves the stability of the installation between the base plate and the circuit board.

[0013] As a further improvement to the above solution, a filter screen is fixed inside the collar, and the filter screen is movably sleeved inside the heat dissipation hole.

[0014] With the above technical solution, a filter screen is fixed inside the interface at the top of the collar. The filter screen is used to intercept dust. When the collar is put into the heat dissipation hole, the filter screen is placed inside the heat dissipation hole, which makes it easier to clean the dust in the heat dissipation hole later and prevents the dust from clogging the heat dissipation hole.

[0015] As a further improvement to the above solution, the bottom of the circuit board is provided with burrs, which are attached to the base plate.

[0016] With the above technical solution, when the circuit board and the base plate are closed, the burrs are tightly attached to the bottom of the circuit board, increasing the frictional resistance.

[0017] As a further improvement to the above solution, a silicone pad is installed on the base plate, and the silicone pad is attached to the bottom of the circuit board.

[0018] With the above technical solution, the silicone pad is located between the circuit board and the base plate. After the airflow enters through the through hole, it cools the silicone pad. The cold air generated by the silicone pad enters the interior of the circuit board through the heat dissipation hole, and dissipates and cools the metal sheet of the internal heat-generating component.

[0019] As a further improvement to the above solution, a sealing ring is fixed to the bottom of the frame plate, and the sealing ring is attached to the circuit board.

[0020] The above technical solution increases the stability between the frame board and the circuit board, preventing loosening.

[0021] As a further improvement to the above solution, a protruding button is provided on the base plate, which abuts against the silicone pad.

[0022] With the above technical solution, when the base plate and the bottom of the circuit board are closed, the protruding button will abut the silicone pad against the bottom of the circuit board, preventing the silicone pad from shifting.

[0023] In use, this partially composite heat dissipation PCB board is assembled by mounting a frame plate on the top surface of the circuit board and then mounting a base plate on the bottom surface of the circuit board, ensuring that the edges of the frame plate and base plate are flush with the circuit board. Side plates are fixed to the four sides of the frame plate and base plate, allowing the heat dissipation component to cover the sides of the circuit board. When the base plate is installed on the bottom of the circuit board, the collar is fitted into the heat dissipation holes, and the filter is attached to the depth of the heat dissipation holes until the base plate and the circuit board are completely attached. The burrs are then tightly attached to the corresponding positions on the base plate. When the entire PCB board is installed in the external mounting component, the airflow generated by the heat sink operation inside the mounting component enters the heat dissipation component through the flow channel, cooling the silicone pads. The cool air generated by the silicone pads enters the depth of the circuit board through the heat dissipation holes, dissipating heat from the heat-generating components.

[0024] Compared with the prior art, this utility model provides a partially composite heat dissipation PCB circuit board, which has the following beneficial effects:

[0025] 1. This partially composite heat dissipation PCB circuit board has heat dissipation holes at the bottom of the circuit board that communicate with the internal metal plates. A base plate is installed at the bottom of the circuit board, and through holes are opened on the base plate opposite to the heat dissipation holes. A silicone pad is installed between the base plate and the circuit board. Airflow through the through holes cools the internal silicone pad. The cold air generated by the silicone pad enters the circuit board through the heat dissipation holes, cooling the metal plates at the bottom of the heat-generating components, thereby effectively improving the heat dissipation effect of the heat-generating components.

[0026] 2. In this partially composite heat dissipation PCB circuit board, when the base plate and the circuit board are closed, the collar drives the filter screen into the heat dissipation hole, thereby effectively preventing dust from accumulating in the heat dissipation hole, facilitating the cleaning of the heat dissipation hole later, and further improving the service life of the circuit board. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall external structure of the device of this utility model;

[0028] Figure 2 This is a schematic diagram of the top planar structure of the base plate of this utility model;

[0029] Figure 3 This utility model Figure 1 Schematic diagram of the structure at point A in the middle;

[0030] Figure 4 This is a partial structural diagram of the separation between the base plate and the circuit board of this utility model.

[0031] The attached diagram lists the components represented by each number as follows:

[0032] 1. Circuit board; 101. Heating element; 102. Positioning hole; 103. Positioning rod; 104. Heat dissipation hole; 105. Rubber ring; 106. Burr;

[0033] 2. Heat dissipation components; 201. Frame plate; 202. Base plate; 203. Side plate; 204. Flow groove; 205. Sealing ring; 206. Silicone gasket; 207. Protruding button; 208. Through hole; 209. Collar; 210. Filter screen. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example 1

[0035] Please see Figures 1-4 As shown, the partially composite heat dissipation PCB circuit board proposed in this embodiment includes a circuit board 1 and a heat dissipation component 2. The heat dissipation component 2 covers the side of the circuit board 1. A heat-generating element 101 is fixed on the circuit board 1. The heat dissipation component 2 can dissipate heat and cool down the heat-generating element 101 on the circuit board 1.

[0036] The heat dissipation assembly 2 is assembled from a frame plate 201, a base plate 202, and a side plate 203. The frame plate 201 and the base plate 202 are arranged opposite to each other, and the side plate 203 is fixed to the side. A flow groove 204 is provided on the side of the side plate 203. The frame plate 201 is attached to the top of the circuit board 1, the base plate 202 is attached to the bottom of the circuit board 1, and the side plate 203 is attached to the side of the circuit board 1, thus covering the circuit board 1. Airflow is blown into the heat dissipation assembly 2 through the flow groove 204 to dissipate heat from the heat-generating components on the circuit board 1.

[0037] The working principle of the partially composite heat dissipation PCB circuit board proposed in this embodiment is as follows: In use, the frame plate 201 is installed on the top surface of the circuit board 1, and the base plate 202 is installed on the bottom of the circuit board 1, so that the frame plate 201 and the base plate 202 are flush with the edge of the circuit board 1. Side plates 203 are fixed on the four sides of the frame plate 201 and the base plate 202, so that the heat dissipation component 2 covers the side of the circuit board 1. When the base plate 202 is installed on the bottom of the circuit board 1, the collar 209 is fitted into the heat dissipation hole. In step 104, the filter 210 is attached to the depth of the heat dissipation hole 104 until the base plate 202 and the circuit board 1 are completely attached. The burr 106 is attached to the corresponding position on the base plate 202. When the PCB board is installed in the external mounting component, the airflow generated by the heat sink in the mounting component enters the heat dissipation component 2 through the flow channel 204 to cool the silicone pad 206. The cold air generated by the silicone pad 206 enters the depth of the circuit board 1 through the heat dissipation hole 104 to dissipate heat from the heat-generating element 101. Example 2

[0038] Please see Figures 1-4 As shown, the partially composite heat dissipation PCB circuit board proposed in this embodiment, based on Embodiment 1, further includes: a positioning hole 102 on the circuit board 1, a positioning rod 103 inserted into the positioning hole 102, both ends of the positioning rod 103 fixed to the frame plate 201 and the base plate 202; a heat dissipation hole 104 on the bottom of the circuit board 1; and a through hole 208 on the base plate 202, corresponding to the heat dissipation hole 104; a rubber ring 105 fixed inside the heat dissipation hole 104; and a collar 2 fixed to the interface edge of the through hole 208. 09. The collar 209 is movably fitted inside the rubber ring 105. A filter screen 210 is fixed inside the collar 209. The filter screen 210 is movably fitted inside the heat dissipation hole 104. A burr 106 is provided at the bottom of the circuit board 1. The burr 106 is attached to the base plate 202. A silicone gasket 206 is installed on the base plate 202. The silicone gasket 206 is attached to the bottom of the circuit board 1. A sealing ring 205 is fixed at the bottom of the frame plate 201. The sealing ring 205 is attached to the circuit board 1. A protruding button 207 is provided on the base plate 202. The protruding button 207 abuts against the silicone gasket 206.

[0039] In this design, positioning holes 102 are provided at the four directional corners of the circuit board 1, and positioning rods 103 are inserted into each positioning hole 102. The positioning rods 103 penetrate the corresponding positions of the frame plate 201 and the base plate 202, improving the stability between the circuit board 1 and the frame plate 201 and the base plate 202. The heat dissipation hole 104 at the bottom of the circuit board 1 is semi-hole-shaped. The heat dissipation hole 104 connects to the metal layer inside the circuit board 1 and is connected to the through hole 208 on the base plate 202, allowing airflow to enter the heat dissipation hole 104 from the through hole 208 to dissipate heat and cool the internal metal sheet, thereby quickly reducing the temperature of the heat-generating component. When the base plate 202 and the circuit board 1 are closed, the collar 209 passes through the heat dissipation hole 104 and is pressed against the rubber ring 105. Under the elastic force of the rubber ring 105, it is tightly attached to the side of the collar 209, improving the stability of the installation between the base plate 202 and the circuit board 1. The top of the collar 209 is connected to the... A filter screen 210 is fixed inside the opening to intercept dust. When the collar 209 is fitted into the heat dissipation hole 104, the filter screen 210 is placed inside the heat dissipation hole 104, which facilitates the cleaning of dust in the heat dissipation hole 104 later and prevents dust from clogging the heat dissipation hole 104. When the circuit board 1 and the base plate 202 are closed, the burr 106 is tightly attached to the bottom of the circuit board 1 to increase frictional resistance. The silicone gasket 206 is located between the circuit board 1 and the base plate 202. After the airflow enters through the through hole 208, it cools the silicone gasket 206. The cold air generated by the silicone gasket 206 enters the interior of the circuit board 1 through the heat dissipation hole 104 to dissipate heat and cool the metal sheet of the internal heat-generating component. The sealing ring 205 increases the stability between the frame plate 201 and the circuit board 1 to prevent loosening. When the base plate 202 and the bottom of the circuit board 1 are closed, the protruding button 207 abuts the silicone gasket 206 against the bottom of the circuit board to prevent the silicone gasket 206 from shifting.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A local composite heat-dissipation PCB circuit board, comprising a circuit board (1) and a heat-dissipation assembly (2), characterized in that, The heat dissipation assembly (2) is covered on the side of the circuit board (1), and the heat generating element (101) is fixed on the circuit board (1); The heat dissipation assembly (2) is spliced by a frame plate (201), a bottom plate (202) and a side plate (203), the frame plate (201) and the bottom plate (202) are oppositely arranged, and the side plate (203) is fixed on the side, and the flow-through groove (204) is formed in the side of the side plate (203).

2. The local composite heat-dissipation PCB circuit board according to claim 1, characterized in that: The positioning hole (102) is formed in the circuit board (1), the positioning rod (103) is inserted in the positioning hole (102), and the two ends of the positioning rod (103) are fixed on the frame plate (201) and the bottom plate (202).

3. A local composite heat-dissipation PCB circuit board according to claim 2, characterized in that: The heat dissipation hole (104) is formed in the bottom of the circuit board (1), and the through hole (208) is formed in the bottom plate (202) and corresponds to the heat dissipation hole (104).

4. The local composite heat-dissipation PCB circuit board according to claim 3, characterized in that: The rubber ring (105) is fixed in the heat dissipation hole (104), and the sleeve ring (209) is fixed on the interface edge of the through hole (208) and movably sleeved in the rubber ring (105).

5. A locally composite heat dissipating PCB circuit board according to claim 4, characterized in that: The sleeve ring (209) is fixed in the heat dissipation hole (104), and the sleeve ring (209) is movably sleeved in the rubber ring (105).

6. A local composite heat dissipating PCB circuit board according to claim 3, characterized in that: The bottom of the circuit board (1) is provided with the burr (106), and the burr (106) is attached to the bottom plate (202).

7. A locally composite heat dissipating PCB circuit board according to claim 6, characterized in that: The bottom plate (202) is provided with the silica gel gasket (206), and the silica gel gasket (206) is attached to the bottom of the circuit board (1).

8. The local composite heat-dissipation PCB circuit board according to claim 2, characterized in that: The bottom of the frame plate (201) is provided with the sealing ring (205), and the sealing ring (205) is attached to the circuit board (1).

9. The local composite heat spreading PCB circuit board of claim 7, wherein: The bottom plate (202) is provided with the convex knob (207), and the convex knob (207) is abutted on the silica gel gasket (206).

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