Transfer device of circuit board

Abstract

The utility model provides a circuit board transfer device, and belongs to the technical field of electronic equipment. The circuit board transfer device comprises a bearing plate, one plate surface of the bearing plate is provided with at least two strip-shaped protrusions used for supporting a circuit board, and each strip-shaped protrusion extends from one side edge of the bearing plate to the other side edge of the bearing plate. According to the invention, the problem that the ink is easy to adhere to the transfer device in the process of transferring the circuit board can be improved, and the preparation yield of the circuit board is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of circuit board transportation equipment, and particularly relates to a circuit board transfer device. BACKGROUND

[0002] A printed circuit board (PCB) is a carrier for carrying electronic components and is used to realize electrical connection between electronic components, and is an important component of electronic equipment. The circuit board generally includes a base plate, a conductive layer and a solder resist layer. The conductive layer is located on the base plate, the conductive layer is patterned by an etching process to form a circuit pattern to realize the transmission of current and signals, and the solder resist layer is covered on the conductive layer to insulate and protect the conductive layer.

[0003] In the related art, when the solder resist layer is prepared on the conductive layer, liquid ink is first coated on the conductive layer, and then the liquid ink is pre-cured so that the liquid ink can be attached to the surface of the conductive layer. Then, the circuit board is transported to the position of the baking equipment by using a transfer device such as a tray, and the ink is baked to solidify the ink on the conductive layer to form the solder resist layer.

[0004] However, when the circuit board is transferred, the ink on the circuit board is easy to contact the surface of the tray, so that the ink adheres to the surface of the tray. This will cause the solder resist layer to be damaged and cannot achieve the purpose of insulation protection, resulting in the scrap of the circuit board. CONTENT OF THE INVENTION

[0005] The present disclosure provides a circuit board transfer device, which can improve the problem that the ink is easy to adhere to the transfer device during the transfer of the circuit board, and improve the production yield of the circuit board. The technical solution is as follows:

[0006] The present disclosure provides a circuit board transfer device, which includes a bearing plate, and at least two strip-shaped protrusions for supporting the circuit board are arranged on one surface of the bearing plate, and each strip-shaped protrusion extends from one side edge to the other side edge of the bearing plate.

[0007] In an implementation manner of the present disclosure, the strip-shaped protrusions are arranged in parallel and at intervals, or at least two of the strip-shaped protrusions intersect.

[0008] In another implementation manner of the embodiment of the present disclosure, the at least two strip-shaped protrusions include a first strip-shaped protrusion and a second strip-shaped protrusion, the first strip-shaped protrusion and the second strip-shaped protrusion are connected perpendicularly; the bearing plate is in a rectangular shape, an end of the first strip-shaped protrusion is located at a midpoint of a short side of the bearing plate, and the first strip-shaped protrusion is perpendicular to the short side of the bearing plate; a distance between an end of the second strip-shaped protrusion and a midpoint of a long side of the bearing plate is 10 mm to 20 mm, and the second strip-shaped protrusion is perpendicular to the long side of the bearing plate.

[0009] In another implementation manner of the embodiment of the present disclosure, a surface of the strip-shaped protrusion away from the bearing plate has a supporting bump.

[0010] In another implementation manner of the embodiment of the present disclosure, the surface of each strip-shaped protrusion has a plurality of supporting bumps, and the supporting bumps on each strip-shaped protrusion are arranged at intervals along a length direction of the strip-shaped protrusion.

[0011] In another implementation manner of the embodiment of the present disclosure, a maximum width of a projection of the supporting bump on the surface of the bearing plate is less than or equal to a width of the strip-shaped protrusion.

[0012] In another implementation manner of the embodiment of the present disclosure, the maximum width of the projection of the supporting bump on the surface of the bearing plate is 30 mm to 40 mm.

[0013] In another implementation manner of the embodiment of the present disclosure, the supporting bump is a conical block or a circular truncated cone block, and a smaller-diameter end of the supporting bump is away from the bearing plate.

[0014] In another implementation manner of the embodiment of the present disclosure, a width of the strip-shaped protrusion is less than or equal to 40 mm.

[0015] In another implementation manner of the embodiment of the present disclosure, the bearing plate is a soft material plate.

[0016] The technical scheme provided by the embodiment of the present disclosure has at least the following beneficial effects:

[0017] The transfer device of the circuit board provided by the embodiment of the present disclosure includes a bearing plate, and a surface of the bearing plate has at least two strip-shaped protrusions. In this way, when the bearing plate is used to transport the circuit board, the circuit board can be in contact with the strip-shaped protrusions protruding from the surface of the bearing plate. That is, the circuit board is supported by the strip-shaped protrusions, and thus the contact area between the bearing plate and the circuit board can be greatly reduced, so that the circuit board is not easy to contact the ink on the circuit board, and the ink on the circuit board is prevented from adhering to the surface of the bearing plate. Meanwhile, the strip-shaped protrusions include at least two strip-shaped protrusions, so that the circuit board loaded on the plurality of strip-shaped protrusions is more stable, and the circuit board is not easy to be tilted on the bearing plate, and the ink on the circuit board is further prevented from contacting the bearing plate.

[0018] And, on the circuit board, there is usually a part of the area that does not need to be coated with ink to achieve insulation. Therefore, the distribution area of the strip-shaped protrusions on the carrier plate can be opposite to the area on the circuit board that does not need to be coated with ink, so that when the circuit board is placed on the carrier plate, the strip-shaped protrusions will only contact the area on the circuit board without ink, and therefore, the strip-shaped protrusions will not contact the ink during the process of supporting the circuit board by the carrier plate, which can maximize the avoidance of the problem of adhesion of the ink to the carrier plate, prevent the subsequent formation of a solder mask from being damaged, and improve the preparation yield of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art without creative labor.

[0020] Figure 1 is a schematic view of a transfer device for a circuit board provided by an embodiment of the present disclosure;

[0021] Figure 2 is a schematic view of another transfer device for a circuit board provided by an embodiment of the present disclosure;

[0022] Figure 3 is a use schematic view of a transfer device for a circuit board provided by an embodiment of the present disclosure.

[0023] The various signs in the drawings are explained as follows:

[0024] 10, carrier plate;

[0025] 20, strip-shaped protrusion;

[0026] 30, support bump;

[0027] 40, circuit board; 41, ink area. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the drawings.

[0029] Unless otherwise defined, technical terms or scientific terms used herein shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first", "second", "third", and the like, as used in the description and the claims of this disclosure do not have any specific meaning, and are merely used to distinguish one component from another. Similarly, the terms "one", "another", and the like, do not limit the quantity of the mentioned objects, and are merely used to distinguish one component from another. The terms "comprise", "comprising", and the like, mean that the elements or objects listed after the terms are encompassed by the terms, and are not exclusive of other elements or objects. The terms "connected" and "coupled" and the like, do not limit the manner in which the components are connected or coupled, and can include electrical, mechanical, or other types of connections or couplings, whether direct or indirect. The terms "upper", "lower", "left", "right", "top", "bottom", and the like, are used to describe relative positions, and can change when the absolute positions of the described objects change.

[0030] Figure 1 is a schematic view of a transfer device for a circuit board according to an embodiment of the present disclosure. As shown in Figure 1 the transfer device includes a carrier plate 10, and a plate surface of the carrier plate 10 has at least two strip-shaped protrusions 20 for supporting a circuit board. Each strip-shaped protrusion 20 extends from one side edge to another side edge of the carrier plate 10.

[0031] The transfer device for a circuit board according to an embodiment of the present disclosure includes a carrier plate 10, and a plate surface of the carrier plate 10 has at least two strip-shaped protrusions 20. In this way, when the carrier plate 10 is used to transport a circuit board, the circuit board can be in contact with the strip-shaped protrusions 20 protruding from the plate surface of the carrier plate 10. That is, the circuit board is supported by the strip-shaped protrusions 20, and thus the contact area between the carrier plate 10 and the circuit board can be greatly reduced, so that the circuit board is less likely to contact the ink on the circuit board, and the ink is prevented from adhering to the plate surface of the carrier plate 10. Meanwhile, the strip-shaped protrusions 20 include at least two strip-shaped protrusions, so that the circuit board loaded on the strip-shaped protrusions 20 is more stable, and the circuit board is less likely to be skewed on the carrier plate 10, further avoiding the contact between the ink of the circuit board and the carrier plate 10.

[0032] In addition, there is usually a part of the area on the circuit board that does not need to be coated with ink to achieve insulation. Therefore, the distribution area of the strip-shaped protrusions 20 on the bearing plate 10 can be opposite to the area on the circuit board that does not need to be coated with ink, so that when the circuit board is placed on the bearing plate 10, the strip-shaped protrusions 20 will only contact the area on the circuit board that does not have ink. Therefore, during the process of supporting the circuit board by the bearing plate 10, the strip-shaped protrusions 20 will not contact the ink at all, which can maximize the avoidance of the problem of adhesion of the ink to the bearing plate 10, prevent the subsequent formation of a solder mask from being damaged, and improve the production yield of the circuit board.

[0033] Optionally, the bearing plate is a soft material plate. For example, the bearing plate is a soft polyvinyl chloride plate. The bearing plate prepared by using this kind of material has small hardness and is not easy to cause damage to the circuit board due to bumping the circuit board.

[0034] In an implementation manner of the present disclosure, the strip-shaped protrusions 20 are arranged in parallel and at intervals.

[0035] By arranging a plurality of strip-shaped protrusions 20 in parallel and at intervals to connect the opposite two side edges of the bearing plate 10, the strength of the bearing plate 10 can be enhanced. Since the bearing plate is usually prepared by using a soft material to avoid bumping the circuit board during transportation and damaging the circuit board, the strip-shaped protrusions 20 arranged to connect the two side edges of the bearing plate 10 can support the bearing plate 10, so that the bearing plate can stably carry the circuit board.

[0036] For example, Figure 2 is a schematic view of another circuit board transfer device provided by an embodiment of the present disclosure. As shown in Figure 2 , two strip-shaped protrusions 20 are arranged on the surface of the bearing plate 10, and the two strip-shaped protrusions 20 are arranged in parallel and at intervals.

[0037] The distribution area of the two strip-shaped protrusions 20 on the bearing plate 10 can be opposite to the area on the circuit board that does not need to be coated with ink. In this way, the strip-shaped protrusions 20 can be prevented from contacting the area on the circuit board that is coated with ink.

[0038] In another implementation manner of the present disclosure, at least two strip-shaped protrusions 20 intersect in the strip-shaped protrusions 20. This arrangement of the strip-shaped protrusions 20 allows the strip-shaped protrusions 20 to support the four side edges of the bearing plate 10, which can maximize the strength of the bearing plate 10 and stably support the circuit board.

[0039] For example, Figure 1 as shown, the at least two strip-shaped protrusions 20 include a first strip-shaped protrusion and a second strip-shaped protrusion, and the first strip-shaped protrusion and the second strip-shaped protrusion are connected perpendicularly.

[0040] Optionally, Figure 1As shown, the shape of the carrier plate 10 is rectangular, the end of the first strip-shaped protrusion is located at the midpoint of the short side of the carrier plate 10, and the first strip-shaped protrusion is perpendicular to the short side of the carrier plate 10; the distance between the end of the second strip-shaped protrusion and the midpoint of the long side of the carrier plate 10 is 10mm to 20mm, and the second strip-shaped protrusion is perpendicular to the long side of the carrier plate 10.

[0041] Wherein, the "first", "second" used in the first strip-shaped protrusion and the second strip-shaped protrusion do not represent any order, quantity or importance, but only distinguish different components.

[0042] Optionally, the width of the strip-shaped protrusion 20 is less than or equal to 40mm. Since the distance between the ink-coated areas on the circuit board is usually about 40mm, the width of the strip-shaped protrusion 20 is less than the gap between the ink-coated areas, so that the strip-shaped protrusion 20 only contacts the area on the circuit board that is not coated with ink, avoiding the problem of ink adhering to the carrier plate 10.

[0043] Optionally, the height of the strip-shaped protrusion 20 is greater than or equal to 3mm. For example, the height of the strip-shaped protrusion 20 is 2mm.

[0044] Therefore, by setting the height of the strip-shaped protrusion 20 to the above size, the strip-shaped protrusion 20 can provide sufficient support to the carrier plate 10 as a reinforcing rib, thereby enhancing the strength of the carrier plate 10.

[0045] Figure 3 is a use schematic diagram of a transfer device for a circuit board provided by an embodiment of the present disclosure. As shown in Figure 3 When the circuit board 40 is placed on the carrier plate 10, the area of the circuit board 40 coated with ink is facing the carrier plate 10, that is, the area of the circuit board 40 coated with ink is facing down.

[0046] As shown in Figure 3 For the circuit board 40 with the ink area 41 arrayed uniformly, since the ink area 41 is easy to be distributed in the central area of the circuit board 40. Therefore, to avoid the strip-shaped protrusion 20 facing the ink area 41 and contacting the ink area 41, part of the strip-shaped protrusion 20 is usually translated from the position of the midpoint of the long side of the carrier plate 10, so that the distance between the end of the strip-shaped protrusion 20 and the midpoint of the long side of the carrier plate 10 is 10mm to 20mm, thereby making the strip-shaped protrusion 20 completely avoid the ink area 41 to prevent the ink from adhering to the carrier plate 10.

[0047] Exemplarily, as shown in Figure 3 The length of the carrier plate 10 is 700mm, and the width of the carrier plate 10 is 590mm.

[0048] The end of the strip-shaped protrusion 20 parallel to the long side of the bearing plate 10 is located at the midpoint of the short side of the bearing plate 10. At this time, the distance from the end of the strip-shaped protrusion 20 to the long side of the bearing plate 10 can be 295 mm.

[0049] The shortest distance from the end of the strip-shaped protrusion 20 parallel to the short side of the bearing plate 10 to the short side of the bearing plate 10 is 335 mm. At this time, the strip-shaped protrusion 20 is equivalent to being shifted 15 mm to the left from the midpoint of the long side of the bearing plate 10. In this way, the strip-shaped protrusion 20 can avoid the ink area of the circuit board.

[0050] Optionally, as shown in Figure 1 , 2 , the surface of the strip-shaped protrusion 20 away from the bearing plate 10 has a supporting bump 30.

[0051] By arranging the supporting bump 30 on the surface of the strip-shaped protrusion 20, the supporting bump 30 supports the circuit board, and compared to directly contacting the circuit board by the strip-shaped protrusion 20, the contact area between the circuit board and the bearing plate 10 can be further reduced, so that the circuit board is less likely to contact the ink on the circuit board, and the ink is prevented from adhering to the surface of the bearing plate 10.

[0052] At the same time, the supporting bump 30 is arranged to abut against the circuit board, so that the distance between the circuit board and the bearing plate 10 is larger, which can further avoid the ink on the circuit board from contacting the surface of the bearing plate 10, prevent the subsequent solder mask layer from being damaged, and improve the production yield of the circuit board.

[0053] Optionally, as shown in Figure 1 , 2 , the surface of each strip-shaped protrusion 20 has a plurality of supporting bumps 30, and the supporting bumps 30 on each strip-shaped protrusion 20 are arranged at intervals along the length direction of the strip-shaped protrusion 20.

[0054] In the above implementation, the supporting bumps 30 arranged at intervals along the length direction of the strip-shaped protrusion 20 change the line contact between the strip-shaped protrusion 20 and the circuit board into point contact between the plurality of supporting bumps 30 and the circuit board. The contact area between the circuit board and the bearing plate 10 can be effectively reduced, so that the circuit board is less likely to contact the ink on the circuit board.

[0055] For example, the arrangement interval of the supporting bumps 30 on the same strip-shaped protrusion 20 can be 5 mm to 20 mm. By arranging the arrangement interval of the supporting bumps 30 in the above range, the supporting bumps 30 can be arranged at an appropriate density, so that the contact area between the supporting bumps 30 and the circuit board is not too small, and the circuit board can be stably placed on the supporting bumps 30.

[0056] Optionally, the support bump 30 is a conical block or a circular truncated cone block, and the smaller-diameter end of the support bump 30 is away from the bearing plate 10.

[0057] In this way, the support bump 30 is set as a conical block or a circular truncated cone block with gradually reduced end size, which can further reduce the contact area between the support bump 30 and the circuit board, so that the circuit board is difficult to contact the ink on the circuit board.

[0058] Optionally, the height of the support bump 30 is greater than or equal to 1 mm. Since the thickness of the ink on the circuit board is usually 25 μm. Therefore, the height of the support bump 30 is set to be greater than the thickness of the ink, so that the ink is also not easy to contact the strip-shaped protrusion 20 or the surface of the bearing plate 10, preventing the ink from adhering to the surface of the bearing plate 10.

[0059] Optionally, as shown in Figure 1 , 2 The maximum width L2 of the orthographic projection of the support bump 30 on the surface of the bearing plate 10 is less than or equal to the width L1 of the strip-shaped protrusion 20.

[0060] In this way, the size of the support bump 30 is smaller than the width of the strip-shaped protrusion 20, preventing the support bump 30 from being too large to contact the area coated with ink on the circuit board, and avoiding the support bump 30 from adhering to the ink.

[0061] Optionally, the maximum width of the orthographic projection of the support bump 30 on the surface of the bearing plate 10 is 30 mm to 40 mm.

[0062] Since the interval of the area coated with ink on the circuit board is usually about 40 mm, the width of the support bump 30 is smaller than the gap between the ink areas, which can just make the support bump 30 only contact the area on the circuit board that is not coated with ink, avoiding the problem of the ink adhering to the bearing plate 10.

[0063] At the same time, the maximum width of the support bump 30 is also controlled to be not less than 30 mm, avoiding the support bump 30 from being too small to support the circuit board stably.

[0064] In other implementations of the present disclosure, the surface of the strip-shaped protrusion 20 away from the bearing plate 10 can also not be provided with a support bump. That is, the strip-shaped protrusion 20 directly contacts the circuit board. Compared with the point contact between the support bump and the circuit board, the strip-shaped protrusion and the circuit board are in line contact. Therefore, the circuit board can be more stably carried on the strip-shaped protrusion.

[0065] The above is not any form of restriction on the present disclosure, although the present disclosure has been disclosed as above by examples, however, not to limit the present disclosure, any skilled person in the art, without departing from the technical solution range of the present disclosure, can make some more changes or modifications as equivalent embodiments of equivalent changes by using the above disclosed technical content, but as long as it does not deviate from the technical solution of the present disclosure, according to the technical essence of the present disclosure, any simple modification, equivalent change and modification of the above examples, still belongs to the range of the technical solution of the present disclosure.

Claims

1. A transfer device for circuit boards, characterized by The transfer device comprises a carrier plate (10), one plate surface of the carrier plate (10) has at least two strip-shaped protrusions (20) for supporting circuit boards, each of the strip-shaped protrusions (20) extends from one side edge to another side edge of the carrier plate (10).

2. The transfer device of claim 1, wherein, Each of the strip-shaped protrusions (20) is arranged in parallel and spaced apart; or, At least two of the strip-shaped protrusions (20) intersect.

3. The transfer device of claim 2, wherein, The at least two strip-shaped protrusions (20) comprise a first strip-shaped protrusion and a second strip-shaped protrusion, the first strip-shaped protrusion and the second strip-shaped protrusion are connected perpendicularly; The carrier plate (10) is rectangular in shape, the end of the first strip-shaped protrusion is located at the midpoint of the short edge of the carrier plate (10), and the first strip-shaped protrusion is perpendicular to the short edge of the carrier plate (10); The distance between the end of the second strip-shaped protrusion and the midpoint of the long edge of the carrier plate (10) is 10mm to 20mm, and the second strip-shaped protrusion is perpendicular to the long edge of the carrier plate (10).

4. The transfer device of claim 1, wherein, The surface of the strip-shaped protrusion (20) away from the carrier plate (10) has a supporting protrusion (30).

5. The transfer device of claim 4, wherein, The surface of each of the strip-shaped protrusions (20) has a plurality of supporting protrusions (30), and the supporting protrusions (30) on each of the strip-shaped protrusions (20) are arranged in spaced apart along the length direction of the strip-shaped protrusion (20).

6. The transfer device of claim 4, wherein, The maximum width of the orthographic projection of the supporting protrusion (30) on the plate surface of the carrier plate (10) is less than or equal to the width of the strip-shaped protrusion (20).

7. The transfer device of claim 4, wherein, The maximum width of the orthographic projection of the supporting protrusion (30) on the plate surface of the carrier plate (10) is 30mm to 40mm.

8. The transfer device of claim 4, wherein, The supporting protrusion (30) is a conical block or a circular truncated cone block, and the smaller end of the supporting protrusion (30) is away from the carrier plate (10).

9. The transfer device of any one of claims 1 to 7, wherein, The width of the strip-shaped protrusion (20) is less than or equal to 40mm.

10. The transfer device of any one of claims 1 to 7, wherein, The carrier plate (10) is a soft material plate.

Images