Heat dissipation structure applied to frequency converter and frequency converter

Abstract

The utility model provides a heat dissipation structure applied to a frequency converter and the frequency converter, and the heat dissipation structure comprises a profile radiator which is provided with tooth sheets on the surface, and the tooth sheets are used for enlarging the heat dissipation area of the frequency converter; the capacitor plate fixing bracket is arranged on the side surface of the profile radiator; a capacitor plate and a driving plate of the frequency converter are independently arranged, the capacitor plate is installed on the capacitor plate fixing support, and the driving plate is installed on one surface, provided with the tooth pieces, of the profile radiator.

Description

Technical Field

[0001] This application belongs to the technical field of variable frequency drive, and relates to a heat dissipation structure, particularly a heat dissipation structure for use in a frequency converter and a frequency converter. Background Technology

[0002] The heat sink in a frequency converter is one of the key components for ensuring the stable operation of the frequency converter. Its main function is to dissipate the heat generated by the frequency converter during operation, prevent the equipment from overheating, thereby extending the service life of the frequency converter and ensuring its efficient operation.

[0003] As a conversion device, a frequency converter generates power consumption during operation. This power consumption varies depending on the load, control method, brand, and specifications of the frequency converter. Data shows that the power consumption of a frequency converter is approximately 4-5% of its capacity. Of this, the inverter section accounts for about 50%, the rectifier and DC (Direct Current) circuits about 40%, and the control and protection circuits 5-15%. The 10°C rule states that when the temperature of a device decreases by 10°C, its reliability doubles. Therefore, reducing temperature rise and improving device reliability are crucial for frequency converters, thereby extending equipment lifespan and better serving society.

[0004] Inverter cooling can be categorized into the following types: natural cooling, forced air cooling, and water cooling.

[0005] Small-capacity frequency inverters generally employ natural cooling, and their operating environment should be well-ventilated and free of dust and easily adhering floating objects. These inverters are often used to drive devices such as air conditioner fans and machine tool engraving machines. They feature low power consumption and an excellent operating environment.

[0006] Furthermore, the capacitance of inverters using natural heat dissipation is not always small. For low-capacity inverters, general heat sinks can be selected, and the heat dissipation area should be maximized within permissible limits, with small spacing between heat sink fins to increase the overall heat dissipation area. For high-capacity inverters, if natural heat dissipation is required, heat pipe heat sinks can be used. Heat pipe heat sinks are a new generation of heat sinks, a product of combining heat pipe technology with radiator technology, and they have extremely high heat dissipation efficiency.

[0007] Forced air cooling refers to the method of directly cooling the equipment casing by using one or more external fans. Since frequency inverters inevitably generate a lot of heat during operation, especially under long-term full-load operation and high ambient temperatures, one or more fans can be added to directly cool the inverter casing to prevent severe overheating. This cooling method is inexpensive, and the number of fans can be increased to enhance the cooling effect if cost is not a concern.

[0008] Water cooling has an inlet and an outlet, and the radiator has multiple water channels inside, which allows it to fully utilize the advantages of water cooling and remove more heat. This is the basic principle of water-cooled radiators. Water cooling is a common method of industrial cooling, but it is rarely used for variable frequency drives (VFDs) because it is costly and bulky. Furthermore, the capacity of VFDs typically ranges from several thousand VA to nearly 100 kVA, making it difficult for users to accept the cost-effectiveness. This method is only used in special applications and for VFDs with extremely large capacities.

[0009] Natural heat dissipation inverters are devices that use natural convection and radiation for heat dissipation. Currently, traditional natural heat dissipation inverters typically employ an integrated capacitor and drive board structure, with the components arranged from bottom to top: heat sink, sheet metal support, drive board, and control board. In this type of structure, the capacitor is on the drive board. An upward-facing capacitor restricts the installation of the control board, while a downward-facing capacitor requires openings in the heat sink or reducing its width, thus decreasing the heat dissipation area, increasing the processing workload, and raising costs. Utility Model Content

[0010] This application provides a heat dissipation structure and a frequency converter for use in frequency converters, which solves the heat dissipation problem of existing natural heat dissipation frequency converters.

[0011] In a first aspect, this application provides a heat dissipation structure for a frequency converter, the heat dissipation structure comprising: a profile heat sink with toothed fins on its surface, the toothed fins being used to increase the heat dissipation area of ​​the frequency converter; a capacitor plate fixing bracket disposed on the side of the profile heat sink; the capacitor plate and the drive plate of the frequency converter being independently disposed, the capacitor plate being mounted on the capacitor plate fixing bracket, and the drive plate being mounted on one of the toothed surfaces of the profile heat sink.

[0012] In one implementation of the first aspect, the profile heat sink includes a substrate and a toothed plate perpendicular to the plane of the substrate, wherein the upper and lower surfaces of the substrate are provided with toothed plates integrally formed with the substrate and having a serrated corrugation.

[0013] In one implementation of the first aspect, the toothed plate includes a main heat dissipation toothed plate and a secondary heat dissipation toothed plate, wherein the main heat dissipation toothed plate is disposed on the lower surface of the substrate, and the secondary heat dissipation toothed plate is disposed on the upper surface of the substrate.

[0014] In one implementation of the first aspect, the capacitor plate fixing bracket includes a U-shaped sheet metal bracket, the U-shaped sheet metal bracket is located on the left side of the profile heat sink, and the capacitor plate is mounted on the U-shaped sheet metal bracket.

[0015] In one implementation of the first aspect, the U-shaped sheet metal bracket is fixed to the profile heat sink by screws, and the capacitor plate is fixed to the U-shaped sheet metal bracket by screws.

[0016] In one implementation of the first aspect, the upper surface of the U-shaped sheet metal bracket is provided with four rivet posts, the capacitor plate is connected to the rivet posts on the upper surface of the U-shaped sheet metal bracket by screws, the capacitor plate is welded with four electrolytic capacitors, and the U-shaped sheet metal bracket has heat dissipation holes on the sheet metal surface near the electrolytic capacitors.

[0017] In one implementation of the first aspect, the drive board of the frequency converter is located above the profile heat sink, the power switch module is located between the profile heat sink and the drive board, and the control board is located above the drive board.

[0018] Secondly, this application provides a frequency converter, which includes the aforementioned heat dissipation structure.

[0019] In one implementation of the second aspect, the frequency converter further includes: a drive board, a power switch module, a control board, and a capacitor board.

[0020] In one implementation of the second aspect, the drive board is fixed above the profile heat sink by copper pillars, the power switch module is disposed between the drive board and the profile heat sink, and the control board is fixed above the drive board by copper pillars.

[0021] As described above, the heat dissipation structure and frequency converter applied to the frequency converter described in this application have the following beneficial effects:

[0022] The profile heat sink consists of a base plate and toothed fins perpendicular to the base plate. The toothed fins are distributed on the upper and lower surfaces of the base plate and have striped wave patterns. Compared with traditional heat sink profiles, the heat dissipation effect is better.

[0023] The U-shaped sheet metal bracket is installed on the side of the radiator and fixed to the profile radiator with screws. The capacitor board is also fixed to the U-shaped sheet metal bracket with screws, which does not occupy space on the profile radiator and makes the installation position more reasonable and convenient. By fixing the capacitor with a simple bracket, the cost is reduced and the heat dissipation capacity of the frequency converter is greatly increased.

[0024] Natural cooling inverters do not require the installation of fans for forced air cooling, and have the advantages of low noise and low cost.

[0025] In traditional naturally cooled inverters, the capacitors are usually placed on the drive board. If the capacitors face upwards, it restricts the installation of the control board. If the capacitors face downwards, it is necessary to make holes in the heat sink, which reduces the heat dissipation area of ​​the heat sink and increases the amount of processing required. Compared with traditional naturally cooled inverters, this invention has better heat dissipation, is easier to install, and has lower costs. Attached Figure Description

[0026] Figure 1 The diagram shown is a schematic diagram of the heat dissipation structure described in an embodiment of this application.

[0027] Figure 2 The diagram shown is a structural schematic of the frequency converter described in an embodiment of this application.

[0028] Figure 3 This diagram shows the component positions of the frequency converter described in this embodiment.

[0029] Figure 4 The diagram shown is a first structural diagram of the frequency converter described in the embodiments of this application.

[0030] Figure 5 The diagram shown is a second structural diagram of the frequency converter described in the embodiments of this application.

[0031] Figure 6 The diagram shown is a third structural diagram of the frequency converter described in the embodiments of this application.

[0032] Component designation explanation

[0033] 1. Profile Radiator

[0034] 1-1 Base board

[0035] 1-2 Main heat sink fins

[0036] 1-3 sets of heat dissipation fins

[0037] 1-4 Top surface of the substrate

[0038] 2 Power Switch Module

[0039] 3. Driver Board

[0040] 4. Control Panel

[0041] 5 capacitor boards

[0042] 6 Electrolytic capacitors

[0043] 7. Capacitor board mounting bracket (U-shaped sheet metal bracket)

[0044] 7-1 Upper surface of U-shaped sheet metal bracket

[0045] 7-2 Rivet Post

[0046] 7-3 Heat dissipation holes

[0047] 7-4 U-shaped sheet metal bracket bottom Detailed Implementation

[0048] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, unless otherwise specified, the following embodiments and features in the embodiments can be combined with each other.

[0049] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. Therefore, the illustrations only show the components related to this application and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0050] The technical solutions in the embodiments of this application will be described in detail below with reference to the accompanying drawings. The purpose of this application is to provide a natural heat dissipation inverter with better heat dissipation, a more reasonable capacitor board mounting position, and a more compact and stable structure, aiming to solve the heat dissipation problem of existing natural heat dissipation inverters.

[0051] Please see Figure 1 The diagram shows a schematic representation of the heat dissipation structure described in an embodiment of this application. Figure 1 As shown in the figure, this embodiment provides a heat dissipation structure for use in frequency converters. The heat dissipation structure includes: a profile heat sink 1 and a capacitor plate fixing bracket 7.

[0052] The profile radiator 1 has toothed plates on its surface, which are used to increase the heat dissipation area of ​​the frequency converter.

[0053] The capacitor plate fixing bracket 7 is located on the side of the profile heat sink 1.

[0054] The capacitor board and drive board of the frequency converter are set independently. The capacitor board is installed on the capacitor board fixing bracket 7, and the drive board is installed on one of the surfaces of the profile heat sink 1 with toothed plates.

[0055] In one embodiment, the profile heat sink includes a substrate and a toothed plate perpendicular to the plane of the substrate. The upper and lower surfaces of the substrate are provided with toothed plates with serrated corrugations integrally formed with the substrate.

[0056] In one embodiment, the heat sink includes a main heat sink and a secondary heat sink, wherein the main heat sink is disposed on the lower surface of the substrate, and the secondary heat sink is disposed on the upper surface of the substrate.

[0057] In one embodiment, the capacitor plate fixing bracket includes a U-shaped sheet metal bracket, which is located on the left side of the profile heat sink, and the capacitor plate is mounted on the U-shaped sheet metal bracket.

[0058] In one embodiment, the U-shaped sheet metal bracket is fixed to the profile heat sink by screws, and the capacitor plate is fixed to the U-shaped sheet metal bracket by screws.

[0059] In one embodiment, the upper surface of the U-shaped sheet metal bracket is provided with four rivet posts, the capacitor plate is connected to the rivet posts on the upper surface of the U-shaped sheet metal bracket by screws, the capacitor plate is welded with four electrolytic capacitors, and the U-shaped sheet metal bracket has heat dissipation holes on the sheet metal surface near the electrolytic capacitors.

[0060] In one embodiment, the inverter's drive board is located above the profile heat sink, the power switch module is located between the profile heat sink and the drive board, and the control board is located above the drive board.

[0061] Therefore, this application adopts a profile heat sink with a larger heat dissipation area and a new capacitor plate mounting method. The profile heat sink is characterized by being composed of a base plate and toothed fins perpendicular to the base plate. The toothed fins are integral with the base plate and are distributed on the upper and lower surfaces of the base plate. The toothed fins are also decorated with striped wavy patterns, resulting in a larger heat dissipation area and better heat dissipation performance compared to traditional heat sink profiles.

[0062] Furthermore, the capacitor is secured by adding a U-shaped sheet metal bracket to the side of the heat sink, allowing it to be fixed to the heat sink. The U-shaped bracket is installed on the left side of the heat sink and secured to the heat sink with screws. The capacitor is then fixed to the U-shaped bracket with screws, saving space on the heat sink and making the installation more efficient and convenient. This simple bracket design reduces costs and increases the inverter's heat dissipation area.

[0063] Please see Figure 2 The diagram shown is a structural schematic of the frequency converter described in an embodiment of this application. Figure 2 As shown, this embodiment provides a frequency converter, which includes the aforementioned heat dissipation structure.

[0064] The heat dissipation structure includes: a profile heat sink with toothed fins on its surface, the toothed fins being used to increase the heat dissipation area of ​​the frequency converter; a capacitor plate fixing bracket disposed on the side of the profile heat sink; the capacitor plate and the drive plate of the frequency converter are independently disposed, the capacitor plate being mounted on the capacitor plate fixing bracket, and the drive plate being mounted on one of the toothed surfaces of the profile heat sink.

[0065] In one embodiment, the frequency converter further includes: a drive board, a power switch module, a control board, and a capacitor board.

[0066] Furthermore, the drive board is fixed above the profile heat sink by copper pillars, the power switch module is located between the drive board and the profile heat sink, and the control board is fixed above the drive board by copper pillars.

[0067] Please see Figure 3 The diagram shows the component positions of the inverter described in this application embodiment. Taking a naturally cooled inverter as an example, the structure of the naturally cooled inverter includes: a profile heat sink 1, a power switch module 2, a drive board 3, a control board 4, a capacitor board 5, an electrolytic capacitor 6 mounted on the capacitor board 5, and a capacitor board fixing bracket (U-shaped sheet metal bracket) 7. The drive board 3 is above the profile heat sink 1, the power switch module 2 is between the profile heat sink 1 and the drive board 3, the control board 4 is above the drive board 3, the U-shaped sheet metal bracket 7 is to the left of the profile heat sink 1, and the capacitor board 5 is fixed on the U-shaped sheet metal bracket 7.

[0068] In one embodiment, the profile heat sink includes a substrate and a toothed plate perpendicular to the plane of the substrate. The upper and lower surfaces of the substrate are provided with toothed plates with serrated corrugations integrally formed with the substrate.

[0069] Please see Figure 4 , Figure 5 and Figure 6 The diagrams shown are, respectively, a first structural diagram, a second structural diagram, and a third structural diagram of the frequency converter described in the embodiments of this application. Figures 4 to 6 As shown, the profile heat sink 1 includes a base plate 1-1 and a toothed plate perpendicular to the plane of the base plate 1-1. The upper and lower surfaces of the base plate 1-1 are provided with toothed plates with serrated corrugations integrally formed with the base plate 1-1.

[0070] In one embodiment, the heat sink includes a main heat sink and a secondary heat sink, wherein the main heat sink is disposed on the lower surface of the substrate, and the secondary heat sink is disposed on the upper surface of the substrate.

[0071] like Figures 4 to 6As shown, the heat dissipation plate includes a main heat dissipation plate 1-2 and a secondary heat dissipation plate 1-3, wherein the main heat dissipation plate 1-2 is disposed on the lower surface of the substrate 1-1, and the secondary heat dissipation plate 1-3 is disposed on the upper surface 1-4 of the substrate 1-1.

[0072] In one embodiment, the capacitor plate fixing bracket includes a U-shaped sheet metal bracket, which is located on the left side of the profile heat sink, and the capacitor plate is mounted on the U-shaped sheet metal bracket.

[0073] like Figure 6 As shown, the capacitor plate fixing bracket includes a U-shaped sheet metal bracket 7, which is located on the left side of the profile heat sink 1, and the capacitor plate 5 is mounted on the U-shaped sheet metal bracket 7.

[0074] In one embodiment, the U-shaped sheet metal bracket is fixed to the profile heat sink by screws, and the capacitor plate is fixed to the U-shaped sheet metal bracket by screws.

[0075] like Figures 4 to 6 As shown, the U-shaped sheet metal bracket 7 is fixed to the profile heat sink 1 by screws, and the capacitor plate 5 is fixed to the U-shaped sheet metal bracket 7 by screws.

[0076] In one embodiment, the upper surface of the U-shaped sheet metal bracket is provided with four rivet posts, the capacitor plate is connected to the rivet posts on the upper surface of the U-shaped sheet metal bracket by screws, the capacitor plate is welded with four electrolytic capacitors, and the U-shaped sheet metal bracket has heat dissipation holes on the sheet metal surface near the electrolytic capacitors.

[0077] like Figures 4 to 6 As shown, the upper surface of the U-shaped sheet metal bracket 7 is provided with 4 rivet posts 7-2. The capacitor plate 5 is connected to the rivet posts 7-2 on the upper surface of the U-shaped sheet metal bracket 7 by screws. The capacitor plate 5 is welded with 4 electrolytic capacitors 6. The U-shaped sheet metal bracket 7 has heat dissipation holes 7-3 on the sheet metal surface near the electrolytic capacitors 6.

[0078] In one embodiment, the inverter's drive board is located above the profile heat sink, the power switch module is located between the profile heat sink and the drive board, and the control board is located above the drive board.

[0079] like Figures 4 to 6As shown, the natural heat dissipation inverter includes a profile heat sink 1, a power switch module 2, a drive board 3, a control board 4, a capacitor board 5, electrolytic capacitors 6 mounted on the capacitor board 5, and a U-shaped sheet metal bracket 7. The profile heat sink 1 is located at the bottom. The U-shaped sheet metal bracket 7 is fixed to the upper surface 1-4 of the heat sink substrate by screws, with the entire bracket positioned on the left side of the heat sink 1. The upper surface 7-1 of the U-shaped sheet metal bracket has four rivets 7-2. The drive board 3 is fixed above the heat sink 1 by copper pillars, and the power switch module 2 is located between the drive board 3 and the heat sink 1. The capacitor board 5 is connected to the rivets 7-2 on the upper surface of the U-shaped sheet metal bracket by screws. The capacitor board 5 has four electrolytic capacitors 6 and some other components welded on it. The U-shaped sheet metal bracket 7 has heat dissipation holes 7-3 on its sheet metal surface near the electrolytic capacitors 6. The control board 4 is fixed above the drive board 3 by copper pillars.

[0080] In a practical application, the profile heat sink 1 is made of aluminum alloy. The profile heat sink 1 consists of a base plate 1-1, main heat dissipation fins 1-2 perpendicular to the base plate 1-1, and secondary heat dissipation fins 1-3. The main heat dissipation fins 1-2 are located on the lower surface of the base plate 1-1, and the secondary heat dissipation fins 1-3 are located on the upper surface of the base plate 1-1. Both the main heat dissipation fins 1-2 and the secondary heat dissipation fins 1-3 are decorated with a sawtooth wave pattern. Compared with traditional profile heat sinks, this profile heat sink 1 features a sawtooth wave pattern on the fins and adds secondary heat dissipation fins 1-3, significantly increasing its heat dissipation capacity.

[0081] In a practical application, the U-shaped sheet metal bracket 7 is made of aluminum-zinc coated sheet. The bottom 7-4 of the U-shaped sheet metal bracket 7 is directly fixed to the upper surface 1-4 of the profile heat sink base plate 1-1 using four M3X6 screws. This facilitates installation, saves space on the heat sink, and results in a more compact and stable structure. Fixing the capacitor with this simple bracket reduces costs and significantly increases the inverter's heat dissipation capacity. The upper surface 7-1 of the U-shaped sheet metal bracket has four rivets 7-2 for fixing the capacitor plate 5. Ventilation holes are provided at the U-shaped sheet metal bracket 7-3 to facilitate capacitor heat dissipation.

[0082] In practical applications, naturally cooled inverters are suitable for situations where heat dissipation requirements are not high or the ambient temperature is low. Due to their simple structure, convenient maintenance, and low cost, they are suitable for some small or auxiliary equipment. For example, household appliances and small industrial equipment can all use naturally cooled inverters.

[0083] The components of a naturally cooled inverter are described below:

[0084] The power switching module 2 includes an IGBT (Insulated Gate Bipolar Transistor) and a rectifier unit.

[0085] The rectifier unit converts AC power with a fixed operating frequency into DC power.

[0086] Among them, the high-power switching transistor IGBT array forms an electronic switch to realize the inverter function, converting DC power into square waves of different frequencies, widths and amplitudes.

[0087] The electrolytic capacitor 6 refers to a high-capacity capacitor: it stores the converted electrical energy.

[0088] The control board 4 includes a controller: it operates according to a set program, controls the amplitude and pulse width of the output square wave, and superimposes it into an approximately sinusoidal alternating current to drive an AC motor.

[0089] The drive board 3 converts the weak electrical signal output by the control board 4 into a strong electrical signal and sends it to the power switch module 2 for frequency conversion drive.

[0090] In the several embodiments provided in this application, it should be understood that the disclosed heat dissipation structure or frequency converter device can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of modules / units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or units may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection of devices or modules or units may be electrical, mechanical, or other forms.

[0091] The modules / units described as separate components may or may not be physically separate. The components shown as modules / units may or may not be physical modules; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules / units can be selected to achieve the objectives of the embodiments of this application, depending on actual needs. For example, the functional modules / units in the various embodiments of this application may be integrated into one processing module, or each module / unit may exist physically separately, or two or more modules / units may be integrated into one module / unit.

[0092] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.

Claims

1. A heat dissipation structure applied to a frequency converter, characterized in that, The heat dissipation structure comprises: a profile heat sink, the surface of which is provided with a toothed sheet for expanding the heat dissipation area of the frequency converter; a capacitor plate fixing support provided on the side surface of the profile heat sink; the capacitor plate of the frequency converter is independently provided from the drive plate, the capacitor plate is installed on the capacitor plate fixing support, and the drive plate is installed on one of the surfaces of the profile heat sink provided with the toothed sheet.

2. The heat dissipation structure according to claim 1, wherein: the profile heat sink comprises a base plate and toothed sheets perpendicular to the plane of the base plate, the upper surface and the lower surface of the base plate are provided with toothed sheets with sawtooth ripples integrally formed with the base plate.

3. The heat dissipation structure according to claim 2, wherein: the toothed sheets comprise main heat dissipation toothed sheets and auxiliary heat dissipation toothed sheets, the main heat dissipation toothed sheets are provided on the lower surface of the base plate, and the auxiliary heat dissipation toothed sheets are provided on the upper surface of the base plate.

4. The heat dissipation structure according to claim 1, wherein: the capacitor plate fixing support comprises a U-shaped sheet metal support, the U-shaped sheet metal support is provided on the left side of the profile heat sink, and the capacitor plate is installed on the U-shaped sheet metal support.

5. The heat dissipation structure according to claim 4, wherein: the U-shaped sheet metal support is fixed on the profile heat sink by screws, and the capacitor plate is fixed on the U-shaped sheet metal support by screws.

6. The heat dissipation structure according to claim 5, wherein: the upper surface of the U-shaped sheet metal support is provided with four riveting columns, the capacitor plate is connected to the riveting columns on the upper surface of the U-shaped sheet metal support by screws, four electrolytic capacitors are welded to the capacitor plate, and the U-shaped sheet metal support is provided with heat dissipation through holes on the sheet metal surface close to the electrolytic capacitors.

7. The heat dissipation structure according to claim 1, wherein: the drive plate of the frequency converter is provided above the profile heat sink, the power switch module is provided between the profile heat sink and the drive plate, and the control plate is provided above the drive plate.

8. A frequency converter, characterized in that The frequency converter comprises the heat dissipation structure according to any one of claims 1 to 7.

9. The frequency converter of claim 8, wherein, The frequency converter further comprises a drive plate, a power switch module, a control plate and a capacitor plate.

10. The frequency converter according to claim 9, wherein: the drive plate is fixed above the profile heat sink by copper columns, the power switch module is provided between the drive plate and the profile heat sink, and the control plate is fixed above the drive plate by copper columns.

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