High-efficiency photovoltaic module

Abstract

The utility model provides a high-efficiency photovoltaic module. The high-efficiency photovoltaic module comprises a front plate layer structure, a first packaging layer structure, a battery piece layer structure, a second packaging layer structure and a back plate layer structure which are stacked in sequence, the front plate layer structure comprises ultra-white tempered glass and a nanometer layer, the outer layer of the ultra-white tempered glass is coated with the nanometer layer, and the thickness of the ultra-white tempered glass ranges from 2.8 mm to 3.6 mm. According to the technical scheme of the invention, the problem that the light transmission effect, the wear resistance and the cleaning function of a photovoltaic module in the prior art cannot be considered at the same time is effectively solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of photovoltaic glass, and particularly to a high-efficiency photovoltaic module. BACKGROUND

[0002] With the growing demand for clean energy worldwide, photovoltaic power generation as a sustainable way to obtain energy has received widespread attention. However, existing photovoltaic modules still have certain limitations in energy conversion efficiency, stability, and cost, etc. For example, the output power of traditional photovoltaic modules fluctuates greatly in environments with large changes in light intensity, affecting the stability of power supply; at the same time, the preparation process of some photovoltaic modules is complex, and the cost is high, which limits its large-scale application.

[0003] Some existing technologies use high-transmittance glass, but due to the limitations of current technology, the wear resistance and self-cleaning function of the high-transmittance glass are not good, for example, the technology with the application number 201621492437.2 and the name of a high-transmittance monocrystalline silicon solar cell panel. CONTENT OF THE UTILITY MODEL

[0004] One of the technical problems to be solved by the present application is that the light transmission effect, wear resistance and cleaning function of the existing photovoltaic module cannot be considered.

[0005] To solve the above technical problems, the present application provides a high-efficiency photovoltaic module, which comprises a front plate layer structure, a first encapsulation layer structure, a cell piece layer structure, a second encapsulation layer structure and a back plate layer structure which are sequentially stacked; the front plate layer structure comprises super white tempered glass and a nano layer, the nano layer is coated on the outer layer of the super white tempered glass, and the thickness of the super white tempered glass is between 2.8mm and 3.6mm.

[0006] In some embodiments, the material of the nano layer is titanium dioxide, and the thickness of the nano layer is between 60nm and 300nm.

[0007] In some embodiments, the material of the first encapsulation layer structure and the material of the second encapsulation layer structure are different.

[0008] In some embodiments, the material of the first encapsulation layer structure is EVA.

[0009] In some embodiments, the thickness of the first encapsulation layer structure is between 0.35mm and 0.7mm.

[0010] In some embodiments, the material of the second encapsulation layer structure is POE.

[0011] In some embodiments, the thickness of the second encapsulation layer structure is between 0.25mm and 0.4mm.

[0012] In some embodiments, the back plate layer structure comprises a back plate body, a first fluorine coating layer and a second fluorine coating layer, and the first fluorine coating layer and the second fluorine coating layer are respectively coated on two sides of the back plate body.

[0013] In some embodiments, the first fluorine coating layer and the second fluorine coating layer are both made of polyvinylidene fluoride.

[0014] In some embodiments, the first fluorine coating layer and the second fluorine coating layer are both between 13 microns and 28 microns thick.

[0015] By the above technical solution, a high-efficiency photovoltaic module is provided, which comprises a front plate layer structure, a first encapsulation layer structure, a cell piece layer structure, a second encapsulation layer structure and a back plate layer structure, the front plate layer structure comprises white tempered glass, the white tempered glass has good light transmission performance, the nano layer has good wear resistance and self-cleaning performance, so that the front plate layer structure can combine good light transmission, wear resistance and self-cleaning performance. The technical solution of the present application effectively solves the problem that the light transmission effect, wear resistance and cleaning function of the photovoltaic module in the prior art cannot be considered. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiment or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative effort.

[0017] Figure 1 Fig. 1 shows a structural schematic diagram of a high-efficiency photovoltaic module according to an embodiment of the present application;

[0018] Figure 2 Fig. 2 shows a structural schematic diagram of a high-efficiency photovoltaic module according to another embodiment of the present application; Figure 1 Fig. 3 shows a schematic diagram of a heat dissipation structure of a high-efficiency photovoltaic module according to an embodiment of the present application.

[0019] The above drawings contain the following reference signs:

[0020] 10, front plate layer structure; 20, first encapsulation layer structure; 30, cell piece layer structure; 40, second encapsulation layer structure; 50, back plate layer structure; 51, heat dissipation structure; 511, groove; 512, protrusion. DETAILED DESCRIPTION

[0021] The embodiments of the present application will be further described in detail below in combination with the drawings and embodiments. The detailed description of the following embodiments and the drawings are used to exemplarily illustrate the principles of the present application, but cannot be used to limit the scope of the present application, and the present application can be implemented in many different forms, not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0022] The present application provides these examples is to make the present application and complete, and to the person skilled in the art fully express the scope of the present application. It should be noted that: unless otherwise specified, the relative arrangement of components and steps, the composition of materials, numerical expressions and values set forth in these examples should be interpreted as merely exemplary, and not as limiting.

[0023] It should be noted that, in the description of the present application, unless otherwise specified, the meaning of "a plurality of" is greater than or equal to two; The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer" and the like is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the present application. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0024] In addition, "first", "second" and similar words used in the present application do not represent any order, number or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable range of error. "Parallel" is not strictly parallel, but within the allowable range of error. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.

[0025] It should also be noted that, in the description of the present application, unless otherwise specifically provided and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; It can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. When it is described that a specific device is located between the first device and the second device, there can be an intermediate device between the specific device and the first device or the second device, or there can be no intermediate device.

[0026] All terms used in the present application have the same meaning as understood by those skilled in the art to which the present application belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or excessively formalized sense, unless otherwise defined explicitly.

[0027] Techniques, methods and equipment known to those skilled in the relevant art can not be discussed in detail, but in appropriate cases, the techniques, methods and equipment should be considered as part of the specification.

[0028] As Figure 1 and Figure 2 shown, in the embodiment one of the present application, a high-performance photovoltaic module is provided, comprising a front plate layer structure 10, a first encapsulation layer structure 20, a cell piece layer structure 30, a second encapsulation layer structure 40 and a back plate layer structure 50 which are sequentially stacked. The front plate layer structure 10 includes super white tempered glass and a nanometer layer, the nanometer layer is coated on the outer layer of the super white tempered glass, and the thickness of the super white tempered glass is between 2.8mm and 3.6mm.

[0029] Through the above technical scheme, a high-performance photovoltaic module is provided, including a front plate layer structure 10, a first encapsulation layer structure 20, a cell piece layer structure 30, a second encapsulation layer structure 40 and a back plate layer structure 50, the front plate layer structure 10 includes white tempered glass, the light transmission performance of the white tempered glass is good, the nanometer layer has good wear resistance and self-cleaning performance, so that the front plate layer structure 10 can combine the light transmission, wear resistance and self-cleaning performance. The technical scheme of the embodiment effectively solves the problem that the light transmission effect, wear resistance and cleaning function of the photovoltaic module in the prior art cannot be considered.

[0030] In the technical scheme of embodiment one, the material of the nanometer layer is titanium dioxide, and the thickness of the nanometer layer is between 60nm and 300nm. If the titanium dioxide is too thick, it will affect the light transmission performance, and if it is too thin, it will affect the wear resistance and self-cleaning performance. In this embodiment, a thickness of 80nm is used.

[0031] In the technical scheme of embodiment one, the material of the first encapsulation layer structure 20 and the material of the second encapsulation layer structure 40 are different. Because the first encapsulation layer structure 20 needs to have sealing and light transmission properties, the first encapsulation layer structure 20 needs to have good sealing and light transmission properties. The second encapsulation layer structure 40 does not require as high light transmission as the first encapsulation layer structure 20. Therefore, the materials of the first encapsulation layer structure 20 and the second encapsulation layer structure 40 are different in this embodiment.

[0032] In the technical scheme of embodiment one, the material of the first encapsulation layer structure 20 is EVA. EVA (ethylene-vinyl acetate copolymer) has good light transmission and sealing properties, and has a high cost performance.

[0033] In the technical solution of the first embodiment, the thickness of the first encapsulation layer structure 20 is between 0.35mm and 0.7mm. The EVA adhesive film has the characteristics of low cost, excellent light transmittance, high bonding strength, and good temperature resistance. The EVA adhesive film is located between the battery piece layer structure 30 and the front plate layer structure 10, and plays a role in encapsulation and protection, which can effectively prevent the battery piece layer structure 30 from being oxidized, water vapor eroded, and external force impacted, and ensure the stable operation and long-term use of the photovoltaic module in harsh environments. In this embodiment, the thickness of the first encapsulation layer structure 20 is 0.5mm. If the first encapsulation layer structure 20 is too thick, it will also affect the light transmission effect, so this embodiment adopts 0.5mm.

[0034] In the technical solution of the first embodiment, the material of the second encapsulation layer structure 40 is POE (polyolefin elastomer). POE has good aging resistance and PID (potential induced degradation) resistance. In this embodiment, POE is used on the back of the battery piece layer structure 30, which can provide good protection for the battery piece layer structure 30. It should be noted that the four sides of the battery piece layer structure 30 are also sealed with POE.

[0035] In the technical solution of the first embodiment, the thickness of the second encapsulation layer structure 40 is between 0.25mm and 0.4mm. Such thickness can ensure that the aging resistance and PID resistance meet the requirements. In this embodiment, the thickness of POE is 0.3mm.

[0036] In the technical solution of the first embodiment, the back plate layer structure 50 includes a back plate main body, a first fluorine coating layer, and a second fluorine coating layer, and the first fluorine coating layer and the second fluorine coating layer are respectively coated on both sides of the back plate main body. This ensures that the back plate layer structure 50 has good barrier, weather resistance, and insulation performance. The thickness of the back plate layer structure 50 is 0.3mm.

[0037] In the technical solution of the first embodiment, the materials of the first fluorine coating layer and the second fluorine coating layer are both polyvinylidene fluoride. This ensures the weather resistance, chemical resistance, and ultraviolet resistance of the back plate layer structure 50 of this embodiment.

[0038] In the technical solution of the first embodiment, the thickness of the first fluorine coating layer and the second fluorine coating layer is between 13 microns and 28 microns. The first fluorine coating layer and the second fluorine coating layer are both 16 microns, so the thickness of the two sides is the same, and there is no need to worry about the installation direction of the back plate layer structure 50.

[0039] In the technical solution of Embodiment 1, the backplate layer structure 50 has a heat dissipation structure 51 on the side away from the front plate layer structure 10. The backplate layer structure 50 has multiple grooves 511 on the side away from the front plate layer structure 10, and multiple protrusions 512 within each groove 511. The grooves 511 and the protrusions 512 together form the heat dissipation structure 51. It should be noted that there is a gap between the protrusions 512 and the sidewalls of the grooves 511, which further ensures the heat dissipation effect.

[0040] The high-efficiency photovoltaic module provided in this embodiment includes a transparent front panel (front panel layer structure 10), a first encapsulation layer structure 20, a cell layer structure 30, a second encapsulation layer structure 40, and a backsheet layer structure 50, which are stacked sequentially. The cell layer structure 30 is composed of multiple photovoltaic cells connected in series and / or in parallel. The photovoltaic cells use novel semiconductor materials and have higher photoelectric conversion efficiency.

[0041] The encapsulation layer uses materials with high light transmittance and low moisture transmittance, which effectively protects the cell layer from the influence of the external environment and improves the service life of the module.

[0042] A heat dissipation structure 51 is provided on the backsheet layer structure 50, which can dissipate the heat generated during the operation of the module in a timely manner, ensuring the stable operation of the module.

[0043] The high-efficiency photovoltaic module of this embodiment adopts the following preparation method, including the following steps:

[0044] 1. Photovoltaic cell fabrication: Using specific processes and materials, photovoltaic cells with high photoelectric conversion efficiency are fabricated.

[0045] ①For example, by optimizing crystal growth conditions, the crystallization quality of semiconductor materials can be improved and crystal defects can be reduced, thereby improving the performance of solar cells.

[0046] ② Alternatively, advanced coating technology can be used to form a high-quality anti-reflective film on the surface of the solar cell, thereby increasing light absorption.

[0047] 2. Laminated Module: The transparent front panel, encapsulation layer, cell layer and back panel are laminated in sequence and tightly bonded by processes such as hot pressing.

[0048] ① During the lamination process, the gaps and air bubbles between each layer are strictly controlled to ensure the performance and reliability of the components.

[0049] 3. Edge sealing: The edges of the component are sealed to prevent moisture and impurities from entering the component.

[0050] 4. Performance testing: The prepared photovoltaic modules are subjected to performance testing, including tests on indicators such as photoelectric conversion efficiency, output power, and stability.

[0051] Transparent front panel

[0052] Made of ultra-clear tempered glass with a thickness of 3.2mm, it has high light transmittance (greater than 91%) and good mechanical strength, effectively resisting external impacts and wind and sand erosion.

[0053] The glass surface is treated with a special nano-coating, which further improves light transmittance and has a self-cleaning function, reducing the adhesion of dust and dirt.

[0054] Encapsulation layer

[0055] A composite encapsulation material consisting of EVA (ethylene-vinyl acetate copolymer) and POE (polyolefin elastomer) is used, with the EVA layer having a thickness of 0.5 mm and the POE layer having a thickness of 0.3 mm.

[0056] This composite encapsulation material not only has excellent optical properties and weather resistance, effectively blocking the intrusion of water vapor and oxygen, but also improves the component's resistance to PID (potential-induced degradation).

[0057] Battery cell layer

[0058] It adopts PERC (passivated emitter and back local contact) monocrystalline silicon solar cells with a cell size of 182mm×182mm and a conversion efficiency of over 23%.

[0059] The solar cells are connected in series and in parallel using conductive silver paste to form solar strings and solar arrays to meet different output voltage and current requirements.

[0060] Back panel

[0061] It uses a double-sided fluorinated backing with a thickness of 0.3mm, which has good weather resistance, insulation and corrosion resistance.

[0062] The backplate surface is designed with a microchannel heat dissipation structure, which increases the contact area with air, improves heat dissipation efficiency, and ensures stable operation of the components in high-temperature environments.

[0063] II. Preparation Methods of High-Efficiency Photovoltaic Modules

[0064] Battery cell manufacturing

[0065] Silicon wafer cleaning: The RCA cleaning process is used to remove impurities and contaminants from the surface of the silicon wafer.

[0066] Diffusion junction formation: An N-type emitter is formed on the surface of a silicon wafer by diffusion through a phosphorus source at high temperature.

[0067] Laser grooving: Using a laser to create grooves on the back of the solar cell, forming localized back contact.

[0068] Passivation treatment: Alumina and silicon nitride passivation layers are deposited on the surface of the solar cell using ALD (atomic layer deposition) technology to reduce the surface recombination rate.

[0069] Electrode printing: Silver and aluminum electrodes are printed on the front and back of the solar cell using screen printing technology.

[0070] Component stacking

[0071] The transparent front panel, EVA encapsulation layer, cell array, POE encapsulation layer and back panel are laid sequentially on the laminator's worktable.

[0072] Ensure there are no air bubbles, wrinkles, or foreign objects between the layers, then place them in a laminator for hot pressing at a temperature of 150℃, a pressure of 15MPa, and a time of 15min.

[0073] Edge seal

[0074] Butyl rubber was used to seal the edges of the components, with a width of 5mm, to ensure a firm seal and prevent any leakage.

[0075] Performance testing

[0076] Visual inspection: Check the surface of the components for defects such as scratches, chipped edges, and missing corners.

[0077] Electrical performance testing: Using a solar simulator, parameters such as open-circuit voltage, short-circuit current, and maximum power of the modules are measured under standard test conditions (STC) to ensure that the module performance meets design requirements.

[0078] Reliability testing: Perform thermal cycling tests, wet-freeze tests, PID tests, etc. on the components to evaluate their reliability and stability under different environmental conditions.

[0079] Through the above implementation methods, the prepared high-efficiency photovoltaic modules have higher photoelectric conversion efficiency, better stability and longer service life, and can meet the photovoltaic power generation needs in various complex environments.

[0080] The difference between the technical solution of Embodiment 2 and that of Embodiment 1 is that the back panel layer structure 50 has a groove on the side away from the front panel layer structure 10, and the groove is a heat dissipation structure 51. This structure has lower processing costs.

[0081] like Figure 1 and Figure 2As shown in Embodiment 2 of this application, a high-efficiency photovoltaic module is provided, comprising a front panel layer structure 10, a first encapsulation layer structure 20, a cell layer structure 30, a second encapsulation layer structure 40, and a backsheet layer structure 50 stacked sequentially. The front panel layer structure 10 includes ultra-clear tempered glass and a nanolayer, with the nanolayer coated on the outer layer of the ultra-clear tempered glass, the thickness of which is between 2.8 mm and 3.6 mm.

[0082] The above technical solution provides a high-efficiency photovoltaic module, including a front panel structure 10, a first encapsulation layer structure 20, a cell layer structure 30, a second encapsulation layer structure 40, and a backsheet structure 50. The front panel structure 10 includes tempered glass, which has good light transmittance, and the nanolayer has good wear resistance and self-cleaning properties. Thus, the front panel structure 10 can effectively combine light transmittance, wear resistance, and self-cleaning properties. The technical solution of this embodiment effectively solves the problem in the prior art where photovoltaic modules cannot simultaneously achieve good light transmittance, wear resistance, and cleaning function.

[0083] In the technical solution of Example 2, the nanolayer is made of titanium dioxide, and its thickness is between 60 nanometers and 300 nanometers. Too thick a layer of titanium dioxide will affect light transmittance, while too thin a layer will affect wear resistance and self-cleaning properties. In this example, a thickness of 80 nanometers is used.

[0084] In the technical solution of Embodiment 2, the materials of the first encapsulation layer structure 20 and the second encapsulation layer structure 40 are different. Because the first encapsulation layer structure 20 needs to have both sealing and light transmittance, it requires good sealing and light transmittance. The second encapsulation layer structure 40 does not have the same requirement for light transmittance as the first encapsulation layer structure 20. Therefore, the materials of the first encapsulation layer structure 20 and the second encapsulation layer structure 40 in this embodiment are different.

[0085] In the technical solution of Embodiment 2, the first encapsulation layer structure 20 is made of EVA. EVA (ethylene-vinyl acetate copolymer) has good light transmittance and sealing properties, and is cost-effective.

[0086] In the technical solution of Embodiment 2, the thickness of the first encapsulation layer structure 20 is between 0.35mm and 0.7mm. EVA film has characteristics such as low cost, excellent light transmittance, high adhesive strength, and good temperature resistance. The EVA film is located between the cell layer structure 30 and the front panel layer structure 10, serving as an encapsulation and protection mechanism. It effectively prevents the cell layer structure 30 from oxidation, moisture erosion, and external impact, ensuring the stable operation and long-term use of the photovoltaic module in harsh environments. In this embodiment, the thickness of the first encapsulation layer structure 20 is 0.5mm. A thickness that is too large would also affect the light transmittance; therefore, 0.5mm is used in this embodiment.

[0087] In the technical solution of Embodiment 2, the second encapsulation layer structure 40 is made of POE (polyolefin elastomer). POE has good aging resistance and resistance to PID (potential-induced degradation). In this embodiment, POE is used on the back side of the battery cell layer structure 30, which can provide good protection for the battery cell layer structure 30. It should be noted that POE is also used to seal the perimeter of the battery cell layer structure 30.

[0088] In the technical solution of Embodiment 2, the thickness of the second encapsulation layer structure 40 is between 0.25 mm and 0.4 mm. This thickness ensures that both aging resistance and PID resistance meet the requirements. In this embodiment, the thickness of POE is 0.3 mm.

[0089] In the technical solution of Embodiment 2, the backsheet layer structure 50 includes a backsheet body, a first fluorine coating, and a second fluorine coating, which are respectively coated on both sides of the backsheet body. This ensures that the backsheet layer structure 50 has good barrier, weather resistance, and insulation properties. The thickness of the backsheet layer structure 50 is 0.3 mm.

[0090] In the technical solution of Embodiment 2, both the first and second fluorine coatings are made of polyvinylidene fluoride. This ensures the weather resistance, chemical resistance, and UV resistance of the backsheet layer structure 50 in this embodiment.

[0091] In the technical solution of Embodiment 2, the thickness of both the first fluorine coating and the second fluorine coating is between 13 micrometers and 28 micrometers. Both the first and second fluorine coatings are 16 micrometers thick, ensuring the same thickness on both sides and eliminating concerns about incorrect installation orientation of the back panel layer structure 50.

[0092] The embodiments of this application have now been described in detail. To avoid obscuring the concept of this application, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0093] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any manner.

Claims

1. A high efficiency photovoltaic module, characterized by, The front plate layer structure (10), the first encapsulation layer structure (20), the battery piece layer structure (30), the second encapsulation layer structure (40) and the back plate layer structure (50) are sequentially stacked. The front plate layer structure (10) comprises ultra-white tempered glass and a nano layer coated on the outer layer of the ultra-white tempered glass, and the thickness of the ultra-white tempered glass is between 2.8mm and 3.6mm.

2. The high performance photovoltaic module of claim 1, wherein, The material of the nano layer is titanium dioxide, and the thickness of the nano layer is between 60nm and 300nm.

3. The high performance photovoltaic module of claim 1, wherein, The material of the first encapsulation layer structure (20) is different from that of the second encapsulation layer structure (40).

4. The high performance photovoltaic module of claim 3, wherein, The material of the first encapsulation layer structure (20) is EVA.

5. The high performance photovoltaic module of claim 4, wherein, The thickness of the first encapsulation layer structure (20) is between 0.35mm and 0.7mm.

6. The high performance photovoltaic module of claim 3, wherein, The material of the second encapsulation layer structure (40) is POE.

7. The high performance photovoltaic module of claim 6, wherein, The thickness of the second encapsulation layer structure (40) is between 0.25mm and 0.4mm.

8. The high performance photovoltaic module of any of claims 1 to 7, wherein, The back plate layer structure (50) comprises a back plate body, a first fluorine coating layer and a second fluorine coating layer, and the first fluorine coating layer and the second fluorine coating layer are respectively coated on both sides of the back plate body.

9. The high performance photovoltaic module of claim 8, wherein, The material of the first fluorine coating layer and the second fluorine coating layer is polyvinylidene fluoride.

10. The high performance photovoltaic module of claim 9, wherein, The thickness of the first fluorine coating layer and the second fluorine coating layer is between 13 microns and 28 microns.

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