Efficient cooling device of injection molding equipment

Abstract

The utility model discloses an efficient cooling device of injection molding equipment, which comprises an accommodating box, a lower mold arranged at the top of the accommodating box and an upper mold positioned above the lower mold, a water storage tank is fixedly connected with an inner cavity of the accommodating box, and a semiconductor cooling sheet is arranged on the surface of the water storage tank. And one end of the top of the accommodating box is fixedly connected with a heat dissipation box. According to the efficient cooling device of the injection molding equipment, the fan mechanism works, air flow is circularly injected into the heat dissipation box, heat carried by the surface of the coiled pipe is taken away through the air flow, water flow in the coiled pipe is subjected to heat exchange and cooling, the water flow is subjected to primary heat dissipation, and after the air flow is injected into an inner cavity of the water storage box, semiconductor cooling fins work, so that the heat dissipation efficiency is improved. The water flow in the inner cavity of the water storage tank can be subjected to secondary heat exchange cooling, the cooling effect and speed of the water flow are improved, and then the upper mold and the lower mold are efficiently cooled.

Description

TECHNICAL FIELD

[0001] The utility model relates to injection molding equipment cooling technical field, concretely is a kind of high-efficiency cooling device of injection molding equipment. BACKGROUND

[0002] Injection molding machine is the equipment that hot plastic or thermosetting plastic is converted into various plastic products using plastic forming mould, its working principle is by the thrust of screw, the plastic in molten state that has plasticized is injected into closed mould cavity, after solidification setting, product is obtained, injection molding is a cyclic process, and each cycle mainly includes quantitative feeding, melting plasticization, pressure injection, mold filling cooling and mold opening and taking steps such as piece.

[0003] In prior art, in the use process of injection molding equipment, in order to improve production efficiency, cooling device needs to be used to cool injection molding equipment, to improve the forming efficiency of injection molding part, but the existing cooling device for injection molding equipment, in the use process, after heat exchange, water flow is mostly carried away by fan heat carried by water flow pipeline, and the efficiency of heat exchange and cooling is low, and the water flow after continuous use cannot be quickly cooled, thereby reducing the forming efficiency of injection molding part and production and processing efficiency. UTILITY MODEL CONTENT

[0004] In view of the deficiencies of prior art, the utility model provides a kind of high-efficiency cooling device of injection molding equipment, solve the problem that the existing cooling device for injection molding equipment, after heat exchange, water flow is mostly carried away by fan heat carried by water flow pipeline, and the efficiency of heat exchange is low.

[0005] To achieve the above object, the utility model is realized by the following technical scheme: a kind of high-efficiency cooling device of injection molding equipment, including containing box, lower mould being arranged at the top of the containing box and upper mould being located above the lower mould, the inner chamber of the containing box is fixedly connected with water storage tank, the surface of the water storage tank is provided with semiconductor cooling fin, one end of the top of the containing box is fixedly connected with heat dissipation box;

[0006] The inner chamber of the containing box is provided with water pump mechanism that extracts the water flow in the inner chamber of the water storage tank and is injected into the heat exchange channel in the lower mould and the upper mould respectively, the inner chamber of the heat dissipation box is provided with serpentine pipe that can collect the water flow after heat exchange of the upper mould and the lower mould, the surface of the heat dissipation box is provided with fan mechanism that circulates and injects air flow into its interior, and the bottom end of the serpentine pipe is communicated with the inner chamber of the water storage tank.

[0007] Further, the inside of the upper mould is provided with second heat exchange channel, and the inner chamber of the lower mould is provided with first heat exchange channel.

[0008] Further, the water pump mechanism comprises a water pump body, a first conveying pipe, a second conveying pipe and a flow distribution disc, the water pump body is fixedly connected to the inner cavity of the containing box, a water suction pipe is communicated with the water inlet of the water pump body, the other end of the water suction pipe is communicated with the bottom of the inner cavity of the water storage tank, the flow distribution disc is fixedly connected to the top of the containing box, the water outlet of the water pump body is communicated with the flow distribution disc through a water delivery pipe, the second conveying pipe and the first conveying pipe are both communicated with the top of the flow distribution disc, the other end of the first conveying pipe is communicated with the water inlet end of the first heat exchange channel, and the other end of the second conveying pipe is communicated with the water inlet end of the second heat exchange channel.

[0009] Further, the side wall of the heat dissipation box is provided with a flow collecting disc communicated with the top end of the serpentine pipe, the side wall of the upper mold is communicated with a first water outlet pipe communicated with the water outlet end of the second heat exchange channel, the other end of the first water outlet pipe is detachably communicated with a connecting hose, the other end of the connecting hose is communicated with the flow collecting disc, and the side wall of the lower mold is provided with a second water outlet pipe communicated with the water outlet end of the first heat exchange channel, and the other end of the second water outlet pipe is communicated with the flow collecting disc.

[0010] Further, the side wall of the containing box is provided with an inspection cover plate which is detachably arranged through a plurality of screws.

[0011] Further, the fan mechanism comprises two ventilation windows and a plurality of fans, the two ventilation windows are respectively arranged on the front side and the rear side of the heat dissipation box, and the plurality of fans are arranged in the ventilation window.

[0012] Compared with the prior art, the water pump mechanism extracts the water flow in the inner cavity of the water storage tank, and injects the water flow into the lower mold and the upper mold, so that the lower mold and the upper mold can be cooled and heat-dissipated, the temperature of the lower mold and the upper mold is reduced, the forming efficiency of the injection molding part is improved, the water flow after heat exchange is collected by the serpentine pipe, the fan mechanism works, the air flow is circulated and injected into the heat dissipation box, the heat carried on the surface of the serpentine pipe is taken away by the air flow, the water flow in the serpentine pipe is heat-exchanged and cooled, the water flow is preliminarily heat-dissipated, and the water flow is injected into the inner cavity of the water storage tank, then the semiconductor cooling fin works, the water flow in the inner cavity of the water storage tank is heat-exchanged and cooled for the second time, the cooling effect and the rate of the water flow are improved, the upper mold and the lower mold are efficiently cooled, and the injection molding production and processing efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0013] Fig. 1 It is a front structure schematic view of the utility model;

[0014] Fig. 2 It is a front structure schematic view of the utility model;

[0015] Fig. 3 It is a structure diagram of the ventilation window and the fan in the utility model.

[0016] In the figure: 1, containing box; 2, water storage tank; 3, water pump body; 4, first heat exchange channel; 5, lower mold; 6, first conveying pipe; 7, flow dividing disc; 8, second conveying pipe; 9, upper mold; 10, second heat exchange channel; 11, heat dissipation box; 12, coiled pipe; 13, flow collecting disc; 14, first water outlet pipe; 15, communication hose; 16, ventilation window; 17, fan; 18, semiconductor cooling fin; 19, screw; 20, maintenance cover plate; 21, second water outlet pipe; 22, water suction pipe; 23, water supply pipe. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0018] Please refer to Figs. 1-3 The utility model provides a kind of technical solutions: a kind of high-efficiency cooling device of injection molding equipment, including containing box 1, lower mold 5 being arranged at the top of containing box 1 and upper mold 9 being located above lower mold 5, the inner cavity of containing box 1 is fixedly connected with water storage tank 2, the surface of water storage tank 2 is provided with semiconductor cooling fin 18, one end of the top of containing box 1 is fixedly connected with heat dissipation box 11.

[0019] The inner cavity of containing box 1 is provided with water pump mechanism that extracts the water flow in the inner cavity of water storage tank 2 and respectively injects into the internal heat exchange channel of lower mold 5 and upper mold 9.

[0020] The inner cavity of heat dissipation box 11 is provided with coiled pipe 12 that can collect the water flow after heat exchange of upper mold 9 and lower mold 5, the surface of heat dissipation box 11 is provided with fan mechanism that circulates and injects airflow into its interior, and the bottom end of coiled pipe 12 is communicated with the inner cavity of water storage tank 2.

[0021] Water pump mechanism extracts the water flow in the inner cavity of water storage tank 2 and injects into the interior of lower mold 5 and upper mold 9, so as to cool and radiate lower mold 5 and upper mold 9, reduce the temperature of lower mold 5 and upper mold 9, and further improve the forming efficiency of injection molding part.

[0022] After coiled pipe 12 collects the water flow after heat exchange, fan mechanism works, circulates and injects airflow into the interior of heat dissipation box 11, uses airflow to carry away the heat carried by the surface of coiled pipe 12, and carries out heat exchange and cooling to the water flow in the interior of coiled pipe 12.

[0023] The water flow is preliminarily cooled, and after being injected into the inner cavity of the water storage box 2, the water flow in the inner cavity of the water storage box 2 is secondarily cooled by the operation of the semiconductor cooling fin 18, so that the cooling effect and rate of the water flow are improved, and the upper mold 9 and the lower mold 5 are efficiently cooled, and the injection molding production and processing efficiency is improved.

[0024] The second heat exchange channel 10 is arranged in the inner cavity of the upper mold 9, and the first heat exchange channel 4 is arranged in the inner cavity of the lower mold 5.

[0025] The water pump mechanism comprises a water pump body 3, a first conveying pipe 6, a second conveying pipe 8 and a flow distribution disc 7, the water pump body 3 is fixedly connected to the inner cavity of the containing box 1, the water inlet of the water pump body 3 is communicated with a water pumping pipe 22, the other end of the water pumping pipe 22 is communicated with the bottom of the inner cavity of the water storage box 2, and the flow distribution disc 7 is fixedly connected to the top of the containing box 1.

[0026] The water outlet of the water pump body 3 is communicated with the flow distribution disc 7 through a water conveying pipe 23, the second conveying pipe 8 and the first conveying pipe 6 are both communicated with the top of the flow distribution disc 7, the other end of the first conveying pipe 6 is communicated with the water inlet end of the first heat exchange channel 4, and the other end of the second conveying pipe 8 is communicated with the water inlet end of the second heat exchange channel 10.

[0027] After the water pump body 3 is operated, the water flow in the inner cavity of the water storage box 2 can be pumped through the water pumping pipe 22, and the water flow can be injected into the inner cavity of the flow distribution disc 7 through the water conveying pipe 23, and then the water flow is distributed through the first conveying pipe 6 and the second conveying pipe 8, and then the water flow is injected into the inner cavities of the second heat exchange channel 10 and the first heat exchange channel 4 respectively, so that the lower mold 5 and the upper mold 9 are cooled.

[0028] The side wall of the heat dissipation box 11 is provided with a flow collecting disc 13 communicated with the top end of the serpentine pipe 12, the side wall of the upper mold 9 is communicated with a first water outlet pipe 14 communicated with the water outlet end of the second heat exchange channel 10, and the other end of the first water outlet pipe 14 is detachably communicated with a connecting hose 15.

[0029] The other end of the connecting hose 15 is communicated with the flow collecting disc 13, and the side wall of the lower mold 5 is provided with a second water outlet pipe 21 communicated with the water outlet end of the first heat exchange channel 4, and the other end of the second water outlet pipe 21 is communicated with the flow collecting disc 13.

[0030] After the water flow in the second heat exchange channel 10 and the first heat exchange channel 4 is exchanged, the water flow after heat exchange can be concentrated and conveyed into the inner cavity of the flow collecting disc 13 through the first water outlet pipe 14, the connecting hose 15 and the second water outlet pipe 21.

[0031] The side wall of the containing box 1 is detachably provided with an inspection cover plate 20 through a plurality of screws 19, and after the inspection cover plate 20 is detached, the subsequent maintenance operation of the device is facilitated.

[0032] The fan mechanism comprises two ventilation windows 16 and a plurality of fans 17, the two ventilation windows 16 are respectively arranged on the front side and the rear side of the heat dissipation box 11, and the plurality of fans 17 are arranged in the interior of one ventilation window 16.

[0033] When the fans 17 work, the air flow can be circulated and injected into the inner cavity of the heat dissipation box 11 through the two ventilation windows 16, so that the surface of the serpentine pipe 12 can be cooled.

[0034] When working, the water pump mechanism extracts the water flow in the inner cavity of the water storage box 2 and injects the water flow into the interior of the lower mold 5 and the upper mold 9, so that the lower mold 5 and the upper mold 9 can be cooled and heat-dissipated, the temperature of the lower mold 5 and the upper mold 9 is reduced, the forming efficiency of the injection molding part is improved, the water flow after heat exchange is collected through the serpentine pipe 12, the fan mechanism works, the air flow is circulated and injected into the interior of the heat dissipation box 11, the heat carried by the surface of the serpentine pipe 12 is taken away by the air flow, the water flow in the serpentine pipe 12 is heat-exchanged and cooled, the water flow is preliminarily heat-dissipated, and after being injected into the inner cavity of the water storage box 2, the water flow in the inner cavity of the water storage box 2 is secondarily heat-exchanged and cooled by the semiconductor cooling fin 18, the cooling effect and the rate of the water flow are improved, the upper mold 9 and the lower mold 5 are efficiently cooled, and the injection molding production and processing efficiency is improved.

[0035] It should be noted that the relational terms herein such as first and second and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0036] The above only describes the preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A high efficiency cooling device of an injection molding apparatus, comprising a housing box (1), a lower mold (5) arranged at the top of the housing box (1), and an upper mold (9) located above the lower mold (5), characterized in that: The inner cavity of the containing box (1) is fixedly connected with a water storage box (2), the surface of the water storage box (2) is provided with semiconductor cooling fins (18), and one end of the top of the containing box (1) is fixedly connected with a heat dissipation box (11). The inner cavity of the containing box (1) is provided with a water pump mechanism for pumping water flow in the inner cavity of the water storage box (2) and injecting into the heat exchange channels in the lower mold (5) and the upper mold (9) respectively, the inner cavity of the heat dissipation box (11) is provided with a serpentine pipe (12) capable of collecting water flow after heat exchange of the upper mold (9) and the lower mold (5), the surface of the heat dissipation box (11) is provided with a fan mechanism capable of circulating air flow into the inside, and the bottom end of the serpentine pipe (12) is communicated with the inner cavity of the water storage box (2).

2. A high efficiency cooling device for injection molding apparatus as claimed in claim 1, wherein: The inner cavity of the upper mold (9) is provided with a second heat exchange channel (10), and the inner cavity of the lower mold (5) is provided with a first heat exchange channel (4).

3. A high efficiency cooling device for injection molding apparatus according to claim 2, wherein: The water pump mechanism comprises a water pump body (3), a first conveying pipe (6), a second conveying pipe (8) and a flow dividing disc (7), the water pump body (3) is fixedly connected to the inner cavity of the containing box (1), the water inlet of the water pump body (3) is communicated with a water pumping pipe (22), the other end of the water pumping pipe (22) is communicated with the bottom of the inner cavity of the water storage box (2), the flow dividing disc (7) is fixedly connected to the top of the containing box (1), the water outlet of the water pump body (3) is communicated with the flow dividing disc (7) through a water conveying pipe (23), the second conveying pipe (8) and the first conveying pipe (6) are both communicated with the top of the flow dividing disc (7), the other end of the first conveying pipe (6) is communicated with the water inlet end of the first heat exchange channel (4), and the other end of the second conveying pipe (8) is communicated with the water inlet end of the second heat exchange channel (10).

4. The efficient cooling device of injection molding apparatus according to claim 2, wherein: The side wall of the heat dissipation box (11) is provided with a flow collecting disc (13) communicated with the top end of the serpentine pipe (12), the side wall of the upper mold (9) is communicated with a first water outlet pipe (14) communicated with the water outlet end of the second heat exchange channel (10), the other end of the first water outlet pipe (14) is detachably communicated with a connecting hose (15), the other end of the connecting hose (15) is communicated with the flow collecting disc (13), and the side wall of the lower mold (5) is provided with a second water outlet pipe (21) communicated with the water outlet end of the first heat exchange channel (4), and the other end of the second water outlet pipe (21) is communicated with the flow collecting disc (13).

5. The efficient cooling device of injection molding apparatus according to claim 1, wherein: The side wall of the containing box (1) is detachably provided with an inspection cover plate (20) through a plurality of screws (19).

6. The efficient cooling device of injection molding apparatus according to claim 1, wherein: The fan mechanism comprises two ventilation windows (16) and a plurality of fans (17), the two ventilation windows (16) are respectively arranged on the front side and the rear side of the heat dissipation box (11), and the plurality of fans (17) are arranged in the inner cavity of one ventilation window (16).

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