Wafer pushing device suitable for MEMS chip manufacturing
By designing a wafer pusher suitable for MEMS chip manufacturing, and using a stepper motor to drive the movement of the pull plate and push plate, the problem of single wafer turnover was solved, achieving precise turnover and reducing the labor intensity of operators.
Patent Information
- Application Number
- CN202520143200.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2035-01-21
AI Technical Summary
Existing wafer pushers cannot achieve single-wafer turnover, which makes it impossible to meet the single-wafer turnover requirements in the MEMS chip manufacturing process. Furthermore, the use of suction pens and tweezers can lead to wafer contamination and scratches.
A wafer pusher suitable for MEMS chip manufacturing was designed. It adopts components such as a base, a retainer, a stepper motor, a pull plate, and a push plate. The stepper motor drives the movement of the pull plate and the push plate to achieve precise turnover of single wafers and reduce the labor intensity of operators.
This enables precise turnover of single wafers, avoiding wafer contamination and scratches, and reducing the labor intensity of operators.
Smart Images
Figure CN223752438U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip manufacturing technical field more specifically, it relates to a kind of Wafer pusher suitable for MEMS chip manufacturing. BACKGROUND
[0002] In chip manufacturing, we often turn over wafer, currently, the turnover tool that we commonly use when wafer turns over is suction pen, tweezers, pusher, but in MEMS chip manufacturing, we usually carry out graphic operation to the front and back of wafer, if using suction pen and tweezers to turn over wafer, it will cause wafer pollution and scratch. Currently, the tool that wafer turns over is commonly used is pusher.
[0003] Existing pusher can only turn over whole box wafer, cannot turn over wafer single piece, but in wafer manufacturing research and development, we usually turn over wafer single piece, so existing pusher does not play its actual role. UTILITY MODEL CONTENT
[0004] In view of the deficiencies in the prior art, the utility model aims at providing a kind of Wafer pusher suitable for MEMS chip manufacturing, which can solve the problem of single wafer turnover.
[0005] To achieve the above object, the utility model provides the following technical scheme:
[0006] A kind of Wafer pusher suitable for MEMS chip manufacturing, including base, the base upper end surface is equipped with the carding one and carding two for placing wafer,
[0007] The side of base is provided with a sliding slot, and the lower end surface of the base is provided with a pushing assembly,
[0008] The pushing assembly includes a stepper motor, a pull plate, a mounting seat, a push plate, a positioning shaft and a mounting rod, the stepper motor is installed on the lower end surface of the base, the output end of the stepper motor is provided with a gear, the pull plate end surface is provided with a convex tooth engaged with the gear, one end of the pull plate is in contact with the gear, and the other end is fixed through the sliding slot and the mounting seat, the positioning shaft and the mounting rod are fixed on the upper end surface of the mounting seat,
[0009] The push plate is provided with a fixing hole and a positioning hole for connecting the positioning shaft and the mounting rod, and a plurality of docking holes connected with the positioning holes are equidistantly arranged on the mounting rod.
[0010] The utility model is further provided as follows: one side of the sliding slot on the lower end surface of the base is provided with a guide block, and a guide groove is formed in the side wall of the guide block for the pull plate to pass through.
[0011] The utility model is further provided as follows: a pin is arranged in the positioning hole and the docking hole, and the push plate and the mounting rod are connected through the pin.
[0012] The utility model further sets up: four support columns are equipped with under the base, support column and base fixed connection.
[0013] The utility model further sets up: the side wall of base is equipped with the controller of stepping motor electric connection.
[0014] In comparison with prior art's insufficient, the beneficial effects of the utility model are:
[0015] Through positioning hole and butt joint hole, the push plate is fixed in the fixed vertical position of the mounting rod, and through moving the push plate to the horizontal position of the wafer to be transferred, the push rod is fixed in the horizontal position of the wafer through the pull plate and the mounting rod, then the stepping motor is started, the wafer in the jam one is transferred to the jam two, thereby solving the single wafer turnover problem, further, through the pull plate moving driven by the stepping motor, the labor intensity of the operator can be reduced. BRIEF DESCRIPTION OF DRAWINGS
[0016] Fig. 1 It is the structural schematic diagram of the utility model embodiment;
[0017] Fig. 2 It is the bottom view of the utility model embodiment.
[0018] Base 1, jam one 2, jam two 3, sliding slot 4, stepping motor 5, pull plate 6, mounting seat 7, push plate 8, positioning shaft 9, mounting rod 10, gear 11, convex tooth 12, butt joint hole 13, guide block 14, pin rod 15, support column 16, controller 17. DETAILED DESCRIPTION
[0019] The technical scheme in the utility model embodiments will be described clearly and completely below in combination with the drawings in the utility model embodiments. Apparently, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.
[0020] In the description of the utility model, it is understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the utility model.
[0021] Working principle: When a single wafer needs to be transferred, to transfer a single wafer from Casser 1 2 to Casser 2 3, Casser 1 2 is placed on the right side of base 1, and Casser 2 3 is placed on the left side of base 1. The push rod is moved to a horizontal position with the wafer to be transferred. Then, the positioning shaft 9 and the mounting rod 10 are inserted into the fixing hole and the positioning hole, respectively. Then, the pin 15 is inserted into the positioning hole and the corresponding mating hole 13 to fix the push plate 8. Then, the stepper motor 5 is started to rotate. The rotation of the stepper motor 5 drives the gear 11 to rotate. Since the gear 11 meshes with the pull plate 6, the rotation of the gear 11 will drive the pull plate 6 to move, thereby driving the mounting base 7 to move. When the mounting base 7 moves, the positioning shaft 9 and the mounting rod 10 will move, and the push plate 8 will also move accordingly, thus completing the transfer of a single wafer. Finally, the stepper motor 5 is driven to rotate in the opposite direction to reset the push plate 8.
[0022] When the height of the wafer changes, the mating hole 13 connecting the push plate 8 and the mounting rod 10 can be changed.
[0023] like Figs. 1-2 As shown,
[0024] The device includes a base 1, with a first 2 and a second 3 for placing wafers on the upper surface of the base 1. Four support columns 16 are provided below the base 1, and the support columns 16 are fixedly connected to the base 1 to provide sufficient space for the installation of the stepper motor 5.
[0025] The base 1 has a controller 17 that is electrically connected to the stepper motor 5 on its side wall, and the controller 17 controls the working state of the stepper motor 5.
[0026] A groove 4 is provided on one side of the base 1, and a pushing component is provided on the lower end face of the base 1 to transfer the wafer.
[0027] The pushing assembly includes a stepper motor 5, a pull plate 6, a mounting base 7, a push plate 8, a positioning shaft 9, and a mounting rod 10. The stepper motor 5 is mounted on the lower end face of the base 1. A gear 11 is sleeved on the output end of the stepper motor 5. The end face of the pull plate 6 is provided with a tooth 12 that meshes with the gear 11. One end of the pull plate 6 abuts against the gear 11, and the other end is fixed to the mounting base 7 through a sliding groove 4. The positioning shaft 9 and the mounting rod 10 are fixed to the upper end face of the mounting base 7. The positioning shaft 9 can prevent the push plate 8 from rotating.
[0028] The rotation of gear 11 drives the pull plate 6 to move, which in turn pulls the mounting base 7 to move, and drives the push plate 8 to move, thus transferring the wafer.
[0029] A guide block 14 is provided on one side of the slide groove 4 on the lower end face of the base 1. The guide rod can prevent the position of the pull plate 6 from shifting during the movement.
[0030] The guide block 14 has a guide groove on its side wall for the pull plate 6 to pass through, making it easy to observe the movement of the pull plate 6.
[0031] The push plate 8 is provided with fixing holes and positioning holes for connecting with the positioning shaft 9 and the mounting rod 10, the mounting rod 10 is provided with a plurality of butt joints 13 equidistantly connected with the positioning holes, the positioning holes and the butt joints 13 are provided with pin rods 15, the push plate 8 and the mounting rod 10 are connected through the pin rods 15, which is convenient for disassembly, and the height position of the push plate 8 can be adjusted through the plurality of butt joints 13.
[0032] The above merely describes the preferred embodiments of the present application and is not intended to limit the present application, and any common change and replacement within the technical scheme range of the present application should be included in the protection range of the present application.
Claims
1. A wafer pusher suitable for MEMS chip manufacturing, comprising a base (1), characterized in that: The upper end face of the base (1) is provided with cassette one (2) and cassette two (3) for placing wafer, The base (1) is provided with a sliding slot (4) on one side, and the lower end face of the base (1) is provided with a pushing assembly, The pushing assembly comprises a stepping motor (5), a pull plate (6), a mounting seat (7), a push plate (8), a positioning shaft (9) and a mounting rod (10), the stepping motor (5) is installed on the lower end face of the base (1), the output end of the stepping motor (5) is provided with a gear (11), the end face of the pull plate (6) is provided with a convex tooth (12) engaged with the gear (11), one end of the pull plate (6) is in contact with the gear (11) and the other end is fixed through the sliding slot (4) and the mounting seat (7), the positioning shaft (9) and the mounting rod (10) are fixed on the upper end face of the mounting seat (7), The push plate (8) is provided with a fixing hole and a positioning hole for connecting the positioning shaft (9) and the mounting rod (10), and the mounting rod (10) is provided with a plurality of butt joints (13) connected with the positioning hole at equal intervals.
2. The wafer prober for MEMS chip manufacturing according to claim 1, wherein: The lower end face of the base (1) is provided with a guide block (14) on one side of the sliding slot (4), and the side wall of the guide block (14) is provided with a guide groove for the pull plate (6) to pass through.
3. The wafer prober for MEMS chip manufacturing according to claim 1, wherein: The positioning hole and the butt joint (13) are provided with a pin (15), and the push plate (8) and the mounting rod (10) are connected through the pin (15).
4. The wafer prober for MEMS chip manufacturing according to claim 1, wherein: The base (1) is provided with four supporting columns (16) below, and the supporting columns (16) are fixedly connected with the base (1).
5. The wafer prober for MEMS chip manufacturing according to claim 1, wherein: The side wall of the base (1) is provided with a controller (17) electrically connected with the stepping motor (5).