Circuit board electroplating equipment
By installing a vibration generator inside the electroplating tank to drive the circuit board to vibrate, combined with spraying chemicals, the problem of unplated holes in multi-layer circuit boards was solved, achieving complete electroplating of the circuit boards and improving the quality of the finished product.
Patent Information
- Application Number
- CN202423298019.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2034-12-30
AI Technical Summary
In existing EVCP integrated electroplating lines, the holes in multi-layer circuit boards are too small in diameter and too thick, causing the chemical spraying impact to fail to completely penetrate them, resulting in some holes being scrapped without being plated.
A vibration generator is used to drive the circuit board to vibrate inside the electroplating tank, causing the chemical solution to flow in the holes. Combined with the spraying of the chemical solution through a nozzle, complete electroplating is achieved.
It improves the electroplating quality of multilayer circuit boards, ensures the flow of chemical solution in the holes to avoid scrap, and does not require modification of the original equipment, thus saving costs.
Smart Images
Figure CN223752937U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to circuit board electroplating technical field, especially involve a kind of circuit board electroplating equipment. BACKGROUND
[0002] With the development of science and technology, many electronic products are more miniaturized, in order to reduce the size of the device, circuit board gradually from single layer to multilayer improvement, the more layers of circuit board can be built more complex integrated circuit, while the space utilization rate inside the device is high, communication equipment, computer hardware, automotive electronics and even to military avionics field development cannot be separated from thicker multilayer circuit board.
[0003] In the present EVCP integrated electroplating line, the spray pipe is usually used to spray liquid medicine on both sides of the circuit board, and the electroplating is carried out by the impact of the sprayed liquid medicine on the board surface. However, due to the small diameter of the holes in the multilayer thick board and the thick body of the board, it is impossible to guarantee complete penetration by relying solely on the impact of liquid medicine spraying, which may result in the inability of the liquid medicine to flow in some holes, causing the upper layer of the hole to be uncoated and scrapped. SUMMARY
[0004] The main purpose of the utility model is to provide a circuit board electroplating equipment, which aims to solve the problem of incomplete electroplating of multilayer boards in the present integrated electroplating line.
[0005] To achieve the above-mentioned purpose, the utility model provides a circuit board electroplating equipment, which comprises:
[0006] A rack;
[0007] An electroplating tank arranged on the rack and used for loading liquid medicine;
[0008] A conveying device comprising a transmission member, a hanger and a conveying assembly, the transmission member being arranged on the rack, the hanger being fixedly connected with the transmission member, and the conveying assembly being movably arranged on the hanger to drive the circuit board to move in the electroplating tank;
[0009] A vibration generating device arranged on the transmission member, at least part of the vibration generating device being projected downwardly in the electroplating tank, and the transmission member being used to transmit the vibration generated by the vibration generating device to the conveying assembly to drive the circuit board to vibrate in the electroplating tank.
[0010] In an embodiment, the vibration generating device is arranged above the electroplating tank and is arranged at a preset distance from the conveying assembly.
[0011] In an embodiment, the vibration generating device comprises a vibration motor and a mounting seat, the mounting seat is arranged on the transmission member, and the vibration motor is arranged on the mounting seat.
[0012] In an embodiment, the mounting base comprises a first mounting plate, a second mounting plate and a buffer, the first mounting plate is fixedly connected with the transmission member, the second mounting plate is arranged above the first mounting plate and is connected with the first mounting plate through the buffer, and the vibration motor is arranged on the second mounting plate.
[0013] In an embodiment, the vibration generating device further comprises a protective cover, the protective cover covers the vibration motor and is connected with the mounting base.
[0014] In an embodiment, the transmission member comprises a first beam and a second beam, the first beam is arranged to extend along the width direction of the electroplating tank and is fixedly connected with the rack at both ends, one end of the second beam is fixedly connected with the first beam, and the other end of the second beam extends towards the electroplating tank and is fixedly connected with the hanger.
[0015] In an embodiment, the circuit board electroplating equipment comprises a plurality of vibration generating devices and a plurality of transmission members, the hanger is arranged to extend along the length direction of the electroplating tank and is fixedly connected with the rack through the plurality of transmission members, and the plurality of vibration generating devices are arranged on the plurality of transmission members.
[0016] In an embodiment, the circuit board electroplating equipment further comprises a plurality of spray pipes arranged in the electroplating tank, the plurality of spray pipes are arranged in double rows and are spaced apart along the length direction of the electroplating tank, and are used for spraying liquid medicine on both sides of the circuit board.
[0017] In an embodiment, the conveying assembly comprises a steel belt, a plurality of guide wheels and a plurality of clamps, the guide wheels are movably arranged on the hanger and are connected with the steel belt, the plurality of clamps are arranged on one side of the steel belt close to the electroplating tank, and the steel belt is used for moving the clamps.
[0018] In an embodiment, a first conductive member is further arranged on the steel belt, a second conductive member is further arranged in the electroplating tank, the first conductive member is connected with a cathode of a power supply, and the second conductive member is connected with an anode of the power supply.
[0019] The technical scheme of the utility model discloses a vibration generating device is used to solve the problem that the circuit board electroplating equipment cannot completely electroplate multilayer circuit boards, specifically, the circuit board electroplating equipment includes a rack, an electroplating cylinder, a conveying device and a vibration generating device, the electroplating cylinder is arranged on the rack and is used for containing plating liquid in the cylinder, the conveying device includes a transmission member, a hanger and a conveying assembly, the transmission member is fixedly connected with the rack, the hanger is fixedly connected with the transmission member, the conveying assembly is movably arranged on the hanger and is used for driving the circuit board to move in the electroplating cylinder, the vibration generating device is arranged on the transmission member and is located above the electroplating cylinder, the vibration generated by the vibration generating device is transmitted to the circuit board along the transmission member, the hanger and the conveying assembly, the circuit board vibrates in the electroplating cylinder to make the plating liquid flow in the holes of the circuit board, complete electroplating is realized, and the finished product quality of the circuit board is improved. BRIEF DESCRIPTION OF DRAWINGS
[0020] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced, and obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to the structure shown in these drawings without creative labor for those skilled in the art.
[0021] Figure 1 The structural schematic diagram of an embodiment of the circuit board electroplating equipment provided by the utility model is shown in the figure.
[0022] Figure 2 The front view of an embodiment of the circuit board electroplating equipment provided by the utility model is shown in the figure.
[0023] Figure 3 The side view of an embodiment of the circuit board electroplating equipment provided by the utility model is shown in the figure.
[0024] Figure 4 The Figure 3 The enlarged view of the position indicated by the arrow A in the figure.
[0025] Figure 5 The Figure 3 The enlarged view of the position indicated by the arrow B in the figure.
[0026] EXPLANATION OF DRAWINGS:
[0027] 100, circuit board plating equipment; 110, rack; 120, plating tank; 121, spray pipe; 122, second conductive member; 130, conveying device; 131, transmission member; 1311, first beam; 1312, second beam; 132, hanger; 133, conveying assembly; 1331, steel belt; 1332, guide wheel; 1333, clamp; 1334, first conductive member; 140, vibration generating device; 141, vibration motor; 142, mounting seat; 1421, first mounting plate; 1422, second mounting plate; 1423, buffer; 143, protective cover;
[0028] 200, circuit board.
[0029] The purposes, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION
[0030] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0031] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.
[0032] In addition, if the embodiments of the present application involve descriptions of "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In addition, "and / or" or "and / or" appearing throughout the text means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B simultaneously satisfy the scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the scope of protection required by the present application.
[0033] In the present EVCP integrated electroplating line, a spray pipe is usually used to spray the liquid medicine on both sides of the circuit board, and the electroplating is performed by the impact of the sprayed liquid medicine on the board surface. Even though the impact force of the liquid medicine sprayed by the spray pipe is not small, small bubbles are inevitably generated during the impact process. In addition, various small holes are distributed on the circuit board. When a thin board is made, the sprayed liquid medicine can easily impact and penetrate the bubbles to the opposite surface. However, for a multi-layer thick board, the hole diameter of the board is too small, and the board is too thick. Therefore, it is impossible to guarantee complete penetration by only the impact of the liquid medicine spray, which may cause the liquid medicine in some holes to fail to flow, resulting in the failure of the board due to the non-plating of the upper layer.
[0034] The utility model provides a kind of circuit board electroplating equipment.
[0035] Please refer to Figures 1 to 3 In an embodiment of the utility model, the circuit board electroplating equipment 100 includes a rack 110, an electroplating cylinder 120, a conveying device 130 and a vibration generating device 140. The electroplating cylinder 120 is arranged on the rack 110 and is used to hold the liquid medicine for electroplating. The conveying device 130 includes a transmission member 131, a hanger 132 and a conveying assembly 133. The transmission member 131 is fixedly connected with the rack 110. The hanger 132 is fixedly connected with the transmission member 131. The conveying assembly 133 is movably arranged on the hanger 132 to drive the circuit board 200 to move in the electroplating cylinder 120. The vibration generating device 140 is arranged on the transmission member 131 and above the electroplating cylinder 120 (i.e., the downward projection falls in the electroplating cylinder 120). The vibration generated by the vibration generating device 140 is transmitted to the circuit board 200 along the transmission member 131, the hanger 132 and the conveying assembly 133 in sequence. The circuit board 200 vibrates in the electroplating cylinder 120 to make the liquid medicine flow in the holes of the circuit board 200, realizing complete electroplating and improving the quality of the finished circuit board 200. Compared with the existing equipment, the present scheme does not need to change the original structure of the circuit board electroplating equipment 100, is easy to install and saves cost.
[0036] In an embodiment, the vibration generating device 140 is arranged above the electroplating cylinder 120 and is set at a preset distance from the conveying assembly 133.
[0037] In an embodiment of the utility model, the vibration generating device 140 is set at a preset distance from the conveying assembly 133. Specifically, the vibration generating device 140 generates vibration. The circuit board 200 needs to reach a certain vibration amplitude in the electroplating cylinder 120 to make the liquid medicine flow in the holes of the circuit board 200. If the vibration generating device 140 is too close to or too far from the conveying assembly 133, it may affect the effective transmission of vibration, leading to reduced vibration efficiency and affecting the electroplating quality of the circuit board 200. Further, a reasonable distance can prevent resonance. Resonance of the circuit board 200 may cause the amplitude to increase and cause damage. A proper distance can also reduce this potential risk.
[0038] In an embodiment, the vibration generating device 140 comprises a vibration motor 141 and a mounting seat 142, the mounting seat 142 is arranged on the transmission member 131, and the vibration motor 141 is arranged on the mounting seat 142.
[0039] As shown in Figure 3 and Figure 4 shown, in an embodiment of the utility model, vibration generating device 140 includes vibration motor 141 and mounting seat 142, specifically, mounting seat 142 is fixedly connected with transmission member 131 through bolt, and vibration motor 141 is also connected on mounting seat 142 through bolt, and the mounting hole for bolt is reserved on transmission member 131 and mounting seat 142, so that the vibration motor 141 can be quickly installed and maintained, and the direct contact between vibration motor 141 and transmission member 131 can be avoided, the vibration source is effectively isolated to reduce the transmission of excess vibration, and the stability and reliability of the equipment are improved. In some other embodiments of the utility model, in addition to using conventional vibration motor 141, electromagnetic vibrator, centrifugal vibrator, vibration table and other devices can also be used, so that the circuit board 200 can be driven to vibrate in the electroplating cylinder 120 and achieve complete electroplating, which is not limited here.
[0040] In an embodiment, the mounting seat 142 comprises a first mounting plate 1421, a second mounting plate 1422 and a buffer 1423, the first mounting plate 1421 is fixedly connected with the transmission member 131, the second mounting plate 1422 is arranged above the first mounting plate 1421 and is connected with the first mounting plate 1421 through the buffer 1423, and the vibration motor 141 is arranged on the second mounting plate 1422.
[0041] As shown in Figure 4 shown, in an embodiment of the utility model, the mounting seat 142 comprises a first mounting plate 1421, a second mounting plate 1422 and a buffer 1423, specifically, the first mounting plate 1421 is arranged in a bent manner and is matched with the surface shape of the transmission member 131 to improve the connection stability of the mounting seat 142 and the transmission member 131, the second mounting plate 1422 is a horizontal plate structure and is arranged above the first mounting plate 1421, and the buffer 1423 with elasticity is arranged between the first mounting plate 1421 and the second mounting plate 1422 for connection. It can be understood that the elastic buffer 1423 can absorb part of the vibration generated by the vibration motor 141, reduce noise and reduce the influence of vibration on other components, prolong the service life of the vibration motor 141 and the equipment.
[0042] In an embodiment, the vibration generating device 140 further comprises a protective cover 143, the protective cover 143 covers the vibration motor 141 and is connected with the mounting seat 142.
[0043] AsFigure 4 As shown, in one embodiment of this utility model, the vibration generating device 140 further includes a protective cover 143. Specifically, since the electroplating solution is usually highly corrosive, if the vibration motor 141 is exposed to these chemical liquids, corrosion may occur, leading to equipment damage. The protective cover 143 is installed on the vibration motor 141 and connected to the second mounting plate 1422 of the mounting base 142, which can effectively prevent the electroplating solution from splashing onto the vibration motor 141, avoiding corrosion or damage. At the same time, the protective cover 143 can also reduce noise and vibration leakage, improving the production environment of the workshop.
[0044] In one embodiment, the transmission component 131 includes a first beam 1311 and a second beam 1312. The first beam 1311 extends along the width direction of the electroplating tank 120 and is fixedly connected to the frame 110 at both ends. One end of the second beam 1312 is fixedly connected to the first beam 1311, and the other end of the second beam 1312 extends toward the electroplating tank 120 and is fixedly connected to the hanger 132.
[0045] like Figure 3 As shown, in one embodiment of this utility model, the transmission component 131 includes a first beam 1311 and a second beam 1312. Specifically, the first beam 1311 is arranged along the width direction of the electroplating tank 120 and its two ends are respectively fixedly connected to the frame 110. The second beam 1312 is arranged in the vertical direction and its upper end is fixedly connected to the first beam 1311 to form a "T"-shaped structure. The bracket 132 is fixed to the side of the second beam 1312. The vibration generating device 140 is arranged above the first beam 1311. The vibration generated by the vibration generating device 140 is transmitted sequentially from the first beam 1311, the second beam 1312, the bracket 132, and the conveying assembly 133 to the circuit board 200. By setting the first beam 1311 and the second beam 1312, the installation of the vibration generating device 140 and the bracket 132 is facilitated, and the integrated structure of the circuit board electroplating equipment 100 is maintained.
[0046] In one embodiment, the circuit board electroplating equipment 100 includes a plurality of vibration generating devices 140 and a plurality of transmission components 131. The bracket 132 extends along the length direction of the electroplating cylinder 120 and is fixedly connected to the frame 110 through the plurality of transmission components 131. The plurality of vibration generating devices 140 are disposed on the plurality of transmission components 131.
[0047] In some embodiments of the utility model, circuit board electroplating equipment 100 includes multiple vibration generating devices 140, conveying device 130 includes multiple transmission members 131, specifically, electroplating cylinder 120 of electroplating line usually has certain length, or electroplating line has multiple electroplating cylinders 120 that are sequentially spliced, hanger 132 extends along the length direction of electroplating cylinder 120 and is consistent with the conveying route of circuit board 200, because hanger 132 is long, in order to ensure conveying stability, multiple transmission members 131 are spaced apart along the length direction of hanger 132 and are connected with rack 110 respectively, in order to ensure that circuit board 200 keeps vibrating in electroplating cylinder 120, multiple vibration generating devices 140 are arranged on multiple transmission members 131 respectively, to ensure that circuit board 200 that moves in electroplating cylinder 120 continuously vibrates to make liquid medicine flow in the hole, improve the electroplating quality of circuit board 200.
[0048] In an embodiment, the circuit board electroplating equipment 100 further includes a plurality of spray pipes 121 arranged in the electroplating cylinder 120, and the plurality of spray pipes 121 are arranged in double rows along the length direction of the electroplating cylinder 120 for spraying liquid medicine on both sides of the circuit board 200.
[0049] As shown in Figure 1 and Figure 3 In an embodiment of the utility model, the circuit board electroplating equipment 100 further includes a plurality of spray pipes 121, and specifically, the plurality of spray pipes 121 are arranged in two rows along the length direction of the electroplating cylinder 120, and the two rows of spray pipes 121 are arranged on both sides of the moving route of the circuit board 200, and the two rows of spray pipes 121 spray liquid medicine on both sides of the circuit board 200 in the middle, because the circuit board 200 has many layers and a large thickness, the liquid medicine sprayed by the spray pipes 121 may not completely flow in the holes of the circuit board 200, and the embodiment can provide more flowability for the liquid medicine by combining the vibration generated by the vibration generating device 140, so that the liquid medicine fills the holes of the circuit board 200, and the electroplating effect is improved.
[0050] In an embodiment, the conveying assembly 133 includes a steel belt 1331, a plurality of guide wheels 1332, and a plurality of clamps 1333, the guide wheels 1332 are movably arranged on the hanger 132 and connected with the steel belt 1331, the plurality of clamps 1333 are arranged on one side of the steel belt 1331 close to the electroplating cylinder 120, and the steel belt 1331 is used to drive the clamps 1333 to move.
[0051] As shown in Figure 5As shown, in one embodiment of this utility model, the conveying assembly 133 includes a steel belt 1331, guide wheels 1332, and clamps 1333. Specifically, one side of the bracket 132 is connected to a second beam 1312, and the other side of the bracket 132 is provided with a track. Multiple guide wheels 1332 are movably mounted on the track. The steel belt 1331 is connected to multiple guide wheels 1332 through connectors. Multiple clamps 1333 are arranged at intervals along the lower edge of the steel belt 1331 facing the electroplating tank 120. 333 is used to clamp the circuit board 200. The circuit board 200 electroplating device also includes a drive mechanism (not shown), which is used to drive the steel belt 1331 to move so that the guide wheel 1332 and the clamp 1333 move along the length direction of the bracket 132. Multiple guide wheels 1332 are arranged on the bracket 132. The connection between the steel belt 1331 and multiple guide wheels 1332 can ensure that the height of multiple clamps 1333 is consistent, and avoid the clamping points of the circuit board 200 being uneven, which would affect the electroplating effect.
[0052] In one embodiment, a first conductive element 1334 is also provided on the steel strip 1331, and a second conductive element 122 is also provided inside the electroplating tank 120. The first conductive element 1334 is connected to the cathode of the power supply, and the second conductive element 122 is connected to the anode of the power supply.
[0053] like Figure 2 and Figure 5 As shown, in one embodiment of this utility model, a first conductive element 1334 is provided on the upper edge of the steel strip 1331 and connected to the cathode of the power supply. A second conductive element 122 is also provided in the electroplating tank 120 and connected to the anode of the power supply. A circuit is formed by connecting the chemical solution, circuit board 200, clamp 1333, and steel strip 1331 in the electroplating tank 120 to electroplat the circuit board 200. Specifically, the first conductive element 1334 can be a copper slider, which is used to slide and abut against the cathode of the power supply in the conductive tank (not shown). Two rows of anode baskets are also provided in the electroplating tank 120 and are respectively arranged on both sides of the width direction of the electroplating tank 120. The anode baskets are spaced apart from the nozzle 121 and connected to the anode of the power supply to reserve sufficient space for the nozzle 121 and the circuit board 200 to ensure the fluidity of the chemical solution.
[0054] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. A circuit board plating apparatus characterized by comprising: The application relates to a circuit board electroplating device. The device comprises a rack, an electroplating tank arranged on the rack and used for loading liquid medicine, a conveying device comprising a transmission member arranged on the rack, a hanger fixedly connected with the transmission member and a conveying assembly movably arranged on the hanger and used for moving a circuit board in the electroplating tank, a vibration generating device arranged on the transmission member, at least part of the vibration generating device being projected downwardly in the electroplating tank, and the transmission member being used for transmitting vibration generated by the vibration generating device to the conveying assembly so as to vibrate the circuit board in the electroplating tank. The vibration generating device is arranged above the electroplating tank and is arranged at a preset distance from the conveying assembly. The vibration generating device comprises a vibration motor and a mounting base arranged on the transmission member. The mounting base comprises a first mounting plate fixedly connected with the transmission member, a second mounting plate arranged above the first mounting plate and connected with the first mounting plate through a buffer member, and the vibration motor is arranged on the second mounting plate.
2. The circuit board plating apparatus of claim 1, wherein The vibration generating device further comprises a protective cover covering the vibration motor and connected with the mounting base.
3. The circuit board plating apparatus of claim 1, wherein The transmission member comprises a first beam extending along the width direction of the electroplating tank and fixedly connected with the rack at both ends and a second beam having one end fixedly connected with the first beam and the other end extending towards the electroplating tank and fixedly connected with the hanger.
4. The circuit board plating apparatus as claimed in claim 3, wherein The circuit board electroplating device comprises a plurality of vibration generating devices and a plurality of transmission members, the hanger extends along the length direction of the electroplating tank and is fixedly connected with the rack through the plurality of transmission members, and the plurality of vibration generating devices are arranged on the plurality of transmission members.
5. The circuit board plating apparatus of claim 3, wherein the plating solution is supplied to the plating solution supply tank through a pipe. The circuit board electroplating device further comprises a plurality of spray pipes arranged in the electroplating tank and arranged in double rows along the length direction of the electroplating tank and used for spraying liquid medicine on both sides of the circuit board.
6. The circuit board plating apparatus of claim 1, wherein The conveying assembly comprises a steel belt, a plurality of guide wheels movably arranged on the hanger and connected with the steel belt and a plurality of clamps arranged on one side of the steel belt close to the electroplating tank and used for moving the clamps.
7. The circuit board plating apparatus of claim 1, wherein The steel belt is further provided with a first conductive member, the electroplating tank is further provided with a second conductive member, the first conductive member is connected with a cathode of a power supply, and the second conductive member is connected with an anode of the power supply.
8. The circuit board plating apparatus of claim 1, wherein 9. The circuit board plating apparatus of claim 1, wherein 10. The circuit board plating apparatus of claim 9, wherein the plating solution is supplied to the plating solution supply tank through a pipe.