Integrated pressure and temperature sensor
By employing an axially sealed and weld-free continuous lead design in an integrated pressure and temperature sensor, the problems of high cost and non-compact structure in the prior art are solved, achieving compact, reliable and efficient temperature measurement of the sensor.
Patent Information
- Application Number
- CN202423221530.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2034-12-26
AI Technical Summary
Existing integrated pressure and temperature sensors suffer from high manufacturing costs, increased length, and non-compact structure, especially due to increased sensor length and limited applicability caused by welding operations and radial sealing.
By employing an axial sealing structure and a continuous lead wire design that eliminates the need for welding, the temperature sensing element is fixed by injection molding in the carrier. An axial sealing ring is used to clamp the element between the disc-shaped carrier and the metal sleeve. Combined with the wire bending design, welding areas and radial sealing are avoided, resulting in a compact sensor structure and reduced costs.
This approach improves the compactness and reliability of the sensor structure, reduces manufacturing costs, and enhances the sensitivity and accuracy of temperature measurement, while avoiding the problems of localized size expansion caused by increased sensor length and improper sealing.
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Figure CN223756077U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates generally to the field of sensors, and more particularly, to an integrated pressure and temperature sensor. BACKGROUND
[0002] In recent years, integrated pressure and temperature sensors have been widely used in the fields of air conditioning systems for motor vehicles, cooling liquid systems for fuel cells, engine lubrication systems, etc. due to their small size, long service life, high compatibility with control systems, and other advantages.
[0003] However, in the existing integrated pressure and temperature sensors, the temperature signal transmission path is split into multiple separate path segments, and electrical connection between different path segments needs to be achieved by means of welding, thereby requiring a special reserved area for welding operation, which increases the manufacturing cost and increases the overall length of the sensor.
[0004] In addition, in the existing integrated pressure and temperature sensors, a radial seal is usually adopted to prevent the medium from flowing into the metal tube. However, the radial seal can expand the local size, thereby affecting the function of the pressure medium channel. In addition, due to the need to specially set a radial seal area, the overall length of the sensor is increased.
[0005] These defects existing in the existing integrated pressure and temperature sensors can limit the applicability of such integrated pressure and temperature sensors. SUMMARY
[0006] Therefore, the purpose of the present application is to provide an integrated pressure and temperature sensor that can overcome at least one defect in the prior art, thereby achieving the beneficial effect of realizing an integrated pressure and temperature sensor that is improved in terms of structural compactness, structural reliability, and / or manufacturing cost.
[0007] The present disclosure proposes an integrated pressure and temperature sensor, characterized in that the integrated pressure and temperature sensor comprises: a housing; a connector mounted to the housing, the housing and the connector defining an inner cavity; a pressure detection module mounted in the inner cavity and configured to detect the pressure of a medium; a temperature detection module mounted in the inner cavity and configured to detect the temperature of the medium; an electronic module assembly mounted in the inner cavity and configured to be electrically connected to the pressure detection module and the temperature detection module; and a metal sleeve for protecting a temperature sensing element, wherein the temperature detection module comprises a temperature sensing element and a carrier carrying the temperature sensing element, the carrier comprising a disc-shaped carrier portion and a tubular carrier portion narrowed with respect to the disc-shaped carrier portion, and a first sealing ring is mounted between the rear end face of the disc-shaped carrier portion and the front end face of the metal sleeve to achieve axial sealing between the carrier and the metal sleeve.
[0008] In some embodiments, the housing includes a first housing portion proximate to the connector and a second housing portion tapered with respect to the first housing portion, the first housing portion configured to be fastened to the connector, the second housing portion internally defining a media passage.
[0009] In some embodiments, a disc-shaped carrier portion of the carrier is mounted within the first housing portion, and a tubular carrier portion of the carrier extends through the media passage of the second housing portion.
[0010] In some embodiments, a recessed receiving groove for receiving the first seal ring is formed on a rear end face of the disc-shaped carrier portion, and a front end face of the metal sleeve is fastened to the rear end face of the disc-shaped carrier portion radially beyond the receiving groove, such that the first seal ring is clamped between the rear end face of the disc-shaped carrier portion and the front face of the metal sleeve.
[0011] In some embodiments, an inner profile of the receiving groove is interference fit with the first seal ring.
[0012] In some embodiments, the rear end face of the disc-shaped carrier portion is formed with a first fastening portion, the front end face of the metal sleeve is formed with a first mating fastening portion, and the first fastening portion and the first mating fastening portion fasten to each other.
[0013] In some embodiments, an outer peripheral face of the tubular carrier portion is formed with a second fastening portion, an inner peripheral face of the metal sleeve is formed with a second mating fastening portion, and the second fastening portion and the second mating fastening portion fasten to each other.
[0014] In some embodiments, one of the first fastening portion and the first mating fastening portion is configured as a protrusion, and the other of the first fastening portion and the first mating fastening portion is configured as a recess.
[0015] In some embodiments, one of the second fastening portion and the second mating fastening portion is configured as a protrusion, and the other of the second fastening portion and the second mating fastening portion is configured as a recess.
[0016] In some embodiments, the temperature sensing element is injection molded in the carrier.
[0017] In some embodiments, the temperature sensing element includes a temperature sensing portion and a lead segment, the lead segment continuously leading from the temperature sensing portion through the carrier and extending away from the carrier for electrical connection with the electronic module assembly.
[0018] In some embodiments, the lead segment is shaped with a plurality of bends, the lead segment first extending from the temperature sensing portion into the tubular carrier portion, then extending from the tubular carrier portion into the disc-shaped carrier portion, and then extending past the disc-shaped carrier portion and out of the front face of the disc-shaped carrier portion for electrical connection to the electronic module assembly.
[0019] In some embodiments, the metal sleeve is configured to fit over the tubular carrier portion and the exterior of the temperature sensing portion and lead segment portion exposed from the tubular carrier portion, wherein the metal sleeve is configured to be fastened to the carrier. BRIEF DESCRIPTION OF DRAWINGS
[0020] The present application is described more fully hereinafter with reference to the accompanying drawings, in which specific embodiments of the application are shown. This description is
[0021] Figure 1 An example diagram of an integrated pressure and temperature sensor is shown in accordance with some embodiments of the present application;
[0022] Figure 2 A partial cross-sectional view of the integrated pressure and temperature sensor of Figure 1
[0023] Figure 3 A perspective view of a temperature sensing module of the integrated pressure and temperature sensor of Figure 1
[0024] A schematic cross-sectional view of the temperature sensing module of Figure 4 Figure 3 A rear perspective view of the temperature sensing module of
[0025] Figure 5 Figure 3 DETAILED DESCRIPTION
[0026] The present application will be described with respect to the drawings in which
[0027] In the various described embodiments, identical components are configured with identical reference numerals or identical component names, and the disclosure contained throughout the specification can be transposed in meaning to components configured with identical reference numerals or identical component names. Furthermore, in various embodiments, the number, implementation, and / or arrangement of components are not limited to the examples shown, but can be selected as desired.
[0028] In this document, spatially relative terms, such as "upper," "lower," "left," "right," "front," "back," "horizontal," "vertical," and the like, can be used herein for ease of description to describe one element's or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if a device described herein is turned over in use or operation, a relative prefiix term such as "lower," which can have been used to describe a portion of the device, can be used herein to describe a portion of the device that is now higher than that portion of the device that originally was situated lower. The device can be oriented in
[0029] In this document, the terms "a" or "an" are used, as is common in the art, to include one or more than one, independent of any other instances or usages of "at least one" in the document, unless otherwise indicated.
[0030] In this document, the terms "illustrative" or "exemplary" mean "serving as an example, instance, or illustration," and should not necessarily be construed as preferred or advantageous over other examples or illustrative embodiments.
[0031] In this document, the term "substantially" means allowing any minor variation as encompassed by manufacturing tolerances, deviations, or imperfections of the device or component, environmental influences, and / or other factors.
[0032] In this document, the term "portion" can be any fraction. For example, it can be greater than 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%.
[0033] In addition, the terms "first," "second," and similar terms can also be used herein, merely for purposes of reference, and thus do not necessarily have to constitute an ordering, unless otherwise indicated by the context.
[0034] Some embodiments of the present application will now be described in more detail with reference to the drawings.
[0035] As shown in FIG. 1, an example diagram of an integrated pressure and temperature sensor 100 is shown in accordance with some embodiments of the present application. The integrated pressure and temperature sensor 100 can include a housing 10 and a connector 20 mountable to the housing 10. That is, the connector 20 can be attached to a top portion of the housing 10. An inner cavity can be defined by the housing 10 and the connector 20, in which a pressure detection module 30, a temperature detection module 40, and an electronic module assembly 50 electrically connected to both can be mounted. Figure 1 The pressure detection module 30 can be configured to detect a pressure of a medium and transmit a detection signal indicative of the pressure to the electronic module assembly 50. The pressure detection module 30 can include a pressure sensing element, such as a ceramic pressure sensing element.
[0036] The temperature detection module 40 can be configured to detect a temperature of the medium and transmit a detection signal indicative of the temperature to the electronic module assembly 50. The temperature detection module 40 can include a temperature sensing element 42, such as a thermistor element, particularly a negative temperature coefficient thermistor element.
[0037] The electronic module assembly 50 can receive the detection signal indicative of the pressure and generate a pressure detection electrical signal based thereon, and receive the detection signal indicative of the temperature and generate a temperature detection electrical signal based thereon. The pressure detection electrical signal and the temperature detection electrical signal generated by the electronic module assembly 50 can be output to an upper computer (e.g., an ECU) via the connector 20 for subsequent processing.
[0038] As shown in FIG. 2, a partial cross-sectional view of the integrated pressure and temperature sensor 100 is shown. The housing 10 can include a first housing portion 101 proximate to the connector 20 and a second housing portion 102 distal to the connector 20. The first housing portion 101 can be configured to be in fastening connection with the connector 20, while the second housing portion 102 defines an inner passage for the medium. That is, the second housing portion 102 can be proximate to the medium and configured to receive the medium via the inner passage for implementing the pressure detection and the temperature detection. Advantageously, the first housing portion 101 can be configured to be a widened housing portion to accommodate the respective functional modules therein, while the second housing portion 102 can be configured to be a narrowed housing portion relative to the first housing portion 101 to fit the detection hole size. Further advantageously, the second housing portion 102 can be configured with external threads to be in fastening connection with internal threads on the detection hole. It should be appreciated that in some embodiments, the first housing portion 101 and the second housing portion 102 can be configured as an integral structure. In other embodiments, the first housing portion 101 and the second housing portion 102 can be configured as separate structures and fastened to each other by means of additional fastening structures.
[0039] Figure 2 As shown in FIG. 2, a partial cross-sectional view of the integrated pressure and temperature sensor 100 is shown. The housing 10 can include a first housing portion 101 proximate to the connector 20 and a second housing portion 102 distal to the connector 20. The first housing portion 101 can be configured to be in fastening connection with the connector 20, while the second housing portion 102 defines an inner passage for the medium. That is, the second housing portion 102 can be proximate to the medium and configured to receive the medium via the inner passage for implementing the pressure detection and the temperature detection. Advantageously, the first housing portion 101 can be configured to be a widened housing portion to accommodate the respective functional modules therein, while the second housing portion 102 can be configured to be a narrowed housing portion relative to the first housing portion 101 to fit the detection hole size. Further advantageously, the second housing portion 102 can be configured with external threads to be in fastening connection with internal threads on the detection hole. It should be appreciated that in some embodiments, the first housing portion 101 and the second housing portion 102 can be configured as an integral structure. In other embodiments, the first housing portion 101 and the second housing portion 102 can be configured as separate structures and fastened to each other by means of additional fastening structures.
[0040] As Figures 3 to 5 shown, some exemplary views of the temperature detection module 40 are shown. Figure 3 A perspective view of the temperature detection module 40 is shown. Figure 4 A schematic cross-sectional view of the temperature detection module 40 is shown. Figure 5 A rear perspective view of the temperature detection module 40 is shown.
[0041] The temperature detection module 40 can include a temperature sensing element 42 and a carrier 44, for example a plastic carrier, which carries the temperature sensing element 42. The temperature sensing element 42 can include a temperature sensing portion 421, i.e. a so-called thermistor portion, and a lead segment 422 extending from the temperature sensing portion 421. Generally, the temperature sensing element 42 can be configured as a one-piece temperature sensing element, that is, the temperature sensing portion 421 and the lead segment 422 can be configured as one piece.
[0042] A cross-sectional view of the carrier 44 can be configured in a substantially T-shape. The carrier 44, which carries the temperature sensing element 42, can include a disc-shaped carrier portion 441 and a tubular carrier portion 442, which is narrowed with respect to the disc-shaped carrier portion 441. The disc-shaped carrier portion 441 of the carrier 44 can be mounted within the first housing portion 101, and the tubular carrier portion 442 of the carrier 44 can extend through the medium passage of the second housing portion 102. The temperature sensing portion 421 and the lead segment 422 portion of the temperature sensing element 42 at the bottom end can be exposed from the tubular carrier portion 442 so as to easily contact the medium to be detected and accurately detect the temperature.
[0043] The present disclosure proposes to retain the temperature sensing element 42 in the carrier 44 by means of injection molding fixation. That is, the temperature sensing element 42 no longer builds the temperature signal transmission path by means of an additional soldering operation. Instead of a separate conductor structure separately accommodated within the carrier 44, the present disclosure proposes to design the lead segment 422 of the temperature sensing element 42 to be elongated to continuously lead from the temperature sensing portion 421 through the carrier 44 and to be fixed within the carrier 44 by means of the injection molding material. Advantageously, the lead segment 422 can first extend from the exposed temperature sensing portion 421 into the tubular carrier portion 442, then from the tubular carrier portion 442 into the disc-shaped carrier portion 441, and then extend through the disc-shaped carrier portion 441 to exit from the front end face of the carrier 44 or the disc-shaped carrier portion 441, for example upward, for electrical connection with the electronic module assembly 50. It can be seen that the elongated design is such that the lead segment 422 can be shaped with a plurality of bends, for example, can include a first bend from the vertical extension within the tubular carrier portion 442 to the horizontal extension within the disc-shaped carrier portion 441 and a second bend from the horizontal extension within the disc-shaped carrier portion 441 to the vertical extension within the disc-shaped carrier portion 441. Thus, the building of the temperature signal transmission path can be realized by the continuously extending lead segment 422 of the temperature sensing element 42 without the need for indirect realization by means of a separate conductor structure. Thus, a reserved area specially provided for the soldering operation is avoided, so that the manufacturing cost is reduced and the overall length of the sensor is shortened.
[0044] In addition, the integrated pressure and temperature sensor 100 can further include a metal sleeve 60 for protecting the temperature sensing element 42, which can be configured to at least cover the exposed temperature sensing portion 421 and the lead segment 422 portion. Advantageously, the metal sleeve 60 can be configured to be sleeved outside the tubular carrier portion 442 and the exposed temperature sensing portion 421 and the lead segment 422 portion from the tubular carrier portion 442.
[0045] In some embodiments, when the housing 10 is made of a thermally conductive material, for example metal, the metal sleeve 60 can be configured to be connected to the carrier 44 without contacting the housing 10 made of metal. Since the metal sleeve 60 does not contact the housing 10 made of metal at all, the conduction heat dissipation between the metal sleeve 60 and the housing 10 can be reduced, thereby avoiding excessive heat spreading between the two, so as to improve the sensitivity and accuracy of the sensor temperature measurement.
[0046] In some embodiments, the metal sleeve 60 can be configured to be fastened to the carrier 44. In particular, the rear end face of the disc-shaped carrier portion 441 can be shaped with first fastening portions 47, preferably a plurality of circumferentially distributed first fastening portions 47, and the front end face of the metal sleeve 60 can be shaped with first mating fastening portions, preferably a plurality of circumferentially distributed first mating fastening portions, which can be fastened to each other. In some embodiments, one of the first fastening portions 47 and the first mating fastening portions can be configured as a protrusion, and the other one of the first fastening portions 47 and the first mating fastening portions can be configured as a recess.
[0047] Additionally or alternatively, the outer circumferential face of the tubular carrier portion 442 can be shaped with second fastening portions 48, preferably a plurality of circumferentially distributed second fastening portions 48, and the inner circumferential face of the metal sleeve 60 can be shaped with second mating fastening portions, preferably a plurality of circumferentially distributed second mating fastening portions, which can be fastened to each other. In some embodiments, one of the second fastening portions 48 and the second mating fastening portions can be configured as a protrusion, and the other one of the second fastening portions 48 and the second mating fastening portions can be configured as a recess.
[0048] Additionally or alternatively, the metal sleeve 60 can be connected to the carrier 44 in a press-in manner. Additionally or alternatively, the metal sleeve 60 can be connected to the carrier 44 in a heat-in manner.
[0049] To prevent the medium from flowing into the gap between the carrier 44 and the metal sleeve 60, the present disclosure proposes to employ a circumferential sealing instead of a conventional radial sealing. According to the radial sealing approach, a sealing ring can be installed between the tubular carrier portion 442 and the metal sleeve 60. In contrast, the axial sealing approach proposed by the present disclosure clamps a first sealing ring 71 between the rear end face of the disc-shaped carrier portion 441 and the front face of the metal sleeve 60. As Figure 4As shown, a recessed receiving groove 46 can be formed on the rear end face of the disc-shaped carrier portion 441, in which the first sealing ring 71 can be mounted, and the front end face of the metal sleeve 60 can be fastened to the rear end face of the disc-shaped carrier portion 441 beyond the receiving groove 46 in the radial direction. In assembly, the inner contour of the receiving groove 46 can be in interference fit with the first sealing ring 71 so as to pre-tighten the first sealing ring 71 in the receiving groove 46, such that the first sealing ring 71 can be arranged around the tubular carrier portion 442 on the front end side. The axial sealing scheme can avoid at least part of the defects caused by the radial sealing. For example, the axial sealing scheme can avoid enlarging the local dimension, thereby allowing a compact radial dimension, for example, improving the applicability of the sensor, for example, adapting to M10 threads or M12 threads. In addition, the axial sealing scheme can avoid adverse effects on the pressure medium channel, and can also reduce the potential damage risk to the sealing ring and / or the metal tube. In addition, since there is no need to specially provide a radial sealing area, the overall length of the sensor is shortened accordingly.
[0050] Additionally or alternatively, the integrated pressure and temperature sensor 100 according to the present disclosure can further include a second sealing ring 72 configured to achieve radial sealing between the pressure sensing element and the carrier 44. Additionally or alternatively, the integrated pressure and temperature sensor 100 according to the present disclosure can further include a third sealing ring 73 configured to achieve radial sealing between the housing 10 and the metal sleeve 60. By providing the above-mentioned first sealing ring 71, second sealing ring 72 and third sealing ring 73 and the like auxiliary components, the assembly of the sensor can be facilitated, and the sensor can be ensured to have good sealing performance.
[0051] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood that the above examples are merely for illustration and are not intended to limit the scope of the present application. The embodiments disclosed herein can be combined in any manner without departing from the spirit and scope of the present application. It will be appreciated by those skilled in the art that various modifications can be made to the embodiments without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.
Claims
1. An integrated pressure and temperature sensor, characterized by, The integrated pressure and temperature sensor comprises: a housing; a connector mounted to the housing, the housing and the connector defining an inner cavity; a pressure detection module mounted in the inner cavity and configured to detect a pressure of a medium; a temperature detection module mounted in the inner cavity and configured to detect a temperature of the medium; an electronic module assembly mounted in the inner cavity and configured to be electrically connected to the pressure detection module and the temperature detection module; and a metal sleeve for protecting a temperature sensing element, wherein the temperature detection module comprises the temperature sensing element and a carrier carrying the temperature sensing element, the carrier comprising a disc-shaped carrier portion and a tubular carrier portion narrowed with respect to the disc-shaped carrier portion, and wherein a first sealing ring is mounted between a rear end face of the disc-shaped carrier portion and a front end face of the metal sleeve to achieve an axial sealing between the carrier and the metal sleeve.
2. The integrated pressure and temperature sensor according to claim 1, wherein the housing comprises a first housing portion proximate to the connector and a second housing portion narrowed with respect to the first housing portion, the first housing portion being configured to be fastened to the connector, and the second housing portion defining a medium passage inside; and the disc-shaped carrier portion of the carrier is mounted in the first housing portion, and the tubular carrier portion of the carrier extends through the medium passage of the second housing portion.
3. The integrated pressure and temperature sensor of claim 1 or 2, wherein, a recessed receiving groove for receiving the first sealing ring is formed on the rear end face of the disc-shaped carrier portion, and the front end face of the metal sleeve is fastened to the rear end face of the disc-shaped carrier portion over the receiving groove in a radial direction, such that the first sealing ring is clamped between the rear end face of the disc-shaped carrier portion and the front face of the metal sleeve.
4. The integrated pressure and temperature sensor of claim 3, wherein, an inner profile of the receiving groove is interference-fitted with the first sealing ring.
5. The integrated pressure and temperature sensor according to claim 1 or 2, wherein a first fastening portion is formed on the rear end face of the disc-shaped carrier portion, a first mating fastening portion is formed on the front end face of the metal sleeve, and the first fastening portion and the first mating fastening portion are fastened to each other; and / or a second fastening portion is formed on an outer peripheral face of the tubular carrier portion, a second mating fastening portion is formed on an inner peripheral face of the metal sleeve, and the second fastening portion and the second mating fastening portion are fastened to each other.
6. The integrated pressure and temperature sensor according to claim 5, wherein one of the first fastening portion and the first mating fastening portion is configured as a protrusion, and the other of the first fastening portion and the first mating fastening portion is configured as a recess; and / or one of the second fastening portion and the second mating fastening portion is configured as a protrusion, and the other of the second fastening portion and the second mating fastening portion is configured as a recess.
7. The integrated pressure and temperature sensor of claim 1 or 2, wherein, the temperature sensing element is injection-molded in the carrier.
8. The integrated pressure and temperature sensor of claim 7, wherein, the temperature sensing element comprises a temperature sensing portion and a lead segment, the lead segment being continuously guided from the temperature sensing portion through the carrier and extending away from the carrier so as to be electrically connected to the electronic module assembly.
9. The integrated pressure and temperature sensor of claim 8, wherein, The lead segment is shaped with a plurality of bends, the lead segment first extending from the temperature sensing portion into the tubular carrier portion, then extending from the tubular carrier portion into the disc-shaped carrier portion, and then extending through the disc-shaped carrier portion and exiting from the front face of the disc-shaped carrier portion for electrical connection to the electronic module assembly.
10. The integrated pressure and temperature sensor of claim 8, wherein, The metal sleeve is configured to fit over the outside of the tubular carrier portion and the temperature sensing portion and the lead segment portion exposed from the tubular carrier portion, wherein the metal sleeve is configured to be fastened to the carrier.
Citation Information
Cited By
Temperature and pressure integrated sensor
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