Blackbody radiation source device

Abstract

The utility model relates to the field of infrared technology. More specifically, the utility model relates to a blackbody radiation source device, comprising a housing with a vacuum interior, and a refrigerator, which is arranged in the housing and is attached to the inner wall of the housing; the heat conduction surface of the radiation part is attached to the refrigerator; an opening is formed in one side, opposite to the radiation surface of the radiation part, of the shell and is sealed through the infrared window; the temperature sensor is connected with the radiation part so as to acquire the temperature of the radiation part; and a suction unit. The utility model provides a blackbody radiation source device which is packaged by metal and is high in vacuum, and is applied to the field of performance index detection of infrared thermal imaging equipment.

Description

TECHNICAL FIELD

[0001] The utility model relates to infrared technical field, more specifically, the utility model relates to a blackbody radiation source device. BACKGROUND

[0002] The surface source blackbody radiation source is an infrared radiation work standard, is widely used in the process test and appraisal test technical index test in the development process of infrared detector, and can complete the test of infrared focal plane device photosensitive surface response uniformity, response curve and other parameters.

[0003] In addition to the high emissivity required for the blackbody radiation source, the surface temperature uniformity is also an important technical index, in order to improve the temperature uniformity of the target surface and solve the frosting problem, the existing surface source blackbody mainly has the following two solutions: the first is to blow dry nitrogen to the surface source blackbody target surface, which can solve the frosting problem, but the structure is complex, and the temperature uniformity of the target surface will be affected, the second is to package the target surface in a dry gas environment or a vacuum environment, and the target surface is directly welded and fixed by using metal solder, but due to the limitation of the existing packaging technology and the continuous release of gas by the material, the vacuum degree is poor, so that high vacuum and temperature uniformity cannot be realized. SUMMARY

[0004] The utility model discloses a kind of metal packaging, and high vacuum blackbody radiation source device, applied to infrared thermal imaging equipment performance index detection field, to solve the above problems.

[0005] In order to realize these purposes and other advantages according to the utility model, a blackbody radiation source device is provided, comprising an internal vacuum shell, and a:

[0006] Refrigerator, which is attached to the inner wall of the shell;

[0007] Radiation element, the heat conduction surface of which is attached to the refrigerator;

[0008] Infrared window sheet, the side of the shell opposite to the radiation surface of the radiation element is opened, and the opening is sealed by the infrared window sheet;

[0009] Temperature sensor, connected to the radiation element to obtain the temperature of the radiation element;

[0010] Suction unit.

[0011] The utility model has the advantages that:

[0012] 1. The blackbody radiation source device of the utility model, set up the adsorption unit in the internal vacuum shell, can keep high vacuum inside the radiation source shell for a long time through the adsorption unit, thereby keep the surface temperature uniformity of blackbody radiation source device, avoid heat exchange;

[0013] 2. The blackbody radiation source device of the utility model simple structure, small, light, can realize positive and negative temperature difference radiation, convenient to carry and use.

[0014] Based on the above technical scheme, the utility model further can make improvement as follows:

[0015] Further, the refrigeration device is a semiconductor refrigeration device.

[0016] The beneficial effect of the above further scheme is: in the further scheme, the refrigeration device is a semiconductor refrigeration device, which is made of semiconductor material using Peltier effect, and is applied to some occasions with limited space, high reliability and no refrigerant pollution. The semiconductor refrigeration device works with direct current, which can both cool and heat, and the polarity of the direct current is changed to determine whether cooling or heating is achieved on the same refrigeration device.

[0017] Further, the radiation element is a red copper element.

[0018] The beneficial effect of the above further scheme is: in the further scheme, the red copper element is made of red copper, and the high purity of red copper makes the internal atomic arrangement more regular, reducing the energy loss in the heat conduction process, thereby improving the heat conduction efficiency.

[0019] Further, the radiation element is provided with a mounting hole, and the sensing end of the temperature sensor is inserted into the mounting hole and connected with the radiation element.

[0020] The beneficial effect of the above further scheme is: in the further scheme, the mounting hole is provided on the red copper element, and the sensing end of the temperature sensor is installed in the mounting hole, and the radiation temperature of the radiation element is collected through the sensing end of the temperature sensor.

[0021] Further, the temperature sensor is a platinum resistance.

[0022] The beneficial effect of the above further scheme is: in the further scheme, the resistance value of the platinum resistance changes with temperature, and the temperature of the measured object is calculated by measuring the resistance value, which is used for high-precision temperature equipment, and the radiation temperature of the radiation element can be more accurately collected.

[0023] Further, in the blackbody radiation source device, the radiation member is attached to the refrigerator through conductive silver paste.

[0024] The beneficial effect of the further scheme is that in the further scheme, the side of the red copper member connected to the refrigerator serves as the heat conduction surface of the radiation member, and after the heat conduction surface is polished smooth, the conductive silver paste is attached to the refrigerator, the conductive silver paste realizes the conductive connection between the red copper member and the refrigerator, and the conductive silver paste has good thermal conductivity, so that the heat conduction effect between the red copper member and the refrigerator can be ensured.

[0025] Further, in the blackbody radiation source device, the radiation surface of the radiation member has a nitrogen aluminum titanium plating layer.

[0026] The beneficial effect of the further scheme is that in the further scheme, the side of the red copper member away from the refrigerator serves as the radiation surface of the radiation member, and the nitrogen aluminum titanium plating layer is sprayed on the radiation surface, and the nitrogen aluminum titanium serves as a high-emissivity material, which can improve the emissivity and temperature uniformity of the radiation surface.

[0027] Further, in the blackbody radiation source device, the getter unit is zirconium vanadium iron alloy, and the zirconium vanadium iron alloy is connected to the inner wall of the shell through an insulator.

[0028] The beneficial effect of the further scheme is that in the further scheme, the zirconium vanadium iron alloy material has a certain gettering capacity, which can ensure high vacuum of the sealed space between the shell and the infrared window sheet, avoid internal heat exchange, and affect the uniformity of the temperature.

[0029] Further, in the blackbody radiation source device, an oxygen-free copper pipe is provided on the shell and penetrates the shell, and the oxygen-free copper pipe is sealed inside.

[0030] The beneficial effect of the further scheme is that in the further scheme, in order to ensure low vacuum of the blackbody radiation source device, after the infrared window and the shell are welded in a sealed state, the oxygen-free copper pipe is connected to the air extraction equipment, the inside of the oxygen-free copper pipe is vacuumed by the air extraction equipment, the vacuum leakage rate is less than 1e -8 Pa.m 3 / s, and after the vacuuming is completed, the oxygen-free copper pipe is clamped and sealed to realize the internal sealing of the oxygen-free copper pipe.

[0031] Further, in the blackbody radiation source device, the surface of the shell is provided with a nickel plating layer and a gold plating layer from inside to outside.

[0032] The beneficial effects of adopting the above-mentioned further solution are as follows: In this further solution, the base plate of the shell substrate can be made of tungsten copper, the surrounding walls are made of 4J29 Kova alloy, and the substrate surface is first plated with nickel and then with gold. The thickness of the nickel plating layer is 3-8μm, and the thickness of the gold plating layer is not less than 1.27μm, so as to ensure good heat dissipation and welding performance of the base plate.

[0033] Other advantages, objectives and features of this invention will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of this invention. Attached Figure Description

[0034] Fig. 1 This is a schematic diagram of the structure of the blackbody radiation source device described in this utility model;

[0035] Fig. 2 This is a cross-sectional view of the blackbody radiation source device described in this utility model;

[0036] Fig. 3 This is an internal layout diagram of the housing described in this utility model.

[0037] The reference numerals in the attached figures are as follows:

[0038] 1. Housing; 2. Semiconductor cooler; 3. Infrared window; 4. Radiation component; 5. Platinum resistance thermometer; 6. Zirconium vanadium iron alloy; 7. Insulating screw; 8. Insulator; 9. Oxygen-free copper tube. Detailed Implementation

[0039] The present invention will be further described in detail below with reference to the embodiments, so that those skilled in the art can implement it based on the description.

[0040] It should be noted that in the description of this utility model, the terms "horizontal", "longitudinal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0041] like Figs. 1-3 As shown, an embodiment of this utility model provides a blackbody radiation source device, including an internal vacuum housing 1, the bottom plate of the housing 1 may be made of tungsten copper, the surrounding walls are made of Kovar 4J29, and the following are disposed within the housing 1:

[0042] A refrigerator is attached to one side of the bottom plate of the shell 1; the refrigerator is a semiconductor refrigerator 2, a plurality of positioning holes are arranged on the semiconductor refrigerator 2, and a plurality of threaded holes equal in number and corresponding one by one are arranged on the bottom plate of the shell 1; after the positioning holes and the corresponding threaded holes are communicated, an insulating screw 7 is arranged, the insulating screw 7 is screwed in the threaded hole after passing through the positioning hole, and the semiconductor refrigerator 2 is fixed on the bottom plate of the shell 1 after the insulating screw 7 is tightened.

[0043] An infrared window sheet 3 is arranged on the side of the shell 1 opposite to the bottom plate, the opening is sealed by the infrared window sheet 3, the infrared window sheet 3 is welded with the shell 1 by solder to form a closed cavity;

[0044] An emitter 4 is attached to the other side of the refrigerator; the emitter 4 is a red copper piece.

[0045] A temperature sensor is connected to the emitter 4 to obtain the temperature of the emitter 4; the emitter 4 is provided with a mounting hole, the sensing end of the temperature sensor is inserted into the mounting hole and connected to the emitter 4, and the temperature sensor is a platinum resistance 5.

[0046] An air suction unit is a zirconium-vanadium-iron alloy 6, which is connected to the inner wall of the shell 1 through an insulator 8 to avoid direct contact between the zirconium-vanadium-iron alloy 6 and the inner wall, and to maximize the contact area between the zirconium-vanadium-iron alloy 6 and the inside of the shell 1 to ensure its air suction effect. The number of zirconium-vanadium-iron alloys 6 in the air suction unit can be adjusted according to actual needs, and when multiple are arranged, they can be distributed in various parts of the shell 1 to further improve the air suction effect of the air suction unit and ensure the vacuum inside the shell 1.

[0047] In the embodiment, the radiation member 4 is arranged in the shell 1, the side of the radiation member 4 which is attached to the refrigerator is a heat conduction surface, and the side of the radiation member 4 which is away from the heat conduction surface is a radiation surface. The semiconductor refrigerator 2 has a front side which is attached to the radiation member 4 and a back side which is attached to the inner wall of the shell 1. Two insulators 8 are arranged on one side wall of the shell 1, and the zirconium-vanadium-iron alloy 6 is connected to the two insulators 8 at two ends thereof, so as to avoid the contact between the zirconium-vanadium-iron alloy 6 and the inner wall of the shell 1. Meanwhile, four insulators 8 are arranged on the other side wall of the shell 1, and the lead wires of the semiconductor refrigerator 2 and the platinum resistance 5 are respectively connected to the external control circuit through the four insulators 8. When the blackbody radiation source device needs to generate a positive temperature difference, the semiconductor refrigerator 2 generates heat at the front side and refrigerates at the back side, the generated heat is conducted to the radiation member 4, the radiation temperature is fed back to the control circuit by the platinum resistance 5, the control circuit controls the current of the semiconductor refrigerator 2, and thus the radiation temperature is controlled. When a negative temperature difference needs to be generated, the semiconductor refrigerator 2 refrigerates at the front side and generates heat at the back side, and the heat generated at the back side is dissipated through the shell 1. Meanwhile, the zirconium-vanadium-iron alloy 6 is arranged in the internal vacuum shell 1, the zirconium-vanadium-iron alloy has a certain getter capacity, and the internal vacuum of the radiation source shell 1 can be maintained for a long time, so that the surface temperature uniformity of the blackbody radiation source device is maintained, and heat exchange is avoided.

[0048] Preferably, as another embodiment of the utility model, the radiation member 4 and the refrigerator are attached through conductive silver paste.

[0049] The beneficial effect of the above further scheme is that, in the further scheme, the side of the radiation member 4 which is connected to the refrigerator is the heat conduction surface of the radiation member 4, the heat conduction surface is polished smooth, and then is tightly attached to the refrigerator through the conductive silver paste, so as to realize the conductive connection between the radiation member 4 and the refrigerator, and the conductive silver paste has good heat conductivity, so as to ensure the heat conduction effect between the radiation member 4 and the refrigerator.

[0050] In the embodiment, the radiation surface of the radiation member 4 has a nitrogen-aluminum-titanium plating layer.

[0051] The beneficial effect of the above further scheme is that, in the further scheme, the side of the radiation member 4 which is away from the refrigerator is the radiation surface of the radiation member 4, and the radiation surface is sprayed with a nitrogen-aluminum-titanium plating layer, and the nitrogen-aluminum-titanium is a high-emissivity material, so as to improve the emissivity and temperature uniformity of the radiation surface.

[0052] Preferably, as another embodiment of the utility model, the shell 1 is provided with an oxygen-free copper tube 9 which penetrates the shell 1, and the oxygen-free copper tube 9 is sealed inside.

[0053] In this embodiment, the oxygen-free copper tube 9 is arranged on the wall of the shell 1, and in order to ensure the low vacuum of the blackbody radiation source device, after the infrared window is welded with the shell 1 in a sealed state, the oxygen-free copper tube 9 is connected to the air extraction equipment, the inside of the oxygen-free copper tube 9 is extracted by the air extraction equipment, and the vacuum leakage rate is less than 1e -8 Pa.m 3 / s, after the vacuum extraction is completed, the oxygen-free copper tube 9 is clamped and sealed, and the inside of the oxygen-free copper tube 9 is sealed.

[0054] Preferably, as another embodiment of the utility model, the surface of the shell 1 is sequentially provided with a nickel plating layer and a gold plating layer from inside to outside.

[0055] In this embodiment, the bottom plate of the shell 1 base material can adopt tungsten copper, the wall around adopts 4J29 Kovar alloy, and the surface of the base material is plated with nickel first and then plated with gold, the thickness of the nickel plating layer is 3-8 μm, and the thickness of the gold plating layer is not less than 1.27 μm, so as to ensure the good heat dissipation performance and welding performance of the bottom plate.

[0056] Although the embodiments of the utility model have been disclosed as above, it is not limited to the application listed in the specification and the embodiments, and it can be fully applied to various fields suitable for the utility model, and other modifications can be easily realized by those skilled in the art, therefore, the utility model is not limited to specific details and the embodiments shown and described herein, without departing from the general concept defined by the claims and the equivalent range.

Claims

1. A blackbody radiation source device, characterized by, The shell comprises an internal vacuum, and A refrigerator is attached to the inner wall of the shell; An infrared emitter is attached to the refrigerator; An infrared window is provided on the side of the shell opposite to the radiation surface of the infrared emitter, and the opening is sealed by the infrared window; A temperature sensor is connected to the infrared emitter to obtain the temperature of the infrared emitter; An air suction unit.

2. A blackbody radiation source device as claimed in claim 1, characterized in that The refrigerator is a semiconductor refrigerator.

3. A blackbody radiation source device as claimed in claim 1, characterized in that The infrared emitter is made of red copper.

4. A blackbody radiation source device as claimed in claim 1, characterized in that The infrared emitter is provided with a mounting hole, and the sensing end of the temperature sensor extends into the mounting hole and is connected to the infrared emitter.

5. A blackbody radiation source device as claimed in claim 4, characterized in that The temperature sensor is a platinum resistance.

6. A blackbody radiation source device as claimed in claim 1, wherein, The infrared emitter and the refrigerator are attached by conductive silver paste.

7. A blackbody radiation source device as claimed in claim 1, wherein The radiation surface of the infrared emitter is provided with a nitrogen-aluminum-titanium plating layer.

8. A blackbody radiation source device as claimed in claim 1, wherein, The air suction unit is a zirconium-vanadium-iron alloy, which is connected to the inner wall of the shell through an insulator.

9. A blackbody radiation source device as claimed in claim 1, wherein, An oxygen-free copper pipe is provided through the shell, and the inside of the oxygen-free copper pipe is sealed.

10. A blackbody radiation source device as claimed in claim 1, wherein, The surface of the shell is provided with a nickel plating layer and a gold plating layer from inside to outside.

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