Capacitor electrical aging treatment support plate device

Abstract

The utility model relates to a carrier plate device for electric aging treatment of a capacitor, and belongs to the technical field of capacitors. Comprising an upper board, a first PCB, an FPC board, a second PCB and a lower board which are sequentially arranged from top to bottom, the lower surface of the first PCB is provided with a conductive copper plate, the conductive copper plate is provided with a plurality of first conductive spring probes and second conductive spring probes, the FPC board is provided with accommodating holes which are in one-to-one correspondence with the first conductive spring probes, the accommodating holes are used for loading capacitor products, and the second PCB is provided with a plurality of second conductive spring probes. A printed circuit is arranged on the upper surface of the second PCB, a conductor is plated on the printed circuit, a golden finger is arranged on one side of the second PCB, and a conductive contact communicated with the second conductive spring probe is arranged on the upper surface of the second PCB. When the electric aging screening device is used for an electric aging screening test, the screening efficiency and the screening accuracy are greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a capacitor electric aging treatment carrier plate device and belongs to the technical field of capacitor. BACKGROUND

[0002] As an important component of electronic components, the performance stability of the capacitor is crucial to the normal operation of the circuit. The finished capacitor usually needs to be subjected to ceramic aging test to screen out defective products and ensure the reliability of the final circuit.

[0003] At present, in the prior art, the utility model patent application number: 201910451050.4 discloses a capacitor carrier box and a method for testing and aging the capacitor using the carrier box. The capacitor carrier box has an upper plate and a bottom plate. The upper plate has a receiving hole for placing the capacitor. The bottom plate has an upper electrode on the top corresponding to the receiving hole and a lower electrode on the bottom corresponding to the upper electrode. In use, first, the capacitor to be tested is placed in the receiving hole of the capacitor carrier box. When testing, the capacitor carrier box with the capacitor is placed on the test station. The test contact is controlled to contact the electrode on the upward end of the capacitor and the lower electrode of the capacitor carrier box, so as to connect the capacitor to the test table for testing. When aging, the capacitor carrier box with the capacitor is installed on the aging plate, and the aging plate is inserted into the aging machine to heat and age the capacitor. However, this capacitor carrier box cannot be used for electric aging alone. In addition, for capacitors with special structures, such as products with upper and lower electrodes and extremely thin thickness, the products need to be electrically aged. The traditional loading plate cannot effectively bear and conduct electricity.

[0004] Therefore, there is an urgent need for a carrier that can effectively bear the above-mentioned special structure capacitors, has conductivity and reduces the difficulty of personnel operation, to realize convenient screening and improve the efficiency of ceramic aging test in the electric aging process. UTILITY MODEL CONTENTS

[0005] The utility model provides a capacitor electric aging treatment carrier plate device, which aims to design a capacitor electric aging treatment carrier plate device that has conductivity and reduces the difficulty of personnel operation, to realize convenient screening and improve the efficiency of aging test in the electric aging process.

[0006] The utility model discloses a technical scheme of a kind of capacitor electric aging treatment carrier plate device, including from top to bottom sequentially with upper plate, first PCB board, FPC board, second PCB board and lower plate, wherein, first PCB board lower surface is equipped with conductive copper plate, and a plurality of first conductive spring probes and second conductive spring probes are equipped on conductive copper plate, FPC board is equipped with the accommodation hole corresponding to first conductive spring probe, and accommodation hole is used to load capacitor product, and the upper surface of second PCB board is equipped with printed circuit, and printed circuit is plated with conductor, and the side of second PCB board is equipped with gold finger, and the upper surface of second PCB board is equipped with the conductive contact for being connected with second conductive spring probe.

[0007] Further, the first conductive spring probe needle tip diameter is greater than the accommodation hole diameter.

[0008] Further, the upper surface of the second PCB board is equipped with guide column, and guide column penetrates first PCB board and upper plate in sequence.

[0009] Further, the upper plate, first PCB board, second PCB board and lower plate are all equipped with screw hole, and the upper plate, first PCB board, second PCB board and lower plate are connected together through bolt assembly.

[0010] Further, the other side upper surface of the second PCB board is equipped with fuse connected with printed circuit.

[0011] Further, the upper plate and first PCB board are bonded together, and the lower plate and second PCB board are fixed together through screw.

[0012] Further, the upper plate and lower plate are made of insulating and high-temperature-resistant material.

[0013] Further, the upper plate and lower plate are all bakelite.

[0014] The utility model discloses a kind of capacitor electric aging treatment carrier plate device, its beneficial effect is that the utility model realizes the connection and aging of capacitor by the carrier plate of multilayer structure.The first conductive spring probe contacts capacitor product, the second conductive spring probe contacts conductive contact, the bottom end of capacitor product contacts conductor, gold finger is inserted into socket, completes circuit connection, to realize the convenient screening in electric aging process and improve the efficiency of aging test. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or prior art, the drawings needed to be used in the embodiment or prior art description will be simply introduced below, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0016] Figure 1 Fig. 1 shows a top view of the upper plate in Example 1.

[0017] Figure 2 Fig. 2 shows a bottom view of the first PCB plate in Example 1.

[0018] Figure 3 Fig. 3 shows a bottom view of the FPC plate in Example 1.

[0019] Figure 4 Fig. 4 shows a top view of the second PCB plate in Example 1.

[0020] Figure 5 Fig. 5 shows a bottom view of the lower plate in Example 1.

[0021] Figure 6 Fig. 6 shows a schematic view of the guide column in Example 1.

[0022] Figure 7 Fig. 7 shows a schematic view of Figure 2 the first conductive spring probe in Example 1.

[0023] Fig. 8 shows a schematic view of the second conductive spring probe in Example 1.

[0024] 1, upper plate; 2, first PCB plate; 3, FPC plate; 4, second PCB plate; 5, lower plate; 6, conductive copper plate; 7, first conductive spring probe; 8, second conductive spring probe; 9, accommodating hole; 10, screw hole; 11, guide column; 12, fuse; 13, gold finger; 14, conductive contact; 15, conductive body; 16, printed circuit. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. The description of the at least one exemplary embodiment is actually only illustrative, but not as any limitation on the present application and its application or use. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] In order to solve the technical problems and further understand the content of the present application, the technical scheme will be further described below in conjunction with the specific embodiments.

[0027] Example 1: As shown in Fig. 1, the upper plate 1 is provided with a plurality of conductive copper plates 6, and the conductive copper plates 6 are arranged in a staggered manner. Figures 1-7As shown, the embodiment provides a capacitor electrical aging treatment carrier plate device, which comprises an upper plate 1, a first PCB plate 2, an FPC plate 3, a second PCB plate 4 and a lower plate 5 arranged in sequence from top to bottom. The lower surface of the first PCB plate 2 is provided with a conductive copper plate 6. The conductive copper plate 6 is provided with 200 first conductive spring probes 7 and 4 second conductive spring probes 8. The FPC plate 3 is provided with a containing hole 9 corresponding to each first conductive spring probe 7. The containing hole 9 is used to load capacitor products. The upper surface of the second PCB plate 4 is provided with a printed circuit 16. The printed circuit 16 is plated with a conductor 15. One side of the second PCB plate 4 is provided with a gold finger 13. The upper surface of the second PCB plate 4 is provided with 4 conductive contacts 14. When the first PCB plate 2 covers the FPC plate 3, the second conductive spring probes 8 are in contact with the conductive contacts 14. In order to ensure that the first conductive spring probes 7 are in good contact with the capacitor products in the containing holes 9, the upper surface of the second PCB plate 4 is provided with a guide column 11. The first PCB plate 2 and the upper plate 1 are both provided with guide holes. The guide column 11 penetrates the guide holes of the first PCB plate 2 and the upper plate 1 in sequence. The guide column 11 plays a role of guiding and positioning. The guide column 11 and the guide holes are matched to realize rapid installation and positioning. The diameter of the needle tip of the first conductive spring probe 7 is greater than the diameter of the containing hole 9, so that the first conductive spring probe 7 cannot pass through the containing hole 9. By arranging the first conductive spring probe 7, the wear of the capacitor products during the aging screening is avoided.

[0028] The upper plate 1, the first PCB plate 2, the second PCB plate 4 and the lower plate 5 are all provided with screw holes 10. After the lower plate 5, the second PCB plate 4, the FPC plate 3, the first PCB plate 2 and the upper plate 1 are installed in sequence from bottom to top, they are connected together by a bolt assembly.

[0029] Further, the other side of the upper surface of the second PCB plate 4 is provided with a fuse 12 connected with the printed circuit 16, which provides a safety guarantee for the electrical aging process.

[0030] The upper plate 1 and the lower plate 5 are made of insulating and high-temperature-resistant materials. As a specific embodiment in the embodiment, the upper plate 1 and the lower plate 5 are both bakelite plates. During the aging operation, the test voltage is maintained at 10-25V, and the temperature is heated to 25°-150° for electrical aging. After being placed for 48h or 96h, the capacitor products are taken out.

[0031] Embodiment 2: as shown in Figures 1-7 On the basis of embodiment 1, the upper plate 1 and the first PCB plate 2 are bonded together, and the lower plate 5 and the second PCB plate 4 are fixed together by screws.

[0032] As shown in Figures 1-7As shown, taking Example 2 as an example, the capacitor product is placed in the accommodating hole 9 of the FPC board 3, and then the first PCB board 2 and the upper board 1 are installed, at this time, the first conductive spring probe 7 is in contact with the capacitor product, the second conductive spring probe 8 is in contact with the conductive contact 14, the bottom end of the capacitor product is in contact with the conductive body 15, the gold finger 13 is inserted into the socket, the circuit connection is completed, the voltage is guaranteed to be 25V, the temperature is guaranteed to be 150° for heating electrical aging, and the capacitor product is taken out after being placed for 96h, the first PCB board 2 and the upper board 1 are removed, and then the capacitor product is observed whether there is damage under thermal stress and electrical stress, a plurality of capacitor products can be aged and screened at one time. The current is transmitted through the contact between the first conductive spring probe 7 and the capacitor product, and the circuit is connected through the contact between the second conductive spring probe 8 and the conductive contact 14, so that the capacitor product can realize the electrical aging process. Therefore, the efficiency of the electrical aging screening is improved, and the difficulty of manual operation is reduced.

[0033] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A device for electro-aging capacitor carrier plates, characterized in that, The application relates to a capacitor product loading device, which comprises, from top to bottom, an upper plate (1), a first PCB plate (2), an FPC plate (3), a second PCB plate (4) and a lower plate (5), wherein the lower surface of the first PCB plate (2) is provided with a conductive copper plate (6), the conductive copper plate (6) is provided with a plurality of first conductive spring probes (7) and second conductive spring probes (8), the FPC plate (3) is provided with a plurality of accommodation holes (9) corresponding to the first conductive spring probes (7) one by one, the accommodation holes (9) are used for loading capacitor products, the upper surface of the second PCB plate (4) is provided with a printed circuit (16), the printed circuit (16) is plated with a conductor (15), one side of the second PCB plate (4) is provided with a gold finger (13), and the upper surface of the second PCB plate (4) is provided with conductive contacts (14) used for being connected with the second conductive spring probes (8).

2. A capacitor electro-aging process carrier plate apparatus as defined in claim 1, wherein, The first conductive spring probes (7) are provided with needle tips with a diameter larger than that of the accommodation holes (9).

3. A capacitor electro-aging process carrier plate apparatus as defined in claim 1, wherein, The upper surface of the second PCB plate (4) is provided with guide columns (11) penetrating through the first PCB plate (2) and the upper plate (1) in sequence.

4. A capacitor electro-aging process carrier plate apparatus as defined in claim 3, wherein, The upper plate (1), the first PCB plate (2), the second PCB plate (4) and the lower plate (5) are all provided with screw holes (10), and the upper plate (1), the first PCB plate (2), the second PCB plate (4) and the lower plate (5) are connected together through a bolt assembly.

5. The capacitor electro-aging process board apparatus of claim 1 wherein, The other side of the upper surface of the second PCB plate (4) is provided with a fuse (12) connected with the printed circuit (16).

6. A capacitor electro-aging process carrier plate apparatus as claimed in any one of claims 1 or 4, wherein, The upper plate (1) and the first PCB plate (2) are bonded together, and the lower plate (5) and the second PCB plate (4) are fixed together through screws.

7. The capacitor electro-aging process board apparatus of claim 1 wherein, The upper plate (1) and the lower plate (5) are made of insulating and high-temperature-resistant materials.

8. A capacitor electro-aging process carrier plate apparatus as defined in claim 7, wherein, The upper plate (1) and the lower plate (5) are both bakelite plates.

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