Touch screen with cooling structure
By introducing a combination of thermally conductive pins, thermally conductive sheets, heat dissipation pipes, and micro-pumps into touchscreen devices, active heat dissipation is achieved, solving the problem of insufficient heat dissipation of touchscreen devices under high load operation and improving the stability and safety of the devices.
Patent Information
- Application Number
- CN202422691651.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2034-11-05
AI Technical Summary
Existing touch screen devices have insufficient heat dissipation efficiency under high load operation, resulting in excessively high device temperature, which affects stability and component safety.
The touch screen assembly and cooling plate are connected by thermally conductive pins and thermally conductive sheets. Combined with heat dissipation pipes and micro pumps to drive coolant circulation, and with the help of semiconductor cooling chips and micro fans, active heat dissipation is achieved.
It effectively reduces the heat generated by the touch screen components during high-load operation, improves equipment stability and lifespan, and prevents components from burning out.
Smart Images

Figure CN223757076U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to touch screen technical field, more particularly to a touch screen with cooling structure. BACKGROUND
[0002] With the rapid development of science and technology, touch screen technology has been widely used in various electronic devices, such as smart phones, tablet computers, information inquiry terminals and large interactive display screens. Large screen touch device has become the preferred way of user interaction in various industries due to its intuitive user experience and multifunctionality. Especially in the fields of education, retail, medical treatment and public service, touch screen device promotes the acceleration of informationization process due to its convenient operation and efficient information transmission capability. However, with the complication and high frequency of application scenarios, touch screen device is prone to overheating under long-time high-brightness operation, which not only affects the stability and operating efficiency of the device, but also may cause the burning of device components.
[0003] At present, large screen touch device is usually designed as a relatively thin body as a whole due to the demand of use scene, so its heat dissipation solution mainly relies on passive heat dissipation, which usually adopts heat-conducting materials to conduct the heat generated by the touch screen to the device shell or heat sink, so as to dissipate to the air through natural convection. However, passive heat dissipation method cannot provide sufficient heat dissipation efficiency in high-load operation and harsh environment, resulting in still high temperature of the device.
[0004] Therefore, it is necessary to provide a touch screen with cooling structure to solve the problem that the above touch device cannot provide sufficient heat dissipation efficiency. SUMMARY
[0005] The utility model aims at providing a touch screen with cooling structure to solve the technical problems mentioned in the background art.
[0006] The utility model adopts the following technical scheme:
[0007] A touch screen with cooling structure, comprising: a touch screen assembly and a cooling assembly arranged on one end face of the touch screen assembly, the cooling assembly comprising a cooling plate, a plurality of heat-conducting pins being equidistantly arranged on one end face of the cooling plate close to the touch screen assembly, the heat-conducting pins being provided with heat dissipation parts protruding from the touch screen assembly, and heat-conducting sheets being connected between the heat-conducting pins, one end of the heat-conducting sheet away from the cooling plate being connected to the touch screen assembly.
[0008] One end of the heat dissipation part towards the touch screen assembly is connected with a heat dissipation pipeline, the heat dissipation pipeline is filled with cooling liquid, the heat dissipation pipeline surrounds the periphery of the touch screen assembly, and the heat dissipation pipeline is connected with a micro pump to make the cooling liquid circulate.
[0009] Further, the heat-conducting block is arranged on the end surface of the cooling plate close to the touch screen assembly, and has a thickness equal to that of the heat-conducting sheet.
[0010] Further, the cooling plate is connected with fixing feet at four corners thereof, the first end of each fixing foot is fixedly connected with the cooling plate, and the second end of each fixing foot is connected with a circuit board.
[0011] Further, the outer side of the heat-dissipating pipe is flush with the outer sides of the cooling plate and the circuit board, and the outer side of the heat-dissipating pipe is surrounded by an outer shell.
[0012] Further, the inner side of the outer shell is provided with a plurality of mounting grooves corresponding to the heat-dissipating pipe, and a semiconductor refrigeration sheet is arranged in each mounting groove.
[0013] Further, the touch screen assembly comprises a protection layer, a touch layer and a display layer which are stacked in sequence, and the display layer is connected with the heat-conducting sheet.
[0014] Further, the end of the cooling plate close to the circuit board is provided with a plurality of heat-conducting silica gel columns which are connected with the heat-generating elements of the circuit board.
[0015] Further, four micro fans are arranged between the circuit board and the cooling plate, and the four micro fans are distributed at four corners of the cooling plate.
[0016] Further, the opposite sides of the outer shell are provided with a plurality of heat-dissipating holes which are arranged between the circuit board and the cooling plate.
[0017] Further, the end of the touch screen assembly close to the cooling plate is provided with a temperature sensor which is electrically connected with the micro fans and the micro pump.
[0018] Beneficial effects:
[0019] The utility model provides a kind of touch screen with cooling structure, by setting up several heat-conducting pins between touch screen assembly and cooling plate, and connecting heat-conducting sheet between heat-conducting pin, realize the efficient conduction of heat generated by touch screen, heat-conducting pin and heat-conducting sheet expand heat conduction path, so that the heat of touch screen can be rapidly conducted to cooling plate, by the heat-conducting pin setting radiating portion protruding from touch screen assembly, so that the heat pipe can be connected with heat-conducting pin for heat conduction, and can be further played cooling effect by covering the periphery of touch screen assembly, by micro pump driving circulation of coolant in heat pipe, to realize active cooling, effectively reduce the heat generated by touch screen assembly when high load operation. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 It is the overall structure schematic diagram of the utility model a kind of touch screen with cooling structure;
[0021] Figure 2 It is the schematic diagram of the utility model cooling assembly and heat pipe;
[0022] Figure 3 It is the side structure schematic diagram of the utility model without shell;
[0023] Figure 4 It is the overall explosion schematic diagram of the utility model a kind of with cooling structure;
[0024] Figure 5 It is the back schematic diagram of the utility model cooling assembly;
[0025] Wherein: 1, touch screen assembly;101, protective layer;102, touch layer;103, display layer;2, cooling assembly;21, cooling plate;22, heat-conducting pin;23, radiating portion;24, heat-conducting sheet;25, heat-conducting block;26, fixed foot;27, heat-conducting silica gel column;3, heat pipe;4, micro pump;5, circuit board;6, shell;61, heat dissipation hole;7, micro fan.
[0026] The utility model purposes realization, functional characteristics and advantages will be further explained with reference to the drawings by combining embodiment. DETAILED DESCRIPTION
[0027] It should be understood that the specific embodiments described herein are only used to explain the utility model, and are not used to limit the utility model.
[0028] In the description of the utility model, it is necessary to understand that the orientation or positional relation indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like is the orientation or positional relation based on the orientation or positional relation shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model. In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "several" is two or more than two, unless otherwise specifically limited.
[0029] In the description of the utility model, it should be explained that, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, it can be directly connected, or indirectly connected through an intermediate medium, it can be the communication between two elements or the interaction relationship between two elements. For ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0030] In the utility model, unless otherwise specifically defined and limited, the "upper" or "lower" of the first feature to the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "upper", "upper" and "upper" of the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0031] Referring to Figures 1 to 4 The utility model proposes a touch screen with cooling structure, including touch screen subassembly 1 and setting cooling assembly 2 at the one end surface of touch screen subassembly 1,
[0032] The cooling assembly 2 comprises a cooling plate 21, a plurality of heat-conducting pins 22 are equidistantly arranged on an end surface of the cooling plate 21 close to the touch screen assembly 1, the heat-conducting pins 22 are provided with heat dissipation portions 23 protruding from the touch screen assembly 1, and heat-conducting sheets 24 are connected between the heat-conducting pins 22, one end of the heat-conducting sheet 24 away from the cooling plate 21 is connected to the touch screen assembly 1;
[0033] One end of the heat dissipation portion 23 is connected to the touch screen assembly 1, a heat dissipation pipe 3 is filled with cooling liquid, the heat dissipation pipe 3 surrounds the periphery of the touch screen assembly 1, and a micro pump 4 is connected to the heat dissipation pipe 3 to make the cooling liquid circulate.
[0034] In the above embodiment, one end of the touch screen assembly 1 is closely combined with the cooling assembly 2 arranged on the end surface, the cooling assembly 2 is composed of a cooling plate 21, the front surface of the cooling plate 21 faces the touch screen assembly 1 and is suitable for closely combining with the touch screen.
[0035] The end surface of the cooling plate 21 close to the touch screen assembly 1 is equidistantly provided with a plurality of heat-conducting pins 22, the heat dissipation portions 23 of the heat-conducting pins 22 protrude from the cooling plate 21 to form a plurality of contact points, which can quickly absorb the heat generated by the touch screen assembly 1. The heat-conducting sheets 24 are connected between the heat-conducting pins 22, which effectively bridge the heat-conducting pins 22 and the touch screen assembly 1, ensuring that the heat can be quickly transmitted to the cooling plate 21 through the heat-conducting sheets 24.
[0036] On the side of the cooling portion facing the touch screen assembly 1, a heat dissipation pipe 3 surrounding the periphery of the touch screen assembly 1 is connected. The heat dissipation pipe 3 is filled with cooling liquid, which circulates through the pipe under the push of a micro pump 4. The micro pump 4 dynamically adjusts the flow rate of the cooling liquid according to the temperature change of the touch screen to adapt to the heat dissipation demand in the working state.
[0037] In summary, by arranging a plurality of heat-conducting pins 22 between the touch screen assembly 1 and the cooling plate 21 and connecting heat-conducting sheets 24 between the heat-conducting pins 22, efficient heat conduction of the heat generated by the touch screen is realized, the heat-conducting pins 22 and the heat-conducting sheets 24 expand the heat conduction path, so that the heat of the touch screen can be quickly conducted to the cooling plate 21, the heat dissipation portions 23 protruding from the touch screen assembly 1 are arranged on the heat-conducting pins 22, so that the heat dissipation pipe 3 can be connected to the heat-conducting pins 22 for heat conduction and can also cover the periphery of the touch screen assembly 1 to further play a cooling effect, the cooling liquid in the heat dissipation pipe 3 is driven to circulate by the micro pump 4, thereby realizing active heat dissipation and effectively reducing the heat generated by the touch screen assembly 1 in high-load operation.
[0038] In an embodiment, the cooling plate 21 is further provided with a heat-conducting block 25 adjacent to one end surface of the touch screen assembly 1. The heat-conducting block 25 has a thickness equal to that of the heat-conducting sheet 24. One end surface of the heat-conducting block 25 is connected to the touch screen assembly 1, and one side of the heat-conducting block 25 is connected to the heat-conducting pin 22. The heat-conducting block 25 further enhances the heat conduction efficiency between the touch screen assembly 1 and the cooling plate 21. The heat-conducting block 25 is in direct contact with the touch screen assembly 1, so that the heat generated from the touch screen assembly 1 can be quickly transferred to the heat-conducting block 25. Since the heat-conducting block 25 has a thickness equal to that of the heat-conducting sheet 24, it ensures uniform distribution of heat inside the heat-conducting block 25, avoiding local overheating. In addition, one side of the heat-conducting block 25 is connected to the heat-conducting pin 22, so that the heat can be further transferred to the cooling plate 21 through the heat-conducting pin 22. The combination of the heat-conducting pin 22 and the heat-conducting block 25 forms an efficient heat conduction path.
[0039] In an embodiment, the cooling plate 21 is further provided with a heat-conducting block 25 adjacent to one end surface of the touch screen assembly 1. The heat-conducting block 25 has a thickness equal to that of the heat-conducting sheet 24. One end surface of the heat-conducting block 25 is connected to the touch screen assembly 1, and one side of the heat-conducting block 25 is connected to the heat-conducting pin 22. The heat-conducting block 25 further enhances the heat conduction efficiency between the touch screen assembly 1 and the cooling plate 21. The heat-conducting block 25 is in direct contact with the touch screen assembly 1, so that the heat generated from the touch screen assembly 1 can be quickly transferred to the heat-conducting block 25. Since the heat-conducting block 25 has a thickness equal to that of the heat-conducting sheet 24, it ensures uniform distribution of heat inside the heat-conducting block 25, avoiding local overheating. In addition, one side of the heat-conducting block 25 is connected to the heat-conducting pin 22, so that the heat can be further transferred to the cooling plate 21 through the heat-conducting pin 22. The combination of the heat-conducting pin 22 and the heat-conducting block 25 forms an efficient heat conduction path.
[0040] In an embodiment, the outer side of the heat dissipation pipe 3 is flush with the outer side of the cooling plate 21 and the circuit board 5, and the outer side of the heat dissipation pipe 3 is surrounded by an outer shell 6, which covers the cooling plate 21 and the circuit board 5. The surrounding coverage of the outer shell 6 not only protects the cooling plate 21 and the circuit board 5 from the external environment, but also further enhances the heat dissipation effect. The material of the outer shell 6 is usually a metal material with good heat conduction performance, such as aluminum alloy or copper alloy, to ensure that heat can be effectively conducted from the cooling plate 21 and the circuit board 5 to the outer shell 6, and dissipated to the environment through the surface of the outer shell 6.
[0041] In an embodiment, the inner side of the shell 6 is provided with a plurality of mounting grooves corresponding to the heat dissipation pipes 3, and semiconductor refrigeration plates are mounted in the mounting grooves, with the refrigeration surface and the heat dissipation surface of the semiconductor refrigeration plates being connected to the heat dissipation pipes 3 and the shell 6, respectively. By using semiconductor refrigeration plates, the heat dissipation efficiency of the touch screen assembly 1 can be further improved. When the semiconductor refrigeration plates are in operation, the refrigeration surface absorbs heat, which is transferred from the cooling plate 21 to the heat dissipation surface through the Peltier effect, and then dissipated to the environment through the heat dissipation surface, the heat dissipation pipes 3, and the shell 6. This refrigeration method has the advantages of fast response speed and accurate control, and can effectively cope with the heat generated by the touch screen assembly 1 during long-time operation or high-load operation.
[0042] In order to further optimize the heat dissipation effect, the outer side of the shell 6 can also be provided with heat dissipation fins. The heat dissipation fins can increase the surface area of the shell 6 in contact with air, thereby improving the heat dissipation efficiency. In actual applications, the shape, size, and distribution of the heat dissipation fins can be designed according to specific requirements to achieve the best heat dissipation effect.
[0043] In an embodiment, the touch screen assembly 1 includes a protective layer 101, a touch control layer 102, and a display layer 103 stacked in sequence, and the display layer 103 is connected to the heat conduction sheet 24. In order to improve the durability and reliability of the touch screen assembly 1, the protective layer 101 can be made of scratch-resistant and impact-resistant materials such as tempered glass or high-strength plastic. In addition, the touch control layer 102 can use capacitive touch control technology to provide more sensitive and accurate touch control response.
[0044] Reference Figure 5 In an embodiment, the cooling plate 21 is provided with a plurality of heat-conducting silicone columns 27 at one end facing the circuit board 5, and the heat-conducting silicone columns 27 are connected to the heat-generating elements of the circuit board 5. The heat-conducting silicone columns 27 directly transfer the heat generated by the heat-generating elements to the cooling plate 21, thereby achieving efficient heat conduction. The heat-conducting silicone columns 27 have good flexibility and heat conduction performance, and can adapt to the shapes and sizes of different heat-generating elements, ensuring the uniformity and reliability of heat transfer. In addition, the use of heat-conducting silicone columns 27 can also reduce the contact thermal resistance between the heat-generating elements and the cooling plate 21, further improving the heat dissipation efficiency.
[0045] In an embodiment, four micro fans 7 are arranged between the circuit board 5 and the cooling plate 21, and the four micro fans 7 are respectively distributed at the four corners of the cooling plate 21. The arrangement of the micro fans 7 can further enhance the heat dissipation effect. The four micro fans 7 are evenly distributed at the four corners of the cooling plate 21, and the air outlets of the four micro fans 7 respectively face different directions, so that the vortex is formed between the circuit board 5 and the cooling plate 21, ensuring the uniformity and comprehensiveness of air flow. When the micro fans 7 work, cold air is sucked in and hot air is pushed out from the other side of the cooling plate 21, forming effective air convection, thereby accelerating the heat dissipation of the surface of the cooling plate 21. In addition, the use of the micro fans 7 can also reduce the surface temperature of the cooling plate 21, further improving the stability and service life of the touch screen assembly 1.
[0046] In an embodiment, a plurality of heat dissipation holes 61 are arranged on opposite sides of the shell 6, and the heat dissipation holes 61 are arranged between the circuit board 5 and the cooling plate 21. Through the design of the heat dissipation holes 61, the heat generated inside can be effectively discharged, avoiding the accumulation of heat inside the device. The heat dissipation holes 61 not only help to improve the heat dissipation efficiency, but also maintain the air circulation inside the device, thereby reducing the overall temperature. In actual application, the size, shape and number of the heat dissipation holes 61 can be adjusted according to specific needs to achieve the best heat dissipation effect.
[0047] In an embodiment, a temperature sensor is arranged at one end of the touch screen assembly 1 close to the cooling plate 21, and the temperature sensor is electrically connected with the micro fans 7 and the micro pump 4 respectively.
[0048] Through real-time monitoring of the temperature sensor, the system can accurately grasp the temperature change of the touch screen assembly 1. When the temperature sensor detects that the temperature exceeds the preset threshold, it will send a signal to the micro fans 7 and the micro pump 4 to start or adjust their working state. The micro fans 7 will correspondingly increase the speed to improve the air flow rate, thereby enhancing the heat dissipation effect. At the same time, the micro pump 4 will also adjust the working state as needed to ensure that the circulation of the cooling liquid in the cooling plate 21 is more efficient.
[0049] The above only describes the preferred embodiments of the present application, and does not limit the patent range of the present application, and any equivalent structure or equivalent process transformation according to the content of the present application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection range of the present application.
Claims
1. A touch screen with a cooling structure, characterized by, The utility model provides a touch screen cooling device, including touch screen component (1) and the cooling assembly (2) of setting in the one end surface of touch screen component (1), cooling assembly (2) includes cooling plate (21), cooling plate (21) is close to the equidistance of one end surface of touch screen component (1) and is provided with a plurality of heat conduction pin (22), heat conduction pin (22) is provided with the heat dissipation part (23) of protruding from touch screen component (1), and each heat conduction pin (22) is connected with heat conduction sheet (24), and the one end of heat conduction sheet (24) away from cooling plate (21) is connected in touch screen component (1); The heat dissipation part (23) is connected with a heat dissipation pipe (3) at one end of the touch screen component (1). The heat dissipation pipe (3) is filled with a cooling liquid. The heat dissipation pipe (3) surrounds the periphery of the touch screen component (1). The heat dissipation pipe (3) is connected with a micro pump (4) to make the cooling liquid circulate.
2. The touch screen with cooling structure according to claim 1, characterized in that, The cooling plate (21) is also provided with a heat conduction block (25) near the one end surface of the touch screen component (1). The thickness of the heat conduction block (25) is equal to the thickness of the heat conduction sheet (24). The one end surface of the heat conduction block (25) away from the cooling plate (21) is connected to the touch screen component (1). One side of the heat conduction block (25) is connected to the heat conduction pin (22).
3. The touch screen with cooling structure according to claim 1, characterized in that, The four corners of the cooling plate (21) are connected with fixing feet (26). The first end of the fixing foot (26) is fixedly connected with the cooling plate (21). The second end of the fixing foot (26) is connected with a circuit board (5). The cooling plate (21) is provided with a wire hole to connect the connecting wire of the touch screen component (1) with the circuit board (5).
4. The touch screen with cooling structure according to claim 3, characterized in that, The outer side of the heat dissipation pipe (3) is flush with the outer side of the cooling plate (21) and the circuit board (5). The outer side of the heat dissipation pipe (3) is surrounded by an outer shell (6). The outer shell (6) surrounds the cooling plate (21) and the circuit board (5).
5. The touch screen with cooling structure according to claim 4, characterized in that, The inner side of the outer shell (6) is provided with a plurality of mounting grooves corresponding to the heat dissipation pipe (3). A semiconductor refrigeration sheet is mounted in the mounting groove. The refrigeration surface and the heat dissipation surface of the semiconductor refrigeration sheet are connected to the heat dissipation pipe (3) and the outer shell (6) respectively.
6. The touch screen with cooling structure according to claim 1, characterized in that, The touch screen component (1) includes a protection layer (101), a touch layer (102), and a display layer (103) stacked in sequence. The display layer (103) is connected to the heat conduction sheet (24).
7. The touch screen with cooling structure according to claim 4, characterized in that, The one end of the cooling plate (21) facing the circuit board (5) is provided with a plurality of heat conduction silica gel columns (27). The heat conduction silica gel columns (27) are connected to the heating elements of the circuit board (5).
8. The touch screen with cooling structure according to claim 3, characterized in that, Four micro fans (7) are arranged between the circuit board (5) and the cooling plate (21). The four micro fans (7) are distributed at the four corners of the cooling plate (21).
9. The touch screen with cooling structure according to claim 4, characterized in that, The opposite sides of the outer shell (6) are provided with a plurality of heat dissipation holes (61). The heat dissipation holes (61) are arranged between the circuit board (5) and the cooling plate (21).
10. The touch screen with cooling structure according to claim 8, characterized in that, The touch screen assembly (1) is provided with a temperature sensor near one end of the cooling plate (21), and the temperature sensor is electrically connected with the micro fan (7) and the micro pump (4) respectively.