Hot melt adhesive pen circuit and hot melt adhesive pen

Abstract

The utility model discloses a hot melt adhesive pen circuit and a hot melt adhesive pen, the hot melt adhesive pen circuit comprises a battery protection module and a switch control module, the battery protection module comprises a battery protection IC and an external MOS tube connected in parallel, the switch control module comprises a touch IC and a power output MOS tube, and the battery protection IC is connected with the positive electrode of a battery through a resistor R1. According to the hot melt adhesive pen, the cost and the failure rate are reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of hot melt glue pens, in particular to a hot melt glue pen circuit and a hot melt glue pen. BACKGROUND

[0002] Hot melt adhesive is a solvent-free, water-free solid fusible polymer. It is solid at room temperature, and becomes a liquid with certain viscosity when heated to a certain temperature. The hot melt adhesive after melting is light brown or white. Hot melt adhesive is composed of basic resin, tackifier, viscosity regulator and antioxidant. When using hot melt adhesive, a hot melt glue pen is needed to cooperate to melt the hot melt adhesive and spray it to the designated position.

[0003] Currently, in specific applications, the hot melt glue pen circuit is controlled by MCU. Each MCU needs to be programmed before use. Long-time work may cause system crash, and the cost of this solution is high. CONTENT OF THE INVENTION

[0004] Therefore, the present application provides a hot melt glue pen circuit and a hot melt glue pen. In limited space, fewer components can be used to increase the overcurrent protection value, reduce the failure rate and product cost.

[0005] In a first aspect, the present application provides a hot melt glue pen circuit, comprising a battery protection module and a switch control module. The battery protection module comprises a battery protection IC and a parallel external MOS tube. The switch control module comprises a power output MOS tube. The battery protection IC is connected to the positive electrode of the power supply through a resistor R1.

[0006] By adopting the above technical solution, the battery protection module and the switch control module are combined, the battery protection IC and the built-in MOS tube are integrated in the battery protection module, which reduces the number of external components, simplifies the circuit structure, and reduces the overall production cost. In products such as hot melt glue pens that have high space requirements, the circuit design of the present application realizes effective integration in limited space by simplifying the number of components and optimizing the layout, which is beneficial to the miniaturization and lightweight design of the product. Since the number of complex electronic components and MCU programming is reduced, the maintenance and repair of the hot melt glue pen become simpler and more direct, which reduces the difficulty of use and maintenance cost for users.

[0007] In some embodiments, the battery protection module is DW03D, the seventh pin of the DW03D is connected to the positive electrode of the battery through the R1, and the third pin of the DW03D is connected to the negative electrode of the battery.

[0008] By adopting the technical scheme, the DW03D is a two-in-one lithium battery protection IC integrating a high-precision voltage detection circuit, a delay circuit and a power MOSFET. The DW03D can monitor the voltage and current of the battery, and when the battery has abnormal conditions such as overcharge, overdischarge, overcurrent or short circuit, the DW03D will respond quickly and take measures to protect the battery. During normal charging, when the battery voltage is higher than the overcharge detection voltage (VCU) and the duration reaches the overcharge voltage detection delay time (tCU) or longer, the DW03D will control the MOSFET to stop charging, thereby preventing the battery from overcharging. During normal discharging, when the battery voltage drops below the overdischarge detection voltage (VDL) and the duration reaches the overdischarge voltage detection delay time (tDL) or longer, the DW03D will disconnect the battery and the load, stopping discharging, thereby preventing the battery from overdischarging.

[0009] In some embodiments, the second pin of the DW03D is connected to G1 of the built-in MOS tube and the external MOS tube for discharge output control.

[0010] By adopting the technical scheme, the second pin of the DW03D is connected to the gate of the built-in MOS tube and the external MOS tube. This design ensures that the current is slightly smaller when only the built-in MOS tube is discharged, and the discharge protection current is doubled when a large current is needed, thereby improving the reliability and safety of the circuit.

[0011] In some embodiments, the eighth pin of the DW03D is connected to G2 of the built-in MOS tube and the external MOS tube for charge state output control.

[0012] By adopting the technical scheme, the eighth pin of the DW03D is connected to the gate G2 of the built-in MOS tube and the external MOS tube, and the system realizes abnormal charging current detection control to prevent charging abnormalities.

[0013] In some embodiments, the overcurrent detection is connected to the first pin of the DW03D through R2. By adopting the technical scheme, when the battery charging or discharging current is too large, the voltage drop on R2 will increase, thereby triggering the overcurrent detection function of the DW03D.

[0014] In some embodiments, the external MOS tube is 8205A, and the built-in MOS tube and the external MOS tube are connected in parallel for current expansion.

[0015] By adopting the technical scheme, the 8205A MOS tube has a high current carrying capacity and is suitable for application scenarios that require large current output. When multiple MOS tubes are connected in parallel, the resistance of the parallel path will be smaller, and the corresponding allowed current will be larger.

[0016] In some embodiments, the switch control module further comprises a touch chip for controlling the external MOS tube.

[0017] By adopting the above technical solution, the technical solution of the switch control module containing the touch chip for controlling the external MOS tube has significant technical effects in improving the convenience and intelligence of control, enhancing the response speed and accuracy of the system, reducing power consumption and maintenance cost, improving safety and stability, realizing multifunctional integration and expansibility, and optimizing user experience and meeting diversified needs.

[0018] In some embodiments, a charging protection module connected to the switch control module is further included, which prevents the switch control module from working in a charging state.

[0019] By adopting the above technical solution, the charging protection module can effectively prevent the switch control module from working during charging, preventing device damage or safety hazards caused by improper operation or current fluctuations, thereby significantly improving the safety of the charging process. The addition of the charging protection module can ensure the stability of the charging current and voltage, avoid the reduction of charging efficiency caused by the interference of the switch control module, and enable the device to complete the charging process faster and more stably. In the charging state, the user may accidentally touch the switch control module, causing unnecessary operation or change of the device state. The presence of the charging protection module effectively prevents this situation from occurring, improving the reliability and stability of the device. Combined with intelligent control algorithms, the charging protection module can further realize intelligent charging management, such as adjusting the charging current according to the battery state, monitoring the battery temperature, etc., to further optimize the charging efficiency and safety.

[0020] In some embodiments, the charging protection module comprises a constant current / constant voltage linear charging IC, which automatically terminates charging when the charging current decreases to 1 / 10 of the set value after reaching the final floating charging voltage.

[0021] By adopting the above technical solution, during the charging process, the battery is first charged with a constant current, and when the battery voltage gradually rises and approaches the preset floating charging voltage (usually 4.2V), the charging current begins to gradually decrease. When the charging current decreases to 1 / 10 of the set value, the linear charging IC automatically terminates charging, thereby avoiding overcharging of the battery and protecting the safety of the battery and the charging device.

[0022] In a second aspect, the present application provides a hot melt glue pen comprising the hot melt glue pen circuit as described in the first aspect.

[0023] By adopting the above technical solution, the hot melt glue pen provided by the present application has the characteristics of efficient heating, precise control, safety and reliability, portability and ease of use, and can be widely applied to various occasions requiring adhesion.

[0024] In summary, the present application has at least one of the following beneficial technical effects:

[0025] 1、The circuit of the present application does not need to design MCU program software and does not need to burn the program in batch production, realizes the cost reduction and efficiency improvement, improves the production efficiency, and is beneficial to batch production.

[0026] 2、The circuit of the present application takes DW03D as the core of the battery protection module, combines with the built-in MOS tube and the external MOS tube, and forms a modular circuit design. This design makes the circuit more concise, easy to maintain and upgrade.

[0027] 3、The hot melt glue pen of the present application can monitor the voltage and current of the battery in real time, and take measures to protect the battery when abnormal conditions occur, thereby improving the safety of the product, reducing the failure rate, and prolonging the service life of the product. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a circuit schematic diagram of the hot melt glue pen of the present application;

[0029] Figure 2 is a circuit schematic diagram of the battery protection module;

[0030] Figure 3 is a circuit schematic diagram of the switch control module;

[0031] Figure 4 is a circuit schematic diagram of the charging protection module.

[0032] REFERENCE SIGNS:

[0033] 1、Battery protection module; 2、Switch control module; 3、Charging protection module. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the present application will be further described in detail below with reference to the drawings. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0035] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0036] In the description of the utility model, it is necessary to explain that, unless there is definite stipulation and limitation, the terms "mount", "connect", "connect" should be understood in broad sense, for example, it can be fixed connection, also can be detachable connection, or integrally connected, can be mechanical connection, also can be electrical connection, can be direct connection, also can indirectly connect through intermediate medium, can be the communication of two elements inside, for the ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0037] In the description of the present application, it should be understood that the orientation or position relationship indicated by the terms "up", "down", "left", "right" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the present application.

[0038] The embodiments of the utility model will be described in detail below with reference to the drawings.In the case of no conflict, the features in the following examples can be combined with each other.

[0039] Example 1

[0040] The embodiment of the present application provides a hot melt glue pen circuit, which comprises a battery protection module 1 and a switch control module 2.The battery protection module 1 comprises a battery protection IC and a parallel external MOS tube, the switch control module 2 comprises a touch IC and a power output MOS tube, and the battery protection IC is connected with the positive electrode of the battery through a resistor.This design effectively solves the problem of MCU dead machine in the traditional hot melt glue pen, improves the reliability of the equipment, and reduces the production cost.

[0041] Please refer to Figure 1 , the battery protection module 1 comprises a battery protection IC and a parallel internal MOS tube.The battery protection IC can select the common type DW03D on the market.The seventh pin of DW03D is connected with the positive electrode of the battery through a resistor, and the third pin is connected with the negative electrode of the battery.

[0042] The MOS tube built-in DW03D is used for discharge output control, and the external MOS tube is used for improving the load capacity of the whole circuit.Preferably, 8205A can be used as an external MOS tube, which is used in parallel with the built-in MOS tube to expand the flow.Thus, not only the maximum working current of the circuit can be increased, but also the heat can be dispersed, and the service life of the device can be prolonged.Of course, other types of MOS tubes can also be selected.

[0043] The overcurrent detection part is connected with the first pin of DW03D through a resistor to realize the monitoring of the current.When the current exceeds the preset threshold, DW03D will automatically cut off the power supply to avoid safety accidents caused by overload.

[0044] Specifically, the battery protection module 1 is composed of DW03 and 8205A in parallel. The positive electrode of the battery is connected to the 7th pin of DW03D through R1, the negative electrode is connected to the 3rd pin of DW03D, the 2nd pin of DW03D outputs high level when the battery voltage is greater than 2.6V, the 2nd pin of the discharge output control end is connected to the 4th pin to control the G pole of the built-in MOS tube and the external MOS tube 8205A, and the discharge MOS tube works normally. On the contrary, when the battery voltage is lower than 2.5V, the 2nd pin of the discharge end outputs low level, and the G pole of the built-in MOS tube and the external MOS tube closes the discharge circuit. When the battery voltage is less than 4.2V, the 8th pin of the charging output control end is connected to the 5th pin to control the G pole of the built-in MOS tube and the external MOS tube 8205A, and the charging MOS tube works normally. On the contrary, when the battery voltage is higher than 4.3V, the 8th pin of the charging output control end outputs low level, and the G pole of the built-in MOS tube and the external MOS tube closes the charging circuit. When the current of the built-in MOS tube of DW03D exceeds 3A, an over-discharge protection signal is output to control the MOS tube to protect it. When the discharge current is greater than 3A, the MOS tube 8205A needs to be connected in parallel to expand the current, so that the discharge current protection current reaches 6A, which meets the circuit requirements.

[0045] Please refer to Figure 2 The switch control module 2 also includes a touch chip for controlling the on-off state of the external MOS tube. The touch chip can sense the user's finger touch, thereby triggering the MOS tube to turn on or off. Commonly used touch chips include TPS22918 or MTCH101, which have high sensitivity and response speed and are suitable for application in portable electronic products.

[0046] Specifically, the positive electrode of the battery is connected to the 5th pin of the touch chip TTP223 through R3, the negative electrode is connected to the 3rd pin, and the 1st pin outputs a state according to the 4th pin connected to the negative electrode to output low level. The G pole of the power output MOS tube Q1 is low and in the off state. When the switch KEY is pressed to trigger the 3rd pin of the touch chip TTP223, the 1st pin of U3 flips and outputs high level according to the 6th pin connected to the power supply, and the G pole of the Q1 power output MOS tube 8205A is high to open the discharge circuit. When the physical button in the circuit is replaced by a touch spring, the touch switch function can be realized, and the same circuit can realize more function selection to reduce development cost.

[0047] Please refer to Figure 3, the charging protection module 3 is designed to prevent accidents caused by misoperation during charging. This module includes a constant current / constant voltage linear charging IC that automatically terminates charging when the charging current drops to 1 / 10 of the set value after reaching the final floating voltage. This ensures that the battery is not overcharged after being fully charged, avoiding potential safety hazards. Common linear charging ICs include TP4056 or BQ24073, which have perfect protection mechanisms and are suitable for various lithium battery charging and discharging scenarios.

[0048] The implementation principle of this embodiment is to optimize the design of the battery protection module 1 and the switch control module 2, achieving efficient and reliable operation of the hot melt glue pen circuit. In particular, the use of parallel MOS tubes and touch chips greatly simplifies the circuit structure and reduces production costs. At the same time, the effective combination of overcurrent detection and charging protection module 3 ensures that the device can be safely used in any situation, improving user experience. In addition, this design scheme also has good scalability, allowing flexible adjustment of component parameters according to actual needs to meet the requirements of different application scenarios.

[0049] Embodiment 2

[0050] The difference between this embodiment and the above-mentioned embodiments is that a temperature feedback loop is added to more accurately control the working state of the heating element. Specifically, a temperature sensor can be added inside the hot melt glue pen to transmit its signal to the battery protection IC, and a comparator is used to determine whether to adjust the heating power. This not only improves heating efficiency but also avoids material damage caused by excessive temperature.

[0051] The temperature sensor can be an NTC thermistor or a PT100 platinum resistor. Both of these sensors have high measurement accuracy and stability. NTC thermistors are small in size and inexpensive, making them suitable for integration in compact devices. PT100 platinum resistors have a wider range and higher resolution, making them suitable for applications that require fine control.

[0052] After filtering and amplification, the signal of the temperature sensor is transmitted to a specific pin of the battery protection IC. The battery protection IC has a comparator function integrated inside, which compares the collected temperature data with the preset value. If the temperature is lower than the preset value, the heating power is increased; otherwise, the heating power is decreased. This method allows dynamic adjustment to maintain the optimal working temperature range.

[0053] In addition, an indicator light is added to the circuit to display the current heating state. The color of the indicator light can be switched according to temperature changes, such as green for normal operation and red for over-temperature alarm. This allows users to directly observe the status of the device and take timely action.

[0054] The implementation principle of this embodiment is to significantly improve the heating control accuracy and safety of the hot melt glue pen by introducing a temperature feedback loop. Real-time monitoring by the temperature sensor and intelligent adjustment by the battery protection IC enable the device to maintain stable performance in complex environments. At the same time, the design of the indicator light enhances the user's perceptual experience, facilitating troubleshooting and maintenance. Overall, this improvement not only enhances the competitiveness of the product but also brings more convenience and peace of mind to users.

[0055] Embodiment 3

[0056] The difference between this embodiment and the above-mentioned embodiments is that a wireless communication function is added, allowing the hot melt glue pen to remotely receive instructions and perform corresponding operations. Specifically, a Bluetooth module or a Wi-Fi module can be added to the hot melt glue pen circuit, and control commands can be sent through a mobile phone APP or other terminal devices to achieve remote control.

[0057] The Bluetooth module can choose HC-05 or ESP32-BT, which supports multiple communication protocols, has low power consumption, and high transmission rate. The Wi-Fi module can choose ESP8266 or ESP32-WROOM-32, which not only supports standard IEEE 802.11b / g / n protocols, but also has powerful processing capabilities and rich peripheral interfaces, making it very suitable for embedded development.

[0058] The wireless communication module is connected to the main control unit through a serial communication interface to realize bidirectional data exchange. After the main control unit receives external instructions, it parses the corresponding action code and then executes the specified operation by controlling the switching state of the external MOS tube. For example, you can set up start heating, stop heating, and temperature adjustment function keys, and users can complete the operation by clicking on the mobile phone APP.

[0059] In addition, some auxiliary functions such as historical record query and energy consumption statistics can be added to the APP side to help users better manage the device. For enterprise users, such design can also help improve work efficiency and management level.

[0060] The implementation principle of this embodiment is to introduce wireless communication functions, which greatly enrich the application scenarios and use convenience of the hot melt glue pen. Users do not need to directly touch the device to easily implement various operations, especially suitable for large production lines or multi-point operation environments. At the same time, the addition of data analysis and management functions provides strong support for enterprise decision-making, further enhancing the market value and technical content of the product.

[0061] Embodiment 4

[0062] The difference between this embodiment and the above-mentioned embodiments is that a multi-protection mechanism is added to enhance the safety and durability of the device. Specifically, in addition to the original battery protection module 1 and the charging protection module 3, an anti-static and anti-electromagnetic interference component is also added to the circuit.

[0063] The anti-static component can use a TVS diode or an ESD protection array, which has fast response time and low clamping voltage characteristics, can effectively absorb transient surge energy, and prevent static breakdown of sensitive components. Common TVS diodes include the P6KE series, and ESD protection arrays include the SP1013 series, which are widely used in various electronic devices.

[0064] The anti-electromagnetic interference component can be selected from a magnetic ring, a common mode choke, or an EMI filter, which can suppress high-frequency noise and stray magnetic field effects, reducing interference with external devices. For example, a magnetic ring can be wrapped around the power supply line to form a shielding layer; a common mode choke can be installed at key nodes to eliminate common mode interference; and an EMI filter can be placed near the input and output ports to purify signal quality.

[0065] In addition, some optimization measures can be taken on the PCB layout, such as reasonable wiring, regional isolation, and installation of ground copper foil, to further reduce the risk of electromagnetic radiation. These methods may seem simple, but they can greatly improve the stability and service life of the system.

[0066] The implementation principle of this embodiment is to comprehensively protect the safety and reliability of the hot melt glue pen through multi-level protection design. Whether it is in a complex industrial site or a home use environment, this device can perform well. Especially for high pressure, high temperature, strong electromagnetic field and other working conditions, the multi-protection mechanism can effectively deal with potential risks to ensure that the device is always in the best working condition. This is of great significance to improving brand image and user trust.

[0067] Embodiment 5

[0068] The difference between this embodiment and the above-mentioned embodiments is that a self-diagnosis function is added, allowing the hot melt glue pen to automatically detect its own state and issue an alarm when a problem is found. Specifically, a small single-chip microcomputer can be added to the circuit to collect data information from each module and perform comprehensive analysis and judgment.

[0069] The single-chip microcomputer establishes a communication link with other modules through the SPI / I²C bus and regularly reads parameters such as battery level, temperature, and current. Once an abnormal condition is found, the LED indicator light or buzzer is immediately lit to remind the user to check the device. In addition, the single-chip microcomputer can also store certain log files to record detailed information of each use, facilitating subsequent maintenance and repair.

[0070] To improve the accuracy of self-diagnosis, a combination of multiple algorithms can be used. For example, Kalman filter is used to smooth the sensor data and remove noise interference; fuzzy logic reasoning method is used to evaluate the overall health status of the equipment and generate a score report. These advanced algorithms may have a large amount of calculation, but modern single-chip microcomputers have strong computing power and can fully handle such tasks.

[0071] In addition, OTA (Over-The-Air) technology can be used to upgrade the firmware online. This means that even after the device is shipped, manufacturers can push new patches and features at any time to continuously optimize user experience. This is a great advantage for companies that pursue technological innovation.

[0072] The implementation principle of the embodiment is: by introducing the self-diagnosis function, the intelligent level and service quality of the hot melt glue pen are greatly improved. Users can use the device more confidently, and it is easier to find solutions when problems occur. Manufacturers can obtain valuable market feedback through big data analysis to guide future product development direction. In short, this design not only improves the user experience, but also lays a solid foundation for the sustainable development of the enterprise.

[0073] Embodiment 6

[0074] The hot melt glue pen provided in the embodiment has an internal circuit of the hot melt glue pen circuit in any of the above embodiments.

[0075] The basic principles, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, the present application can have various changes, modifications, replacements and variations, and these changes, modifications, replacements and variations fall within the scope of the present application.

Claims

1. A hot melt glue pen circuit, characterized in that, It includes a battery protection module and a switch control module. The battery protection module includes a battery protection IC with a built-in MOSFET connected in parallel with an external MOSFET. The switch control module includes a touch IC and an external MOSFET. The battery protection IC is connected to the positive terminal of the power supply through a resistor R1.

2. The hot melt glue pen circuit according to claim 1, characterized in that, The battery protection module is a DW03D. The seventh pin of the DW03D is connected to the positive terminal of the power supply through R1, and the third pin of the DW03D is connected to the negative terminal of the power supply.

3. The hot melt glue pen circuit according to claim 2, characterized in that, The second pin of the DW03D is connected to the G1 pin of the built-in MOSFET and the external MOSFET, and is used for discharge state output control.

4. The hot melt glue pen circuit according to claim 2, characterized in that, The eighth pin of the DW03D is connected to the G2 pin of the built-in MOSFET and the external MOSFET, and is used for charging status output control.

5. The hot melt glue pen circuit according to claim 2, characterized in that, Overcurrent detection is connected to the first pin of the DW03D via R2.

6. The hot melt glue pen circuit according to any one of claims 2-5, characterized in that, The external MOSFET is an 8205A, and the built-in MOSFET and the external MOSFET in the DW03D are connected in parallel for current amplification.

7. The hot melt glue pen circuit according to claim 1, characterized in that, The switch control module also includes a touch chip for controlling the power output MOSFET of Q1.

8. The hot melt glue pen circuit according to claim 1, characterized in that, It also includes a charging protection module connected to the switch control module, which prevents the switch control module from operating during charging.

9. The hot melt glue pen circuit according to claim 8, characterized in that, The charging protection module includes a constant current / constant voltage linear charging IC. When the charging current drops to 1 / 10 of the set value after reaching the final float voltage, the linear charging IC automatically terminates the charging.

10. A hot melt adhesive pen, characterized in that, Includes the hot melt glue pen circuit as described in any one of claims 1-9.

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