R-shift test substrate

Abstract

The utility model discloses an R-shift test substrate, and relates to the field of electronic circuit manufacture, the R-shift test substrate comprises N layers of core plates, N is a positive integer greater than or equal to 1, and the N layers of core plates comprise a first layer of core plate; the first layer of core board is provided with n first left side bonding pads and n first right side bonding pads, n is a positive integer greater than 1, the n first left side bonding pads are connected according to a first intermittent mode, and the n first right side bonding pads are connected according to a second intermittent mode; i blind holes are formed between each first left side bonding pad and the corresponding first right side bonding pad, i is a positive integer greater than 1, each first left side bonding pad is connected with the first blind hole, in the second to (i-1) th blind holes, the even number of blind holes are connected with the next adjacent blind hole of the even number of blind holes, and the ith blind hole is connected with the corresponding first right side bonding pad. By means of the arrangement, the problem that an existing R-shift test substrate cannot rapidly and accurately position a specific hole position where failure occurs, and consequently analysis efficiency is low is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic circuit manufacturing field especially, relate to a kind of R-shift test substrate. BACKGROUND

[0002] In the field of electronic circuit manufacturing, R-shift test substrate usually relies on the blind hole in the substrate or polypropylene (PP) and its corresponding large copper skin, to realize the electrical interconnection of multiple blind holes. This design enhances the stability and reliability of the circuit to some extent, however, in practical application, when a blind hole in the R-shift test substrate fails (such as open circuit or short circuit), the traditional failure analysis process usually needs to grind all blind holes one by one, this process not only consumes time, but also greatly consumes equipment and human resources.

[0003] Therefore, the existing R-shift test substrate cannot quickly and accurately locate the specific hole position where failure occurs, resulting in low analysis efficiency. SUMMARY

[0004] The utility model embodiment provides a kind of R-shift test substrate, to solve the problem that the existing R-shift test substrate cannot quickly and accurately locate the specific hole position where failure occurs, resulting in low analysis efficiency.

[0005] In order to solve the above-mentioned problems, the utility model provides an R-shift test substrate, comprising N layers of core plates, N is a positive integer greater than or equal to 1, the N layers of core plates include the first layer of core plate;

[0006] The first layer of core plate is provided with n first left side pads and n first right side pads, n is a positive integer greater than 1, the first left side pads are connected according to the first intermittent mode, and the first right side pads are connected according to the second intermittent mode;

[0007] Each first left side pad and the corresponding first right side pad are provided with i blind holes, i is a positive integer greater than 1, each first left side pad is connected with the first blind hole, and in the second to i-1 blind holes, the even blind hole is connected with the next adjacent blind hole, and the i blind hole is connected with the corresponding first right side pad.

[0008] Optionally, the N layers of core plates further include the second layer of core plate;

[0009] The second layer of core plate is provided with one second left side pad and one second right side pad;

[0010] The length of the second left side pad includes the total length of the n first left side pads in the first layer core plate and the total interval distance between the n first left side pads, and the length of the second right side pad includes the total length of the n first right side pads in the first layer core plate and the total interval distance between the n first right side pads.

[0011] The second left side pad is electrically connected with the n first left side pads in the first layer core plate.

[0012] The second right side pad is electrically connected with the n first right side pads in the first layer core plate.

[0013] Each blind hole between the second left side pad and the second right side pad is independent, and each blind hole is electrically connected with the corresponding blind hole of the first layer core plate.

[0014] Optionally, the N-layer core plate further includes a third layer core plate to an n-th layer core plate.

[0015] The structure of the third layer core plate to the n-1-th layer core plate is the same as that of the second layer core plate, and the structure of the n-th layer core plate is the same as that of the first layer core plate.

[0016] Optionally, the interval distance between adjacent first left side pads is X mm, the interval distance between adjacent first right side pads is Y mm, and the X mm is equal to the Y mm.

[0017] Optionally, the value range of the X mm and the Y mm is 0.05 mm-0.5 mm.

[0018] Optionally, the length and width of the first left side pad and the first right side pad are xmm and ymm respectively, the value range of the xmm is 1 mm-2 mm, and the value range of the ymm is 0.5 mm-1 mm.

[0019] Optionally, the n first left side pads are connected by wires in a first intermittent manner, and the n first right side pads are connected by wires in a second intermittent manner.

[0020] Optionally, the n first left side pads are connected in a first intermittent manner, and the n first right side pads are connected in a second intermittent manner, including:

[0021] Among the first to n-th first left side pads, an even first left side pad is connected with the next adjacent first left side pad of the even first left side pad.

[0022] Among the first to the nth first right side pads, the odd first right side pad is connected with the next adjacent first right side pad of the odd first right side pad;

[0023] Or,

[0024] Among the first to the nth first left side pads, the odd first left side pad is connected with the next adjacent first left side pad of the odd first left side pad;

[0025] Among the first to the nth first right side pads, the even first right side pad is connected with the next adjacent first right side pad of the even first right side pad.

[0026] Optionally, the N-layer core plate is combined through a pressing process.

[0027] Optionally, the R-shift test substrate comprises a printed circuit board.

[0028] The utility model provides a kind of R-shift test substrate, which connects n first left side pads and n first right side pads in intermittent connection mode, and sets multiple blind holes between each first left side pad and corresponding first right side pad. When a blind hole fails, the row number of the failed blind hole can be quickly located by testing the resistance change of the blind hole between each row of first left side pads and corresponding first right side pads, and then the blind hole in this row is analyzed, reducing the analysis time on the remaining blind holes and improving the analysis efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0029] To more clearly illustrate the technical solutions of the embodiments of the utility model, the following will be briefly introduced the drawings needed to be used in the description of the embodiments of the utility model. Obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to these drawings without creative labor for those skilled in the art.

[0030] Fig. 1 is a schematic diagram of the first layer core plate of the R-shift test substrate in an embodiment of the utility model;

[0031] Fig. 2 is a schematic diagram of the second layer core plate of the R-shift test substrate in an embodiment of the utility model;

[0032] Fig. 3 is a schematic diagram of the R-shift test substrate with three layer core plates in an embodiment of the utility model. DETAILED DESCRIPTION

[0033] Clearly, the described embodiments are only some, but not all implementations of this application. Based on the embodiments of the present application described above, those skilled in the art can obtain all other embodiments within the scope of the present application without any inventive effort, and these embodiments all belong to the scope of the present application.

[0034] It is to be understood that the application can assume various alternative forms of embodiment, and it is not to be limited to the embodiments set forth and described herein. Rather, the instant disclosure is intended to cover all adaptations, modifications, and equivalents. In addition, unless expressly stated otherwise, the description of an embodiment should not be construed as indicating that the features, items or components relating thereto are essential or indispensable. In the drawings, the size and relative sizes of layers and regions can be exaggerated for clarity.

[0035] It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers present. It will also be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms since such terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section.

[0036] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0037] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein the term "and / or" includes any and all combinations of associated items.

[0038] For a thorough understanding of the present application, reference will be made to the following detailed description, in conjunction with the accompanying drawings, in which:

[0039] In one embodiment, as shown in FIG. 1, the present application provides an R-shift test substrate, which comprises N layers of core plates, N is a positive integer greater than or equal to 1, and the N layers of core plates comprise a first layer of core plate. Figs. 1 to 3 The first layer of core plate is provided with n first left side pads and n first right side pads, n is a positive integer greater than 1, and the n first left side pads are connected in a first intermittent manner, and the n first right side pads are connected in a second intermittent manner.

[0040] In this embodiment, the first layer of core plate is provided with n first left side pads and n first right side pads, n is a positive integer greater than 1, for example, n is 5, then the first layer of core plate will be provided with 5 first left side pads and 5 first right side pads.

[0041] As an example, the n first left side pads are connected in a first intermittent manner, and the n first right side pads are connected in a second intermittent manner, which includes the following manners:

[0042] In one embodiment, among the first to n first left side pads, the even first left side pads are connected with the next adjacent first left side pad of the even first left side pad, and among the first to n first right side pads, the odd first right side pads are connected with the next adjacent first right side pad of the odd first right side pad.

[0043] As an example, among the first left-side pads from the 1st to the nth, even-numbered first left-side pads are connected to the next adjacent first left-side pad, including: the 2nd first left-side pad is electrically connected to the 3rd first left-side pad, the 4th first left-side pad is electrically connected to the 5th first left-side pad, and so on, up to the (n-1)th first left-side pad being electrically connected to the nth first left-side pad. Among the first right-side pads from the 1st to the nth, odd-numbered first right-side pads are connected to the next adjacent first right-side pad, including: the 1st first right-side pad is electrically connected to the 2nd first right-side pad, the 3rd first right-side pad is electrically connected to the 4th first right-side pad, and so on, up to the (n-2)th first right-side pad being electrically connected to the (n-1)th first right-side pad. With the above settings, when performing resistance change rate testing on the R-shift test substrate in the future, the isolation test method can be used to quickly locate which row of the failed blind via is located, thus improving the analysis efficiency.

[0044] For example, such as Fig. 3 As shown, assuming n is 5, the arrangement of the 1st to 5th first left-side pads is L1, L2, L3, L4, and L5; the arrangement of the 1st to 5th first right-side pads is R1, R2, R3, R4, and R5. Specifically, the connection method can be as follows: For the first left-side pads, the 2nd first left-side pad (L2) and the 4th first left-side pad (L4) are connected to their adjacent next first left-side pad, i.e., L2 is connected to L3, and L4 is connected to L5, while the 1st first left-side pad (L1) remains independent. For the first right-side pads, the 1st first right-side pad (R1) and the 3rd first right-side pad (R3) are connected to their adjacent next first right-side pad, i.e., R1 is connected to R2, and R3 is connected to R4, while the 5th first right-side pad (R5) remains independent. It should be noted that the above is merely an example and does not constitute a limitation of this application.

[0045] In another embodiment, among the first to nth first left pads, the odd-numbered first left pads are connected to the next adjacent first left pad of the odd-numbered first left pad; among the first to nth first right pads, the even-numbered first right pads are connected to the next adjacent first right pad of the even-numbered first right pad.

[0046] As an example, in the first to the nth first left side pads, the odd first left side pads are connected with the next adjacent first left side pad of the odd first left side pad, including: the first first left side pad is electrically connected with the second first left side pad, the third first left side pad is electrically connected with the fourth first left side pad, and so on, the (n-2)th first left side pad is electrically connected with the (n-1)th first left side pad. In the first to the nth first right side pads, the even first right side pads are connected with the next adjacent first right side pad of the even first right side pad, including: the second first right side pad is electrically connected with the third first right side pad, the fourth first right side pad is electrically connected with the fifth first right side pad, and so on, the (n-1)th first right side pad is electrically connected with the nth first right side pad.

[0047] For example, assuming that n is 5, the arrangement of the first to the fifth first left side pads is L1, L2, L3, L4 and L5, and the arrangement of the first to the fifth first right side pads is R1, R2, R3, R4 and R5. The specific connection mode can be: for the first left side pads, the first first left side pad (L1) and the third first left side pad (L3) are connected with the next adjacent first left side pad, that is, L1 is connected with L2, and L3 is connected with L4, and the fifth first left side pad (L5) is kept independent. For the first right side pads, the second first right side pad (R2) and the fourth first right side pad (R4) are connected with the next adjacent first right side pad, that is, R2 is connected with R3, and R4 is connected with R5, and the first first right side pad (R1) is kept independent. It should be noted that the above is only an example and does not limit the present application.

[0048] In an embodiment, i blind holes are arranged between each first left side pad and the corresponding first right side pad, i is a positive integer greater than 1, each first left side pad is connected with the first blind hole, and in the second to the (i-1)th blind holes, the even blind holes are connected with the next adjacent blind hole, and the ith blind hole is connected with the corresponding first right side pad.

[0049] In the embodiment, i blind holes are arranged between each first left side pad and the corresponding first right side pad, at this time, the total number of blind holes of the first core plate is n*i, for example, assuming that n is 5 and i is 20, the total number of blind holes of the first core plate is 100, and the present application is not limited in particular.

[0050] As an example, i blind holes are provided between each first left pad and the corresponding first right pad, where i is a positive integer greater than 1. Specifically, the 1st blind hole is connected to each first left pad to provide a basic electrical connection for the entire circuit, and the 2nd to the (i-1)th blind hole is connected in a spaced-apart manner, where an even blind hole is connected to the next adjacent even blind hole. This design not only achieves higher compactness in layout, but also enhances the stability of the circuit in signal transmission. Finally, the ith blind hole is directly connected to the corresponding first right pad, completing the complete circuit connection between the left pad and the right pad.

[0051] For example, the R-shift test substrate is designed with 5 first left pads and 5 first right pads, and 20 blind holes are provided between each pair of pads. As a connection method, the 1st first left pad is connected to the 1st blind hole, the 2nd blind hole is connected to the 3rd blind hole, the 4th blind hole is connected to the 5th blind hole, and so on, and the ith blind hole is connected to the 1st first right pad, forming a right electrical path. And because the 1st first right pad is connected to the 2nd first right pad, or the 1st first left pad is connected to the 2nd first left pad, the signal can be successfully transmitted to the next row of pads, ensuring smooth transmission of current between multiple rows of blind holes.

[0052] In summary, through the above design, when the resistance between the 1st first left pad and the nth first right pad is greater than the preset threshold value during the R-shift test (resistance change rate test), it indicates that there is a failed blind hole in the R-shift test substrate, and then by testing the resistance between each row of first left pads and the corresponding first right pads, the row number of the failed blind hole can be quickly located, and then by slicing the blind hole quality, the blind hole failure position can be found, and the analysis efficiency is improved. For example, when testing the first left pad and the corresponding first right pad of the 1st row, the connection between the 1st row and the 2nd row of pads can be disconnected, for example, the connection between the 1st first right pad and the 2nd first right pad is disconnected, or the connection between the 1st first left pad and the 2nd first left pad is disconnected.

[0053] In an embodiment, the N-layer core board further comprises a second layer core board; the second layer core board is provided with a second left side pad and a second right side pad; the length of the second left side pad comprises the total length of n first left side pads in the first layer core board and the total interval distance between the n first left side pads, and the length of the second right side pad comprises the total length of n first right side pads in the first layer core board and the total interval distance between the n first right side pads; the second left side pad is in electrical conduction with the n first left side pads in the first layer core board; the second right side pad is in electrical conduction with the n first right side pads in the first layer core board; each blind hole between the second left side pad and the second right side pad is independent, and each blind hole is in electrical conduction with the corresponding blind hole in the first layer core board.

[0054] As an example, the length of the second left side pad can be the total length of n first left side pads in the first layer core board and the total interval distance between the n first left side pads, and the length of the second right side pad can be the total length of n first right side pads in the first layer core board and the total interval distance between the n first right side pads. Through the above arrangement, a solid foundation is provided for the electrical connection between different layer core boards, and the transmission efficiency of the signal is optimized. The second left side pad is in electrical conduction with the n first left side pads in the first layer core board, and the second right side pad is in electrical conduction with the n first right side pads in the first layer core board, which ensures the continuity of the signal transmission path and reduces distortion and attenuation in the transmission process.

[0055] For example, assuming that there are 5 first left side pads and 5 first right side pads on the first layer core board, and the interval between each pad is 0.1 mm. Then, the total length of the second left side pad will be the total length of the 5 first left side pads plus the total of 4 intervals (0.1 mm x 4 = 0.4 mm), i.e., the length of the second left side pad will be the total length of the 5 first left side pads plus 0.4 mm. And the second right side pad is calculated in the same way to ensure that the length of the second right side pad is consistent with the second left side pad.

[0056] Further, as shown in Fig. 2 each blind hole between the second left side pad and the second right side pad is independent, which means that the electrical function of each blind hole will not be affected by other blind holes. The number of blind holes between the second left side pad and the second right side pad is the total number of blind holes on the first layer core board, i.e., n*i blind holes, and the arrangement of blind holes between the second left side pad and the second right side pad is consistent with the arrangement of blind holes between the first left side pad and the first right side pad in the first layer core board, and each blind hole is in electrical conduction with the corresponding blind hole in the first layer core board, which provides a good foundation for subsequent electrical testing and verification, and ensures that the product can achieve the expected performance indicators in actual application.

[0057] In an embodiment, the N-layer core board further comprises a third core board to an nth core board; the third core board to the (n-1)th core board have the same structure as the second core board, and the nth core board has the same structure as the first core board.

[0058] As an example, the N-layer core board further comprises a third core board to an nth core board, wherein the third core board to the (n-1)th core board have the same structure as the second core board, and the nth core board has the same structure as the first core board, that is, the third core board to the (n-1)th core board are consistent with the second core board in layout and pad arrangement, and the nth core board is consistent with the first core board in layout and pad arrangement. For example, N is 5, and the R-shift test substrate comprises 5 core boards, wherein the third core board and the fourth core board are consistent with the second core board in layout and pad arrangement, and the fifth core board is consistent with the first core board in layout and pad arrangement. Through this design, the overall circuit can maintain high signal integrity in a multi-layer architecture, adapting to the requirements of modern electronic products for high performance.

[0059] In an embodiment, the interval distance between adjacent first left side pads is X mm, and the interval distance between adjacent first right side pads is Y mm, and X mm is equal to Y mm.

[0060] In this embodiment, the value range of X mm and Y mm is 0.05 mm-0.5 mm, and preferably, the value of X mm and Y mm can be 0.1 mm, 0.15 mm, 0.2 mm, 0.3 mm and 0.4 mm, and the specific value is not limited.

[0061] As an example, the interval distance between adjacent first left side pads is X mm, and the interval distance between adjacent first right side pads is Y mm, and X mm is equal to Y mm, which means that the pad layout of the entire R-shift test substrate is symmetrical on the left and right sides, which helps to maintain the consistency and stability of electrical performance.

[0062] It should be understood that in a specific application such as high-frequency circuit design, selecting a suitable interval distance can significantly affect the signal propagation delay and transmission efficiency, and controlling the interval distance to be between 0.05 mm and 0.5 mm provides sufficient flexibility for designers to meet the needs of R-shift test substrates in different scenarios, while also ensuring the rationality of the layout in a compact space, demonstrating the adaptability and practicality of the R-shift test substrate.

[0063] It should be noted that the interval distance between adjacent first left side pads and the interval distance between adjacent first right side pads can be flexibly adjusted according to actual needs, and the specific value is not limited.

[0064] In an embodiment, the length and width of the first left pad and the first right pad are xmm and ymm, respectively, wherein xmm is in the range of 1mm-2mm, and ymm is in the range of 0.5mm-1mm.

[0065] As an example, the length and width of the first left pad and the first right pad are xmm and ymm, respectively. Wherein xmm is in the range of 1mm-2mm, and ymm is in the range of 0.5mm-1mm. Preferably, xmm can be 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm or 2mm, and ymm can be 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm, without being limited in particular. For example, xmm can be 1mm and ymm can be 0.5mm. By the above setting, the pad has sufficient size to support reliable electrical connection, and does not occupy too much space of the R-shift test substrate to meet the demand of high-density wiring.

[0066] It should be noted that the values of x and y can be adjusted according to the demand, without being limited in particular.

[0067] In an embodiment, the n first left pads are connected by wires in a first intermittent manner, and the n first right pads are connected by wires in a second intermittent manner.

[0068] In the embodiment, the diameter of the wire can be zmm, and zmm can be in the range of 0.05mm-0.3mm, preferably 0.06mm, 0.08mm, 0.1mm, 0.15mm, 0.2mm or 0.25mm, without being limited in particular. By selecting wires with different diameters, the resistance, signal integrity and space occupation of the wire can be balanced according to the actual application demand. For example, for low-power circuits, a wire with a small diameter such as 0.05mm can be selected to effectively reduce current loss; for high-frequency and high-power applications, a wire with a diameter of 0.2mm or 0.25mm can be selected to reduce the inductance and resistance of the wire, and improve the transmission speed and reliability of the signal, without being limited in particular.

[0069] In an embodiment, the N-layer core board is combined by a pressing process.

[0070] In this embodiment, the N-layer core board is combined through a pressing process. As an example, the pressing process includes a hot pressing method, in which the multi-layer core board is pressed under specific temperature and pressure conditions (for example, the pressing temperature is about 150°C, and the pressing pressure is 10 tons), so that the layers of the core board are effectively combined together, reducing the bubbles and defects between the layers of the core board, and improving the durability and electrical performance of the R-shift test substrate. It should be noted that during the pressing process, the pressing temperature and pressure can be adjusted according to different needs to adapt to various test requirements, and the specific conditions are not limited.

[0071] In an embodiment, the R-shift test substrate includes a printed circuit board. In this embodiment, the R-shift test substrate can be a flexible circuit board (FPC) or an integrated circuit board (IC) in addition to being a printed circuit board (PCB), which is not limited here.

[0072] For the above-mentioned R-shift test substrate, a test method for the R-shift test substrate is provided, which specifically includes:

[0073] 1. Test preparation

[0074] Materials and equipment: R-shift test substrate, multimeter (for measuring resistance), cutting tool (for breaking the wire), and slicing machine (for subsequent blind hole analysis).

[0075] 2. Test steps

[0076] Step one: initial resistance measurement

[0077] Before testing, use a multimeter to measure the resistance between the first left pad and the nth right pad, and record the value as R0.

[0078] Step two: perform test

[0079] Apply the required test conditions, such as voltage or current, to the R-shift test substrate, and record the environmental parameters during operation.

[0080] Step three: resistance measurement again

[0081] After applying the test conditions, use the multimeter to measure the resistance between the same pads again, and record the value as R1.

[0082] Step four: calculate R-shift (resistance change rate)

[0083] Calculate the R-shift value: R-shift = (R1-R0) / R0

[0084] Determine whether the R-shift value exceeds the preset threshold (for example, 6%).

[0085] If the preset threshold is exceeded, it indicates that there is a blind hole failure.

[0086] Step five: isolation test

[0087] The wires are picked off row by row to confirm the row number of the failed blind hole, as follows:

[0088] The wires between the first row and the second row of pads are picked off, and the resistance of the first row of blind holes is measured.

[0089] The wires between the second row and the third row of pads are picked off, and the resistance of the second row of blind holes is measured, and so on.

[0090] The resistance values of each row are recorded, and the resistance changes between different rows are compared to determine the failed row.

[0091] Step six: slice analysis

[0092] The blind holes of the confirmed failed row are analyzed by slicing, for example, using a slicer to slice each blind hole of the failed row, observing the internal structure, and recording the slicing results to determine the failed blind hole.

[0093] Through the above test method, the failed blind hole can be quickly located, reducing the analysis time on the remaining blind holes and improving the analysis efficiency.

[0094] For example, assume that the initial measured resistance R0 is 0.4Ω, and then a certain current is applied to simulate the normal working state. After a certain period of time, the resistance R1 measured again is 0.45Ω. Using the formula: R-shift = (R1 - R0) / R0 = (0.45 - 0.4) / 0.4 = 0.125, the calculation result R-shift is 0.125, which exceeds the preset threshold of 6%, indicating that there is a failed blind hole. Further, through the isolation test row by row, the failed row is determined, and then only the blind holes of the failed row need to be analyzed by slicing, reducing the analysis time on the remaining blind holes and improving the analysis efficiency. It should be understood that the above test method is not only suitable for R-shift test boards, but also provides an effective reference for the testing of other types of circuit boards in the future. Therefore, as long as other types of circuit boards are tested in the above similar manner, they should be within the scope of protection of the present application.

[0095] The above-described embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. An R-shift test substrate, characterized in that, It includes N core layers, where N is a positive integer greater than or equal to 1, and the N core layers include the first core layer; The first core board is provided with n first left side pads and n first right side pads, where n is a positive integer greater than 1. The n first left side pads are connected in a first intermittent manner, and the n first right side pads are connected in a second intermittent manner. Each of the first left pads is provided with i blind vias between it and the corresponding first right pad, where i is a positive integer greater than 1. Each of the first left pads is connected to the first blind via. Among the second to the (i-1)th blind vias, the even-numbered blind vias are connected to the next adjacent blind via of the even-numbered blind via, and the i-th blind via is connected to the corresponding first right pad.

2. The R-shift test substrate according to claim 1, characterized in that, The N-layer core board also includes a second core board; The second core board is provided with one second left-side pad and one second right-side pad; The length of the second left pad includes the total length of the n first left pads in the first core board and the sum of the spacing between the n first left pads; the length of the second right pad includes the total length of the n first right pads in the first core board and the sum of the spacing between the n first right pads. The second left-side pad is electrically connected to n first left-side pads in the first layer core board; The second right-side pad is electrically connected to n first right-side pads in the first layer core board; Each blind via between the second left pad and the second right pad is independent, and each blind via is electrically connected to the blind via corresponding to the first layer core board.

3. The R-shift test substrate according to claim 2, characterized in that, The N-layer core board also includes the 3rd to nth core boards; The structure of the third to (n-1)th core layers is the same as that of the second core layer, and the structure of the nth core layer is the same as that of the first core layer.

4. The R-shift test substrate according to claim 3, characterized in that, The spacing between adjacent first left pads is X mm, and the spacing between adjacent first right pads is Y mm, wherein X mm and Y mm are equal.

5. The R-shift test substrate according to claim 4, characterized in that, The values ​​of Xmm and Ymm are both in the range of 0.05mm-0.5mm.

6. The R-shift test substrate according to any one of claims 1-5, characterized in that, The length and width of the first left pad and the first right pad are x mm and y mm, respectively, where x mm ranges from 1 mm to 2 mm and y mm ranges from 0.5 mm to 1 mm.

7. The R-shift test substrate according to any one of claims 1-5, characterized in that, The n first left-side pads are connected by wires in a first intermittent manner, and the n first right-side pads are connected by wires in a second intermittent manner.

8. The R-shift test substrate according to any one of claims 1-5, characterized in that, The n first left-side pads are connected in a first intermittent manner, and the n first right-side pads are connected in a second intermittent manner, including: In the first to nth first left pads, the even-numbered first left pads are connected to the next adjacent first left pad of the even-numbered first left pad; In the first to nth first right pads, the odd-numbered first right pads are connected to the next adjacent first right pad of the odd-numbered first right pad; or, In the first to nth first left pads, the odd-numbered first left pads are connected to the next adjacent first left pad of the odd-numbered first left pad; In the first to nth first right pads, the even-numbered first right pads are connected to the next adjacent first right pad of the even-numbered first right pad.

9. The R-shift test substrate according to any one of claims 1-5, characterized in that, The N-layer core board is bonded together using a pressing process.

10. The R-shift test substrate according to any one of claims 1-5, characterized in that, The R-shift test substrate includes a printed circuit board.

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