Casing of direct current conversion and charging communication controller
By designing a housing for DC-DC converter and charging communication controller, integrating DC-DC converter and EVCC, and utilizing the combined structure of upper and lower housings and the layout of heat dissipation components, the low space utilization and heat dissipation problems of separate designs are solved, achieving high integration and stable operation of new energy vehicles.
Patent Information
- Application Number
- CN202422710133.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-07
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2034-11-07
AI Technical Summary
The DC-DC converter and EVCC in existing new energy vehicles adopt a separate design, which leads to low space utilization, high system complexity and increased failure risk. Furthermore, as the integration level increases, heat dissipation and ease of assembly become challenges.
Design a DC-DC converter and charging communication controller housing. It adopts a combination structure of upper and lower housing, combined with U-shaped assembly groove, wedge plate, and clamping plate to fix and seal the PCB board. The heat dissipation problem is solved by the layout of pressing ribs and heat-conducting pillar rings. It integrates DC-DC and EVCC functions.
It improves device integration, reduces space occupation, lowers production costs and system complexity, enhances equipment stability and heat dissipation performance, and is suitable for electronic control systems of new energy vehicles.
Smart Images

Figure CN223758487U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to new energy automobile electronic technology field especially, relate to a direct current conversion and charging communication controller casing. BACKGROUND
[0002] The automobile electronic equipment as the important component of new energy automobile, its integration, high efficiency and reliability become the focus of the industry, and DCDC and EVCC as the key component of new energy automobile electronic equipment, its technology development is particularly key.
[0003] At present, the DCDC and EVCC in new energy automobile generally adopt the separate design, and the DCDC converts the high-voltage direct current of new energy automobile into low-voltage direct current, provides stable power supply for the low-voltage electrical system of automobile, and the EVCC is responsible for communication with external charging equipment, controls the charging process, and ensures the charging safety and high efficiency. However, the separate design has some technical problems, such as two independent devices need to be installed in different positions of the automobile, which leads to low space utilization, is not conducive to the miniaturization design of the automobile, and the two devices need to be connected through a complex wire harness, which increases the complexity and fault risk of the system. Therefore, the technical personnel in the art propose to integrate the DCDC and EVCC to improve the device integration, but with the increase of functional devices and the higher requirement for integration, it brings challenges to the heat dissipation performance and assembly convenience of the device. SUMMARY
[0004] To solve the above technical problems, the utility model provides a direct current conversion and charging communication controller casing. In order to have a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not a general review, nor does it determine the key / important elements or delineate the protection scope of these embodiments. The only purpose is to present some concepts in a simple form as a prelude to the detailed description that follows.
[0005] The utility model adopts the following technical scheme:
[0006] In some optional embodiments, a direct current conversion and charging communication controller casing is provided, comprising: an upper casing, a lower casing, a sealing assembly and a plurality of heat dissipation pieces.
[0007] The lower casing is an upper opening casing structure, and a top edge of the lower casing is provided with a U-shaped assembling groove; the upper casing is a lower opening casing structure, and a bottom edge of the upper casing is provided with a wedge plate, and an inner side of the wedge plate is provided with a clamping plate, and a distance is formed between the clamping plate and a top of an inner side groove wall of the U-shaped assembling groove to form a PCB board mounting groove; the sealing assembly is arranged in the PCB board mounting groove and the U-shaped assembling groove; the upper casing and the lower casing are both provided with a pressing rib which protrudes towards the inside of the casing, and an inner surface of the pressing rib is provided with the heat dissipation piece.
[0008] Further, an outer side of the U-shaped assembling groove is provided with a mounting edge plate, and a plurality of mounting long round holes are uniformly arranged on the mounting edge plate.
[0009] Further, a top of an inner side groove wall of the U-shaped assembling groove is provided with a plurality of positioning pins, and a height of the positioning pins is less than the thickness of the PCB board to be assembled.
[0010] Further, the sealing assembly comprises a first sealing silica gel strip and a second sealing silica gel strip, the first sealing silica gel strip is arranged in the U-shaped assembling groove, and the second sealing silica gel strip is arranged at the bottom of the clamping plate.
[0011] Further, a first assembling hole is arranged on the clamping plate, a second assembling hole is arranged on the wedge plate at a position corresponding to the first assembling hole, and a third assembling hole is arranged on an outer side groove wall of the U-shaped assembling groove at a position corresponding to the second assembling hole.
[0012] Further, the heat dissipation piece comprises an adhesive sheet, a pressing sheet and a plurality of heat conduction column rings, the adhesive sheet is fixed on the inner surface of the pressing rib through heat conduction silica gel, the heat conduction column rings are located between the adhesive sheet and the pressing sheet, and the top center position and the bottom center position of the heat conduction column rings are connected with the adhesive sheet and the pressing sheet respectively.
[0013] Further, a high-voltage input interface mounting groove and a low-voltage output interface mounting groove are arranged on the side surface of the upper casing, and a charging interface mounting groove is arranged on the side surface of the lower casing.
[0014] The casing of the present application is designed to be assembled by matching the upper casing and the lower casing, and the U-shaped assembling groove, the wedge plate, the clamping plate and other structures are used to directly fix the PCB board during assembly and to meet the heat dissipation requirement through the pressing rib, so that the heat dissipation problem caused by high device integration is solved, and stable operation of the equipment is ensured. BRIEF DESCRIPTION OF DRAWINGS
[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.
[0016] Figure 1 is a schematic diagram of the external structure of a DC conversion and charging communication controller shell of the present application;
[0017] Figure 2 is a schematic diagram of the internal structure of a DC conversion and charging communication controller shell of the present application;
[0018] Figure 3 is a schematic diagram of one of the states of the heat dissipation member of the present application;
[0019] Figure 4 is a schematic diagram of another state of the heat dissipation member of the present application;
[0020] Figure 5 is Figure 2 a partial enlarged view. DETAILED DESCRIPTION
[0021] The embodiments of the present application will be described in detail below with reference to the drawings. It should be clear that the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0022] The DC conversion and charging communication controller is a two-in-one converter integrating DCDC and EVCC, that is, the functions of DCDC and EVCC are integrated in one device, and the same control unit is used for unified control and management, according to the running state of the automobile and the charging demand, the working mode of DCDC and EVCC is adjusted, and the power conversion form is used to realize the conversion of high-voltage direct current to low-voltage direct current and the reverse charging function. This integrated design reduces the occupied space, is beneficial to the miniaturization design of new energy vehicles, reduces the number of parts and manufacturing processes, reduces the production cost, and reduces the complex wire harness connection, reduces the complexity and fault risk of the system.
[0023] As shown in Figures 1-5 In some illustrative embodiments, the present application provides a shell of a DC conversion and charging communication controller, which comprises an upper shell 1, a lower shell 2, a sealing assembly and a plurality of heat dissipation members 3.
[0024] The upper casing 1, as the upper half of the casing, is specifically a lower opening casing structure, that is, a structure with a lower opening, made of high-strength and lightweight materials, and has sufficient installation space reserved. The lower casing 2 is an upper opening casing structure corresponding to the upper casing 1. The upper casing 1 can be tightly fitted with the lower casing 2 to form a complete packaging space, and the electronic devices of the DC conversion and charging communication controller are packaged inside the casing.
[0025] The sealing assembly is used to ensure the sealing performance between the upper casing 1 and the lower casing 2, preventing external environmental factors such as dust and moisture from damaging the internal electronic components. The heat dissipation member 3 effectively conducts the heat generated by the internal electronic components to the outside of the casing, keeping the internal temperature within a safe range. Through the optimized design of the upper casing 1 and the lower casing 2, and the reasonable layout of the heat dissipation member and the application of the sealing assembly, the casing's protection level is guaranteed while the heat dissipation performance of the internal electronic components is ensured. At the same time, the assembly convenience is also improved. The casing design for high-integration DC conversion and charging communication controller improves the working efficiency and reliability of the equipment, and is more suitable for the electronic control system of new energy vehicles.
[0026] The top edge of the lower casing 2 is provided with a U-shaped assembly groove 201, which is used to butt joint with the edge of the upper casing 1, providing better positioning and fixing effect, ensuring that the upper and lower casings can be quickly positioned and stably combined together during assembly. In addition, the design of the U-shaped assembly groove 201 also provides convenience for the installation of the sealing assembly, for example, sealing gaskets or other sealing materials can be embedded in the U-shaped groove to form an effective sealing barrier.
[0027] The outer side of the U-shaped assembly groove 201 is provided with a mounting flange plate 202, and the mounting flange plate 202 is provided with uniformly distributed mounting long circular holes 203. The design of the mounting flange plate 202 allows the casing of the DC conversion and charging communication controller to be stably installed in the vehicle interior, and through the mounting long circular holes 203, the casing can be connected with the vehicle chassis or other structural components using screws and other fixing members. The uniform distribution design of the mounting long circular holes 203 allows the casing to be fine-tuned during installation, and the design of the mounting flange plate 202 also considers the convenience of maintenance. Once the electronic components inside the casing need to be replaced or maintained, the casing can be quickly disassembled and reinstalled.
[0028] The bottom edge of the upper casing 1 is provided with a wedge plate 101, which is designed to enhance the sealing and stability between the casings. The wedge plate 101 is embedded in the U-shaped assembly groove 201, and when the upper and lower casings are combined, the extrusion force generated by the wedge-shaped structure makes the sealing assembly more closely fit on the joint surface of the two casings, thereby improving the overall sealing performance. Moreover, the provision of the wedge plate 101 helps to stably connect the upper casing 1 and the lower casing 2, better coping with the vibration or impact of the casings during vehicle operation. At the same time, the wedge plate 101 also plays a guiding role, helping the upper casing 1 to accurately slide into the U-shaped assembly groove 201 of the lower casing 2 during assembly, reducing assembly errors.
[0029] The inner side of the wedge plate 101 is provided with a clamping plate 102, which is spaced a certain distance from the top of the inner side groove wall 2011 of the U-shaped assembly groove to form a PCB mounting groove 4 for fixing and mounting the circuit board. During assembly, the upper casing 1 is placed on the lower casing 2, and the wedge plate 101 enters the U-shaped assembly groove 201 of the lower casing. As the upper casing 1 continues to descend, the clamping plate 102 will be pressed at the edge of the PCB 5, making it tightly adhere to the bottom of the PCB mounting groove 4, while the wedge plate 101 generates an extrusion force to ensure the sealing between the upper and lower casings. Through this design, the upper casing 1 not only provides fixation and protection for the PCB, but also completes the fixation of the PCB 5 at the same time during the assembly of the casing.
[0030] The top of the inner side groove wall 2011 of the U-shaped assembly groove is provided with a plurality of positioning pins 2012, and the height of the positioning pins 2012 is less than the thickness of the PCB to be assembled, so that during assembly, the PCB 5 can be placed stably on the lower casing 2, and the positioning pins 2012 will not hinder the clamping plate 102 from pressing the PCB 5. The to-be-assembled PCB 5 is provided with corresponding positioning holes, and the positioning pins 2012 are used to cooperate with the positioning holes on the PCB to limit the position, ensuring that the PCB 5 maintains the correct position during assembly. During assembly, the to-be-assembled PCB 5 is placed on the lower casing 2 at the predetermined position, and as the PCB 5 is placed, the positioning pins 2012 will be inserted into the positioning holes on the PCB, which ensures the accurate position of the PCB 5 in the casing, providing convenience for subsequent assembly. Then, the upper casing 1 is placed on the lower casing 2, the wedge plate 101 is embedded in the U-shaped assembly groove 201, and the clamping plate 102 is pressed at the edge of the PCB 5, further fixing the position of the PCB 5. Finally, the upper and lower casings are fixed together by screws to complete the assembly, at this time, the PCB 5 is firmly fixed inside the casing, and the sealing between the upper and lower casings is also guaranteed.
[0031] Specifically, the first assembly hole 1021 is formed on the clamping plate 102, the second assembly hole 1011 is formed on the wedge plate 101 at the position corresponding to the first assembly hole 1021, and the third assembly hole 2014 is formed on the outer side groove wall 2013 of the U-shaped assembly groove at the position corresponding to the second assembly hole 1011. The upper and lower housings are fixed together by screws passing through the third assembly hole 2014, the second assembly hole 1011, and the first assembly hole 1021 in sequence. The clamping plate 102 not only serves as a fixing structure of the PCB 5, but also as part of the screw fixing, thereby enhancing the stability of the overall structure.
[0032] The sealing assembly includes a first sealing silica gel strip 6 and a second sealing silica gel strip 7. The first sealing silica gel strip 6 is arranged in the U-shaped assembly groove 201 and forms the first sealing line when the upper housing 1 and the lower housing 2 are assembled, thereby preventing the influence of external environmental factors on the internal electronic components. The second sealing silica gel strip 7 is arranged at the bottom of the clamping plate 102 and contacts the lower housing 2 and the PCB 5, thereby forming the second sealing line. The sealing performance of the housing is significantly improved, and the PCB 5 is provided with a buffering effect, which can better cope with vibration.
[0033] The high-voltage input interface mounting groove 103 and the low-voltage output interface mounting groove 104 are formed on the side surface of the upper housing 1, and the charging interface mounting groove 204 is formed on the side surface of the lower housing 2.
[0034] The upper housing 1 and the lower housing 2 are both provided with a pressing rib 8 protruding into the housing. The pressing rib 8 is directly pressed by a mold during the manufacturing process of the housing, so no additional structural components are needed. The position and number of the pressing rib 8 are designed according to the electronic devices or specific areas on the PCB that need to be focused on heat dissipation. These devices are usually power devices that generate a lot of heat during operation. The pressing rib 8 protrudes into the housing, and when the housing is assembled, the rib can directly contact the electronic devices on the PCB. Since the pressing rib 8 protrudes, the heat dissipation area is increased, which helps to conduct the heat generated by the devices to the housing and then dissipate the heat to the external environment through the housing, thereby improving the heat dissipation efficiency. In addition, the pressing rib 8 can also enhance the mechanical strength of the housing, so that the housing can better protect the internal electronic devices when subjected to external impact or pressure, prevent damage caused by mechanical vibration or impact, and reduce deformation caused by temperature changes.
[0035] The inner surface of the pressing rib 8 is provided with a heat dissipation member 3. The heat dissipation member 3 is designed to provide a buffering mechanism to protect the internal electronic devices from damage caused by deformation of the casing or extrusion by external force while ensuring heat dissipation efficiency. The heat dissipation member 3 comprises an adhesive sheet 301, a pressing sheet 302, and a plurality of heat-conducting columnar rings 303. The adhesive sheet 301 is fixed on the inner surface of the pressing rib 8 by heat-conducting silicone, and the heat-conducting columnar rings 303 are located between the adhesive sheet 301 and the pressing sheet 302, with the top center and bottom center of the heat-conducting columnar rings 303 being connected to the adhesive sheet 301 and the pressing sheet 302, respectively.
[0036] The heat-conducting columnar rings 303 have deformability and are usually made of heat-conducting materials with good elasticity, such as heat-conducting silicone rubber or metal springs. When the upper casing 1 and the lower casing 2 are assembled, the pressing rib 8 may exert pressure on the internal electronic devices. At this time, the deformability of the heat-conducting columnar rings 303 allows them to compress when subjected to pressure, thereby reducing the distance between the adhesive sheet 301 and the pressing sheet 302 and not directly exerting pressure on the electronic devices. The deformation of the heat-conducting columnar rings 303 provides a buffering effect, so that even if the casing deforms due to temperature changes or external forces during subsequent use, the heat-conducting columnar rings 303 can absorb these deformations and prevent them from being transmitted to sensitive electronic devices. Although the heat-conducting columnar rings 303 have deformability, they still maintain good heat-conducting properties, ensuring that heat can be effectively conducted from the electronic devices to the outside of the casing.
[0037] The above merely describes specific embodiments of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions within the scope of the present application disclosed herein can be easily conceived by those skilled in the art, and should be covered within the scope of protection of the present application. Therefore, the scope of protection of the present application should be subject to the scope of protection of the claims.
Claims
1. A DC conversion and charging communication controller enclosure, characterized by, The utility model relates to a high-voltage and low-voltage combined power supply device, comprising: An upper casing, a lower casing, a sealing assembly and several heat dissipation pieces; The lower casing is an upper opening casing structure, and the top edge of the lower casing is provided with a U-shaped assembly groove; the upper casing is a lower opening casing structure, and the bottom edge of the upper casing is provided with a wedge plate; the inner side of the wedge plate is provided with a clamping plate, and the clamping plate is spaced apart from the top of the inner side groove wall of the U-shaped assembly groove to form a PCB mounting groove; the sealing assembly is arranged in the PCB mounting groove and the U-shaped assembly groove; the upper casing and the lower casing are both provided with a pressing rib protruding towards the inside of the casing, and the inner surface of the pressing rib is provided with the heat dissipation pieces; The side of the upper casing is provided with a high-voltage input interface mounting groove and a low-voltage output interface mounting groove, and the side of the lower casing is provided with a charging interface mounting groove.
2. A DC conversion and charging communication controller housing according to claim 1, wherein, The outer side of the U-shaped assembly groove is provided with a mounting flange plate, and the mounting flange plate is provided with uniformly distributed mounting long circular holes.
3. A DC conversion and charging communication controller housing according to claim 2, wherein, The top of the inner side groove wall of the U-shaped assembly groove is provided with several positioning pins, and the height of the positioning pins is less than the thickness of the PCB to be assembled.
4. A DC conversion and charging communication controller housing according to claim 3, wherein, The sealing assembly comprises a first sealing silica gel strip and a second sealing silica gel strip; the first sealing silica gel strip is arranged in the U-shaped assembly groove, and the second sealing silica gel strip is arranged at the bottom of the clamping plate.
5. A DC conversion and charging communication controller housing according to claim 4, wherein, The clamping plate is provided with a first assembly hole, the wedge plate is provided with a second assembly hole at the position corresponding to the first assembly hole, and the outer side groove wall of the U-shaped assembly groove is provided with a third assembly hole at the position corresponding to the second assembly hole.
6. A DC conversion and charging communication controller housing according to claim 5, wherein, The heat dissipation pieces comprise an adhesive sheet, a pressing sheet and several heat conduction column rings; the adhesive sheet is fixed on the inner surface of the pressing rib by heat conductive silica gel; the heat conduction column rings are located between the adhesive sheet and the pressing sheet; the top center position and the bottom center position of the heat conduction column rings are connected with the adhesive sheet and the pressing sheet, respectively.