Embedded multifunctional sensor circuit board

Abstract

The utility model discloses an embedded multifunctional sensor circuit board, which comprises a circuit board mounting base, a circuit board fixing position is arranged above the circuit board mounting base, and a ventilation slot is arranged below the circuit board mounting base; the circuit board main body is mounted on the circuit board fixing position, and a sensor processing chip is mounted in the center of the circuit board main body in an embedded manner; and the heat dissipation assembly is arranged above the ventilation slot, and the heat dissipation end of the heat dissipation assembly is in contact with the circuit board main body, so that the cooling of the circuit board main body is realized. According to the utility model, the ventilation slot is arranged below the circuit board mounting base, and the heat dissipation assembly is arranged above the ventilation slot, so that the heat dissipation effect of the circuit board main body can be effectively improved. Wherein the cooling end of the semiconductor chilling plate is in contact with the circuit board main body, so that the cooling efficiency of the circuit board is greatly improved; and the heat dissipation fins exchange heat with air in the ventilation slots, so that the heat dissipation effect is further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of circuit boards, specifically to a kind of embedded multifunctional sensor circuit board. BACKGROUND

[0002] The heat dissipation of traditional circuit board mainly relies on heat conduction and natural convection, which is feasible in applications with low heat dissipation requirements, but is insufficient in high-performance or long-time working environments. Some designs use a combination of heat sinks and fans, but the heat dissipation efficiency is still limited, especially in dense electronic component layouts, where heat is difficult to dissipate effectively. Some circuit boards use simple protective covers or dust screens for dust prevention, but these methods are ineffective against small dust particles and can easily accumulate dust. Dust prevention designs often conflict with heat dissipation designs, and closed dustproof structures can affect ventilation and heat dissipation. SUMMARY

[0003] The utility model provides a kind of embedded multifunctional sensor circuit board to solve the problems existing in the background art.

[0004] The utility model embedded multifunctional sensor circuit board is realized by the following technical solutions, comprising:

[0005] A circuit board mounting base is provided with a circuit board fixing position on the top, and a ventilation slot is provided below the circuit board mounting base.

[0006] A circuit board main body is installed on the circuit board fixing position, and a sensor processing chip is embedded and installed in the center of the circuit board main body.

[0007] A heat dissipation assembly is provided above the ventilation slot, and the heat dissipation end of the heat dissipation assembly is in contact with the circuit board main body, thereby realizing the cooling of the circuit board main body.

[0008] As a preferred technical solution, a dust cover is provided on the circuit board mounting base, and wiring terminals for connecting sensors are provided around the circuit board main body, and the wiring terminals around the circuit board main body are provided through the connecting slots of the dust cover.

[0009] As a preferred technical solution, a connecting terminal is inserted above the connecting slot of the dust cover, and the connecting terminal is connected with the wiring terminal on the circuit board main body; the other end of the connecting terminal is connected with various sensors.

[0010] As a preferred technical solution, a connecting slot is provided between the circuit board fixing position and the ventilation slot of the circuit board mounting base, and the heat dissipation assembly is provided in the connecting slot.

[0011] The heat dissipation assembly comprises a semiconductor refrigeration sheet and a heat dissipation fin, the semiconductor refrigeration sheet is arranged in the connecting groove, and the cooling end of the semiconductor refrigeration sheet is in contact with the circuit board body; the heat dissipation fin is arranged in the ventilation groove, and the connecting end of the heat dissipation fin is in contact with the heating end of the semiconductor refrigeration sheet, so that the semiconductor refrigeration sheet is cooled.

[0012] As a preferred technical scheme, the ventilation groove is provided with an air inlet fan and an air outlet fan on two sides respectively, and the air outlet end of the air inlet fan and the air inlet end of the air outlet fan correspond to the heat dissipation end of the heat dissipation fin.

[0013] As a preferred technical scheme, the dustproof cover plate and the circuit board body are provided with through holes for passing through locking screws, and the locking screws arranged on the dustproof cover plate pass through the through holes and are locked and connected with the circuit board fixing position of the circuit board mounting base.

[0014] As a preferred technical scheme, the side surface of the connecting terminal is provided with a baffle, and the baffle is connected with the dustproof cover plate through magnetic attraction.

[0015] The beneficial effects of the utility model are:

[0016] The utility model discloses a ventilation groove is arranged below the circuit board mounting base, and a heat dissipation assembly is arranged above the ventilation groove, which can effectively improve the heat dissipation effect of the circuit board body. The cooling end of the semiconductor refrigeration sheet is in contact with the circuit board body, greatly improving the cooling efficiency of the circuit board. The heat dissipation fin exchanges heat with the air flow in the ventilation groove, further improving the heat dissipation effect.

[0017] The dustproof cover plate is arranged on the circuit board mounting base, which can effectively prevent dust from entering the circuit board, ensure the long-term stable operation of the circuit board, and the wiring terminal passes through the dustproof cover plate through the connecting groove. This design not only makes the connection more convenient, but also prevents dust from entering the circuit board through the connecting part. ACCURATE DRAWINGS

[0018] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can obtain other drawings according to these drawings without creating creative labor.

[0019] Fig. 1 It is a three-dimensional structure schematic view of the utility model;

[0020] Fig. 2 It is a sectional structure schematic view of the utility model;

[0021] Fig. 3 The utility model discloses an explosion structure schematic view;

[0022] Mark explanation:

[0023] 1, circuit board mounting seat, 2, circuit board main body, 3, circuit board installation position, 4, ventilation groove, 5, sensor processing chip, 6, dustproof cover plate, 7, wiring terminal, 8, connecting groove, 9, connecting terminal, 10, connecting groove, 11, semiconductor refrigeration piece, 12, radiating fin, 13, air inlet fan, 14, air outlet fan, 15, locking screw, 16, baffle. Specific implementation

[0024] All features disclosed in the specification, or steps in all methods or processes disclosed, can be combined in any manner, except where mutually exclusive.

[0025] As Figs. 1-3 Indicated, the utility model discloses a kind of embedded multifunctional sensor circuit boards, comprising:

[0026] Circuit board mounting base 1, the upper portion of the circuit board mounting base 1 is provided with circuit board fixed position 3, and the lower portion of the circuit board mounting base 1 is provided with ventilation groove 4;

[0027] Circuit board main body 2, the circuit board main body 2 is installed on circuit board fixed position 3, and sensor processing chip 5 is embedded and installed in the center of the circuit board main body 2;

[0028] Heat dissipation assembly, the heat dissipation assembly is arranged above ventilation groove 4, and the heat dissipation end of the heat dissipation assembly is in contact with circuit board main body 2, to realize the cooling of circuit board main body 2.

[0029] Among them, dustproof cover plate 6 is provided on circuit board mounting base 1, wiring terminal 7 for connecting sensor is provided around circuit board main body 2, and wiring terminal 7 around circuit board main body 2 is arranged through the connecting groove 10 of dustproof cover plate 6 to prevent dust from entering the inside of circuit board.

[0030] Among them, connecting terminal 9 is inserted and arranged above connecting groove 10 of dustproof cover plate 6, and connecting terminal 9 is connected with wiring terminal 7 on circuit board main body 2;The other end of the connecting terminal 9 is connected with various sensors, so as to realize the collection and transmission of data.

[0031] In order to further optimize the heat dissipation effect, in the embodiment, connecting groove 10 is provided between circuit board fixed position 3 and ventilation groove 4 of circuit board mounting base 1, and heat dissipation assembly is arranged in connecting groove 10;

[0032] The heat dissipation assembly comprises a semiconductor refrigeration sheet 11 and a heat dissipation fin 12, the semiconductor refrigeration sheet 11 is arranged in the connecting groove 10, and the cooling end of the semiconductor refrigeration sheet 11 is in contact with the circuit board body 2; the heat dissipation fin 12 is arranged in the ventilation groove 4, and the connecting end of the heat dissipation fin 12 is in contact with the heating end of the semiconductor refrigeration sheet 11, and the heat dissipation fin 12 is cooled by the air flow in the ventilation groove 4.

[0033] In order to further enhance the heat dissipation effect, the ventilation groove 4 is provided with an air inlet fan 13 and an air outlet fan 14 on both sides, and the air outlet end of the air inlet fan 13 and the air inlet end of the air outlet fan 14 are both in correspondence with the heat dissipation end position of the heat dissipation fin 12.

[0034] In addition, the dustproof cover plate 6 and the circuit board body 2 are both provided with through holes for passing through locking screws 15, and the locking screws 15 arranged on the dustproof cover plate 6 pass through the through holes and are locked and connected with the circuit board fixing position 3 of the circuit board mounting base 1.

[0035] In addition, the side surface of the connecting terminal 9 is provided with a baffle 16, and the baffle 16 is connected with the dustproof cover plate 6 through magnetic attraction, so that the installation and disassembly of the connecting terminal 9 are more convenient, and the maintenance and replacement of the sensor are also facilitated.

[0036] The utility model discloses a ventilation groove is arranged below the circuit board mounting base, and a heat dissipation assembly is arranged above the ventilation groove, so that the heat dissipation effect of the circuit board body can be effectively improved.

[0037] The cooling end of the semiconductor refrigeration sheet is in contact with the circuit board body, greatly improving the cooling efficiency of the circuit board; the heat dissipation fin exchanges heat with the air flow in the ventilation groove, further improving the heat dissipation effect; the dustproof cover plate is arranged on the circuit board mounting base, which can effectively prevent dust from entering the inside of the circuit board, ensure the long-term stable operation of the circuit board, and the wiring terminal passes through the dustproof cover plate through the connecting groove, which not only makes the connection more convenient, but also prevents dust from entering the inside of the circuit board through the connecting part.

[0038] The above is only a specific embodiment of the utility model, but the protection scope of the utility model is not limited to this, any change or replacement without creative labor should be covered in the protection scope of the utility model. Therefore, the protection scope of the utility model should be limited by the protection scope defined in the claims.

Claims

1. An embedded multi-function sensor circuit board, characterized by, The utility model relates to a circuit board mounting base (1) is provided with the circuit board fixed position (3) on the top, and the lower part of circuit board mounting base (1) is provided with the ventilation groove (4), the circuit board main body (2) is installed on the circuit board fixed position (3), and the central part of circuit board main body (2) is embedded and is installed with sensor processing chip (5), the heat dissipation assembly is provided with the heat dissipation end and the contact of circuit board main body (2) on the top of ventilation groove (4), and then realizes the cooling of circuit board main body (2). The dustproof cover plate (6) is arranged on the circuit board mounting base (1), the wiring terminal (7) for connecting the sensor is arranged around the circuit board main body (2), and the wiring terminal (7) around the circuit board main body (2) is arranged through the connecting slot (10) of the dustproof cover plate (6). The connecting terminal (9) is inserted and arranged above the connecting slot (10) of the dustproof cover plate (6), and the connecting terminal (9) is connected with the wiring terminal (7) on the circuit board main body (2); the other end of the connecting terminal (9) is connected with various sensors. The connecting slot (10) is arranged between the circuit board fixed position (3) and the ventilation groove (4) of the circuit board mounting base (1), and the heat dissipation assembly is arranged in the connecting slot (10); 2. The embedded multi-functional sensor circuit board of claim 1, wherein: The heat dissipation assembly includes a semiconductor refrigeration sheet (11) and a heat dissipation fin (12), the semiconductor refrigeration sheet (11) is arranged in the connecting slot (10), and the cooling end of the semiconductor refrigeration sheet (11) is in contact with the circuit board main body (2); the heat dissipation fin (12) is installed in the ventilation groove (4), and the connecting end of the heat dissipation fin (12) is in contact with the heating end of the semiconductor refrigeration sheet (11), thereby cooling the semiconductor refrigeration sheet (11).

3. The embedded multi-functional sensor circuit board of claim 2, wherein: The ventilation groove (4) is provided with an air inlet fan (13) and an air outlet fan (14) on both sides, and the air outlet end of the air inlet fan (13) and the air inlet end of the air outlet fan (14) correspond to the position of the heat dissipation end of the heat dissipation fin (12).

4. The embedded multi-functional sensor circuit board of claim 1, wherein: The dustproof cover plate (6) and the circuit board main body (2) are provided with through holes for passing through locking screws (15), and the locking screws (15) arranged on the dustproof cover plate (6) pass through the through holes and are locked and connected with the circuit board fixed position (3) of the circuit board mounting base (1). The side surface of the connecting terminal (9) is provided with a baffle (16), and the baffle (16) is connected by magnetic attraction between the dustproof cover plate (6).

5. The embedded multi-functional sensor circuit board of claim 1, wherein: ​ 6. The embedded multi-functional sensor circuit board of claim 2, wherein: ​ 7. The embedded multi-functional sensor circuit board of claim 3, wherein: ​

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