Material collecting device

By introducing a screw jack and a pressing assembly into the receiving device, the problem of ceramic circuit boards shifting during transportation was solved, achieving stable transportation and stacking.

CN223765584UActive Publication Date: 2026-01-06SHENZHEN JIADUJIA ELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202520104700.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-16
Publication Date
2026-01-06
Estimated Expiration
2035-01-16

AI Technical Summary

Technical Problem

When traditional receiving devices transport stacked ceramic circuit boards, the stacked ceramic circuit boards are prone to shifting, affecting the next process flow.

Method used

A screw jack drives the movement of the bearing plate, and a pressing assembly is used to press and fix the ceramic circuit board through clamping blocks and pressure heads. Photoelectric sensors are used to control the pressing timing.

Benefits of technology

This effectively prevents ceramic circuit boards from shifting during transportation, ensuring the smooth progress of subsequent processes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of electronic circuits, in particular to a material receiving device which comprises a lead screw elevator, a bearing plate and a pressing assembly, the bearing plate is used for placing stacked ceramic circuit boards, the lead screw elevator is connected with the bearing plate, and the lead screw elevator is used for driving the bearing plate to move in the vertical direction. The pressing assembly comprises a clamping block, a connecting rod, a pressing head and a first driving device, the connecting rod penetrates through the clamping block and the pressing head, so that the pressing head is rotationally connected with the clamping block, the first driving device is horizontally arranged, the output end of the first driving device is connected with the pressing head, and the first driving device is used for driving the pressing head to rotate around the connecting rod; therefore, the pressing head can press the ceramic circuit boards stacked on the bearing plate. The problem that when a traditional receiving device transports stacked ceramic circuit boards, the stacked ceramic circuit boards are prone to displacement is solved.
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Description

Technical Field

[0001] This application relates to the field of electronic circuit technology, and in particular to a receiving device. Background Technology

[0002] Ceramic circuit boards, also known as ceramic substrates, are high-tech products that use ceramic materials as a base and form circuit patterns on the surface through a series of precision manufacturing processes. In order to prevent ceramic circuit boards from being oxidized during production and transportation, a coating device is usually used to coat the ceramic circuit boards. Then, the coated ceramic circuit boards are placed into a receiving device for stacking by a gripper. When the stack reaches a certain level, the receiving device transports the ceramic circuit boards to the next station.

[0003] Traditional receiving devices often cause stacked ceramic circuit boards to shift during transport, affecting the next process flow. Utility Model Content

[0004] This application provides a receiving device designed to solve the problem that stacked ceramic circuit boards are easily displaced when transporting them using traditional receiving devices.

[0005] To solve the above-mentioned technical problems, this application proposes a material receiving device, which includes: a screw jack, a bearing plate, and a pressing assembly;

[0006] The support plate is used to place stacked ceramic circuit boards, and the screw jack is connected to the support plate and is used to drive the support plate to move in the vertical direction;

[0007] The pressing assembly includes a clamping block, a connecting rod, a pressing head, and a first driving device. The connecting rod passes through the clamping block and the pressing head, so that the pressing head and the clamping block are rotatably connected. The first driving device is horizontally arranged, and the output end of the first driving device is connected to the pressing head. The first driving device is used to drive the pressing head to rotate around the connecting rod, so that the pressing head can press the ceramic circuit boards stacked on the support plate.

[0008] Furthermore, the receiving device also includes a base plate, which is arranged parallel to and spaced apart from the support plate, and the screw jack is fixedly assembled with the base plate.

[0009] Furthermore, the receiving device also includes a second driving device and a guide rail. The second driving device is connected to the substrate, and the substrate is connected to the guide rail. The second driving device is used to drive the substrate to move along the guide rail.

[0010] Furthermore, the screw jack includes a lifting screw, which is connected to the center of the bearing plate.

[0011] Furthermore, the receiving device also includes a first baffle and a second baffle, which are arranged in parallel and spaced apart, and are respectively fixedly mounted on both sides of the substrate.

[0012] Furthermore, the receiving device also includes several positioning rods, which are vertically arranged and fixedly assembled with the lower surface of the bearing plate, and the positioning rods penetrate through the substrate.

[0013] Furthermore, the receiving device also includes a first fixing plate, which is fixedly assembled with the substrate, and the pressing assembly is mounted based on the first fixing plate.

[0014] Furthermore, the receiving device also includes an assembly rod, which is fixedly assembled to the lower surface of the substrate. The assembly rod is vertically arranged and equipped with a photoelectric sensor. The positioning rod is equipped with a second fixing plate that matches the photoelectric sensor.

[0015] Furthermore, several of the positioning rods are evenly distributed around the lifting screw.

[0016] The beneficial effects of this application are as follows: The receiving device provided in this application includes a screw jack, a support plate, and a pressing assembly. The support plate is used to place stacked ceramic circuit boards. The screw jack is connected to the support plate and is used to drive the support plate to move vertically. The pressing assembly includes a clamping block, a connecting rod, a pressing head, and a first driving device. The connecting rod passes through the clamping block and the pressing head, so that the pressing head and the clamping block are rotatably connected. The first driving device is horizontally set, and its output end is connected to the pressing head. The first driving device is used to drive the pressing head to rotate around the connecting rod, so that the pressing head can press the stacked ceramic circuit boards on the support plate. By pressing the stacked ceramic circuit boards with the pressing head, the ceramic circuit boards are less likely to shift when the receiving device transports them. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0018] Figure 1 This is a three-dimensional structural schematic diagram of a material receiving device according to an embodiment of the present invention;

[0019] Figure 2 This is a three-dimensional structural diagram of a portion of the material receiving device according to an embodiment of the present utility model;

[0020] Figure 3 This is a three-dimensional structural diagram of the pressing component in a receiving device according to an embodiment of the present invention.

[0021] Explanation of reference numerals in the attached drawings: 100, bearing plate; 110, positioning rod; 111, second fixing plate; 200, screw jack; 210, lifting screw; 300, pressing assembly; 310, clamping block; 311, clamping plate; 320, connecting rod; 330, pressure head; 331, connecting part; 332, pressure strip; 340, first driving device; 350, assembly block; 400, base plate; 410, second driving device; 420, guide rail; 430, first baffle; 440, second baffle; 500, first fixing plate; 600, assembly rod; 610, photoelectric sensor. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0023] Those skilled in the art will understand that, unless explicitly stated otherwise, the singular forms “a,” “an,” “the,” and “the” used herein may also include the plural forms. It should be further understood that the term “comprising” as used in the specification of this application means the presence of features, integers, steps, operations, elements, modules, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, modules, components, and / or groups thereof. It should be understood that when we say an element is “connected” or “coupled” to another element, it can be directly connected or coupled to the other element, or there may be intermediate elements. Furthermore, “connected” or “coupled” as used herein can include wireless connections or wireless coupling. The term “and / or” as used herein includes all or any modules and all combinations of one or more associated listed items.

[0024] Those skilled in the art will understand that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0025] like Figure 1 and Figure 3As shown, this application provides a receiving device, which includes a screw jack 200, a support plate 100, and a pressing assembly 300. The support plate 100 is used to place stacked ceramic circuit boards. The screw jack 200 is connected to the support plate 100 and is used to drive the support plate 100 to move in the vertical direction. The pressing assembly 300 includes a clamping block 310, a connecting rod 320, a pressing head 330, and a first driving device 340. The connecting rod 320 passes through the clamping block 310 and the pressing head 330, so that the pressing head 330 and the clamping block 310 are rotatably connected. The first driving device 340 is horizontally arranged, and the output end of the first driving device 340 is connected to the pressing head 330. The first driving device 340 is used to drive the pressing head 330 to rotate around the connecting rod 320 so that the pressing head 330 can press the stacked ceramic circuit boards on the support plate 100.

[0026] In one specific embodiment, the screw jack 200 is a mechanical device that converts the rotational motion of a motor into linear lifting motion through screw transmission. It plays a crucial driving role in this device, precisely controlling the lifting height of the support plate 100. The support plate 100 is a flat plate structure used to support items. The support plate 100 is a horizontally positioned rectangular plate, providing a stable placement platform for the ceramic circuit boards. During the process of the external gripper stacking the ceramic circuit boards onto the support plate 100, the screw jack 200 drives the support plate 100 to descend synchronously, facilitating the stacking of the ceramic circuit boards.

[0027] The pressing assembly 300 is a collection of components that realize the pressing operation of ceramic circuit boards. The clamping block 310 includes two clamping plates 311 spaced apart. The pressing head 330 includes a connecting part 331, which is L-shaped and located between the two clamping plates 311. The connecting rod 320 is cylindrical and passes through the connecting part 331 and the clamping plate 311 laterally, so that the pressing head 330 and the clamping block 310 are rotatably connected. The pressing head 330 also includes a pressing strip 332, which is long and fixed perpendicularly to the end of the connecting part 331 away from the clamping plate 311. The first drive device 340 is a telescopic motor. The first drive device 340 is horizontally set. The output end of the first drive device 340 is rotatably connected to the connecting part 331 of the pressure head 330. During the telescopic process, the output end of the first drive device 340 can drive the connecting part 331 to rotate around the connecting rod 320, thereby enabling the pressure bar 332 of the pressure head 330 to move toward the support plate 100 to press the ceramic circuit boards stacked on the support plate 100.

[0028] In summary, by stacking ceramic circuit boards on the carrier plate 100 and then pressing and fixing the stacked ceramic circuit boards on the carrier plate 100 using the pressing assembly 300, the displacement of the stacked ceramic circuit boards during subsequent transportation is effectively prevented.

[0029] like Figure 2 As shown, the receiving device also includes a base plate 400, which is arranged parallel to and spaced apart from the support plate 100. The screw jack 200 is fixedly assembled with the base plate 400. The screw jack 200 includes a lifting screw 210, which is connected to the center position of the support plate 100.

[0030] In one specific embodiment, the base plate 400 serves as a fundamental support structure for the entire receiving device, providing a stable platform for the installation of other related components. The base plate 400 is a rectangular plate, positioned below the support plate 100 and parallel to it at a distance. The screw jack 200 is fixedly mounted on the base plate 400, meaning the base plate 400 supports the screw jack 200, which is fixedly mounted at its center.

[0031] The screw jack 200 includes a lifting screw 210, which is a key transmission element that converts the rotational motion of the motor into linear motion. The lifting screw 210 is vertically arranged and passes through the base plate 400. The top of the lifting screw 210 is fixedly connected to the center of the lower surface of the support plate 100, so that when the screw jack 200 drives the support plate 100 to rise and fall, the force on each part of the support plate 100 is relatively uniform, ensuring that the support plate 100 rises and falls smoothly in the vertical direction.

[0032] like Figure 2 As shown, the receiving device also includes a second driving device 410 and a guide rail 420. The second driving device 410 is connected to the substrate 400, and the substrate 400 is connected based on the guide rail 420. The second driving device 410 is used to drive the substrate 400 to move along the guide rail 420.

[0033] In one specific embodiment, the guide rail 420 has two parallel and spaced-apart rails. The guide rail 420 is horizontally positioned below the substrate 400. A slider is slidably mounted on the guide rail 420. The substrate 400 is fixedly assembled with the slider. The second driving device 410 is fixedly connected to the substrate 400. The second driving device 410 is used to drive the substrate 400 to move along the guide rail 420 so as to transport the ceramic circuit board on the carrier plate 100 to the corresponding next work station.

[0034] like Figure 1 As shown, the receiving device also includes a first baffle 430 and a second baffle 440, which are arranged in parallel and spaced apart. The first baffle 430 and the second baffle 440 are respectively fixedly mounted on both sides of the base plate 400.

[0035] In one specific embodiment, the first baffle 430 and the second baffle 440 are both protective and blocking components. They are both vertically arranged rectangles, and the first baffle 430 and the second baffle 440 are arranged parallel and spaced apart. The first baffle 430 and the second baffle 440 are respectively fixedly mounted on both sides of the substrate 400, forming a fence-like structure that defines the area where the support plate 100 is located on both sides. Its main purpose is to prevent the ceramic circuit board placed on the support plate 100 from accidentally slipping off the sides of the substrate 400 during the lifting or horizontal movement of the support plate 100.

[0036] like Figure 2 As shown, the receiving device also includes several positioning rods 110. The positioning rods 110 are vertically arranged and fixedly assembled with the lower surface of the bearing plate 100, and the positioning rods 110 penetrate through the substrate 400.

[0037] In one specific embodiment, the positioning rod 110 is cylindrical and plays a crucial role in positioning and auxiliary support in this receiving device. The vertical arrangement of the positioning rod 110 conforms to the vertical lifting and lowering movement characteristics of the support plate 100. The positioning rod 110 is fixedly assembled to the lower surface of the support plate 100, allowing it to move together with the support plate 100 and providing guidance for its lifting and lowering, ensuring that the support plate 100 moves in the correct vertical direction and avoiding skewing. Simultaneously, the positioning rod 110 penetrates the substrate 400, allowing it to rely on the substrate 400 for further stability during movement. This through-fitting with the substrate 400 also strengthens the connection between the support plate 100 and the substrate 400, making the entire receiving device structure more robust.

[0038] like Figure 3 As shown, the receiving device also includes a first fixing plate 500, which is fixedly assembled with the substrate 400, and the pressing assembly 300 is mounted on the first fixing plate 500.

[0039] In one specific embodiment, the first fixing plate 500 is a plate-shaped structure fixed on the base plate 400. The first fixing plate 500 is vertically arranged and serves to provide a stable mounting base for the pressing assembly 300. The clamping block 310 is fixedly assembled to the upper end of the first fixing plate 500. The pressing assembly 300 also includes an assembly block 350, which is fixedly assembled to the fixing plate. The first driving device 340 is fixedly assembled to the side of the assembly block 350 away from the first fixing plate 500, and the assembly block 350 provides a mounting base for the first driving device 340.

[0040] like Figure 2As shown, the receiving device also includes an assembly rod 600, which is fixedly assembled to the lower surface of the substrate 400. The assembly rod 600 is vertically arranged and is equipped with a photoelectric sensor 610. The positioning rod 110 is equipped with a second fixing plate 111 that matches the photoelectric sensor 610.

[0041] In one specific embodiment, the assembly rod 600 is a slender rod that is vertically fixed to the lower surface of the substrate 400. The photoelectric sensor 610 is an electronic component that uses the photoelectric effect to detect information such as the position and state of an object; several photoelectric sensors 610 are evenly mounted on the assembly rod 600. The second fixing plate 111 is a plate-like structure disposed on the positioning rod 110. The second fixing plate 111 is perpendicular to the positioning rod 110 and matches the photoelectric sensors 610. When the carrier plate 100 drives the positioning rod 110 to move up and down, the second fixing plate 111 on the positioning rod 110 passes through different photoelectric sensors 610 in sequence. The photoelectric sensors 610 can accurately grasp key information such as the current position and lifting / lowering state of the carrier plate 100 by detecting the blocking of light. When the photoelectric sensor 610 detects that the carrier plate 100 has descended to a preset limit position, it indicates that the ceramic circuit boards on the carrier plate 100 have been stacked to a preset height. At this time, the pressing assembly 300 starts working to clamp and fix the stacked ceramic circuit boards.

[0042] like Figure 2 As shown, several positioning rods 110 are evenly distributed around the lifting screw 210.

[0043] In one specific embodiment, since the lifting screw 210 is the key transmission component driving the lifting and lowering of the support plate 100, and the positioning rods 110 are evenly distributed around it, it is as if a stable support frame is constructed with the lifting screw 210 as the center. This layout allows the support plate 100 to receive balanced support in all directions, ensuring that the support plate 100 maintains a stable horizontal state.

[0044] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A material collection device, characterized by, The utility model relates to a ceramic circuit board stacking and pressing device, which comprises a screw rod lifting machine, a bearing plate and a pressing assembly. The bearing plate is used for placing stacked ceramic circuit boards, the screw rod lifting machine is connected with the bearing plate, and the screw rod lifting machine is used for driving the bearing plate to move in the vertical direction. The pressing assembly comprises a clamping block, a connecting rod, a pressing head and a first driving device, the connecting rod penetrates through the clamping block and the pressing head, so that the pressing head and the clamping block are rotationally connected, the first driving device is horizontally arranged, the output end of the first driving device is connected with the pressing head, and the first driving device is used for driving the pressing head to rotate around the connecting rod, so as to press the stacked ceramic circuit boards on the bearing plate. The material collecting device further comprises a base plate, the base plate is arranged in parallel and spaced apart from the bearing plate, and the screw rod lifting machine is fixedly assembled with the base plate.

2. The material receiving device of claim 1, wherein, The material collecting device further comprises a second driving device and a guide rail, the second driving device is connected with the base plate, the base plate is connected based on the guide rail, and the second driving device is used for driving the base plate to move along the guide rail.

3. The material receiving device of claim 2, wherein, The screw rod lifting machine comprises a lifting screw rod, and the lifting screw rod is connected with the central position of the bearing plate.

4. The material receiving device of claim 1, wherein, The material collecting device further comprises a first baffle and a second baffle, the first baffle and the second baffle are arranged in parallel and spaced apart, and the first baffle and the second baffle are fixedly assembled on both sides of the base plate, respectively.

5. The material collection device of claim 2, wherein, The material collecting device further comprises a plurality of positioning rods, the positioning rods are vertically arranged, the positioning rods are fixedly assembled with the lower surface of the bearing plate, and the positioning rods penetrate through the base plate.

6. The material receiving apparatus of claim 2, wherein The material collecting device further comprises a first fixed plate, the first fixed plate is fixedly assembled with the base plate, and the pressing assembly is installed based on the first fixed plate.

7. The material receiving apparatus of claim 2, wherein The material collecting device further comprises an assembly rod, the assembly rod is fixedly assembled with the lower surface of the base plate, the assembly rod is vertically arranged, an optical sensor is arranged on the assembly rod, and a second fixed plate matched with the optical sensor is arranged on the positioning rod.

8. The material collection device of claim 6, wherein, The plurality of positioning rods are uniformly distributed around the lifting screw rod.

9. The material collection device of claim 4, wherein, ​

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