Temperature control extraction equipment

Abstract

The utility model discloses temperature control extraction equipment which comprises a base plate, a temperature control device and a temperature control device, the temperature control assembly comprises a semiconductor chilling plate, and the semiconductor chilling plate is arranged on the lower side of a substrate of the extraction equipment in an attached mode and conducts temperature control on the kit by conducting heat exchange on the base; the heat exchange assembly is used for carrying out heat exchange with the surface, far away from the substrate, of the semiconductor chilling plate; the controller is electrically connected with the semiconductor chilling plate so as to control the semiconductor chilling plate to control the temperature of the kit. It can be seen that the semiconductor chilling plate is arranged on the lower side of the substrate of the extraction equipment to conduct heat exchange on the base of the kit, so that temperature control over the kit is achieved, meanwhile, by arranging the heat exchange assembly, waste energy generated by the semiconductor chilling plate can be effectively transmitted to the outside, and the temperature control effect is achieved; the kit can be kept in a certain temperature state.

Description

Technical Field

[0001] This utility model belongs to the field of molecular biology experimental equipment technology, specifically relating to a temperature-controlled extraction device. Background Technology

[0002] Extraction equipment is an instrument that uses matching extraction reagents to automatically complete the sample extraction process. It is widely used in various fields such as disease control centers, clinical disease diagnosis, blood transfusion safety, forensic identification, environmental microbiology testing, food safety testing, animal husbandry, and molecular biology research. Biomolecular reactions typically require reagents placed in the kits provided by the extraction equipment, and these reagents sometimes need to be stored at specific temperatures during and after the reaction.

[0003] Therefore, there is an urgent need for an extraction device that can maintain a certain temperature during and after the reaction of reagents in the kit. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a temperature-controlled extraction device. By setting a semiconductor cooling chip on the underside of the substrate of the extraction device to exchange heat with the base of the reagent kit, the temperature of the reagent kit can be controlled. At the same time, by setting a heat exchange component to exchange heat with the semiconductor cooling chip, the semiconductor cooling chip can maintain the temperature control effect and keep the reagent kit at a certain temperature.

[0005] This utility model provides a temperature-controlled extraction device, comprising:

[0006] The substrate is provided with a base for placing the reagent kit;

[0007] A temperature control component, comprising a semiconductor cooling chip, which is attached to the lower side of the substrate of the extraction device and controls the temperature of the reagent kit by exchanging heat with the base;

[0008] A heat exchange assembly for exchanging heat with the side of the semiconductor cooling chip away from the substrate;

[0009] A controller, electrically connected to the thermoelectric cooler, is provided to control the thermoelectric cooler to regulate the temperature of the reagent kit.

[0010] Preferably, the heat exchange component exchanges heat with the semiconductor cooling chip through a heat exchange medium.

[0011] Preferably, the heat exchange assembly includes a heat exchange block:

[0012] The heat exchange block is disposed against the side of the semiconductor cooling chip away from the substrate. The heat exchange block has a first liquid inlet and a first liquid outlet. The first liquid inlet is used to introduce a heat exchange medium to exchange heat with the semiconductor cooling chip, and the first liquid outlet is used to discharge the heat exchange medium after heat exchange. Preferably, the heat exchange block is provided with a first heat exchange tube or a cold storage cavity that is respectively connected to the liquid inlet and the liquid outlet to realize the heat exchange.

[0013] Furthermore, each heat exchange block corresponds to a pair of fixing blocks, and the pair of fixing blocks are respectively fixed on the substrate and extend downward from the substrate to opposite sides of the heat exchange block, for engaging and fixing the cooling chip and the heat exchange block from the sides respectively.

[0014] Preferably, the substrate is provided with multiple bases to match and place the corresponding reagent kits one by one. The multiple bases are temperature controlled by a semiconductor cooling chip. Furthermore, the semiconductor cooling chip covers the temperature control area of ​​the multiple bases.

[0015] Preferably, heat exchange is performed between the semiconductor cooling chip and at least one heat exchange block.

[0016] Preferably, the substrate is provided with multiple bases to match and place the corresponding reagent kits one by one, and the temperature of the reagent kit is controlled by heat exchange between the base corresponding to each reagent kit and at least one semiconductor cooling chip.

[0017] All thermoelectric coolers share a single heat exchange block for heat exchange;

[0018] Alternatively, the at least one thermoelectric cooler chip used to control the temperature of each of the kits may share at least one heat exchanger for heat exchange.

[0019] Preferably, the substrate has two bases for placing two reagent kits respectively. Each reagent kit is temperature controlled by two semiconductor cooling chips, and the two semiconductor cooling chips corresponding to each reagent kit share a heat exchange block for heat exchange. Preferably, the two heat exchange blocks corresponding to the two reagent kits are connected in parallel or in series.

[0020] Preferably, it further includes a heat exchange medium supply device for circulating the heat exchange medium. Preferably, the heat exchange medium supply device includes a storage tank for adding the heat exchange medium from the outside and / or a pump for driving the circulation. More preferably, the heat exchange medium is water.

[0021] Preferably, it further includes a heat exchange module, the heat exchange module including a second heat exchange tube and at least one fan, the at least one fan performing heat exchange on the heat exchange medium, the second heat exchange tube having a second liquid inlet and a second liquid outlet, the second liquid inlet being used to introduce the heat exchange medium after heat exchange by the heat exchange component, and the second liquid outlet being used to discharge the heat exchange medium after heat exchange by the heat exchange component.

[0022] Preferably, it also includes an operating compartment and a fixed support frame, wherein the operating compartment is an open space enclosed by a rear side plate, two side plates, a top plate and a portion of a base plate;

[0023] The operating chamber is equipped with a magnetic rod holder, a magnetic rod, and the reagent kit inside, and a motion component for driving the reagent kit to move is installed outside the operating chamber.

[0024] The heat exchange module is mounted on the fixed support frame, and the pump and / or the storage tank is mounted on the outer side of the top plate of the operating compartment, with the heat exchange module being mounted adjacent to the pump. Preferably, the second heat exchange tube is located above the at least one fan, or the water pump and / or the storage tank is adjacent to the outer side of one of the two side plates.

[0025] Preferably, the temperature control component further includes a temperature sensor, which is used to detect the temperature during the temperature control process to ensure temperature control;

[0026] The temperature sensor is also electrically connected to the controller, which compares the temperature detected by the temperature sensor with a preset temperature and determines the state of the thermoelectric cooler based on the comparison result.

[0027] Preferably, the temperature control assembly further includes a temperature measuring connector, which is connected to the base, and the temperature sensor is connected to the base via the temperature measuring connector. More preferably, the temperature measuring connector and the base are connected using the same thermally conductive material.

[0028] Preferably, the base is embedded in the base mounting. Preferably, a heat insulation strip is embedded between the substrate and the base to prevent heat exchange between the base and the substrate.

[0029] The beneficial effects of this utility model are as follows:

[0030] This utility model provides a temperature-controlled extraction device that uses a semiconductor cooling chip on the underside of the substrate of the extraction device to exchange heat with the base of the reagent kit, thereby achieving temperature control of the reagent kit. At the same time, by setting up a heat exchange component, the waste energy generated by the semiconductor cooling chip can be effectively transferred to the outside, achieving the temperature control effect and maintaining the reagent kit at a certain temperature.

[0031] Furthermore, the semiconductor cooling chip is bonded to the substrate, resulting in high heat exchange efficiency, which enables the reagent kit to be quickly maintained at a certain temperature. Attached Figure Description

[0032] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 A three-dimensional structural diagram of a temperature-controlled extraction device provided by this utility model;

[0034] Figure 2 A three-dimensional structural schematic diagram of the temperature-controlled extraction device provided by this utility model from another perspective;

[0035] Figure 3 Exploded view of the substrate of the temperature-controlled extraction device provided by this utility model;

[0036] Figure 4 A schematic diagram of the substrate of the temperature-controlled extraction device provided by this utility model in another state;

[0037] Figure 5 A cross-sectional perspective structural diagram of a temperature-controlled extraction device including a heat exchange medium supply component, provided for an embodiment of this utility model;

[0038] Figure 6 A schematic diagram illustrating the principle of heat exchange medium circulation within the temperature-controlled extraction device provided in this embodiment of the utility model.

[0039] In the picture:

[0040] 100: Extraction equipment; 1: Sample loading plate; 2: Temperature control assembly; 3: Heat exchange assembly; 4: Controller; 5: Heat exchange medium supply device; 6: Operating chamber; 7: Fixed support frame;

[0041] 21: Semiconductor cooling chip; 22: Temperature sensing connection block; 31: Heat exchange block; 32: Fixing block;

[0042] 310: First liquid inlet; 311: First liquid outlet; 51: Pump; 52: Storage tank;

[0043] 53: Heat exchange module; 530: Second heat exchange tube; 531: Fan; 61: Rear side plate;

[0044] 62: Side panel; 63: Top panel; 64: Magnetic rod holder; 65: Magnetic rod; 66: Motion assembly Detailed Implementation

[0045] This utility model provides a temperature-controlled extraction device. To make the purpose, technical solution, and effects of this utility model clearer and more explicit, the following describes this utility model in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely for explaining this utility model and are not intended to limit this utility model.

[0046] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0047] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0048] In the description of this utility model, it should be noted that the terms "bottom," "middle," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0049] Figure 1 This is a three-dimensional structural diagram of a temperature-controlled extraction device 100 provided by the present invention. Figure 2 This is a three-dimensional structural diagram of the temperature-controlled extraction device 100 provided by this utility model from another perspective. Figure 3 An exploded view of the substrate of the temperature-controlled extraction device 100 provided by this utility model is shown below. Figures 1-3 The extraction device 100 includes:

[0050] The substrate 1 has a base 11 for placing a reagent kit (not shown) on it.

[0051] Temperature control component 2, which includes a semiconductor cooling chip 21, is attached to the lower side of the substrate 1 of the extraction device 100 and controls the temperature of the reagent kit by exchanging heat with the base;

[0052] The heat exchange assembly 3 is used to exchange heat with the side of the semiconductor cooling chip 21 away from the substrate 1;

[0053] Controller 4 is electrically connected to semiconductor cooling chip 21 to control the temperature of the reagent kit by semiconductor cooling chip 21.

[0054] The temperature-controlled extraction device provided in the above embodiment achieves temperature control of the reagent kit by setting a semiconductor cooling chip 21 on the lower side of the substrate 1 of the extraction device 100 to exchange heat with the base 11 of the reagent kit. At the same time, by setting a heat exchange component 3 to exchange heat with the semiconductor cooling chip 21, the semiconductor cooling chip can maintain the temperature control effect and keep the reagent kit at a certain temperature.

[0055] When the thermoelectric cooler 21 is used to cool the base 11, the heat exchange component 3 is used to exchange heat with the high-temperature heat generated by the thermoelectric cooler 21, and remove the high-temperature heat, so that the thermoelectric cooler can continuously cool the base 11 until it is cooled to the preset temperature.

[0056] When the thermoelectric cooler 21 is used to heat the base 11, the heat exchange component 3 is used to exchange heat with the low-temperature cold energy generated by the thermoelectric cooler 21. Then, the heat exchange component 3 absorbs heat, so that the thermoelectric cooler can continuously heat the base 11 until it reaches the preset temperature.

[0057] In some embodiments, the heat exchange assembly 3 can exchange heat with the semiconductor cooling chip 21 through a heat exchange medium. The heat exchange assembly 3 includes heat exchange blocks 31 and a pair of fixing blocks 32 corresponding to each heat exchange block 31. The heat exchange medium can be a liquid, such as water.

[0058] For details, see Figure 3 The heat exchange block 31 is disposed in contact with the side of the semiconductor cooling chip 21 away from the substrate 1, that is, in Figure 3 In this configuration, the heat exchange block 31 is fitted to the lower surface of the thermoelectric cooler 21. The heat exchange block 31 has a first liquid inlet 310 and a first liquid outlet 311. The first liquid inlet 310 is used to introduce the heat exchange medium for heat exchange with the thermoelectric cooler 21, and the first liquid outlet 311 is used to discharge the heat exchange medium after heat exchange. It should be noted that the first liquid inlet can also be 311, and correspondingly, the first liquid outlet is 310. The configuration of the first liquid inlet and the first liquid outlet can be set as needed, and no limitations are imposed here.

[0059] In some embodiments, heat exchange can be achieved by providing a first heat exchange tube (not shown) inside the heat exchange block 31. In another embodiment, heat exchange can also be achieved by providing a cold storage cavity inside the heat exchange block 31. Of course, other pipes or grooves can also be provided inside the heat exchange block 31 as needed to achieve heat exchange. This utility model does not impose any limitations on this.

[0060] In order to fix the heat exchange block 31 and the semiconductor cooling chip 21 on the substrate 1, a pair of fixing blocks 32 can be provided for each heat exchange block 31. Then, the pair of fixing blocks 32 are locked and fixed on the substrate 1 by fasteners such as screws and extend downward from the substrate 1 to the opposite sides of the heat exchange block. They are used to lock and fix the cooling chip 21 and the heat exchange block 31 from both sides, which is convenient for installation.

[0061] In some embodiments, to ensure a tight bond between the upper surface of the thermoelectric cooler 21 and the base 11 of the reagent kit, thermally conductive silicone grease can be applied to the upper surface of the thermoelectric cooler 21. In other embodiments, to ensure a tight bond between the lower surface of the thermoelectric cooler 21 and the heat exchange block 31, thermally conductive silicone grease can also be applied to the lower surface of the thermoelectric cooler 21. In still other embodiments, to ensure a tight bond between the base 11 of the reagent kit, the thermoelectric cooler 21, and the heat exchange block 31, thermally conductive silicone grease can be applied to both the upper and lower surfaces of the thermoelectric cooler 21, thereby achieving a tight bond between the base 11 of the reagent kit, the thermoelectric cooler 21, and the heat exchange block 31 by applying thermally conductive silicone grease to both sides of the thermoelectric cooler 21. A schematic diagram of a structure in which thermally conductive silicone grease is applied to the upper surface of the thermoelectric cooler 21 to adhere to the base of the reagent kit, and thermally conductive silicone grease is applied to the lower surface of the thermoelectric cooler 21 to adhere to the heat exchange block 31, and then a pair of fixing blocks 32 are used to fix the thermoelectric cooler 21 and the heat exchange block 31 to the substrate 1 can be found in [reference needed]. Figure 4 .

[0062] In other embodiments, multiple bases 11 can be provided on the substrate as needed, and corresponding reagent kits can be placed on the multiple bases 11 respectively. In this case, the multiple bases 11 can be temperature-controlled by heat exchange with a single thermoelectric cooler 21. To improve the temperature control effect, the thermoelectric cooler can cover the temperature control area of ​​the multiple bases. The multiple bases 11 can exchange heat with the thermoelectric cooler 21 through a heat exchange block 32. Of course, to improve the heat exchange efficiency, the multiple bases 11 can also exchange heat with the thermoelectric cooler 21 through multiple heat exchange blocks 32.

[0063] In some other embodiments, when multiple bases 11 are provided on the substrate 1, in order to more quickly control the temperature of each base 11 corresponding to the reagent kit, at least one thermoelectric cooler can be used to exchange heat with each base, thereby controlling the temperature of the reagent kit on that base. In this case, all thermoelectric coolers can share a single heat exchange block. Of course, to improve the efficiency of heat exchange, a separate heat exchange block can be configured for each reagent kit.

[0064] For details, see Figures 3-4 The substrate 1 has two bases 11 for placing two reagent kits (not shown). Each reagent kit is temperature-controlled by two thermoelectric coolers 21. The two thermoelectric coolers 21 corresponding to each reagent kit share a heat exchange block 32 for heat exchange. The two heat exchange blocks 32 corresponding to the two reagent kits can be connected in series, that is, after heat exchange is performed on the two thermoelectric coolers corresponding to one heat exchange block, the heat exchange medium discharged from one heat exchange block flows into the other heat exchange block to continue heat exchange on the two thermoelectric coolers corresponding to the other heat exchange block. Of course, the two heat exchange blocks 32 can also be connected in parallel, that is, the heat exchange medium flows into one heat exchange block and the other heat exchange block respectively, and heats the two thermoelectric coolers corresponding to each of the two heat exchange blocks respectively. After heat exchange, the heat exchange medium is discharged from their respective heat exchange blocks.

[0065] It should be noted that the reagent kits placed on the base 11 can be of any shape and structure. For example, any commercially available multi-well reagent kit can be used, such as 24-well, 48-well, 96-well, 192-well, 384-well, 768-well, or 1536-well plates. Reagent kits with matching wells larger than standard wells can also be used. Of course, multi-well reagent kits with any number of sample loading wells can also be designed according to requirements.

[0066] Alternatively, the base 11 can be embedded into the substrate 1, or it can be mounted on the substrate 1 in other ways. To prevent heat exchange between the base 11 and the substrate 1, a heat insulation strip 12 can be embedded between the substrate 1 and the base 11. (See [reference]). Figure 3 The heat insulation strip 12 can be embedded and enclosed along the circumference of the base.

[0067] In order to circulate the heat exchange medium, the temperature-controlled extraction device 100 provided in the above embodiments of the present invention also includes a heat exchange medium supply component 5. Figure 5 A cross-sectional perspective view of a temperature-controlled extraction device 100 including a heat exchange medium supply component 5, provided for an embodiment of this utility model. Figure 6A schematic diagram illustrating the principle of heat exchange medium circulation within the temperature-controlled extraction device 100 provided in this embodiment of the present invention.

[0068] See Figures 5-6 In some embodiments, the heat exchange medium supply assembly 5 may include a pump 51 for driving circulation, in which case the heat exchange medium may be pre-stored in the circulation pipeline; in other embodiments, in addition to the pump 51, the heat exchange medium supply assembly may also include a storage tank 52 for heating the heat exchange medium from the outside.

[0069] In some other embodiments, in order to enable the recycling of the heat exchange medium, the heat exchange medium providing module 51 may further include a heat exchange module 53 for exchanging heat in the heat exchange medium. The heat exchange module 53 may include a second heat exchange tube 530 and at least one fan 531. When the thermoelectric cooler 21 is used to cool the base 11, the heat exchange module 53 is used to dissipate heat in the heat exchange medium, that is, the fan 531 can blow cold air to dissipate heat in the heat exchange medium; when the thermoelectric cooler 21 is used to heat the base 11, the heat exchange module 53 is used to heat the heat exchange medium, that is, the fan 531 can blow hot air to provide the heat for heating the heat exchange medium.

[0070] The second heat exchange tube 530 has a second inlet (not shown) and a second outlet (not shown). The second inlet is used to introduce the heat exchange medium discharged from the heat exchange assembly 3, and the second outlet is used to discharge the heat exchange medium after heat exchange by the heat exchange assembly 3. At least one fan 531 heats the heat exchange medium in the second heat exchange tube. In the example of two heat exchange blocks connected in series, the heat exchange medium enters from the first inlet of one heat exchange block, heats the two thermoelectric coolers corresponding to that heat exchange block, and after heat exchange, it is discharged from the first outlet of that heat exchange block and then enters the first inlet of another heat exchange block to heat the two thermoelectric coolers corresponding to that other heat exchange block, and then is discharged from the first outlet of that heat exchange block. After all the thermoelectric coolers corresponding to the two heat exchange blocks have been heated, under the action of the pump, the heat exchange medium after heat exchange enters the heat exchange tube 530 from the second inlet for heat exchange, and after heat exchange, it is discharged from the second outlet of the heat exchange tube 530. In the parallel examples described above, the heat exchange medium flows into the first inlet of one heat exchange block and the first inlet of the other heat exchange block, and exchanges heat with the two corresponding semiconductor cooling chips of each heat exchange block. After heat exchange, the medium is discharged from the first outlet of each heat exchange block. Then, the heat exchange medium discharged from the first outlet of each heat exchange block is collected or pumped into the heat exchange tube 530 through the second inlet. After heat exchange, the medium is discharged from the second outlet of the heat exchange tube 530.

[0071] In some embodiments, in order not to occupy the space of the extraction device 100, the second heat exchange tube 530 can be a coiled tube. Of course, the second heat exchange tube 530 can also be other types of pipes, as long as they can exchange heat with the heat exchange medium discharged from the heat exchange component 3.

[0072] The following example illustrates the circulation process of the heat exchange medium using a substrate 1 of the extraction device 100 with two bases 11, each base 11 having two semiconductor cooling chips 21 for heat exchange, and each base having a corresponding pair of heat exchange blocks 31.

[0073] For the aforementioned series connection method between heat exchange blocks, see Figures 5-6 First, pump 51 is started. After pump 51 is started, the heat exchange medium in storage tank 52 will enter. Figure 6 The heat exchange block 31 is set under the right base 11. After exchanging heat with the two semiconductor cooling chips set under the right base 11, the heat exchange medium flows into the left heat exchange block 31 for heat exchange. After exchanging heat with the two semiconductor cooling chips on the left, the heat exchange medium flows out from the left heat exchange block 31 and enters the heat exchange module 53 for heat exchange. After being exchanging heat with the heat exchange module 53, the heat exchange medium re-enters the pump 51 for circulation.

[0074] It should be noted that in order to ensure uniform heat exchange on each base 11 and further improve the extraction accuracy of the extraction device, the heat exchange blocks are connected in parallel. That is, the pump 51 can also perform heat exchange on each reagent kit base separately. For example, by setting a three-way valve on the outlet pipe of the pump 51, the heat exchange medium from the pump 51 flows into the heat exchange block 31 on the left and the heat exchange block 31 on the right. Then, the heat exchange medium flowing out from the heat exchange blocks 31 on both sides enters the heat exchange module 53 for heat exchange. After being heated by the heat exchange module 53, the heat exchange medium re-enters the pump 51 for circulation.

[0075] In addition, without the storage tank 52, the heat exchange medium can be pre-stored in the pipeline, so that after the pump 51 is started, the heat exchange medium can circulate in the pipeline.

[0076] The temperature-controlled extraction device 100 also includes an operating chamber 6 and a fixed support frame 7. The operating chamber 6 is located inside the extraction device 100. (See below) Figure 1 The operating chamber 6 is an open working space enclosed by a rear side plate 61, two side plates 62, a top plate 63, and part of a base plate. Inside the operating chamber 6 are a magnetic rod holder 64, a magnetic rod 65, and a reagent kit (not shown). Outside the operating chamber is a motion component 66 for driving the movement of the reagent kit. Driven by the motion component, the magnetic rod holder 64 drives the magnetic rod 65 to reciprocate up and down and left and right.

[0077] In some embodiments, the heat exchange module 53 can be mounted on the fixed support frame 7. For example, the heat exchange module 53 can be fixedly mounted on the fixed support frame 7 by fasteners such as screws. See [link to documentation]. Figure 5 Pump 51 and storage tank 52 are located on the outside of the top plate 63 of the operating chamber 6. For example, pump 51 and storage tank 52 can be located above the top plate 63 of the operating chamber 6, and storage tank 52 can be located above pump 51. Heat exchange module 53 can be located adjacent to pump 51 and storage tank 52, and pump 51 and storage tank 52 can be fixed on heat exchange module 53. Of course, pump 51, storage tank 52 and heat exchange module 53 can also be located in other positions outside the operating chamber 6, such as in other positions outside the two side plates 62 of the operating chamber 6. This embodiment of the utility model does not limit the location of pump 51, storage tank 52 and heat exchange module 53, as long as the corresponding functions of these components can be realized.

[0078] In order to detect the temperature during the temperature control process and thus ensure temperature control, the temperature control component 2 may also include a temperature sensor (not shown). The temperature sensor is electrically connected to the controller and feeds back the detected temperature to the controller. The controller compares the temperature detected by the temperature sensor with the preset temperature to determine whether to continue the cooling state, continue the heating state, or pause the cooling or heating.

[0079] In some embodiments, the temperature control component 2 may further include a temperature sensing connection block 22, see [link to documentation]. Figure 4 The temperature measuring connector is connected to the base 11, and the temperature sensor is connected to the base 11 via the temperature measuring connector 22, so as to detect the temperature of the base 11 through the temperature measuring connector 22, thereby detecting the temperature of the reagent kit. In order to detect the temperature of the reagent kit more accurately, the temperature measuring connector 22 can use the same thermally conductive material as the base 11.

[0080] The specific operation process of using the temperature-controlled extraction device 100 of this utility model is as follows:

[0081] I. Refrigeration process:

[0082] 1. First, start pump 51 to pump room temperature heat exchange medium from storage tank 52 into the pipeline;

[0083] 2. The ambient temperature heat exchange medium enters the heat exchange block 31, and the ambient temperature heat exchange medium in the heat exchange block 31 exchanges heat with the semiconductor cooling chip 21, taking away the high temperature heat exchange medium. Then the high temperature heat exchange medium enters the heat exchange module 53 for heat exchange. After heat exchange in the heat exchange module 53, the heat exchange medium flows back into the storage tank 52 for circulation.

[0084] 3. The temperature sensor reads the current temperature at preset time intervals and compares the read current temperature with the preset cooling temperature, such as 0°. If the current temperature is greater than the preset cooling temperature, the semiconductor cooling chip 21 is activated to start cooling.

[0085] 4. The temperature of the upper surface of the semiconductor cooling chip 21 decreases, which carries away the heat from the reagent kit on the base 11. The temperature of the base 11 drops rapidly, so the temperature of the reagent kit placed on the base 11 also decreases, and thus the temperature of the reagent decreases.

[0086] 5. The high-temperature heat from the lower surface of the thermoelectric cooler 21 is conducted to the heat exchange block 31, and the temperature of the heat exchange medium in the heat exchange block 31 rises. The high-temperature heat exchange medium is driven by the pump 51 to circulate between the heat exchange module 53 and the heat exchange block 31. At this time, the heat exchange module 53 is used to exchange heat with the high-temperature heat generated by the thermoelectric cooler 21, and remove the heat from the thermoelectric cooler 21, thereby reducing the bottom temperature of the thermoelectric cooler 21 so that it can continue to cool down.

[0087] 6. When the temperature sensor reads the preset cooling temperature, such as 0°C, the controller controls the semiconductor cooling chip 21 to enter the heat preservation state, so that the reagent kit can maintain low temperature operation.

[0088] The above-mentioned extraction device heats the base of the reagent kit by setting a semiconductor cooling chip on the underside of the substrate of the extraction device. At the same time, by setting the heat exchange component and the semiconductor cooling chip, the heat generated by the semiconductor cooling chip during the cooling process can be effectively transferred to the outside to achieve a cooling effect, thereby keeping the reagent kit at a low temperature.

[0089] II. Heating process:

[0090] 1. First, start pump 51 to pump room temperature heat exchange medium from storage tank 52 into the pipeline;

[0091] 2. The ambient temperature heat exchange medium enters the heat exchange block 31. The ambient temperature heat exchange medium in the heat exchange block 31 exchanges heat with the semiconductor cooling chip 21. After the heat exchange, the temperature of the ambient temperature heat exchange medium decreases. Then the low temperature heat exchange medium enters the heat exchange module 53 to absorb heat and increase its temperature. After the heat exchange medium is heated in the heat exchange module 53, it flows back into the storage tank 52 for circulation.

[0092] 3. The temperature sensor reads the current temperature at preset time intervals and compares the read current temperature with the preset heating temperature, such as 40°. If the current temperature is lower than the preset heating temperature, the semiconductor cooling chip 21 is activated to start heating.

[0093] 4. The temperature of the upper surface of the semiconductor cooling chip 21 increases, which carries away the cold energy from the reagent kit on the base 11. The temperature of the base 11 rises rapidly, so the temperature of the reagent kit placed on the base 11 also rises, and thus the temperature of the reagent rises.

[0094] 5. The low-temperature cold energy on the lower surface of the semiconductor cooling chip 21 is conducted to the heat exchange block 31, the temperature of the heat exchange medium in the heat exchange block 31 decreases, and the low-temperature heat exchange medium is driven by the pump 51 to circulate between the heat exchange module 53 and the heat exchange block 31. Then the low-temperature heat exchange medium enters the heat exchange module 53 to absorb heat and increase the temperature, thereby raising the bottom temperature of the semiconductor cooling chip 21 so that it can continue to heat up.

[0095] 6. When the temperature sensor reads the preset heating temperature, such as 40°C, the controller controls the semiconductor cooling chip 21 to enter the heat preservation state, so that the reagent kit can maintain high temperature operation.

[0096] The above-mentioned extraction device heats the base of the reagent kit by setting a semiconductor cooling chip on the underside of the substrate of the extraction device. At the same time, by setting a heat exchange component to exchange heat with the semiconductor cooling chip, the cold energy generated during the cooling process of the semiconductor cooling chip can be effectively transferred to the outside to achieve a heating effect, thereby keeping the reagent kit at a high temperature.

[0097] The foregoing description has fully disclosed the specific embodiments of this utility model. It should be noted that any modifications made by those skilled in the art to the specific embodiments of this utility model do not depart from the scope of the claims. Accordingly, the scope of the claims of this utility model is not limited to the foregoing specific embodiments.

Claims

1. A temperature-controlled extraction apparatus, characterized by, The utility model relates to a temperature control device for reagent box, comprising: a substrate provided with a seat for placing a reagent box; a temperature control assembly, the temperature control assembly comprises a semiconductor refrigerating sheet, the semiconductor refrigerating sheet is attached to the lower side of the substrate of the extraction equipment, and the temperature of the reagent box is controlled by heat exchange with the seat; a heat exchange assembly for heat exchange with the side of the semiconductor refrigerating sheet away from the substrate; a controller electrically connected with the semiconductor refrigerating sheet to control the temperature of the reagent box.

2. The temperature-controlled extraction device of claim 1, wherein, The heat exchange assembly exchanges heat with the semiconductor refrigerating sheet through a heat exchange medium.

3. The temperature-controlled extraction device of claim 2, wherein, The heat exchange assembly comprises a heat exchange block attached to the side of the semiconductor refrigerating sheet away from the substrate, the heat exchange block has a first liquid inlet and a first liquid outlet, the first liquid inlet is used to introduce a heat exchange medium for heat exchange with the semiconductor refrigerating sheet, and the first liquid outlet is used to discharge the heat exchanged heat exchange medium.

4. The temperature-controlled extraction device of claim 3, wherein, The heat exchange block is internally provided with a first heat exchange pipe or a cold storage cavity in communication with the liquid inlet and the liquid outlet respectively to realize the heat exchange.

5. The temperature-controlled extraction device of claim 3, wherein, Each heat exchange block corresponds to a pair of fixing blocks, and a pair of fixing blocks are fixed on the substrate and extend downward from the substrate to the opposite sides of the heat exchange block to respectively clamp and fix the semiconductor refrigerating sheet and the heat exchange block.

6. The temperature-controlled extraction device of claim 3, wherein, The substrate is provided with a plurality of seats to respectively match the placement of corresponding reagent boxes, and the plurality of seats are controlled in temperature by heat exchange with a semiconductor refrigerating sheet, further, the semiconductor refrigerating sheet covers the temperature control area of the plurality of seats.

7. The temperature-controlled extraction device of claim 6, wherein, At least one heat exchange block exchanges heat with a semiconductor refrigerating sheet.

8. The temperature-controlled extraction device of claim 3, wherein, The substrate is provided with a plurality of seats to respectively match the placement of corresponding reagent boxes, and the plurality of seats are controlled in temperature by heat exchange with a semiconductor refrigerating sheet, further, the semiconductor refrigerating sheet covers the temperature control area of the plurality of seats. All semiconductor refrigerating sheets share a heat exchange block for heat exchange. Or the at least one semiconductor refrigerating sheet for controlling the temperature of each reagent box shares at least one heat exchange block for heat exchange.

9. The temperature-controlled extraction device of claim 8, wherein, The substrate is provided with two seats to respectively match the placement of two reagent boxes, each reagent box is controlled in temperature by two semiconductor refrigerating sheets, and the two semiconductor refrigerating sheets corresponding to each reagent box share a heat exchange block for heat exchange.

10. The temperature-controlled extraction device of claim 9, wherein, The two heat exchange blocks corresponding to the two reagent boxes are connected in parallel or in series.

11. The temperature-controlled extraction device of claim 2, wherein, Further comprising a heat exchange medium providing device for circulating the heat exchange medium.

12. The temperature-controlled extraction device of claim 11, wherein, The heat exchange medium providing device comprises a storage tank for adding heat exchange medium from the outside and / or a pump for driving circulation.

13. The temperature-controlled extraction device of claim 11, wherein, The heat exchange medium is water.

14. The temperature-controlled extraction device of claim 12, wherein, Further comprising a heat exchange module, the heat exchange module comprises a second heat exchange pipe and at least one fan, the at least one fan exchanges heat with the heat exchange medium, the second heat exchange pipe has a second liquid inlet and a second liquid outlet, the second liquid inlet is used to introduce the heat exchange medium exchanged by the heat exchange assembly, and the second liquid outlet is used to discharge the heat exchange medium exchanged by the heat exchange assembly.

15. The temperature-controlled extraction device of claim 14, wherein, The operation bin is formed by a rear side plate, two side plates, a top plate and part of a base plate, and has an open space; The operation bin is internally provided with a magnetic rod holder, a magnetic rod and the reagent box, and externally provided with a movement assembly for driving the reagent box to move; The heat exchange module is arranged on the fixed support frame, the pump and / or the storage tank is arranged outside the top plate of the operation bin, and the heat exchange module is arranged adjacent to the pump.

16. The temperature-controlled extraction device of claim 15, wherein, The second heat exchange pipe is located above the at least one fan, or the pump and / or the storage tank is located outside one of the two side plates.

17. The temperature-controlled extraction device of any one of claims 1-16, wherein, The temperature control assembly further comprises a temperature sensor for detecting the temperature during temperature control to ensure temperature control. The temperature sensor is also electrically connected to the controller, and the controller compares the temperature detected by the temperature sensor with a preset temperature, and determines the state of the semiconductor refrigeration sheet according to the comparison result.

18. The temperature-controlled extraction device of claim 17, wherein, The temperature control assembly further comprises a temperature measurement connecting piece, which is connected to the base, and the temperature sensor is connected to the base via the temperature measurement connecting piece.

19. The temperature-controlled extraction device of claim 18, wherein, The temperature measurement connecting piece and the base are connected by the same heat-conducting material.

20. The temperature-controlled extraction device of claim 1, wherein, The base is embedded in the base plate.

21. The temperature-controlled extraction device of claim 20, wherein, A heat insulation strip is embedded between the base plate and the base to block heat exchange between the base and the base plate.

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