Multi-layer high-density interconnection board VCP jet electroplating device
By designing a liquid level monitoring component for a multilayer high-density interconnect board VCP jet electroplating device, the electroplating solution is replenished in a timely manner, solving the electroplating quality problem caused by the drop in electroplating solution level and realizing the stability and continuity of the electroplating process.
Patent Information
- Application Number
- CN202423120213.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2034-12-18
AI Technical Summary
In the vertical continuous electroplating process, the failure to detect the drop in the electroplating liquid level in time leads to poor electroplating quality.
A VCP jet electroplating device for multilayer high-density interconnect boards was designed. The liquid level of the electroplating tank is monitored in real time by a liquid level monitoring component, and the electroplating solution is replenished in a timely manner by an alarm sensor to ensure that the electroplating process is continuous.
It enables real-time monitoring and automatic replenishment of electroplating liquid level, ensuring the stability and continuity of electroplating quality and reducing equipment costs.
Smart Images
Figure CN223766462U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to circuit board production technical field especially relates to a multilayer high density interconnection board VCP jet stream electroplating device. BACKGROUND
[0002] Multilayer high density interconnection board, namely multilayer HDI circuit board.
[0003] VCP jet stream electroplating, namely vertical continuous electroplating technology, is suitable for PCB (printed circuit board) copper plating process.
[0004] In the process of vertical continuous electroplating, the water washing liquid or electroplating liquid in each pool is driven by the circuit board and will produce certain loss, resulting in the liquid level in the pool to drop, and if the operator cannot find it in time, the liquid level in the pool cannot cover the board to be electroplated, which will cause the surface electroplating of the board to be incomplete and affect the electroplating quality.
[0005] Therefore, the multilayer high density interconnection board VCP jet stream electroplating device is proposed to solve the existing problems. UTILITY MODEL CONTENT
[0006] The utility model discloses a kind of multilayer high density interconnection board VCP jet stream electroplating devices to solve the problems of the prior art in view of the problems in the background art.
[0007] To achieve the above object, the utility model provides the following technical scheme: a kind of multilayer high density interconnection board VCP jet stream electroplating device, including floor, crossbeam, substrate and pool body, the upper surface of the floor is linearly arranged and is equipped with pool body, the floor is equipped with guide rail, the crossbeam is slidably equipped on the guide rail by drive assembly, the substrate is lifted and is located below the crossbeam, the lower surface of the substrate is symmetrically slidably equipped with two clamping arms by screw rod assembly, and the lower surface of the substrate is equipped with liquid level monitoring assembly.
[0008] Preferably, the upper end of the pool body is provided with a water inlet, and the lower end of the pool body is provided with a water outlet.
[0009] Preferably, the drive assembly is composed of a rack and a gear, the rack is arranged on the outer wall of the guide rail, the gear is rotatably arranged on the crossbeam, and the rack and the gear are meshed with each other.
[0010] Preferably, the upper surface of the crossbeam is provided with an air cylinder, and the output end of the air cylinder penetrates the crossbeam and is fixed to the upper surface of the substrate.
[0011] Preferably, the screw rod assembly is composed of a screw rod and a sliding groove, the sliding groove is opened in the lower surface of the substrate, and the screw rod is rotatably arranged in the sliding groove.
[0012] Preferably, the two clamping arms are symmetrically threaded on the screw rod, and the two clamping arms are in sliding contact with the chute, and the two clamping arms are engaged with the screw rod in opposite directions.
[0013] Preferably, the liquid level monitoring assembly is composed of a float ball, a beam plate, a movable contact, a static contact and an alarm sensor, the beam plate is arranged on the base plate, the float ball is slidably arranged on the beam plate, the movable contact is arranged at the top end of the float ball, the static contact is arranged on the lower surface of the beam plate, and the alarm sensor is arranged on the upper surface of the beam plate.
[0014] Preferably, the lower surface of the floor is provided with four support seats, and the four support seats are arranged in a rectangular array on the lower surface of the floor.
[0015] Compared with the prior art, the utility model has the advantages that:
[0016] The multilayer high-density interconnection board VCP jet flow electroplating device can position the multilayer high-density interconnection circuit board to be electroplated below the base plate through the two clamping arms, then control the beam to slide and drive the circuit board to move above the specified electroplating tank, then control the base plate to descend so that the circuit board is completely immersed in the electroplating tank, after the electroplating of the electroplating tank is completed, the circuit board is controlled to ascend, then the beam continues to move and moves the circuit board to the next tank body, and the vertical continuous electroplating operation of the circuit board is completed through the reciprocating movement.
[0017] When the base plate drives the circuit board to be immersed in the tank body, the liquid level of the tank body pushes the float ball to ascend, when the base plate reaches the specified height, the movable contact is inserted into the static contact, the circuit is connected, and thus the alarm sensor normally works, when the liquid level in the tank body decreases and the movable contact cannot be inserted into the static contact, the circuit is disconnected, at this time, the alarm sensor cannot work, and the computer receives the signal in time and then controls the corresponding pump injection structure to inject a certain amount of electroplating liquid into the tank body.
[0018] In the process of vertical continuous electroplating, the operator can find the liquid level loss condition in the electroplating tank in time and supplement the liquid in time, so that the normal electroplating operation is ensured. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 It is a three-dimensional structure schematic view of the utility model;
[0020] Figure 2 It is a front view structure schematic view of the utility model;
[0021] Figure 3 It is a beam structure schematic view of the utility model;
[0022] Figure 4A screw rod assembly structure schematic view of the utility model.
[0023] Figure 5 A liquid level monitoring assembly structure schematic view of the utility model.
[0024] Reference signs:
[0025] 1, support seat, 2, floor, 3, guide rail, 4, water outlet, 5, water inlet, 6, crossbeam, 7, floating ball, 8, base plate, 9, air cylinder, 10, pool body, 11, rack, 12, gear, 13, clamping arm, 14, screw rod, 15, sliding slot, 16, beam plate, 17, moving contact, 18, static contact, 19, alarm sensor. DETAILED DESCRIPTION
[0026] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.
[0027] Embodiment one
[0028] As Figures 1-4 shown, the utility model provides a kind of multilayer high-density interconnection board VCP jet stream electroplating device, including floor 2, crossbeam 6, base plate 8 and pool body 10, the upper surface of floor 2 is linearly arranged and is equipped with pool body 10, floor 2 is equipped with guide rail 3, guide rail 3 is equipped with crossbeam 6 by driving assembly sliding, base plate 8 is lifted and is equipped below crossbeam 6, the lower surface of base plate 8 is equipped with two clamping arms 13 by screw rod assembly symmetry sliding, and liquid level monitoring assembly is equipped below base plate 8.
[0029] Based on embodiment 1:
[0030] The multilayer high-density interconnection board VCP jet stream electroplating device of the utility model can position multilayer high-density interconnection circuit board to be electroplated below base plate 8 by two clamping arms 13 during use, then control crossbeam 6 to move circuit board to the upper side of specified electroplating pool, then control base plate 8 to descend so that circuit board is completely immersed in electroplating pool, after the electroplating of this electroplating pool is completed, control circuit board to ascend, then crossbeam 6 continues to move, and circuit board is moved to next pool body 10, so reciprocate, and the vertical continuous electroplating operation of circuit board is completed.
[0031] The alarm sensor 19 is connected to an external power supply to display the working state, when the substrate 8 drives the circuit board to be immersed in the pool body 10, the liquid level of the pool body 10 pushes the floating ball 7 to go up, when the substrate 8 reaches the specified height, the movable contact 17 is inserted into the static contact 18, the circuit is connected, so that the alarm sensor 19 normally works, when the liquid level in the pool body 10 is lowered and the movable contact 17 cannot be inserted into the static contact 18, the circuit is disconnected, at this time, the alarm sensor 19 cannot work, the computer receives the signal in time, and then controls the corresponding pump structure to inject a certain amount of electroplating solution into the pool body 10, through the cooperation of the above structure, it is not necessary to install a liquid level sensor in each electroplating pool, and the equipment investment cost is reduced.
[0032] Embodiment two
[0033] As Figures 1-4 shown, compared with embodiment one, the multi-layer high-density interconnection plate VCP jet electroplating device further comprises: a water inlet 5 arranged at the upper end of the pool body 10, and a water outlet 4 arranged at the lower end of the pool body 10, so that the pool body 10 is connected to the external pump structure through the water inlet 5 and the water outlet 4 to supplement the liquid, and connected to the external sewage pipeline to replace the liquid.
[0034] The driving assembly is composed of a rack 11 and a gear 12, the rack 11 is arranged at the outer wall upper end of the guide rail 3, the gear 12 is rotatably arranged on the cross beam 6, the rack 11 and the gear 12 are mutually engaged, and the power device drives the gear 12 to rotate, so that the cross beam 6 slides on the guide rail 3.
[0035] The upper surface of the cross beam 6 is provided with a gas cylinder 9, the output end of the gas cylinder 9 penetrates the cross beam 6 and is fixed to the upper surface of the substrate 8, and the lifting action of the substrate 8 is controlled through the gas cylinder 9.
[0036] The screw rod assembly is composed of a screw rod 14 and a sliding groove 15, the sliding groove 15 is arranged on the lower surface of the substrate 8, the screw rod 14 is rotatably arranged in the sliding groove 15, two clamping arms 13 are symmetrically arranged on the screw rod 14 in a threaded manner, the two clamping arms 13 are in sliding contact with the sliding groove 15, the threaded engagement directions of the two clamping arms 13 and the screw rod 14 are opposite, the power device drives the screw rod 14 to rotate, under the principle of the screw rod, and the threaded engagement directions of the two clamping arms 13 and the screw rod 14 are opposite, so that the mutual approach or separation of the two clamping arms 13 can be synchronously controlled.
[0037] The liquid level monitoring assembly is composed of a floating ball 7, a beam plate 16, a movable contact 17, a static contact 18 and an alarm sensor 19, the beam plate 16 is arranged on the base plate 8, the floating ball 7 is slidingly arranged on the beam plate 16, the movable contact 17 is arranged at the top end of the floating ball 7, the static contact 18 is arranged on the lower surface of the beam plate 16, and the alarm sensor 19 is arranged on the upper surface of the beam plate 16, when the base plate 8 drives the circuit board to be immersed in the inside of the pool body 10, the liquid level of the pool body 10 rises against the floating ball 7, when the base plate 8 reaches the specified height, the movable contact 17 is inserted into the static contact 18, the circuit is connected, so that the alarm sensor 19 normally operates.
[0038] The lower surface of the floor 2 is provided with four support seats 1, and the positions of the four support seats 1 are distributed in a rectangular array on the lower surface of the floor 2
[0039] It should be noted that the structure of the air cylinder 9 and the alarm sensor 19 is a mature technology, and the working principle and internal structure thereof are known to those skilled in the art, the present application only utilizes the function and does not improve the internal structure, therefore, the detailed description is not given here, and those skilled in the art can make any selection according to the needs or convenience.
[0040] The gear 12 and the screw rod 14 of the present application also need to provide a power device to make them work normally, and as known to those skilled in the art, the power supply is common, which belongs to conventional means or common knowledge, and will not be described here, and those skilled in the art can make any selection according to the needs or convenience.
[0041] The above specific embodiments are only several preferred embodiments of the present application, based on the technical scheme of the present application and the related inspiration of the above embodiments, those skilled in the art can make various alternative improvements and combinations on the above specific embodiments.
[0042] It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and can be realized in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the involved claims.
Claims
1. A multi-layer high density interconnect board VCP jet electroplating apparatus comprising a floor (2), a crossbeam (6), a substrate (8) and a cell body (10) characterised in that: The upper surface of the floor (2) is linearly arranged with a pool body (10), the floor (2) is provided with a guide rail (3), the guide rail (3) is slidably provided with a cross beam (6) through a driving assembly, the base plate (8) is arranged below the cross beam (6), the lower surface of the base plate (8) is symmetrically slidably provided with two clamping arms (13) through a lead screw assembly, and the lower surface of the base plate (8) is provided with a liquid level monitoring assembly.
2. A multi-layer high density interconnect board VCP jet electroplating apparatus as defined in claim 1, wherein: The upper end of the pool body (10) is provided with a water inlet (5), and the lower end of the pool body (10) is provided with a water outlet (4).
3. A multi-layer high density interconnect board VCP jet electroplating apparatus as defined in claim 1, wherein: The driving assembly is composed of a rack (11) and a gear (12), the rack (11) is arranged on the outer wall of the upper end of the guide rail (3), the gear (12) is rotatably arranged on the cross beam (6), and the rack (11) and the gear (12) are in meshing relationship.
4. A multi-layer high density interconnect board VCP jet electroplating apparatus as defined in claim 1, wherein: The upper surface of the cross beam (6) is provided with a gas cylinder (9), the output end of the gas cylinder (9) penetrates the cross beam (6) and is fixed to the upper surface of the base plate (8).
5. A multi-layer high density interconnect board VCP jet electroplating apparatus as defined in claim 1 wherein: The lead screw assembly is composed of a screw rod (14) and a sliding groove (15), the sliding groove (15) is arranged on the lower surface of the base plate (8), and the screw rod (14) is rotatably arranged in the sliding groove (15).
6. A multi-layer high density interconnect board VCP jet electroplating apparatus as defined in claim 5, wherein: The two clamping arms (13) are symmetrically screwed on the screw rod (14), and the two clamping arms (13) are in sliding contact with the sliding groove (15), and the two clamping arms (13) are in opposite screw engagement directions with the screw rod (14).
7. A multi-layer high density interconnect board VCP jet electroplating apparatus as defined in claim 1 wherein: The liquid level monitoring assembly is composed of a floating ball (7), a beam plate (16), a movable contact (17), a static contact (18) and an alarm sensor (19), the beam plate (16) is arranged on the base plate (8), the floating ball (7) is slidably arranged on the beam plate (16), the movable contact (17) is arranged at the top end of the floating ball (7), the static contact (18) is arranged on the lower surface of the beam plate (16), and the alarm sensor (19) is arranged on the upper surface of the beam plate (16).
8. A multi-layer high density interconnect board VCP jet electroplating apparatus as defined in claim 1 wherein: The lower surface of the floor (2) is provided with a supporting seat (1), there are four supporting seats (1), and the positions of the four supporting seats (1) are distributed in a rectangular array on the lower surface of the floor (2).