Photoresist coating device for integrated circuit

Abstract

The utility model belongs to the technical field of photoresist coating, and particularly relates to an integrated circuit photoresist coating device which comprises a base, a shell cover is fixedly connected to the base, an annular groove is formed in the shell cover, a protective cover is arranged in the annular groove, four connecting seats are fixedly connected to the top side of the protective cover, and the four connecting seats are fixedly connected to the top side of the protective cover. Four first pneumatic cylinders are installed on the base, a first pneumatic rod is assembled at the acting end of each first pneumatic cylinder, and the top ends of the first pneumatic cylinders are fixedly connected to the connecting base. When the photoresist collecting device is used, photoresist thrown out from the edge of a wafer can be effectively blocked in the rotating process of the wafer, splashing and waste of the photoresist are avoided, the blocked photoresist falls into the shell cover and flows into the annular collecting box through the leakage opening, and therefore the thrown-out photoresist can be effectively collected, and the photoresist collecting effect is improved. Waste of the photoresist and environmental pollution are avoided, meanwhile, the photoresist collected in the annular collection box can be reused after being treated, and the material cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of photoresist coating technology, specifically an integrated circuit photoresist coating device. Background Technology

[0002] Photoresist is a photosensitive material that is mainly used in the photolithography process during chip manufacturing. In the manufacturing of integrated circuit chips, it is usually necessary to uniformly coat the photoresist onto the wafer, so a photoresist coating device is required.

[0003] A Chinese patent with announcement number CN221056826U discloses a photoresist coating device that improves the convenience of cleaning chips before coating, reduces the labor intensity of manual coating operations, and improves coating quality. It includes an air suction box and a worktable. The worktable is installed on top of the air suction box, and an air suction hole is provided in the middle of the top of the worktable. It also includes a discharge device, an air suction device, an air inlet device, a first electric cylinder, an air blowing box, and air blowing pipes. The air blowing box is connected to an external air source, and multiple sets of air blowing pipes are connected and installed at the bottom of the air blowing box. An air inlet device is connected to the outer wall of the worktable. The air suction box is installed on the air suction device, which is used to suction air from inside the air suction box and to drive the air suction box to rotate.

[0004] In the aforementioned photoresist coating apparatus, during the rapid rotation of the wafer after dispensing, while the photoresist spreads uniformly towards the edge, excess photoresist is flung off from the wafer edge and cannot be effectively collected, resulting in photoresist waste. This not only increases material costs but may also cause environmental pollution. Therefore, to address these issues, an integrated circuit photoresist coating apparatus is proposed. Utility Model Content

[0005] In order to overcome the shortcomings of the existing technology and solve the problems mentioned in the background technology, this utility model proposes an integrated circuit photoresist coating device.

[0006] The technical solution adopted by this utility model to solve its technical problem is as follows: An integrated circuit photoresist coating device of this utility model includes a base, a housing fixedly connected to the base, an annular groove formed inside the housing, a protective cover disposed within the annular groove, four connecting seats fixedly connected to the top side of the protective cover, four first pneumatic cylinders mounted on the base, each first pneumatic cylinder having a first pneumatic rod mounted on its actuating end, and the top of the first pneumatic cylinder fixedly connected to the connecting seat, the bottom of the housing cooperating with the base to form multiple outlets, an annular collection box fixedly connected to the bottom side of the port of the base, and an inclined block disposed inside the annular collection box, the annular collection box being connected to... Equipped with a drain pipe, during the coating of photoresist onto the wafer surface, a collection component is installed to facilitate the collection of the ejected photoresist. The first pneumatic cylinder is activated, causing the protective cover to move to its highest position, effectively protecting and blocking the periphery of the wafer. This effectively prevents photoresist from splashing and wasting during wafer rotation. The blocked photoresist falls into the casing and flows through a drain into a ring-shaped collection box, thus effectively collecting the ejected photoresist and preventing waste and environmental pollution. Furthermore, the photoresist collected in the ring-shaped collection box can be processed and reused, reducing material costs.

[0007] Preferably, a one-way valve is installed on the drain pipe, a rotating column is rotatably installed at the bottom of the housing, an air suction box is fixedly connected to the top of the rotating column, an air suction hole is opened on the top side of the air suction box, a motor is installed on the bottom side of the housing, a drive gear is installed at the output end of the motor, a driven gear is fitted on the rotating column, and the drive gear and the driven gear mesh with each other. During the photoresist coating process, after the wafer is adsorbed and fixed, the motor is started, causing the drive gear to rotate, which forces the driven gear to drive the rotating column to rotate, thereby causing the air suction box and the adsorbed and fixed wafer to rotate. Through the rapid rotation of the wafer after dispensing, the photoresist is evenly diffused to the edge, thereby enabling the photoresist to be evenly coated on the wafer surface.

[0008] Preferably, the suction box has a mounting hole on its circumferential surface, a sleeve is fixed in the mounting hole, a piston is installed in the sleeve, a push-pull rod is fixed to the piston, and a rod cap is fixed to the other end of the push-pull rod. A second pneumatic cylinder is installed on both sides of the circumferential surface of the sleeve, and a second pneumatic rod is fitted to the working end of each of the two second pneumatic cylinders. The end of the second pneumatic rod is fixed to the rod cap. When adsorbing and fixing the wafer, the second pneumatic cylinder is activated, causing the second pneumatic rod to push the rod cap to move, which in turn causes the push-pull rod to drive the piston to move, drawing the gas in the suction box into the sleeve, creating a negative pressure in the suction box, and adsorbing and fixing the wafer through the suction hole.

[0009] Preferably, a fixing frame is fixedly connected to the base, and a third pneumatic cylinder is installed on the fixing frame. The working end of the third pneumatic cylinder is equipped with a third pneumatic rod, and a dispensing head is installed at the bottom end of the third pneumatic rod. A photoresist storage tank is installed on the top side of the fixing frame, and a pump body is provided at the bottom end of the photoresist storage tank. The input port of the pump body is connected to a liquid extraction pipe, and the output port of the pump body is connected to a delivery hose. The other end of the delivery hose is connected to the dispensing head. During the photoresist coating process, the third pneumatic cylinder is activated to move the dispensing head down to a suitable height from the wafer. Then, the pump body is activated to allow the photoresist in the storage tank to flow into the dispensing head through the delivery hose. Finally, the photoresist drips onto the wafer through the dispensing head, facilitating subsequent spin coating operations on the wafer.

[0010] Preferably, a motor is installed on the top of the photoresist storage tank, and a stirring shaft is connected to the output end of the motor. Multiple stirring blades are fixed on the stirring shaft, and scrapers are fixedly connected to the top and bottom ends of the stirring shaft. When coating photoresist, the motor operates to make the stirring shaft drive the stirring blades and scrapers to rotate. The rotation of the stirring blades can make the components in the photoresist fully and evenly mixed, avoiding precipitation or stratification. The rotation of the scraper can prevent the photoresist from sticking to the wall, ensuring that the photoresist maintains a high degree of uniformity in the subsequent coating process.

[0011] The advantages of this utility model are:

[0012] 1. In this invention, when coating photoresist onto the wafer surface, a collection component is set up to facilitate the collection of the ejected photoresist. The first pneumatic cylinder is activated to move the protective cover to its highest position, thereby effectively protecting and blocking the periphery of the wafer. This effectively blocks the photoresist ejected from the wafer edge during wafer rotation, preventing photoresist splattering and waste. The blocked photoresist falls into the housing and flows into the annular collection box through the drain, thus effectively collecting the ejected photoresist, avoiding waste and environmental pollution. At the same time, the photoresist collected in the annular collection box can be processed and reused, reducing material costs.

[0013] 2. In this invention, when coating photoresist, the motor drives the stirring shaft to rotate the stirring blades and scraper. The rotation of the stirring blades ensures that the components in the photoresist are fully and evenly mixed, preventing sedimentation or stratification. The rotation of the scraper prevents the photoresist from sticking to the walls, ensuring that the photoresist maintains a high degree of uniformity during subsequent coating processes. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the device;

[0016] Figure 2 This is a three-dimensional cross-sectional view of the device.

[0017] Figure 3 This is a schematic diagram showing the overall cross-sectional view of the device.

[0018] Figure 4 To collect schematic diagrams of the component's three-dimensional structure;

[0019] Figure 5 This is a cross-sectional three-dimensional structural diagram of the intake box;

[0020] Figure 6 A cross-sectional three-dimensional structural diagram of the adhesive storage tank;

[0021] In the diagram: 1. Base; 2. Shell; 3. Protective cover; 4. Connecting seat; 5. First pneumatic cylinder; 6. First pneumatic rod; 7. Leak; 8. Annular collection box; 9. Inclined block; 10. Drain pipe; 11. Rotating column; 12. Suction box; 13. Suction hole; 14. Driven gear; 15. Electric motor; 16. Driving gear; 17. Sleeve; 18. Piston; 19. Push-pull rod; 20. Rod cap; 21. Second pneumatic cylinder; 22. Second pneumatic rod; 23. Fixing frame; 24. Third pneumatic cylinder; 25. Dispensing head; 26. Glue storage tank; 27. Pump body; 28. Delivery hose; 29. ​​Motor; 30. Stirring shaft; 31. Stirring blade; 32. Scraper. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0023] Please see Figure 1-4As shown, an integrated circuit photoresist coating apparatus includes a base 1, a housing 2 fixedly attached to the base 1, an annular groove inside the housing 2, a protective cover 3 disposed within the annular groove, four connecting seats 4 fixedly attached to the top side of the protective cover 3, four first pneumatic cylinders 5 mounted on the base 1, each first pneumatic cylinder 5 having a first pneumatic rod 6 mounted on its actuating end, and the top of the first pneumatic cylinder 5 fixedly attached to the connecting seat 4, the bottom of the housing 2 cooperating with the base 1 to have multiple drain ports 7, an annular collection box 8 fixedly attached to the bottom side of the port of the base 1, and an inclined block 9 disposed within the annular collection box 8, a drain pipe 10 connected to the annular collection box 8, and a one-way valve mounted on the drain pipe 10; during operation, photoresist is coated onto the wafer surface. During photoresist application, to facilitate the collection of ejected photoresist, a collection assembly is installed. The first pneumatic cylinder 5 is activated, causing the first pneumatic rod 6 to move the protective cover 3 upwards until it reaches its highest point. This effectively protects and blocks the periphery of the wafer, preventing photoresist from splashing and wasting during wafer rotation. The blocked photoresist falls into the housing 2 and flows into the annular collection box 8 through the drain 7 at the bottom of the housing 2. This effectively collects the ejected photoresist, avoiding waste and environmental pollution. Furthermore, the photoresist collected in the annular collection box 8 can be processed and reused, reducing material costs.

[0024] Please see Figure 2-3 and Figure 5As shown, a rotating column 11 is rotatably mounted on the bottom of the housing 2, and an air intake box 12 is fixedly connected to the top of the rotating column 11. An air intake hole 13 is opened on the top side of the air intake box 12. An electric motor 15 is mounted on the bottom side of the housing 2, and a drive gear 16 is installed at the output end of the electric motor 15. A driven gear 14 is fitted on the rotating column 11, and the drive gear 16 and the driven gear 14 mesh with each other. An installation hole is opened on the circumferential surface of the air intake box 12, and a sleeve 17 is fixed in the installation hole. A piston 18 is installed in the sleeve 17, and a push-pull rod 19 is fixedly connected to the piston 18. A rod cap 20 is fixedly connected to the other end of the push-pull rod 19. Second pneumatic cylinders 21 are installed on both sides of the circumferential surface of the sleeve 17. A second pneumatic rod 22 is assembled on the working end of each of the two second pneumatic cylinders 21. The end of 2 is fixed to the rod cap 20. During operation, in the photoresist coating process, the wafer to be coated is first placed on the suction box 12. Then, the second pneumatic cylinder 21 is started, which causes the second pneumatic rod 22 to push the rod cap 20 to move. This causes the push-pull rod 19 to drive the piston 18 to move, drawing the gas in the suction box 12 into the sleeve 17, creating a negative pressure in the suction box 12. The wafer is then adsorbed and fixed through the suction hole 13. Then, the motor 15 is started, which causes the drive gear 16 to rotate, forcing the driven gear 14 to drive the rotating column 11 to rotate. This causes the suction box 12 and the adsorbed and fixed wafer to rotate. Through the rapid rotation of the wafer after the photoresist is applied, the photoresist is evenly diffused to the edge, thus enabling the photoresist to be evenly coated on the wafer surface.

[0025] Please see Figure 6 As shown, a fixed frame 23 is fixedly connected to the base 1. A third pneumatic cylinder 24 is installed on the fixed frame 23. The working end of the third pneumatic cylinder 24 is equipped with a third pneumatic rod, and the bottom end of the third pneumatic rod is equipped with a dispensing head 25. A storage tank 26 is installed on the top side of the fixed frame 23. A pump body 27 is provided at the bottom end of the storage tank 26. The input port of the pump body 27 is connected to a liquid suction pipe, and the output port of the pump body 27 is connected to a delivery hose 28. The other end of the delivery hose 28 is connected to the dispensing head 25. During operation, during the photoresist coating process, the third pneumatic cylinder 24 is activated, causing the third pneumatic rod to drive the dispensing head 25 to move down until the dispensing head 25 moves down to a suitable height from the wafer. Then, the pump body 27 is activated, allowing the photoresist in the storage tank 26 to flow into the dispensing head 25 through the delivery hose 28. Finally, the photoresist drips onto the wafer through the dispensing head 25, facilitating subsequent spin coating operations on the wafer.

[0026] A motor 29 is installed on the top of the photoresist storage tank 26. The output end of the motor 29 is connected to a stirring shaft 30. Multiple stirring blades 31 are fixed on the stirring shaft 30. Scrapers 32 are fixedly connected to the top and bottom ends of the stirring shaft 30. During operation, when applying photoresist, the motor 29 drives the stirring shaft 30 to rotate, causing the stirring blades 31 and scrapers 32 to rotate. The rotation of the stirring blades 31 can ensure that the components in the photoresist are fully mixed and uniform, avoiding precipitation or stratification. The rotation of the scrapers 32 can prevent the photoresist from sticking to the wall, ensuring that the photoresist maintains a high degree of uniformity in the subsequent coating process.

[0027] Working Principle: During the rapid rotation of the wafer after photoresist dispensing in the aforementioned photoresist coating device, while the photoresist spreads evenly to the edge, excess photoresist is flung off the wafer edge and cannot be effectively collected, leading to photoresist waste. This not only increases material costs but may also cause environmental pollution. Therefore, to address this problem, an integrated circuit photoresist coating device is proposed. To facilitate the collection of flung photoresist during photoresist coating on the wafer surface, a collection component is installed. The first pneumatic cylinder 5 is activated, causing the first pneumatic rod 6 to... The protective cover 3 is moved upward until it reaches its highest point, thereby effectively protecting and blocking the periphery of the wafer. This effectively blocks the photoresist that is thrown out from the edge of the wafer during rotation, preventing photoresist splattering and waste. The blocked photoresist falls into the housing 2 and flows into the annular collection box 8 through the drain 7 at the bottom of the housing 2, thus effectively collecting the thrown photoresist and avoiding waste and environmental pollution. At the same time, the photoresist collected in the annular collection box 8 can be processed and reused, reducing material costs.

[0028] During the photoresist coating process, the wafer to be coated is first placed on the suction box 12. Then, the second pneumatic cylinder 21 is activated, causing the second pneumatic rod 22 to push the rod cap 20 to move, which in turn causes the push-pull rod 19 to drive the piston 18 to move, drawing the gas in the suction box 12 into the sleeve 17, creating a negative pressure in the suction box 12, and adsorbing and fixing the wafer through the suction hole 13. Next, the third pneumatic cylinder 24 is activated, causing the third pneumatic rod to move the dispensing head 25 downward until the dispensing head 25 is lowered away from the wafer. Once the appropriate height is reached, the pump body 27 is activated, allowing the photoresist in the storage tank 26 to flow into the dispensing head 25 through the delivery hose 28. Finally, the photoresist is dripped onto the wafer through the dispensing head 25. Then, the motor 15 is activated, causing the drive gear 16 to rotate, which in turn forces the driven gear 14 to drive the rotating column 11 to rotate. This causes the suction box 12 and the wafer after adsorption and fixation to rotate accordingly. Through the rapid rotation of the wafer after dispensing, the photoresist is evenly diffused to the edges, thereby uniformly coating the wafer surface with photoresist.

[0029] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. An integrated circuit photoresist coating apparatus characterized by: The utility model provides a kind of automatic glue dispensing machine, including base (1), the shell (2) is fixed on the base (1), annular groove is set in the shell (2), protective cover (3) is arranged in annular groove, the top side of the protective cover (3) is fixed with four connecting seats (4), four first pneumatic cylinders (5) are installed on the base (1), the acting end of each first pneumatic cylinder (5) is equipped with first pneumatic rod (6), and the top end of the first pneumatic cylinder (5) is fixed in connecting seat (4), the bottom of the shell (2) is cooperated with base (1) and is commonly provided with multiple leak (7), the port bottom side of the base (1) is fixed with annular collection box (8), and the annular collection box (8) is provided with inclined block (9), the annular collection box (8) is connected with drain pipe (10), the drain pipe (10) is equipped with check valve, the bottom of the shell (2) is rotatably installed with rotating column (11), the top end of the rotating column (11) is fixed with air suction tank (12), the top side of the air suction tank (12) is provided with air suction hole (13), the bottom side of the shell (2) is installed with motor (15), the output end of the motor (15) is installed with driving gear (16), the rotating column (11) is sleeved with driven gear (14), and the driving gear (16) and driven gear (14) are engaged with each other.

2. The integrated circuit photoresist coating apparatus of claim 1, wherein: The circumferential surface of the air suction tank (12) is provided with a mounting hole, a sleeve (17) is fixed in the mounting hole, the sleeve (17) is provided with a piston (18), the piston (18) is fixed with a push-pull rod (19), the other end of the push-pull rod (19) is fixed with a rod cap (20).

3. An integrated circuit photoresist coating apparatus according to claim 2, wherein: The circumferential surface of the sleeve (17) is provided with a second pneumatic cylinder (21) on both sides, the acting end of the two second pneumatic cylinders (21) is equipped with a second pneumatic rod (22), and the end of the second pneumatic rod (22) is fixed on the rod cap (20).

4. The integrated circuit photoresist coating apparatus of claim 1, wherein: The base (1) is fixed with a fixing frame (23), the fixing frame (23) is installed with a third pneumatic cylinder (24), the acting end of the third pneumatic cylinder (24) is equipped with a third pneumatic rod, and the bottom end of the third pneumatic rod is installed with a glue outlet (25).

5. An integrated circuit photoresist coating apparatus according to claim 4, wherein: The top side of the fixing frame (23) is installed with a glue storage tank (26), the bottom end of the glue storage tank (26) is provided with a pump body (27), the input hole of the pump body (27) is connected with a pumping pipe, the output hole of the pump body (27) is connected with a conveying hose (28), and the other end of the conveying hose (28) is communicated with the glue outlet (25).

6. An integrated circuit photoresist coating apparatus according to claim 5, wherein: The top of the glue storage tank (26) is installed with a motor (29), the output end of the motor (29) is connected with a stirring shaft (30), the stirring shaft (30) is fixed with a plurality of stirring blades (31), and the top end and bottom end of the stirring shaft (30) are cooperatively fixed with a scraping strip (32).

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