Power supply device, gate drive device, and inverter device

Abstract

The utility model provides a power supply device, a grid driving device and an inverter device. The power supply device comprises a transformer built-in IC; a power input line connected to the transformer built-in IC; a decoupling capacitor provided on the power input line; a filter circuit provided upstream of the decoupling capacitor on the power input line; and a Y capacitor provided on the power input line between the filter circuit and the decoupling capacitor.

Description

Technical Field

[0001] This utility model relates to a power supply device, a gate drive device, and an inverter device. Background Technology

[0002] Previously, power supply devices that supply power to gate drive circuits, which provide gate signals to devices such as inverters, had isolated power supply circuits. However, in recent years, to achieve miniaturization of power supply devices, ICs with integrated isolated transformers have begun to be used.

[0003] For example, Patent Document 1 discloses a transformer-embedded IC that can be applied to power supply devices.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent No. 6741370 Utility Model Content

[0007] The problem to be solved by the utility model

[0008] However, in order to miniaturize the transformer in the transformer-in-interface IC, high-frequency switching of several MHz to tens of MHz is performed in the transformer-in-interface IC, and it is desirable to suppress noise including conducted noise and radiated noise.

[0009] Therefore, the purpose of this invention is to suppress noise.

[0010] Solution for solving the problem

[0011] Solution 1 is a power supply device, characterized in that it comprises:

[0012] The transformer has a built-in IC;

[0013] The power input line is connected to the built-in IC of the aforementioned transformer;

[0014] Decoupling capacitors are provided on the aforementioned power input lines;

[0015] A filter circuit located upstream of the decoupling capacitor on the aforementioned power input line; and

[0016] A Y capacitor is provided between the above-mentioned filter circuit and the above-mentioned decoupling capacitor on the above-mentioned power input line.

[0017] Option 2, based on the power supply device provided in Option 1, is characterized in that:

[0018] The aforementioned transformer-embedded IC, the aforementioned Y capacitor, and the aforementioned decoupling capacitor are mounted on the same substrate.

[0019] Option 3, based on the power supply device provided in Option 1, is characterized in that...

[0020] The aforementioned Y capacitor is connected to the grounded metal component via a conductor pattern with a width of 1 mm or more formed on the substrate on which the aforementioned Y capacitor is mounted.

[0021] Option 4, based on the power supply device provided in Option 1, is characterized in that...

[0022] The aforementioned Y capacitor is connected to the grounded metal component via a conductor pattern formed on a substrate on which the aforementioned Y capacitor is mounted and metal terminals connected from the conductor pattern to the aforementioned metal component.

[0023] Option 5, based on the power supply device provided in Option 4, is characterized in that,

[0024] The cross-sectional area of ​​the aforementioned metal terminal is 2mm². 2 above.

[0025] Option 6, based on the power supply device provided in Option 4, is characterized in that,

[0026] The aforementioned metal terminals have a cylindrical or plate-like shape.

[0027] Option 7, based on the power supply device provided in Option 4, is characterized in that,

[0028] The aforementioned metal terminal has a cylindrical shape with a radius of 1 mm or more, or a plate shape with a width of 2 mm or more.

[0029] Option 8, based on the power supply device provided in Option 4, is characterized in that...

[0030] The aforementioned metal components are metal shielding plates that electromagnetically shield the substrate equipped with the aforementioned Y capacitor and other substrates, metal housings that house the substrate equipped with the aforementioned Y capacitor, metal coolers that cool semiconductor elements mounted on the substrate equipped with the aforementioned Y capacitor, or resin shielding plates, housings, or coolers with copper plating or conductive coatings on their surfaces.

[0031] Option 9, based on the power supply device provided in Option 8, is characterized in that...

[0032] The aforementioned metal component is the component in the aforementioned shielding plate, the aforementioned housing, and the aforementioned cooler that has the shortest connection distance to the aforementioned Y capacitor.

[0033] Scheme 10, based on the power supply device provided in Scheme 4, is characterized in that:

[0034] Compared to other grounded components, the aforementioned metal component has a shorter connection distance to the aforementioned Y capacitor.

[0035] Scheme 11, based on the power supply device provided in Scheme 4, is characterized in that,

[0036] The connection line from the aforementioned Y capacitor to the aforementioned metal component is electrically disconnected from the 0V pattern of the aforementioned power input line.

[0037] Solution 12 provides a gate driving device, characterized in that it comprises:

[0038] The aforementioned power supply device; and

[0039] A gate drive circuit that receives power from the aforementioned power supply device and drives the gate of a power module, which is equipped with power semiconductors constituting an inverter circuit, to turn on / off.

[0040] Solution 13 provides an inverter device, characterized in that it comprises:

[0041] The aforementioned power supply equipment;

[0042] An inverter circuit consisting of capacitors and power modules; and

[0043] A gate drive circuit that receives power from the aforementioned power supply device and drives the gate of the aforementioned power module to be turned on / off.

[0044] Utility Model Effect

[0045] According to this invention, noise can be suppressed. Attached Figure Description

[0046] Figure 1 This is a block diagram schematically illustrating the structure of the inverter device according to this embodiment.

[0047] Figure 2 This is a diagram showing a first specific example of a metal component and a metal terminal.

[0048] Figure 3 This is a diagram showing a second specific example of a metal component and a metal terminal.

[0049] Figure 4 This is a diagram showing a third specific example of a metal component and a metal terminal.

[0050] In the picture:

[0051] 100—Inverter device, 101—Capacitor, 102—Power module, 200—Gate drive device, 201—Gate drive circuit, 300—Power supply device, 301—Transformer built-in IC, 302—Decoupling capacitor, 303—Y capacitor, 304—Filter circuit, 310—Substrate, 311—Power input line, 311a—0V pattern, 311b—Power pattern, 312—Conductor pattern, 313, 313a, 313b, 313c—Metal terminals, 320—Other substrates, 350—Metal components, 351—Shielding plate, 352—Housing, 353—Cooler, 400—Motor, 500—Low voltage power supply, 600—High voltage power supply. Detailed Implementation

[0052] Hereinafter, embodiments of the power supply device, gate drive device, and inverter device of this utility model will be described in detail with reference to the accompanying drawings. However, in order to avoid unnecessary length in the following description and to facilitate understanding by those skilled in the art, detailed descriptions that are not necessarily required will sometimes be omitted. For example, detailed descriptions of matters already known may be omitted, as may be omitted, or descriptions of substantially the same structures may be repeated. In addition, elements described in the figures previously described may sometimes be appropriately referenced in the description of the figures later.

[0053] (Structure of inverter device 100)

[0054] Figure 1 This is a block diagram schematically showing the structure of the inverter device 100 of this embodiment.

[0055] The inverter device 100 is connected to a high-voltage power supply 600, such as 400V or 800V, and converts the DC power from the high-voltage power supply 600 into AC power and supplies it to the motor 400 to drive the motor 400.

[0056] The inverter device 100 includes a capacitor 101, a power module 102, and a gate drive device 200.

[0057] Capacitor 101 and power module 102 constitute the inverter circuit. Capacitor 101 is a smoothing capacitor in the inverter circuit. Power module 102 is a component modularized from power semiconductors that constitute the inverter circuit and act as switches.

[0058] The gate driving device 200 includes a gate driving circuit 201 and a power supply device 300. The gate driving circuit 201 drives the gate of the power semiconductor mounted in the power module 102 to be turned on / off. The power supply device 300 supplies power to the gate driving circuit 201.

[0059] The power supply device 300 includes a transformer-integrated circuit (IC) 301, a decoupling capacitor 302, a Y capacitor 303, and a filter circuit 304. The power supply device 300 is connected to a low-voltage power supply 500, for example, from 9V to 16V. Furthermore, the power supply device 300 includes a power input line 311 connected to the transformer-integrated IC 301, which supplies power from the low-voltage power supply 500 to the transformer-integrated IC 301. The power input line 311 includes a 0V pattern 311a and a power pattern 311b.

[0060] In addition, the transformer has multiple sets of built-in IC301, decoupling capacitor 302, and Y capacitor 303, depending on the number of output phases of the power module 102. Figure 1 A group is shown as a representative example.

[0061] The transformer-embedded IC 301, decoupling capacitor 302, Y capacitor 303, and filter circuit 304 are arranged on the power input line 311 in this order. Specifically, decoupling capacitor 302 is located on the power input line 311. The filter circuit 304 is located upstream of the decoupling capacitor 302 on the power input line 311. Furthermore, the Y capacitor 303 is located between the filter circuit 304 and the decoupling capacitor 302 on the power input line 311.

[0062] In addition, the power supply device 300 includes a substrate 310 equipped with a transformer-integrated IC 301, a decoupling capacitor 302, and a Y capacitor 303.

[0063] The transformer-integrated IC 301 supplies power from the power input line 311 to the gate drive circuit 201. The transformer-integrated IC 301 includes an isolated power supply circuit that uses a built-in transformer to insulate the input and output sides. To achieve miniaturization of the built-in transformer, the transformer-integrated IC 301 switches at a high frequency of several MHz to tens of MHz (Mega Hertz), requiring suppression of noise such as radiated and conducted noise.

[0064] The decoupling capacitor 302, the Y capacitor 303, and the filter circuit 304 are provided to suppress noise.

[0065] The decoupling capacitor 302 is a capacitor disposed between the 0V pattern 311a and the power pattern 311b of the power input line 311, and maintains the voltage of the power input line 311 as DC.

[0066] The filter circuit 304 removes noise mixed into the power input line 311.

[0067] Y capacitor 303 is disposed between decoupling capacitor 302 and filter circuit 304. Y capacitor 303 has a capacitor on the 0V pattern 311a side (omitted in the illustration) and a capacitor on the power supply pattern 311b side. Furthermore, Y capacitor 303 connects the 0V pattern 311a and the power supply pattern 311b to a grounded metal component 350 via each capacitor. Y capacitor 303 is connected to the grounded metal component 350 via a conductor pattern 312 formed on substrate 310 and a metal terminal 313 connected from the conductor pattern 312 to the metal component 350. Therefore, compared to the case via a component other than the metal terminal 313, Y capacitor 303 can be grounded with lower impedance.

[0068] The transformer-embedded IC 301, decoupling capacitor 302, Y capacitor 303, and filter circuit 304 are sequentially arranged on the power input line 311, thereby achieving a multiplier effect between the filter circuit 304 and the Y capacitor 303. As a result, the noise caused by the transformer-embedded IC 301 is suppressed.

[0069] In addition, the transformer-embedded IC301, decoupling capacitor 302, and Y capacitor 303 are mounted on the same substrate 310. Therefore, the Y capacitor 303 is close to the transformer-embedded IC301, resulting in high noise suppression effect.

[0070] Furthermore, the noise suppression effect is improved through the low-impedance connection via the conductor pattern 312 and the metal terminal 313. The cross-sectional area of ​​the metal terminal 313 is preferably 2 mm². 2 The above. It has a thickness of 2mm. 2 The large cross-sectional area of ​​the metal terminal 313 results in low impedance and thus high noise suppression.

[0071] Furthermore, the width of the conductor pattern 312 is preferably 1 mm or more. That is, the Y capacitor 303 is preferably connected to the grounded metal component 350 via a conductor pattern 312 with a width of 1 mm or more formed on the substrate 310 on which the Y capacitor 303 is equipped. Compared with the case of a conductor pattern 312 with a width of less than 1 mm, the Y capacitor 303 is grounded with a low impedance, thus achieving a high noise suppression effect.

[0072] Furthermore, the connection line from the Y capacitor 303 to the metal component 350, consisting of, for example, conductor pattern 312 and metal terminal 313, is electrically disconnected from the 0V pattern 311a of the power input line 311. This electrical disconnection significantly improves noise suppression.

[0073] The following describes specific examples of metal component 350 and metal terminal 313.

[0074] Figure 2This is a diagram showing a first specific example of metal component 350 and metal terminal 313.

[0075] Figure 2 A substrate 310 and other substrates 320, including a Y capacitor 303 (not shown), are illustrated. These other substrates 320 may be, for example, control substrates. Furthermore, Figure 2 An example of a metal shielding plate 351 as a metal component 350 is shown. The shielding plate 351 provides electromagnetic shielding for the substrate 310, which houses the Y capacitor 303, and other substrates 320. Examples of shielding plates 351 include plates made of metals such as aluminum, or resin plates coated with a copper-plated layer or a conductive coating.

[0076] In addition, Figure 2 In this example, a cylindrical metal terminal 313a protruding from the substrate 310 toward the shielding plate 351 is shown as an example of a metal terminal 313a. As an example, the cylindrical metal terminal 313a has a radius of 1 mm or more, achieving low impedance through a large cross-sectional area. Furthermore, when it is cylindrical, it is easy to obtain a metal terminal 313a with a large cross-sectional area.

[0077] Metal terminals 313a are linearly connected from conductor patterns 312, which are connected to the plurality of Y capacitors 303 provided on the substrate 310, to the nearest position of the shielding plate 351, achieving a low-impedance connection. The shielding plate 351 is mostly located near the substrate 310, so the connection distance from the Y capacitors 303 to the shielding plate 351 is short, making it easy to obtain a low-impedance connection.

[0078] Figure 3 This is a diagram showing a second specific example of metal component 350 and metal terminal 313.

[0079] Figure 3 The diagram shows a substrate 310 equipped with a Y capacitor 303 (not shown) and a power module 102 holding the substrate 310. Furthermore, Figure 3 An example of a metal housing 352 as a metal component 350 is shown. The housing 352 houses and protects the substrate 310 and the power module 102. Examples of housings 352 include those made of metals such as aluminum, or those made of resin with a copper plating layer or a conductive coating on the surface.

[0080] In addition, Figure 3 The diagram shows an example of a metal terminal 313 with a plate-like shape, mounted from the substrate 310 to the housing 352. As an example, the plate-like metal terminal 313b has a width of 2 mm or more, achieving low impedance through its large cross-sectional area. Furthermore, a large cross-sectional area is easily obtained for the metal terminal 313b when it is plate-like.

[0081] Metal terminal 313b is mounted from substrate 310 to a position close to housing 352, thereby achieving a low-impedance connection by connecting Y capacitor 303 to housing 352 with a short distance. Housing 352 houses substrate 310, so in most cases the connection distance to Y capacitor 303 is shortened, making it easy to obtain a low-impedance connection.

[0082] Figure 4 This is a diagram showing a third specific example of metal component 350 and metal terminal 313.

[0083] Figure 4 The diagram also shows a substrate 310 equipped with a Y capacitor 303 (not shown) and a power module 102 holding the substrate 310. Furthermore, in Figure 4 The diagram shows a metal cooler 353 as an example of a metal component 350. The cooler 353 is, for example, a heat sink for cooling the power module 102 mounted outside the substrate 310. Examples of coolers 353 include those made of metals such as aluminum, or those made of resin with a copper plating layer or a conductive coating on the surface. Although not shown in the diagram, the cooler 353 and the housing 352 are connected by, for example, metal screws.

[0084] In addition, Figure 4 In the example of metal terminal 313, a metal terminal 313c protruding from substrate 310 toward cooler 353 is shown. Figure 4 The cross-sectional area of ​​the metal terminal 313c shown is also 2mm². 2 The above achieves low impedance.

[0085] Metal terminal 313c is linearly connected from substrate 310 to cooler 353, thereby achieving a low-impedance connection by connecting Y capacitor 303 to cooler 353 over a short distance. Since the cooler 353 of power module 102 is usually located near substrate 310 where Y capacitor 303 is mounted, the short connection distance from Y capacitor 303 to cooler 353 facilitates a low-impedance connection.

[0086] Furthermore, the combination of specific examples of metal component 350 and specific examples of metal terminal 313 is not limited to the combinations described above, and can be any combination. Moreover, regarding multiple components of the shielding plate 351, housing 352, and cooler 353, where connection via metal terminal 313 is possible, it is preferable to use the component of the shielding plate 351, housing 352, and cooler 353 with the shortest connection distance to the Y capacitor 303 as the metal component 350. This results in a low-impedance connection from the Y capacitor 303 to the metal component 350, leading to high noise suppression efficiency.

[0087] From another perspective, when multiple candidate metal components 350 exist for grounding, it is preferable to use the component with the shorter connection distance to the Y capacitor 303 compared to other grounded components as the metal component 350. This results in a low-impedance connection from the Y capacitor 303 to the metal component 350, leading to high noise suppression efficiency.

[0088] Furthermore, as an example of the use of the power supply device, gate drive device, and inverter device of this utility model, the driving of a motor is listed here. However, the use of the power supply device, gate drive device, and inverter device of this utility model is not limited to the above and can be widely used in lighting, solar power generation, etc.

[0089] The above-described embodiments are exemplary in all respects and should not be considered limiting. The scope of this utility model is not indicated by the above-described embodiments, but by the scope to be protected, and is intended to include equivalent meanings and all modifications within that scope.

[0090] In addition, this technology can adopt the following structure. (1)

[0092] A power supply device comprising:

[0093] The transformer has a built-in IC;

[0094] The power input line is connected to the built-in IC of the aforementioned transformer;

[0095] Decoupling capacitors are provided on the aforementioned power input lines;

[0096] A filter circuit located upstream of the decoupling capacitor on the aforementioned power input line; and

[0097] A Y capacitor is provided between the above-mentioned filter circuit and the above-mentioned decoupling capacitor on the above-mentioned power input line. (2)

[0099] According to the power supply device described in (1), wherein,

[0100] The aforementioned transformer-embedded IC, the aforementioned Y capacitor, and the aforementioned decoupling capacitor are mounted on the same substrate. (3)

[0102] According to the power supply device described in (1) or (2), wherein,

[0103] The aforementioned Y capacitor is connected to the grounded metal component via a conductor pattern with a width of 1 mm or more formed on the substrate on which the aforementioned Y capacitor is mounted. (4)

[0105] According to any one of (1) to (3) the power supply device described therein,

[0106] The aforementioned Y capacitor is connected to the grounded metal component via a conductor pattern formed on a substrate on which the aforementioned Y capacitor is mounted and metal terminals connected from the conductor pattern to the aforementioned metal component. (5)

[0108] According to the power supply device described in (4), wherein,

[0109] The cross-sectional area of ​​the aforementioned metal terminal is 2mm². 2 above. (6)

[0111] According to the power supply device described in (4) or (5), wherein,

[0112] The aforementioned metal terminals have a cylindrical or plate-like shape. (7)

[0114] According to any one of (4) to (6) the power supply device described therein,

[0115] The aforementioned metal terminal has a cylindrical shape with a radius of 1 mm or more, or a plate shape with a width of 2 mm or more. (8)

[0117] According to any one of (4) to (7) the power supply device described therein,

[0118] The aforementioned metal components are metal shielding plates that electromagnetically shield the substrate equipped with the aforementioned Y capacitor and other substrates, metal housings that house the substrate equipped with the aforementioned Y capacitor, metal coolers that cool semiconductor elements mounted on the substrate equipped with the aforementioned Y capacitor, or resin shielding plates, housings, or coolers with copper plating or conductive coatings on their surfaces. (9)

[0120] According to the power supply device described in (8), among which,

[0121] The aforementioned metal component is the component in the aforementioned shielding plate, the aforementioned housing, and the aforementioned cooler that has the shortest connection distance to the aforementioned Y capacitor. (10)

[0123] According to any one of (4) to (9) the power supply device described therein,

[0124] Compared to other grounded components, the aforementioned metal component has a shorter connection distance to the aforementioned Y capacitor. (11)

[0126] According to any one of (4) to (10) the power supply device described therein,

[0127] The connection line from the aforementioned Y capacitor to the aforementioned metal component is electrically disconnected from the 0V pattern of the aforementioned power input line. (12)

[0129] A gate driving device comprising:

[0130] The power supply device described in any one of (1) to (11); and

[0131] A gate drive circuit that receives power from the aforementioned power supply device and drives the gate of a power module, which is equipped with power semiconductors constituting an inverter circuit, to turn on / off. (13)

[0133] An inverter device comprising:

[0134] The power supply device described in any one of (1) to (11);

[0135] An inverter circuit consisting of capacitors and power modules; and

[0136] A gate drive circuit that receives power from the aforementioned power supply device and drives the gate of the aforementioned power module to be turned on / off.

Claims

1. A power supply device characterized by comprising: Possessing: a transformer built-in IC; a power supply input line connected to the transformer built-in IC; a decoupling capacitor provided on the power supply input line; a filter circuit provided on the power supply input line on an upstream side of the decoupling capacitor; and a Y capacitor provided on the power supply input line between the filter circuit and the decoupling capacitor.

2. The power supply device according to claim 1, wherein the transformer built-in IC, the Y capacitor, and the decoupling capacitor are provided on the same substrate.

3. The power supply device according to claim 1, wherein the Y capacitor is connected to a grounded metal member via a conductor pattern formed on a substrate on which the Y capacitor is provided, the conductor pattern having a width of 1 mm or more.

4. The power supply device according to claim 1, wherein the Y capacitor is connected to a grounded metal member via a conductor pattern formed on a substrate on which the Y capacitor is provided and a metal terminal connected from the conductor pattern to the metal member.

5. The power supply device according to claim 4, wherein The cross-sectional area of the above metal terminal is 2 mm 2 The above.

6. The power supply device according to claim 4, wherein the metal terminal has a cylindrical shape or a plate shape.

7. The power supply device according to claim 4, wherein the metal terminal has a cylindrical shape having a radius of 1 mm or more or a plate shape having a width of 2 mm or more.

8. The power supply device according to claim 4, wherein the metal member is a shield plate made of metal that electromagnetically shields the substrate on which the Y capacitor is provided and another substrate, a case made of metal that houses the substrate on which the Y capacitor is provided, or a cooler made of metal that cools a semiconductor element provided outside the substrate on which the Y capacitor is provided, or a shield plate, a case, or a cooler made of resin on the surface of which a copper-plated layer or a paint having electrical conductivity is applied.

9. The power supply device according to claim 8, wherein the metal member is a member that is short in distance from the Y capacitor among the shield plate, the case, and the cooler.

10. The power supply device according to claim 4, wherein the metal member is short in distance from the Y capacitor compared to other members that are grounded.

11. The power supply device according to claim 4, wherein a connection line from the Y capacitor to the metal member is electrically separated from a 0 V pattern of the power supply input line.

12. A gate drive device, characterized by comprising: Possessing: the power supply device according to any one of claims 1 to 11; and a gate drive circuit that is supplied with electric power from the power supply device and performs on / off driving of a gate of a power module on which a power semiconductor that constitutes an inverter circuit is mounted.

13. An inverter device characterized by comprising: Possessing: the power supply device according to any one of claims 1 to 11; an inverter circuit constituted by a capacitor and a power module; and a gate drive circuit that is supplied with electric power from the power supply device and performs on / off driving of a gate of the power module.

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