Key-type mobile phone and compatible mainboard assembly
By designing a compatible motherboard component, the problem of incompatibility between motherboards for candybar and flip phones was solved, achieving compatibility between motherboards for candybar and flip phones, reducing development costs and shortening the R&D cycle.
Patent Information
- Application Number
- CN202520309493.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2035-02-25
AI Technical Summary
In the existing technology, the motherboards of candybar phones and flip phones are not interchangeable, resulting in high motherboard development costs and long R&D cycles, and a lack of motherboard structures that are compatible with both candybar phones and flip phones.
Design a compatible motherboard assembly, including a motherboard and a sub-board. The motherboard has keyboard contacts and is connected to the sub-board via a flexible circuit cable. The sub-board and the motherboard have an adjustable angle to adapt to different usage conditions of flip phones and candybar phones.
It achieves the commonality of motherboards for both candybar and flip phones, reducing development costs and shortening the R&D cycle.
Smart Images
Figure CN223772066U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to communication equipment technical field, concretely relates to a key type cell phone and compatible mainboard assembly. BACKGROUND
[0002] In recent years, although touch screen cell phones have become mainstream, key cell phones still occupy a place in the individual market due to their unique input experience, the needs of specific user groups and emotional factors.
[0003] Key cell phones include straight-line cell phones and flip cell phones, and the mainboard is an important component of the key cell phone. The straight-line cell phone adopts a single mainboard structure (CD surface mainboard), and the typical value of the size specification is 120x60x1.2mm. The flip cell phone adopts a split double mainboard structure (AB surface mainboard+CD surface mainboard), and the main board and the auxiliary board are connected through an FPC flexible flat cable.
[0004] However, the mainboards of the straight-line cell phone and the flip cell phone cannot be used universally in the prior art, and there is a lack of a mainboard structure that can be compatible with the straight-line cell phone and the flip cell phone. The development repetition rate of the mainboards of the straight-line cell phone and the flip cell phone is relatively high, and the mainboard verification period needs to be repeated, resulting in a relatively high cost of separate development of the mainboards and a relatively long development period. SUMMARY
[0005] Therefore, the utility model aims to provide a key type cell phone and a compatible mainboard assembly to at least partially solve the above technical problems.
[0006] In order to achieve the above-mentioned purpose, the utility model embodiment provides the following technical scheme:
[0007] The utility model provides a compatible mainboard assembly for a key type cell phone, wherein the key type cell phone comprises a screen and an outer shell, and a keyboard module is arranged on the outer shell, and the compatible mainboard assembly comprises:
[0008] a mainboard, which is installed in the outer shell, and a plurality of keyboard contacts are formed on the mainboard, and the keyboard contacts are attached to the keyboard module;
[0009] an auxiliary board, which is installed in the outer shell or the screen, and the auxiliary board and the mainboard are electrically connected through a flexible circuit flat cable, and the angle between the auxiliary board and the mainboard is adjustable.
[0010] Thus, through the design of the main board and the auxiliary board, when used in a flip phone, the main board and the auxiliary board can be folded within a certain angle range, thereby adapting to the standby state and the use state of the flip phone; when used in a straight phone, the main board and the auxiliary board are arranged unfolded, thereby adapting to the use of the straight phone. The main board of the straight phone and the flip phone can be universal, thereby solving the problems of higher development cost and longer development cycle of the main board of the straight phone and the flip phone through the compatible main board structure of the straight phone and the flip phone.
[0011] In some embodiments, the main board is integrated with a display driving IC, a touch chip and a light sensor.
[0012] In some embodiments, the auxiliary board is integrated with a baseband chip, a power management module and a keyboard interface.
[0013] The utility model provides a kind of key type mobile phone, the key type mobile phone is flip phone, the flip phone includes the compatible main board assembly as described above, the main board and the auxiliary board can be rotatably connected, and there is preset angle opening and closing angle, the flexible circuit flat cable has preset bending allowance.
[0014] In some embodiments, the preset angle is 120°, and the preset bending allowance is 8mm.
[0015] In some embodiments, the size of the keyboard module is 55x35mm, the keyboard module is provided with a programmable pad array, and the keyboard module has a dynamic impedance matching circuit and a case matrix remapping module.
[0016] The utility model provides a kind of key type mobile phone, the key type mobile phone is straight phone, the straight phone includes the compatible main board assembly as described above, the main board and the auxiliary board are fixedly connected in parallel, and the flexible circuit flat cable forms S type stress buffer structure.
[0017] The size of the keyboard module is 55x35mm, wherein a 15mm area at the top of the keyboard module is embedded below the screen; the keyboard module is provided with a programmable pad array, and the keyboard module has a dynamic impedance matching circuit and a case matrix remapping module. BRIEF DESCRIPTION OF DRAWINGS
[0018] To more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings needed in the description of embodiments or prior art will be briefly introduced below. Obviously, the drawings in the following description are only exemplary, and for those skilled in the art, other implementation drawings can be obtained without creative labor on the basis of the provided drawings.
[0019] The structure, proportion, size and the like shown in the specification are only used to cooperate with the content disclosed in the specification, to be understood and read by those skilled in the art, and do not define the limiting conditions for the implementation of the utility model, so they do not have technical substantive significance. Any modification of structure, change of proportion relationship or adjustment of size, without affecting the functions and purposes that the utility model can produce, should still fall within the scope of the technical content disclosed by the utility model.
[0020] Figure 1 One of the principle schematic diagrams of the key type mobile phone provided by the utility model;
[0021] Figure 2 The second principle schematic diagram of the key type mobile phone provided by the utility model;
[0022] Figure 3 One of the comparison diagrams of two models of the key type mobile phone provided by the utility model;
[0023] Figure 4 The second comparison diagram of two models of the key type mobile phone provided by the utility model.
[0024] Explanation of reference signs:
[0025] 10-screen, 20-outer shell, 30-hinge;
[0026] 1-mainboard, 11-keyboard contact, 12-screw hole;
[0027] 2-keyboard module; 3-screw; 4-subboard; 5-flexible circuit flat cable. DETAILED DESCRIPTION
[0028] The implementation of the utility model is illustrated by specific embodiments below, and those skilled in the art can easily understand other advantages and functions of the utility model from the content disclosed in the specification. Obviously, the described embodiments are part of the embodiments of the utility model, not all embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.
[0029] In a specific embodiment, the compatible mainboard assembly provided by the utility model is used for a key type mobile phone, the key type mobile phone comprises a screen 10 and an outer shell 20, a keyboard module 2 is arranged on the outer shell 20, the compatible mainboard assembly comprises a mainboard 1 and a subboard 4; wherein the mainboard 1 is installed in the outer shell 20, a plurality of keyboard contacts 11 are formed in the mainboard 1, the keyboard contacts 11 are attached to the keyboard module 2; the subboard 4 is installed in the outer shell 20 or the screen 10, the subboard 4 and the mainboard 1 are electrically connected through a flexible circuit flat cable 5, and the angle between the subboard 4 and the mainboard 1 is adjustable. Wherein, the mainboard 1 is integrated with a display driving IC, a touch chip and a light sensor, the subboard 4 is integrated with a baseband chip, a power management module and a keyboard interface.
[0030] When the above-mentioned compatible mainboard assembly is applied to a flip phone, as shown in Figure 1 , the flip phone comprises the compatible mainboard assembly as described above, the mainboard 1 and the subboard 4 are connected through a hinge to realize rotatable connection, and have a preset angle of opening and closing angle, and the flexible circuit flat cable 5 has a preset bending allowance. Specifically, the preset angle is 120°, and the preset bending allowance is 8mm.
[0031] On the basis of the compatible mainboard assembly, the flip phone can also have a compatible keyboard module. In some embodiments, please continue to refer to Figure 1 , the size of the keyboard module 2 is 55*35mm, the keyboard module 2 is provided with a programmable pad array, and the keyboard module 2 has a dynamic impedance matching circuit and a case matrix remapping module. A screw hole 12 is formed in the mainboard 1, and the keyboard module 2 is detachably connected with the mainboard 1 through a screw 3 passing through the screw hole 12.
[0032] When the above-mentioned compatible mainboard assembly is applied to a straight phone, as shown in Figure 2 , the straight phone comprises the compatible mainboard assembly as described above, the mainboard 1 and the subboard 4 are fixedly connected in parallel, and the flexible circuit flat cable 5 forms an S-shaped stress buffer structure.
[0033] On the basis of the compatible mainboard assembly, the straight phone can also have a compatible keyboard module. In some embodiments, please continue to refer to Figure 2 , the size of the keyboard module 2 is 55*35mm, wherein a 15mm area at the top of the keyboard module 2 is embedded below the screen; the keyboard module 2 is provided with a programmable pad array, and the keyboard module 2 has a dynamic impedance matching circuit and a case matrix remapping module. A screw hole 12 is formed in the mainboard 1, and the keyboard module 2 is detachably connected with the mainboard 1 through a screw 3 passing through the screw hole 12.
[0034] Specifically, the solution provided by this invention designs a motherboard that can be used in both flip phones and candybar phones, enabling both flip and candybar models to share a single motherboard. The motherboard modular architecture adopts a dual-motherboard layered structure. The main board (UI board) integrates a display driver IC, touch chip, and light sensor, while the secondary board (IO board) integrates a baseband chip, power management module, and keyboard interface. The two boards are connected by a 0.3mm pitch FPC cable (impedance control ±10%). From a form factor adaptation perspective, in flip mode, the UI board and IO board open at a 120° angle, with the cable having an 8mm bending allowance. In candybar mode, the UI board and IO board are fixed parallel to each other, and the cable forms an "S"-shaped stress buffer structure.
[0035] Thus, through the design of the main board 1 and the sub-board 4, when used in a flip phone, the main board 1 and the sub-board 4 can fold within a certain angle range, thus adapting to the standby and usage states of the flip phone; when used in a candybar phone, the main board 1 and the sub-board 4 unfold, thus adapting to the use of the candybar phone. This makes the main board of candybar phones and flip phones interchangeable, thereby solving the problem of high development costs and long development cycles for the main board of candybar phones and flip phones by being compatible with the main board structure of candybar phones and flip phones.
[0036] In practical applications, the limitations of keyboard integration for candybar and flip phones include directly integrating the keyboard matrix circuit (K board) onto the CD side motherboard; the keyboard area size for the T9 candybar model is 40×30mm (typical value), while for the flip model it is 55×35mm, with a key pitch tolerance requirement of ±0.15mm, which necessitates redesigning the PCB traces for different models.
[0037] In view of this, based on a compatible motherboard, this utility model also provides a keyboard reuse solution. Its physical layer design includes developing a standard keyboard module (55×35mm) and setting a programmable pad array (pitch adjustable within ±1.5mm). For candybar phones, a shielded installation is used, with the top 15mm area embedded below the screen. From a circuit layer optimization perspective, a dynamic impedance matching circuit is used to automatically adjust the scanning frequency according to the actual usage area; a key matrix remapping module is used to store different key configurations via EEPROM.
[0038] To make it easier to understand, we'll use two sample phones—a candybar phone and a flip phone—as examples, combined with... Figure 3 and Figure 4 The comparison diagram shown briefly describes the structure and advantages of compatible motherboard components and compatible keyboard modules.
[0039] The T9 parts of both models are the same. The flip phone has three rows of buttons at the top, but only the bottom two rows are used. The top row is hidden under the screen of the candybar phone. This ensures that both phones use the same keyboard board and that the keyboard size of the candybar phone is smaller than that of the flip phone.
[0040] From the mechanical adaptation structure, the mainboard positioning system adopts three-step positioning pin structure (Φ1.2mm+Φ1.5mm+Φ2.0mm), and sets a thermal compensation gap (0.05mm / ℃ expansion coefficient); in the interface protection design, the keyboard FPC connector is configured with a silica gel sealing ring (IP54 protection level), and a nylon reinforcing rib structure is arranged at the wire winding shaft. In the dual-mode adaptive mainboard system, the UI / IO double board structure connected rotatably is contained, and the mode detection sensor (Hall element+accelerometer fusion judgment) is provided; in the dynamic keyboard multiplexing technology, the programmable pad matrix (5×8 array layout) and the key mapping algorithm based on the mode recognition are set, and the multilayer composite wire (PI substrate+ copper-nickel alloy layer) is arranged.
[0041] Through experimental verification, the two prototypes save cost and shorten the period through the compatible mainboard structure and the compatible keyboard module, and 2 million yuan of cost can be saved for 100,000 units per year, which can be seen from table 1 and table 2.
[0042] (Table 1: technical parameter comparison)
[0043]
[0044] (Table 2: economic benefit analysis)
[0045]
[0046] The above specific embodiments further illustrate the purpose, technical scheme and beneficial effects of the utility model, and it should be understood that the above is only a specific embodiment of the utility model, and is not used to limit the protection scope of the utility model, and any modification, equivalent replacement, improvement, etc. made on the basis of the technical scheme of the utility model should be included in the protection scope of the utility model.
Claims
1. A compatible main board assembly for a key phone, the key phone comprising a screen and an outer housing, a keyboard module being arranged on the outer housing, characterized in that, The compatible mainboard assembly comprises: a mainboard installed in the outer casing, a plurality of keyboard contacts being formed on the mainboard, the keyboard contacts being matched with the keyboard module; a subboard installed in the outer casing or the screen, the subboard being electrically connected with the mainboard through a flexible circuit flat cable, and the angle between the subboard and the mainboard being adjustable.
2. The compatible motherboard assembly of claim 1, wherein, The mainboard is integrated with a display driving IC, a touch chip and a light sensor.
3. The compatible motherboard assembly of claim 1, wherein, The subboard is integrated with a baseband chip, a power management module and a keyboard interface.
4. A push button phone, characterized in that The key phone is a flip phone, the flip phone comprising the compatible mainboard assembly according to any one of claims 1-3, the mainboard and the subboard being rotatably connected and having a preset opening and closing angle, and the flexible circuit flat cable having a preset bending allowance.
5. The push-to-talk handset of claim 4, wherein, The preset angle is 120°, and the preset bending allowance is 8mm.
6. The handset of claim 5, wherein, The keyboard module has a size of 55x35mm, is provided with a programmable pad array, and has a dynamic impedance matching circuit and a case matrix remapping module.
7. A push button phone, characterized in that The key phone is a straight phone, the straight phone comprising the compatible mainboard assembly according to any one of claims 1-3, the mainboard and the subboard being fixedly connected in parallel, and the flexible circuit flat cable forming an S-shaped stress buffering structure.
8. The key phone of claim 7, wherein, The keyboard module has a size of 55x35mm, wherein a 15mm area at the top of the keyboard module is embedded below the screen; the keyboard module is provided with a programmable pad array, and has a dynamic impedance matching circuit and a case matrix remapping module.