High-conductivity plane step circuit board

Abstract

The utility model discloses a plane step circuit board with high conductivity, which comprises a plane substrate, a plurality of step plates with planes of different heights are fixedly mounted at the top of the plane substrate, and radiating fins are mounted at the bottom of the plane substrate. When the electronic component works to generate heat, the heat is transmitted to the step plate in a heat conduction mode, is transmitted to the plane substrate through the step plate, is efficiently transmitted to the cooling fins through the heat conduction layer made of the graphene material and is dissipated to the outside, so that the overall efficient heat dissipation of the circuit board is realized, the heat generated when the circuit board works is quickly dissipated, and the service life of the circuit board is prolonged. The working temperature of the circuit board is ensured to be in a reasonable range, and the high-conductivity stability and reliability are maintained.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board technology, specifically relating to a planar stepped circuit board with high conductivity. Background Technology

[0002] High-conductivity planar stepped circuit boards have wide applications in high-end electronic devices and a promising market prospect. For example, high conductivity can reduce signal loss and reflection, lower signal noise and crosstalk, and ensure fast and accurate transmission of electronic signals on the board. The stepped design of the product allows for three-dimensional assembly of electronic components, improving the space utilization and connection density of electronic devices, and helping to improve the stability and anti-interference capability of IMUs.

[0003] Traditional high-conductivity planar stepped circuit boards rely on a relatively simple heat dissipation method, primarily using natural convection and radiation, resulting in low heat dissipation efficiency. When electronic devices contain heat-generating components of varying heights, the lack of an effective heat dissipation structure on the circuit board makes it difficult for heat to dissipate quickly, easily leading to localized overheating. This affects the performance and lifespan of electronic components, thereby reducing the stability and reliability of the entire electronic device. Utility Model Content

[0004] The purpose of this invention is to provide a high-conductivity planar stepped circuit board to solve the technical defects of existing high-conductivity planar stepped circuit boards, which have a single heat dissipation method and low efficiency of natural convection and radiation heat dissipation.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a high conductivity planar stepped circuit board, comprising a planar substrate, wherein a plurality of stepped plates of different heights are fixedly mounted on the top of the planar substrate, and a heat sink is mounted on the bottom of the planar substrate.

[0006] As a further embodiment of this utility model, the heat sink is made of aluminum, the heat sink is fixedly installed on the bottom of the planar substrate, and a thermally conductive layer is provided between the heat sink and the planar substrate, the thermally conductive layer being a graphene coating.

[0007] As a further embodiment of this utility model, each of the stepped plates is provided with heat dissipation holes, which penetrate the planar substrate.

[0008] As a further preferred embodiment of this utility model, a pad is fixedly installed on the bottom of the planar substrate.

[0009] As a further preferred embodiment of this utility model, the inner wall of the heat dissipation hole is provided with a copper plating layer.

[0010] As a preferred embodiment of this utility model, both the planar substrate and the stepped plate are made of No-flow PP material.

[0011] As a preferred embodiment of this utility model, reinforcing ribs are fixedly connected between the edges of the plurality of stepped plates and the planar substrate.

[0012] Compared with existing technologies, the high conductivity planar stepped circuit board provided by this utility model has the following advantages:

[0013] 1. When electronic components generate heat during operation, the heat is first transferred to the stepped plate through thermal conduction, then from the stepped plate to the planar substrate, and finally efficiently transferred to the heat sink through the thermally conductive layer of graphene material and dissipated to the outside, achieving efficient overall heat dissipation of the circuit board. During this process, the heat dissipation holes on the stepped plate play an auxiliary role in heat dissipation. The copper plating layer on the inner wall of the heat dissipation holes can quickly guide heat to the heat dissipation holes, realizing convection heat dissipation from top to bottom of the circuit board, further improving the heat dissipation effect. It can quickly dissipate the heat generated when the circuit board is working, ensuring that the operating temperature of the circuit board is within a reasonable range, maintaining its high conductivity, stability, and reliability.

[0014] 2. The pad can increase the overall installation height of the circuit board, allowing the heat sink to be suspended in the air, thus better exchanging heat with the air and further improving heat dissipation efficiency.

[0015] 3. By using No-flow PP material for both the planar substrate and the stepped plate, the circuit board can be guaranteed to have certain mechanical strength and electrical insulation performance. At the same time, the amount of adhesive flow can be effectively controlled during the lamination of the stepped position, ensuring the integrity of the stepped area. This helps to realize complex planar stepped structures and can meet the high performance and high conductivity requirements of the circuit board, enabling the circuit board to work stably in different electrical and physical environments. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only examples of embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model. Figure 1 ;

[0018] Figure 2 This is a schematic diagram of the structure of an embodiment of the present utility model. Figure 2 ;

[0019] Figure 3 This is a schematic diagram of the installation structure of the heat sink in an embodiment of this utility model.

[0020] Figure label:

[0021] 1. Planar substrate; 2. Stepped plate; 3. Positioning groove; 4. Heat dissipation hole; 5. Heat sink; 6. Thermal conductive layer; 7. Pad; 8. Reinforcing rib. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only for explaining the present invention and are not intended to limit the present invention.

[0023] In the description of the embodiments of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.

[0024] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an integral connection, or a detachable connection; they can refer to the internal connection of two components; they can refer to a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present invention should be understood according to the specific circumstances.

[0025] See appendix Figures 1-3 As shown in the figure, an embodiment of the present invention provides a high conductivity planar stepped circuit board, including a planar substrate 1, a plurality of stepped plates 2 of different heights fixedly installed on the top of the planar substrate 1, and a heat sink 5 installed on the bottom of the planar substrate 1.

[0026] The planar substrate 1 serves as the basic load-bearing structure of the circuit board, providing stable planar support for the entire circuit board. By installing multiple stepped plates 2 of different heights on the top of the planar substrate 1, it is used to accommodate electronic components of different heights, thereby achieving refined assembly and miniaturized layout of the circuit board and meeting the diverse spatial layout requirements of electronic components. In addition, to improve the heat dissipation capacity of the circuit board, a heat sink 5 is installed at the bottom of the planar substrate 1. The heat sink 5 can quickly dissipate the heat generated by the circuit board during operation, ensuring that the operating temperature of the circuit board is within a reasonable range and maintaining its high conductivity, stability, and reliability.

[0027] The heat sink 5 is made of aluminum and is fixedly installed on the bottom of the planar substrate 1. A thermally conductive layer 6 is provided between the heat sink 5 and the planar substrate 1. The thermally conductive layer 6 is a graphene coating.

[0028] By using an aluminum heat sink 5, the heat of the circuit board can be effectively dissipated to the outside, increasing the heat dissipation effect of the circuit board. In addition, a graphene thermally conductive layer 6 is set between the heat sink 5 and the planar substrate 1, which can effectively reduce the thermal resistance between the planar substrate 1 and the heat sink 5, so that heat can be efficiently conducted from the planar substrate 1 to the heat sink 5, thereby improving the overall heat dissipation efficiency of the circuit board.

[0029] Each stepped plate 2 is provided with a heat dissipation hole 4, which penetrates the planar substrate 1. The heat dissipation hole 4 provides an additional heat dissipation channel for the heat generated by the electronic components on the stepped plate 2, allowing the heat to be quickly conducted from the stepped plate 2 to the planar substrate 1. The heat is then dissipated by the planar substrate 1 and its bottom heat dissipation structure, achieving multi-dimensional heat dissipation, avoiding local overheating, ensuring temperature uniformity in all areas of the circuit board, and improving the heat dissipation performance and reliability of the circuit board.

[0030] A pad 7 is fixedly mounted on the bottom of the planar substrate 1. The pad 7 can increase the overall mounting height of the circuit board, so that the heat sink 5 can be suspended in the air, which can better exchange heat with the air and further improve the heat dissipation efficiency.

[0031] The inner wall of the heat dissipation hole 4 is provided with a copper plating layer. In order to enhance the heat dissipation performance of the heat dissipation hole 4, the copper plating layer is provided on the inner wall of the heat dissipation hole 4, which can enable heat to be conducted more efficiently when passing through the heat dissipation hole 4, while preventing oxidation of the inner wall of the heat dissipation hole 4, extending the service life of the heat dissipation hole 4, and providing a guarantee for the long-term stable heat dissipation of the circuit board.

[0032] Both the planar substrate 1 and the stepped plate 2 are made of No-flow PP material. While ensuring that the circuit board has certain mechanical strength and electrical insulation performance, the amount of adhesive flow can be effectively controlled when pressing at the stepped position to ensure the integrity of the stepped area. This helps to realize complex planar stepped structures and can meet the high performance and high conductivity requirements of the circuit board, enabling the circuit board to work stably in different electrical and physical environments.

[0033] Multiple stepped plates 2 are fixedly connected to the planar substrate 1 by reinforcing ribs 8. The reinforcing ribs 8 can enhance the connection strength between the stepped plates 2 and the planar substrate 1, improve the overall mechanical stability of the circuit board, and prevent structural loosening or deformation between the stepped plates 2 and the planar substrate 1 when subjected to external impact, vibration or other mechanical action, so as to ensure the solid structure of the circuit board, protect the safety of electronic components and the normal use of the circuit board.

[0034] When this invention is used, the heat generated by the electronic components is first transferred to the stepped plate 2 through thermal conduction, then transferred from the stepped plate 2 to the planar substrate 1, and finally efficiently transferred to the heat sink 5 through the graphene thermal conductive layer 6 and dissipated to the outside, achieving efficient heat dissipation of the circuit board as a whole. During this process, the heat dissipation holes 4 on the stepped plate 2 play an auxiliary role in heat dissipation. The copper plating layer on the inner wall of the heat dissipation holes 4 can quickly guide heat to the heat dissipation holes 4, realizing convection heat dissipation on the circuit board and further improving the heat dissipation effect.

[0035] The foregoing has shown and described the basic principles of the present invention. The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. The above embodiments and descriptions in the specification are only illustrative of the principles of the present invention. Any modifications, equivalent substitutions, and improvements made within the scope of the present invention without departing from the scope of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-conductivity planar stepped circuit board, characterized by: The utility model relates to a heat dissipation device, including plane base plate (1), a plurality of different height plane step board (2) are fixedly installed on the top of plane base plate (1), the bottom of plane base plate (1) is installed with fin (5).

2. The high-conductivity planar stepped circuit board of claim 1, wherein: The fin (5) is made of aluminum, the fin (5) is fixedly installed on the bottom of the plane base plate (1), a heat-conducting layer (6) is arranged between the fin (5) and the plane base plate (1), and the heat-conducting layer (6) is a graphene coating.

3. The high-conductivity planar stepped circuit board of claim 2, wherein: Each of the step boards (2) is provided with a heat dissipation hole (4) penetrating through the plane base plate (1).

4. The high-conductivity planar stepped circuit board of claim 3, wherein: The bottom of the plane base plate (1) is fixedly installed with a backing plate (7).

5. The high-conductivity planar stepped circuit board of claim 3, wherein: The inner wall of the heat dissipation hole (4) is provided with a copper plating layer.

6. The high-conductivity planar stepped circuit board of claim 1, wherein: The plane base plate (1) and the step board (2) are both made of No-flow PP material.

7. The high-conductivity planar stepped circuit board of claim 1, wherein: A reinforcing rib (8) is fixedly connected between the edges of the plurality of step boards (2) and the plane base plate (1).

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