High-reliability CSP light source packaging structure

Abstract

The utility model belongs to the technical field of LED packaging structures, and particularly relates to a high-reliability CSP light source packaging structure which comprises an LED chip, fluorescent glue and first transparent glue. The fluorescent glue surrounds the upper side and the periphery of the LED chip, and the first transparent glue surrounds the LED chip and the fluorescent glue and exposes an electrode of the LED chip. According to the CSP light source packaging structure disclosed by the utility model, the LED chip and the fluorescent glue are surrounded by the first transparent glue, so that harmful substances generated by direct contact between the fluorescent glue and the outside are effectively avoided, and serious attenuation of photoelectric color characteristics and failure of a light source caused by corrosion of the packaging structure by the harmful substances are avoided; moreover, the first transparent adhesive tape structure does not affect the multi-surface light emitting of the LED chip, thereby improving the light emitting quality and reliability of the light source packaging structure.

Description

Technical Field

[0001] This utility model belongs to the field of LED packaging structure technology, specifically relating to a highly reliable CSP light source packaging structure. Background Technology

[0002] LED technology is widely used in display backlighting, and high-quality backlighting demands higher requirements for the color gamut and luminous efficacy of LED light sources. In the mainstream market, LED light sources utilize KSF phosphors to improve luminous efficacy and color gamut. This encapsulation process involves mixing KSF and β-sialo phosphors and molding the mixture onto the LED chip, which is then cut to obtain individual CSPs. Some processes also mold transparent adhesive over the KSF and β-sialo phosphor mixture to further protect the phosphors. However, in these encapsulation structures, KSF phosphors inevitably come into contact with water, generating HF, which corrodes the chip and substrate materials, leading to severe degradation of the photoelectric and color characteristics of the light source, or even light source failure.

[0003] Therefore, some existing packaging processes fill the LED chip with reflective white glue, then mold a mixture of KSF and βsialo phosphors on top of the LED chip and reflective white glue, and then mold transparent glue on top of the phosphor mixture to prevent KSF phosphor from directly contacting water. However, this structure sacrifices some light output, reduces the beam angle, and lowers the backlight effect. Utility Model Content

[0004] The technical problem to be solved by this invention is to overcome the technical problem that the exposure of phosphor in the LED light source packaging structure in the prior art produces harmful substances, which leads to a decrease in light output quality or even failure. A highly reliable CSP light source packaging structure is proposed.

[0005] A highly reliable CSP light source packaging structure includes an LED chip, a phosphor, and a first transparent adhesive; the phosphor surrounds the upper side and the periphery of the LED chip, and the first transparent adhesive surrounds the LED chip and the phosphor, exposing the electrodes of the LED chip.

[0006] Furthermore, the fluorescent adhesive covers the upper side and surrounding area of ​​the LED chip, and the first transparent adhesive covers the surface of the structure formed by the LED chip and the fluorescent adhesive, exposing the electrodes of the LED chip.

[0007] Furthermore, it also includes a second transparent adhesive that covers the surface of the LED chip and exposes the electrodes of the LED chip.

[0008] Furthermore, the fluorescent adhesive covers the upper side and the surrounding area of ​​the second transparent adhesive, and the first transparent adhesive covers the surface of the structure formed by the LED chip, the fluorescent adhesive, and the second transparent adhesive, exposing the electrodes of the LED chip.

[0009] Furthermore, it also includes a substrate located below the LED chip, wherein the electrodes of the LED chip are electrically connected to the pads on the upper side of the substrate.

[0010] Furthermore, the first transparent adhesive fills the gap between the lower side of the LED chip and the upper side of the substrate.

[0011] Furthermore, the LED chip is one of the following: a conventional LED chip, a flip-chip LED chip, and a vertical LED chip.

[0012] Furthermore, the fluorescent adhesive includes KSF phosphor and βsialo phosphor.

[0013] Furthermore, the first transparent adhesive includes one or more of high-reflection transparent adhesive, medium-reflection transparent adhesive, low-reflection transparent adhesive, zirconium dioxide, titanium dioxide, and silicon dioxide.

[0014] Furthermore, the substrate is one of BT board, FR4 board, glass board, ceramic (aluminum nitride, aluminum oxide) board, aluminum substrate, and copper substrate.

[0015] Beneficial Effects: This utility model discloses a highly reliable CSP light source packaging structure, including an LED chip, fluorescent adhesive, and a first transparent adhesive. The fluorescent adhesive surrounds the upper side and all sides of the LED chip, and the first transparent adhesive surrounds the LED chip and the fluorescent adhesive, exposing the electrodes of the LED chip. The CSP light source packaging structure disclosed in this utility model effectively avoids the generation of harmful substances from direct contact between the fluorescent adhesive and the external environment by surrounding the LED chip and the fluorescent adhesive with the first transparent adhesive. This avoids severe attenuation of photoelectric and color characteristics and light source failure caused by harmful substances corroding the packaging structure. Furthermore, the first transparent adhesive structure in this utility model does not affect the multi-faceted light output of the LED chip, thereby improving the light output quality and reliability of the light source packaging structure. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a packaging structure of the present invention;

[0018] Figure 2 This is a schematic diagram of another packaging structure of this utility model.

[0019] Explanation of reference numerals in the attached diagram: 1. LED chip; 2. Phosphor adhesive; 3. First transparent adhesive; 4. Second transparent adhesive; 5. Substrate; 6. Solder. Detailed Implementation

[0020] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0021] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0023] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0024] This invention provides a highly reliable CSP light source packaging structure, including an LED chip 1, a fluorescent adhesive 2, and a first transparent adhesive 3; the fluorescent adhesive 2 surrounds the upper side and the periphery of the LED chip 1, and the first transparent adhesive 3 surrounds the LED chip 1 and the fluorescent adhesive 2, and exposes the electrodes of the LED chip 1.

[0025] The CSP light source packaging structure disclosed in this utility model surrounds the LED chip 1 and the phosphor 2 with a first transparent adhesive 3. This effectively prevents the phosphor 2 from directly contacting the external environment and generating harmful substances, thus avoiding severe attenuation of photoelectric and color characteristics and light source failure caused by the corrosion of the packaging structure by harmful substances. Furthermore, the first transparent adhesive 3 structure in this utility model does not affect the multi-faceted light output of the LED chip 1, thereby improving the light output quality and reliability of the light source packaging structure, passing the AEC-Q102 test. The emitted light is a bat-shaped beam pattern with a beam angle of not less than 120°, which is beneficial for end customers to match the beam pattern. In this structure, the first transparent adhesive 3 isolates the phosphor 2 from the substrate 5, further preventing the phosphor 2 or its generated harmful substances from corroding the substrate 5, further improving the reliability of the packaged light source.

[0026] Specifically, the fluorescent adhesive 2 includes KSF phosphor and β-sialo phosphor. The first transparent adhesive 3 includes one or more of high-refractive-index transparent adhesive, medium-refractive-index transparent adhesive, low-refractive-index transparent adhesive, zirconium dioxide, titanium dioxide, and silicon dioxide. The substrate 5 is one of BT board, FR4 board, glass board, ceramic (aluminum nitride, alumina) board, aluminum substrate, and copper substrate.

[0027] Example 1:

[0028] Reference Figure 1 As shown, in this embodiment, the fluorescent adhesive 2 covers the upper side and the surrounding area of ​​the LED chip 1, and the first transparent adhesive 3 covers the surface of the structure formed by the LED chip 1 and the fluorescent adhesive 2, exposing the electrodes of the LED chip 1.

[0029] Specifically, the substrate 5 is located below the LED chip 1, and the electrodes of the LED chip 1 are electrically connected to the pads on the upper side of the substrate 5. In this embodiment, the LED chip 1 is a flip-chip LED chip, and the lower electrode of the LED chip 1 is electrically fixed to the pads on the upper side of the substrate 5 by solder 6. In this embodiment, the solder 6 is preferably solder paste. The first transparent adhesive 3 fills the gap between the lower side of the LED chip 1 and the upper side of the substrate 5, thereby sealing and encapsulating the LED chip 1 and the phosphor adhesive 2 with the first transparent adhesive and the substrate 5, isolating them from the outside environment.

[0030] In a preferred embodiment, the fluorescent adhesive 2 has a size offset from the LED chip 1 of ≥30μm-1000μm, which is smaller than the first transparent adhesive 3; the fluorescent adhesive 2 has a thickness of ≥30μm. The first transparent adhesive 3 has a size offset from the fluorescent adhesive 2 of ≥10μm; the first transparent adhesive 3 has a thickness of ≥10μm; the first transparent adhesive 3 forms a five-sided coating of the fluorescent adhesive 2, effectively blocking moisture in the air from contacting KSF.

[0031] Example 2:

[0032] Reference Figure 2 As shown, in this embodiment, a second transparent adhesive 4 is also included. The second transparent adhesive 4 covers the surface of the LED chip 1 and exposes the electrodes of the LED chip 1. The fluorescent adhesive 2 covers the upper side and surrounding area of ​​the second transparent adhesive 4, and the first transparent adhesive 3 covers the surface of the structure formed by the LED chip 1, the fluorescent adhesive 2, and the second transparent adhesive 4, and exposes the electrodes of the LED chip 1.

[0033] Specifically, the substrate 5 is located below the LED chip 1, and the electrodes of the LED chip 1 are electrically connected to the pads on the upper side of the substrate 5. In this embodiment, the LED chip 1 is a flip-chip LED chip, and the lower electrode of the LED chip 1 is electrically fixed to the pads on the upper side of the substrate 5 by solder 6. In this embodiment, the solder 6 is preferably solder paste. The first transparent adhesive 3 fills the gap between the lower side of the LED chip 1 and the upper side of the substrate 5, thereby sealing and encapsulating the LED chip 1, the phosphor adhesive 2, and the second transparent adhesive 4 with the first transparent adhesive 3 and the substrate 5, isolating them from the outside environment.

[0034] In this embodiment, the second transparent adhesive 4 isolates the LED chip 1 from the fluorescent adhesive 2, further preventing the fluorescent adhesive 2 or its harmful substances from corroding the LED chip 1, and further improving the reliability of the packaged light source.

[0035] In this embodiment, the second transparent adhesive 4 includes one or more of high-reflection transparent adhesive, medium-reflection transparent adhesive, low-reflection transparent adhesive, zirconium dioxide, titanium dioxide, and silicon dioxide.

[0036] In a preferred embodiment, the second transparent adhesive 4 has a volume / w size offset from the LED chip 1 of 10μm-100μm, and a thickness of 10μm-100μm. The second transparent adhesive 4 effectively prevents KSF phosphor from directly contacting the LED chip 1. The fluorescent adhesive 2 has a volume / w size offset from the LED chip 1 of ≥30μm-1000μm, smaller than the first transparent adhesive 3; the fluorescent adhesive 2 has a thickness ≥30μm. The first transparent adhesive 3 has a volume / w size offset from the fluorescent adhesive 2 of ≥10μm; the first transparent adhesive 3 has a thickness ≥10μm. The first transparent adhesive 3 forms a five-sided coating of the fluorescent adhesive 2, effectively blocking moisture in the air from contacting KSF.

[0037] In some other embodiments of this utility model, the LED chip 1 is a front-mounted LED chip. In this packaging structure, the upper electrode of the LED chip 1 is connected to the pad of the substrate 5 by gold wire. The LED chip 1 is directly fixed on the substrate 5, and no gap is formed between the LED chip 1 and the substrate 5.

[0038] In some other embodiments of this utility model, the LED chip 1 is a front-mounted LED chip. In this packaging structure, the upper electrode of the LED chip 1 is connected to the pad of the substrate 5 by gold wire, and the lower electrode is soldered to the pad of the substrate 5 by solder 6.

[0039] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0040] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A CSP light source package structure with high reliability, characterized in that, It comprises LED chip (1), fluorescent glue and first transparent glue; the fluorescent glue surrounds the upper side and the four sides of the LED chip (1), and the first transparent glue surrounds the LED chip (1) and the fluorescent glue and exposes the electrode of the LED chip (1).

2. The CSP light source package structure of claim 1, wherein the CSP light source package structure is characterized by: The fluorescent glue (2) covers the upper side and the four sides of the LED chip (1), and the first transparent glue (3) covers the surface of the structure formed by the LED chip (1) and the fluorescent glue (2) and exposes the electrode of the LED chip (1).

3. The CSP light source package structure of claim 1, wherein the CSP light source package structure is characterized by: It further comprises second transparent glue (4), which covers the surface of the LED chip (1) and exposes the electrode of the LED chip (1).

4. The CSP light source package structure of claim 3, wherein the CSP light source package structure is characterized by: The fluorescent glue (2) covers the upper side and the four sides of the second transparent glue (4), and the first transparent glue (3) covers the surface of the structure formed by the LED chip (1), the fluorescent glue (2) and the second transparent glue (4) and exposes the electrode of the LED chip (1).

5. The CSP light source package structure of claim 1, wherein the CSP light source package structure is characterized by: It further comprises a substrate (5) located below the LED chip (1), and the electrode of the LED chip (1) is conductively connected with the pad on the upper side of the substrate (5).

6. The high-reliability CSP light source packaging structure according to claim 5, characterized in that, The first transparent glue (3) fills the gap between the lower side of the LED chip (1) and the upper side of the substrate (5).

7. The CSP light source package structure of claim 1, wherein the CSP light source package structure is a CSP light source package structure of a high reliability. The LED chip (1) is one of a positive structure LED chip, a flip chip LED chip and a vertical structure LED chip.

8. The CSP light source package structure of claim 1, wherein the CSP light source package structure is a CSP light source package structure with high reliability. The fluorescent glue (2) comprises KSF fluorescent powder and beta sialo fluorescent powder.

9. The CSP light source package structure of claim 1, wherein the CSP light source package structure is a high reliability CSP light source package structure. The first transparent glue (3) comprises one or more of high-refractive transparent glue, medium-refractive transparent glue, low-refractive transparent glue, zirconium dioxide, titanium dioxide and silicon dioxide.

10. The CSP light source package structure of claim 5, wherein the CSP light source package structure is a CSP light source package structure of a high reliability. The substrate (5) is one of BT board, FR4 board, glass board, ceramic (aluminum nitride, aluminum oxide) board, aluminum substrate and copper substrate.

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