Light-emitting device with large angle

Abstract

The utility model discloses a light-emitting device with a large angle, which comprises an LED (light-emitting diode) support, and an LED chip and a convex packaging layer are arranged on the LED support; the LED support comprises a substrate and a box dam, and the LED chip is arranged on the substrate and located in the box dam. The convex packaging layer comprises a first packaging adhesive layer, a second packaging adhesive layer, a third packaging adhesive layer, a first particle layer and a second particle layer. By arranging the first packaging adhesive layer and the second packaging adhesive layer which are filled with the particles, and the first particle layer and the second particle layer which are higher than the box dam, more light in the center of the LED chip can be refracted to the periphery, the light emitting angle is increased, and meanwhile, the intensity of light transmitted by the particles is high, and the light loss is small.

Description

Technical Field

[0001] This utility model belongs to the field of LED packaging technology, specifically relating to a light-emitting device with a large angle. Background Technology

[0002] With social development and the improvement of people's living standards, consumers have placed increasingly higher demands on the display indicators of televisions, such as color saturation, color reproduction, and contrast. HDR (High Dynamic Range) displays, characterized by high contrast, high resolution, and wide color gamut, have greatly improved the display effect of LCD displays. HDR on the market is achieved through Local Dimming technology. HDR TVs can be divided into three types based on the number of backlight zones: high-zone, medium-zone, and low-zone. High-zone TVs have more than 1000 zones, boasting high brightness, thinness, and picture quality comparable to OLED, but they are expensive and generally found in flagship high-end models. High-zone TVs typically use Mini COB backlights. Medium-zone TVs have between 500 and 1000 zones, offering high brightness and picture quality superior to traditional LCD displays, at a moderate price. Medium-zone TVs primarily use Mini POB backlights. Low-zone TVs have 100-500 zones; due to the reduced number of zones, the corresponding cost is lower, while the display effect is still superior to traditional LCD backlights, making them more accessible to mass consumers. Low-spot backlights primarily use Mini POB as their product form. They typically use blue LEDs paired with quantum dot films to produce white light, which requires a wider LED angle. Currently, a white adhesive layer is used to cover the surface of the LED chip to block light, but this results in too much loss of central luminous flux and low brightness. Alternatively, a semi-transparent and semi-reflective layer can be used to cover the LED chip to reduce the loss of central luminous flux, but this also reduces the angle, leading to a smaller pitch / OD ratio, a poor product experience, and a higher number of LED chips required. Utility Model Content

[0003] In order to overcome the above-mentioned shortcomings of the prior art, the purpose of this utility model is to provide a light-emitting device with a large light-emitting angle, which can reduce the loss of central luminous flux while ensuring a large light-emitting angle.

[0004] To achieve its purpose, the technical solution adopted by this utility model is as follows:

[0005] A light-emitting device with a large angle includes an LED bracket, on which an LED chip and a raised encapsulation layer are disposed;

[0006] The LED bracket includes a substrate and a retaining wall, and the LED chip is disposed on the substrate and located within the retaining wall.

[0007] The convex encapsulation layer includes a first encapsulating adhesive layer, a second encapsulating adhesive layer, a third encapsulating adhesive layer, a first particle layer, and a second particle layer. The first encapsulating adhesive layer and the second encapsulating adhesive layer are disposed within the dam. The first encapsulating adhesive layer is disposed opposite to the second encapsulating adhesive layer and covers the LED chip. The first particle layer is disposed on top of the second encapsulating adhesive layer. The third encapsulating adhesive layer is disposed opposite to the dam and covers the first particle layer. The second particle layer is disposed on top of the third encapsulating adhesive layer.

[0008] Preferably, the first particle layer and the second particle layer are spherical in shape.

[0009] Preferably, the first particle layer and the second particle layer are hollow structures.

[0010] Preferably, the cross-section of the first particle layer is annular, and the cross-section of the second particle layer is circular, with the second particle layer located within the annular shape of the first particle layer in a top-view orientation.

[0011] Preferably, the particle size of the particles in the first particle layer is 15-65 μm, and the particle size of the particles in the second particle layer is 65-115 μm.

[0012] Preferably, the first and second particle layers are white, and the particle materials of the first and second particle layers are gray borosilicate, SiO2, ZnO, or Al3O.

[0013] Preferably, the dam is transparent or semi-transparent.

[0014] Preferably, the third encapsulating adhesive layer is semi-convex.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] This invention proposes a large-angle light-emitting device. By incorporating a first and second encapsulating layer filled with particles, and a first and second particle layer higher than the surrounding dam, more light from the center of the LED chip can be refracted to the surrounding area, thus improving the light-emitting angle. Simultaneously, the particles transmit light with high intensity and minimal light loss. This two-layer structure reduces brightness loss while improving the light-emitting angle. Furthermore, the first particle layer covers the light-emitting surface of the LED chip, resulting in more uniform color and ensuring consistent light emission. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a cross-sectional structural diagram of Embodiment 1 of the present invention;

[0019] Figure 2 This is a cross-sectional view of Embodiment 2 of the present invention;

[0020] Figure 3 This is a cross-sectional view of Embodiment 3 of the present invention;

[0021] Figure 4 This is a cross-sectional structural diagram of Embodiment 4 of this utility model;

[0022] Figure 5 This is a top view of the structure of Embodiment 1 of this utility model.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. LED chip; 2. Substrate; 3. Barrier; 4. First encapsulating layer; 5. Second encapsulating layer; 6. Third encapsulating layer; 7. First particle layer; 8. Second particle layer. Detailed Implementation

[0025] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features of this utility model can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this utility model; the described embodiments are only a part of the embodiments of this utility model, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0027] Example 1:

[0028] like Figure 1 and Figure 5 A light-emitting device with a large angle includes an LED bracket, on which an LED chip 1 and a raised encapsulation layer are disposed;

[0029] The LED bracket includes a substrate 2 and a dam 3, with the LED chip 1 disposed on the substrate 2 and located within the dam 3;

[0030] The convex encapsulation layer includes a first encapsulating adhesive layer 4, a second encapsulating adhesive layer 5, a third encapsulating adhesive layer 6, a first particle layer 7, and a second particle layer 8. The first encapsulating adhesive layer 4 and the second encapsulating adhesive layer 5 are disposed within the dam 3. The first encapsulating adhesive layer 4 is disposed below the second encapsulating adhesive layer 5 and covers the LED chip 1. The first particle layer 7 is disposed on top of the second encapsulating adhesive layer 5. The third encapsulating adhesive layer 6 is disposed above the dam 3 and covers the first particle layer 7. The second particle layer 8 is disposed on top of the third encapsulating adhesive layer 6.

[0031] This embodiment, by setting a first encapsulating adhesive layer 4 and a second encapsulating adhesive layer 5 filled with particles, and a first particle layer 7 and a second particle layer 8 higher than the surrounding dam 3, can refract more light from the center of the LED chip 1 to the surrounding area, thereby improving the emission angle. Simultaneously, the particles transmit light with high intensity and low light loss. These two layers reduce brightness loss while improving the emission angle. Furthermore, the first particle layer 7 covers the light-emitting surface of the LED chip 1, resulting in more uniform color and ensuring consistent light emission.

[0032] Specifically, the first particle layer 7 and the second particle layer 8 are spherical in shape.

[0033] Specifically, the first particle layer 7 and the second particle layer 8 are hollow structures.

[0034] Specifically, the cross-section of the first particle layer 7 is annular, and the cross-section of the second particle layer 8 is circular. In the top view, the second particle layer 8 is located inside the annular shape of the first particle layer 7.

[0035] Specifically, the particle size of the particles in the first particle layer 7 is 15-65 μm, and the particle size of the particles in the second particle layer 8 is 65-115 μm.

[0036] Specifically, the first particle layer 7 and the second particle layer 8 are white in color, and the particle material of the first particle layer 7 and the second particle layer 8 is gray borosilicate, SiO2, ZnO, or Al3O.

[0037] Specifically, dam 3 is transparent or semi-transparent.

[0038] Specifically, the third encapsulating layer 6 is semi-convex.

[0039] The distance between the top of the second encapsulating layer 5 and the top of the dam 3 is 0-100μm. The top of the second encapsulating layer 5 is a planar structure, which makes the first particle layer 7 form a flat cup structure, so that the particles of the first particle layer 7 are evenly covered, thereby obtaining more uniform color and consistent luminescence.

[0040] It also includes a method for manufacturing a light-emitting device with a large angle, used to manufacture the aforementioned light-emitting device with a large angle, the steps of which are as follows:

[0041] S1. Place LED chip 1 on the LED bracket;

[0042] S2. The first encapsulating adhesive layer 4 is covered on the LED chip 1. Phosphor is provided in the first encapsulating adhesive layer 4. The phosphor is settled by centrifugation and the first encapsulating adhesive layer 4 is in a cured or semi-cured state by fast baking process.

[0043] S3. A second encapsulating layer 5 filled with particles is set on top of the first encapsulating layer 4 by dispensing glue, and the second encapsulating layer 5 is baked to form a first particle layer 7 on the top of the second encapsulating layer 5, which covers the light-emitting surface of the LED chip 1.

[0044] S4. A third encapsulating layer 6 filled with particles is applied above the second encapsulating layer 5 by dispensing, so that the third encapsulating layer 6 covers the light-emitting surface of the LED chip 1 and forms a semi-convex shape. The third encapsulating layer 6 is then baked to form a second particle layer 8 on top of the third encapsulating layer 6.

[0045] Meanwhile, the transparent encapsulating adhesive of the above-mentioned encapsulating layer can be made of, but is not limited to, light-transmitting thixotropic silicone resin. The LED bracket can adopt a transparent bracket scheme with four-sided light emission, which is formed on the substrate 2 by thermoplastic molding. The transparent bracket can generally be made of, but is not limited to, transparent or translucent plastic materials, such as PPA (poly(p-phenylene terephthalamide)), PCT (polyethylene terephthalate), thermoplastic resin, etc.

[0046] Example 2:

[0047] like Figure 2 The difference from Embodiment 1 is that the second encapsulating adhesive layer 5 has a micro-convex circular shape, which makes the first particle layer 7 micro-convex circular and covers the light-emitting surface.

[0048] Example 3:

[0049] like Figure 3 The difference from Example 1 is that the phosphor in the first encapsulating adhesive layer 4 is treated with a suspension process to increase the excitation efficiency of the phosphor and reduce the amount of phosphor used.

[0050] Example 4:

[0051] like Figure 4 LED chip 1 is a standard LED chip 1 structure.

[0052] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A light emitting device having a large angle, characterized by The LED support is provided with an LED chip and a convex encapsulation layer; The LED support comprises a substrate and a dam, and the LED chip is arranged on the substrate and in the dam; The convex encapsulation layer comprises a first encapsulation glue layer, a second encapsulation glue layer, a third encapsulation glue layer, a first particle layer and a second particle layer, the first encapsulation glue layer and the second encapsulation glue layer are arranged in the dam, the first encapsulation glue layer is arranged below the second encapsulation glue layer, the first encapsulation glue layer covers the LED chip, the first particle layer is arranged on the top of the second encapsulation glue layer, the third encapsulation glue layer is arranged above the dam and covers the first particle layer, and the second particle layer is arranged on the top of the third encapsulation glue layer.

2. The light-emitting device with large viewing angle according to claim 1, wherein The first particle layer and the second particle layer are circular and spherical.

3. The light-emitting device with large viewing angle according to claim 1, wherein The first particle layer and the second particle layer are hollow structures.

4. The light-emitting device with large viewing angle according to claim 1, wherein The cross section of the first particle layer is a circular ring, the cross section of the second particle layer is a circle, and the second particle layer is in the circular ring of the first particle layer in the top view direction.

5. The light-emitting device with large viewing angle according to claim 1, wherein The value particle diameter of the particles of the first particle layer is 15-65 μm, and the value particle diameter of the particles of the second particle layer is 65-115 μm.

6. The light emitting device with large angle of claim 1, wherein, The color of the first particle layer and the second particle layer is white, and the particle material of the first particle layer and the second particle layer is gray borosilicate or SiO2 or Zn0 or Al30.

7. The light emitting device with large angle of claim 1, wherein, The dam is transparent or semi-transparent.

8. The light-emitting device with large viewing angle according to claim 1, wherein The third encapsulation glue layer is semi-convex and circular.

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