Powder feeding head
By incorporating a semiconductor cooling chip and a multi-layer cooling device on the powder feeding head, the problems of shortened service life and nodule formation caused by high temperature of the powder feeding head are solved, resulting in reduced temperature and improved working efficiency.
Patent Information
- Application Number
- CN202422925585.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2034-11-29
AI Technical Summary
Traditional powder feeding heads have a shorter service life under high temperature environments, and the powder tubes are prone to deformation, breakage, and lumps, resulting in defective products.
The device employs a semiconductor refrigeration unit and a multi-layer cooling unit, including inner and outer spiral flow channels, combined with a semiconductor refrigeration chip and a cooling medium, to reduce the temperature of the powder feeding head.
It effectively reduces the temperature of the powder feeding head and powder pipe, improves the efficiency of cladding work, extends the service life of parts, and reduces manufacturing costs.
Smart Images
Figure CN223776025U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of additive manufacturing and relates to a powder feeding head, and more particularly to a laser cladding coaxial powder feeding head. Background Technology
[0002] For powder feeding heads in additive manufacturing equipment that include powder or filament feeding, the following shortcomings are often present: 1) With the increase of laser cladding power, traditional water cooling cannot meet the cooling capacity requirements, which will cause the powder feeding head to reach high temperatures. High temperatures in the powder feeding head will reduce the service life of components, such as powder tube deformation, breakage, and accelerated powder tube wear; 2) High temperatures in the powder feeding head will also make the bottom of the powder feeding head more prone to nodule formation, resulting in defective products. Utility Model Content
[0003] In order to solve the above-mentioned technical problems in the background art, the present invention provides a powder feeding head that can reduce the temperature of the powder tube and the powder feeding head, improve the cladding efficiency, and reduce the manufacturing cost of parts.
[0004] To achieve the above objectives, the present invention adopts the following technical solution:
[0005] A powder feeding head includes a powder feeding head body and a powder feeding tube. The powder feeding head body has a laser via, and the powder feeding tube is disposed on the powder feeding head body. The extension line of the powder feeding tube intersects the axis of the laser via. The powder feeding head further includes a semiconductor cooling device disposed on the powder feeding head body and parallel to the powder feeding tube.
[0006] The aforementioned laser via, powder feeding tube, and semiconductor cooling device are sequentially arranged on the powder feeding head body from the inside out along the radial direction of the powder feeding head body.
[0007] The aforementioned semiconductor cooling device includes a DC power supply and a semiconductor cooling chip connected to the DC power supply; the laser via, powder feeding tube, and semiconductor cooling chip are sequentially arranged on the powder feeding head body from the inside to the outside along the radial direction of the powder feeding head body.
[0008] The aforementioned semiconductor refrigeration chip has an overall tile-like structure, and the semiconductor refrigeration chip is arranged around the outside of the powder feeding pipe.
[0009] The number of the aforementioned semiconductor cooling chips corresponds to the number of powder feeding tubes.
[0010] The aforementioned powder feeding head also includes an outer cooling device disposed on the powder feeding head body; the laser via, powder feeding tube, semiconductor cooling device and outer cooling device are disposed sequentially from the inside to the outside along the radial direction of the powder feeding head body.
[0011] The aforementioned external cooling device includes an external spiral flow channel, which is provided with an external cooling medium inlet and an external cooling medium outlet; the external spiral flow channel is arranged around the outside of the semiconductor refrigeration device.
[0012] Along the incident direction of the laser in the laser via, the position of the outer cooling medium inlet is lower than the position of the outer cooling medium outlet.
[0013] The aforementioned powder feeding head also includes an inner cooling device disposed on the powder feeding head body. The laser via, the inner cooling device, the powder feeding tube, the semiconductor cooling device, and the outer cooling device are disposed sequentially from the inside to the outside along the radial direction of the powder feeding head body.
[0014] The aforementioned internal cooling device includes an internal spiral flow channel, which is provided with an internal cooling medium inlet and an internal cooling medium outlet; the internal spiral flow channel is arranged around the outside of the laser via.
[0015] The advantages of this utility model are:
[0016] This invention provides a powder feeding head, including a powder feeding head body and a powder feeding tube. The powder feeding head body has a laser via, and the powder feeding tube is mounted on the powder feeding head body, with its extension line intersecting the axis of the laser via. The powder feeding head also includes a semiconductor cooling device mounted on the powder feeding head body and parallel to the powder feeding tube. The core of this invention is the addition of a semiconductor cooling chip to the outside of the powder feeding tube, along with an external cooling device to dissipate heat from the semiconductor cooling chip, and an internal cooling device between the laser via and the powder feeding tube. These three cooling devices significantly reduce the temperature of the powder tube and the powder feeding head, improving cladding efficiency and reducing manufacturing costs. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall structure of the powder feeding head provided by this utility model;
[0018] Figure 2 This is a schematic diagram of the cross-sectional structure (semiconductor cooling chip visible) of the powder feeding head provided by this utility model;
[0019] Figure 3 This is a cross-sectional view of the powder feeding head provided by this utility model (with water cooling visible inside);
[0020] Figure 4 This is a schematic diagram of the powder feeding head provided by this utility model during the assembly of a semiconductor refrigeration chip;
[0021] Figure 5 This is a schematic diagram of the cooling principle of the semiconductor refrigeration chip used in this utility model;
[0022] Figure 6 This is a schematic diagram showing the connection between the semiconductor cooling chip used in this utility model and the power supply;
[0023] in:
[0024] 1-Powder feeding head body; 2-Semiconductor cooling chip; 3-Powder feeding tube; 4-Inner spiral flow channel; 5-Laser through hole; 6-Inner cooling medium inlet; 7-Inner cooling medium outlet; 8-Outer cooling medium inlet; 9-Outer cooling medium outlet; 10-Outer spiral flow channel. Detailed Implementation
[0025] See Figure 1 , Figure 2 as well as Figure 4 This utility model provides a powder feeding head, including a powder feeding head body 1 and a powder feeding tube 3. The powder feeding head body 1 has a laser via 5, and the powder feeding tube 3 is disposed on the powder feeding head body 1. The extension line of the powder feeding tube 3 intersects the axis of the laser via 5. The powder feeding head also includes a semiconductor cooling device disposed on the powder feeding head body 1 and parallel to the powder feeding tube 3. See also... Figure 2 The laser via 5, the powder feeding tube 3, and the semiconductor cooling device are arranged sequentially from the inside to the outside along the radial direction of the powder feeding head body 1.
[0026] See Figure 2 as well as Figure 3 The powder feeding head provided by this utility model also includes an outer cooling device disposed on the powder feeding head body 1; the laser via 5, the powder feeding tube 3, the semiconductor cooling device, and the outer cooling device are arranged sequentially from the inside to the outside along the radial direction of the powder feeding head body 1. The outer cooling device includes an outer spiral flow channel 10, which has an outer cooling medium inlet 8 and an outer cooling medium outlet 9; the outer spiral flow channel 10 is arranged around the outside of the semiconductor cooling device. For example, a cooling medium, such as water, cold air, or cooling oil, can flow through the outer spiral flow channel 10. To ensure cooling effect, along the incident direction of the laser in the laser via 5, the position of the outer cooling medium inlet 8 is lower than the position of the outer cooling medium outlet 9, that is, the cooling medium enters the outer spiral flow channel 10 from the bottom of the powder feeding head body 1 and finally flows out from the top of the powder feeding head body 1 or is reused. The outer spiral flow channel 10 can remove the heat generated by the semiconductor cooling device at the hot end, and also can isolate the heat generated by the powder feeding head from radiating to the center of the powder feeding head.
[0027] See Figure 2 as well as Figure 3The powder feeding head also includes an inner cooling device disposed on the powder feeding head body 1. The laser via 5, the inner cooling device, the powder feeding tube 3, the semiconductor cooling device, and the outer cooling device are arranged sequentially from the inside to the outside along the radial direction of the powder feeding head body 1. The inner cooling device includes an inner spiral flow channel 4, which is provided with an inner cooling medium inlet 6 and an inner cooling medium outlet 7. The inner spiral flow channel 4 is arranged around the outside of the laser via 5. For example, the cooling medium in the inner spiral flow channel 4 and the cooling medium in the outer spiral flow channel 10 can be the same or different, but generally the same medium can be used for cooling. The inner spiral flow channel 4 can remove the heat between the laser via 5 and the powder feeding tube 3, that is, the center of the powder feeding head body.
[0028] See Figure 6 The semiconductor cooling device used in this invention includes a DC power supply and a semiconductor cooling chip 2 connected to the DC power supply; the laser via 5, the powder feeding tube 3, and the semiconductor cooling chip 2 are sequentially arranged on the powder feeding head body 1 from the inside to the outside along the radial direction of the powder feeding head body 1. See also Figure 5 The thermocouple 2 is composed of multiple N-type and P-type semiconductor materials connected by conductors to form thermocouple pairs. When direct current passes through these thermocouple pairs, the energy difference of electrons in the two semiconductor materials causes the cold end temperature to decrease and the hot end temperature to increase, thereby achieving a cooling effect. The cold end is close to the powder delivery pipe, and the hot end is close to the thermocouple device, achieving a cooling effect on the powder delivery head. For example, see [link to example]. Figure 4 The semiconductor cooling chip 2 has a tile-like structure and is arranged around the outside of the powder feeding pipe 3.
[0029] See Figure 1 The number of thermoelectric coolers 2 corresponds to the number of powder feeding tubes 3; that is, a thermoelectric cooler 2 is provided on the outside of each powder feeding tube 3 to cool different powder feeding tubes 3. For example, there are four powder feeding tubes 3, tapered with the axis of the laser via 5. In this case, the thermoelectric coolers 2 are tile-shaped structures, and there are also four of them, each corresponding to a position on one of the powder feeding tubes 3. Each powder feeding tube has a thermoelectric cooler on its outer side to reduce the temperature of the powder tube.
Claims
1. A powder feeding head, comprising a powder feeding head body (1) and a powder feeding tube (3), wherein the powder feeding head body (1) has a laser via (5), and the powder feeding tube (3) is disposed on the powder feeding head body (1), wherein the extension line of the powder feeding tube (3) intersects the axis of the laser via (5); characterized in that: The powder feeding head also includes a semiconductor cooling device disposed on the powder feeding head body (1) and parallel to the powder feeding tube (3) and an outer cooling device disposed on the powder feeding head body (1); the laser via (5), the powder feeding tube (3), the semiconductor cooling device and the outer cooling device are disposed sequentially from the inside to the outside along the radial direction of the powder feeding head body (1).
2. The powder feeding head according to claim 1, characterized in that: The semiconductor cooling device includes a DC power supply and a semiconductor cooling chip (2) connected to the DC power supply; the laser via (5), the powder feeding tube (3) and the semiconductor cooling chip (2) are arranged sequentially from the inside to the outside along the radial direction of the powder feeding head body (1).
3. The powder feeding head according to claim 2, characterized in that: The semiconductor cooling chip (2) has an overall tile-like structure and is arranged around the outside of the powder feeding pipe (3).
4. The powder feeding head according to claim 3, characterized in that: The number of semiconductor cooling chips (2) corresponds to the number of powder feeding tubes (3).
5. The powder feeding head according to any one of claims 1-4, characterized in that: The outer cooling device includes an outer spiral flow channel (10), which is provided with an outer cooling medium inlet (8) and an outer cooling medium outlet (9); the outer spiral flow channel (10) is arranged around the outside of the semiconductor refrigeration device.
6. The powder feeding head according to claim 5, characterized in that: Along the incident direction of the laser in the laser via (5), the position of the outer cooling medium inlet (8) is lower than the position of the outer cooling medium outlet (9).
7. The powder feeding head according to claim 6, characterized in that: The powder feeding head also includes an inner cooling device disposed on the powder feeding head body (1). The laser via (5), the inner cooling device, the powder feeding tube (3), the semiconductor cooling device and the outer cooling device are disposed sequentially from the inside to the outside along the radial direction of the powder feeding head body (1).
8. The powder feeding head according to claim 7, characterized in that: The inner cooling device includes an inner spiral channel (4), which is provided with an inner cooling medium inlet (6) and an inner cooling medium outlet (7); the inner spiral channel (4) is arranged around the outside of the laser via (5).