Vacuum semiconductor welding device

Abstract

The utility model discloses a vacuum semiconductor welding device, and relates to the field of semiconductor welding devices. The device comprises a device shell, a cavity is formed in the inner side of the device shell, a welding device is installed on the inner side of the cavity, a sliding rail is arranged on the outer side of the welding device, and a plurality of sliding seats are installed on the inner side of the sliding rail in a sliding mode. According to the semiconductor refrigeration device, the semiconductor after welding can be subjected to staged rapid refrigeration treatment, the semiconductor before welding can be subjected to preheating treatment, so that the semiconductor can be in a proper temperature state in the welding process through the arrangement, and the semiconductor refrigeration sheet can also perform refrigeration or heating according to the welding requirement; through the accurate temperature control and welding operation, a reasonable temperature change curve is formed, it is ensured that the welding material is fully melted and forms metallurgical bonding with the base material, and therefore the welding quality is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor welding equipment, specifically a vacuum semiconductor welding device. Background Technology

[0002] Vacuum semiconductor welding equipment is a key piece of equipment in semiconductor manufacturing. By welding in a vacuum environment, it effectively avoids oxidation and contamination, improving the precision and quality of welding. The equipment consists of components such as a frame, pressure plate, base, housing, and vacuum pumping device, which can create a sealed vacuum chamber to provide a stable environment for the welding process. Vacuum semiconductor welding equipment is widely used in semiconductor packaging, optoelectronics, aerospace and other fields. Its high efficiency, precision and environmental protection characteristics meet the industry's demand for high-quality welding.

[0003] Existing semiconductor vacuum welding equipment requires high-temperature heating of the semiconductor device and solder area during welding operations to ensure the smooth progress of the welding process. However, after the traditional welding operation is completed, there is a problem of rapid cooling of the high-temperature semiconductor, which makes it difficult to effectively control the cooling rate of the semiconductor and easily causes defects such as cracking of the welded area, thereby reducing the ease of use and reliability of the vacuum welding equipment. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide a vacuum semiconductor welding device to solve the technical problem of difficult temperature control in semiconductor welding operations.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a vacuum semiconductor welding device, comprising a device housing, a vacuum pump device installed on one side of the device housing, a cavity formed on the inner side of the device housing, a welding device installed on the inner side of the cavity, a slide rail provided on the outer side of the welding device, and a plurality of sliding seats slidably installed on the inner side of the slide rail, wherein a semiconductor support plate is snapped onto the sliding seats;

[0006] The outer side of the slide rail is provided with a first-stage cooling zone, a second-stage cooling zone, and a preheating zone. Each of the first-stage cooling zone, the second-stage cooling zone, and the preheating zone is composed of a support frame and several semiconductor cooling chips.

[0007] By adopting the above technical solution, the vacuum semiconductor welding device can effectively create a vacuum environment in the cavity through the cooperation of the device shell and the vacuum pump device, thus avoiding the influence of gases such as oxygen on the welding quality during the welding process.

[0008] Furthermore, the first-stage cooling zone and the second-stage cooling zone are installed at the end of the welding device, and the preheating zone is installed at the beginning of the welding device.

[0009] By adopting the above technical solution, installing the first-stage cooling zone and the second-stage cooling zone at the end of the welding device, it is possible to ensure that the semiconductor after welding is cooled rapidly and in stages, which helps to quickly solidify the welded parts and improve the welding quality.

[0010] Furthermore, the welding device includes a three-axis machining table, on which a welding gun is mounted.

[0011] By adopting the above technical solution, the three-axis machining table can realize the precise movement of the welding gun in three-dimensional space, thereby meeting the requirements of complex welding shapes.

[0012] Furthermore, several of the semiconductor cooling chips are arranged in an equidistant rectangular array on the support frame, and an access port and an observation window are provided on the front side of the device housing.

[0013] By adopting the above technical solutions, the uniformity of cooling or heating effects can be ensured, and the accuracy of temperature control during the welding process can be improved.

[0014] Furthermore, in the first and second cooling zones, the cooling surfaces of the semiconductor cooling chips are installed facing the slide rail, while in the preheating zone, the heating surfaces of the semiconductor cooling chips are installed facing the slide rail.

[0015] By adopting the above technical solution, the semiconductors on the slide rail can be directly cooled, improving cooling efficiency and accuracy.

[0016] Furthermore, the linear motor and the semiconductor cooling chip in the three-axis machining table are both electrically connected to an external power source through a control center.

[0017] By adopting the above technical solution, the linear motor and semiconductor cooling chip in the three-axis machining table are electrically connected to an external power source, realizing precise control of the welding and cooling processes.

[0018] Furthermore, the sliding seat includes a mounting plate, and a drive wheel and two sets of limit wheels are mounted below the mounting plate to drive the sliding seat to slide inside the slide rail.

[0019] By adopting the above technical solution, the sliding seat can slide stably and flexibly inside the slide rail.

[0020] In summary, the present invention has the following main advantages:

[0021] 1. This utility model features a cooling zone, a second cooling zone, and a preheating zone set on the outer side of the slide rail. It consists of a support frame and several semiconductor cooling chips, allowing the semiconductor to undergo rapid cooling in stages after welding, while the semiconductor can be preheated before welding. This setup ensures that the semiconductor is in a suitable temperature state during the welding process. At the same time, through the electrical connection between the control center and the external power supply, the linear motor on the three-axis machining table can drive the welding gun to perform precise welding. The semiconductor cooling chips can also cool or heat according to the welding requirements. This precise temperature control and welding operation forms a reasonable temperature change curve, ensuring that the welding material melts fully and forms a metallurgical bond with the substrate, thereby effectively improving the welding quality.

[0022] 2. This utility model uses a slide rail and a sliding seat. The slide rail on the outside of the welding device provides a stable running track for the sliding seat, enabling the sliding seat to move smoothly and accurately along the slide rail. The semiconductor support plate carried on the sliding seat ensures the stability and safety of the semiconductor during the movement process, allowing the semiconductor to move stably and flexibly as needed during the welding process. This not only improves the accuracy of welding but also greatly enhances the efficiency of welding. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0024] Figure 2 This is a schematic diagram of the main structure of this utility model;

[0025] Figure 3 This is a schematic diagram of the installation and arrangement structure of the welding device and slide rail of this utility model;

[0026] Figure 4 This is a top view of the slide rail structure of this utility model;

[0027] Figure 5 This is a bottom view of the mounting plate of this utility model.

[0028] In the diagram: 1. Device housing; 2. Vacuum pump device; 3. Cavity; 4. Observation window; 5. Access port; 6. Welding device; 601. Three-axis machining table; 602. Welding gun; 7. Slide rail; 8. Sliding seat; 801. Mounting plate; 802. Drive wheel; 803. Limit wheel; 9. Semiconductor support plate; 10. First-stage cooling zone; 11. Second-stage cooling zone; 12. Preheating zone; 13. Semiconductor cooling chip. Detailed Implementation

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. Example 1:

[0030] A vacuum semiconductor welding apparatus, such as Figures 1-5 As shown, the device includes a housing 1, a vacuum pump device 2 installed on one side of the housing 1, a cavity 3 formed inside the housing 1, a welding device 6 installed inside the cavity 3, a slide rail 7 provided outside the welding device 6, and a plurality of sliding seats 8 slidably installed inside the slide rail 7, with a semiconductor substrate 9 snapped onto the sliding seats 8.

[0031] The outer side of the slide rail 7 is provided with a first-stage cooling zone 10, a second-stage cooling zone 11, and a preheating zone 12. Each of the first-stage cooling zone 10, the second-stage cooling zone 11, and the preheating zone 12 is composed of a support frame and several semiconductor cooling chips 13. Through the cooperation of the device housing 1 and the vacuum pump device 2, this vacuum semiconductor welding device can effectively form a vacuum environment in the cavity 3, avoiding the influence of gases such as oxygen on the welding quality during the welding process. At the same time, the design of the welding device 6 and its outer slide rail 7, sliding seat 8, and semiconductor support plate 9 enables the semiconductor to move stably and flexibly during the welding process, improving the accuracy and efficiency of the welding.

[0032] See Figure 3 , Figure 4 A first-stage cooling zone 10 and a second-stage cooling zone 11 are installed at the end of the welding device 6, and a preheating zone 12 is installed at the beginning of the welding device 6. Installing the first-stage cooling zone 10 and the second-stage cooling zone 11 at the end of the welding device 6 can ensure that the semiconductor after welding is cooled rapidly and in stages, which helps the welded part to solidify quickly and improves the welding quality. At the same time, the preheating zone 12 installed at the beginning of the welding device 6 can preheat the semiconductor to be welded, so that it reaches a suitable welding temperature, further improving the accuracy and reliability of welding.

[0033] See Figure 1 , Figure 2 , Figure 3 , Figure 4 The welding device 6 includes a three-axis machining table 601, on which a welding gun 602 is mounted. The three-axis machining table 601 can realize the precise movement of the welding gun 602 in three-dimensional space, thereby meeting the requirements of complex welding shapes. At the same time, the precise control of the welding gun 602 also ensures the stability and consistency of the welding process, improving welding quality and production efficiency.

[0034] See Figure 1 , Figure 2 , Figure 3 , Figure 4 Several semiconductor cooling chips 13 are arranged in an equidistant rectangular array on the support frame. The front side of the device housing 1 is provided with an access port 5 and an observation window 4, which can ensure the uniformity of cooling or heating effect and improve the accuracy of temperature control during the welding process. At the same time, the access port 5 and the observation window 4 provided on the front side of the device housing 1 facilitate the operator to maintain and observe the inside of the device, thereby improving the ease of use and safety of the device.

[0035] See Figure 3 , Figure 4 In the first-stage cooling zone 10 and the second-stage cooling zone 11, the cooling surface of the semiconductor cooling chip 13 is installed facing the slide rail 7, and in the preheating zone 12, the heating surface of the semiconductor cooling chip 13 is installed facing the slide rail 7. This allows for direct cooling of the semiconductor on the slide rail 7, improving cooling efficiency and accuracy. At the same time, the heating surface of the semiconductor cooling chip 13 in the preheating zone 12 facing the slide rail 7 allows for direct preheating of the semiconductor on the slide rail 7, bringing it to a suitable welding temperature, further improving welding quality and efficiency.

[0036] See Figure 3 , Figure 4 The linear motor and the semiconductor cooling chip 13 in the three-axis machining table 601 are both electrically connected to an external power source through the control center. This electrical connection enables precise control of the welding and cooling processes. At the same time, this electrical connection method also improves the automation and intelligence level of the device, making it easier for operators to monitor and adjust the device, thereby improving production efficiency and welding quality. Example 2:

[0037] See Figure 3 , Figure 4 , Figure 5 The sliding seat 8 includes a mounting plate 801. A drive wheel 802 and two sets of limit wheels 803 are mounted below the mounting plate 801 to drive the sliding seat 8 to slide inside the slide rail 7. This allows the sliding seat 8 to slide stably and flexibly inside the slide rail 7. At the same time, the cooperation between the drive wheel 802 and the limit wheels 803 ensures the accuracy and reliability of the sliding seat 8 during the sliding process, avoids welding quality problems caused by unstable sliding, and improves the overall performance and stability of the device.

[0038] The implementation principle of this embodiment is as follows: A cavity 3 is formed inside the outer shell 1 of the device. The air in the cavity 3 is drawn out by the vacuum pump device 2 to create a vacuum environment. Inside the cavity 3, the welding device 6 is responsible for performing semiconductor welding operations. Several sliding seats 8 are slidably installed on the slide rail 7 on its outer side to support the semiconductor support plate 9 and enable it to move during the welding process. A first cooling zone 10, a second cooling zone 11, and a preheating zone 12 are set outside the slide rail 7. These zones are composed of a support frame and several semiconductor cooling chips 13, which are used to perform staged rapid cooling treatment on the welded semiconductor and preheating treatment before welding, respectively. Through the electrical connection between the control center and the external power supply, the linear motor on the three-axis machining table 601 drives the welding gun 602 to perform precise welding. At the same time, the semiconductor cooling chips 13 cool or heat as needed to ensure the smooth progress of the welding process and the stability of the welding quality. By forming a reasonable temperature change curve, it is ensured that the welding material is fully melted and forms a metallurgical bond with the substrate, thereby improving the welding quality.

[0039] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A vacuum semiconductor welding apparatus, characterized in that: The device includes a housing (1), a vacuum pump device (2) is installed on one side of the housing (1), a cavity (3) is formed on the inner side of the housing (1), a welding device (6) is installed on the inner side of the cavity (3), a slide rail (7) is provided on the outer side of the welding device (6), and a plurality of sliding seats (8) are slidably installed on the inner side of the slide rail (7), and a semiconductor substrate (9) is snapped onto the sliding seat (8). The slide rail (7) is provided with a first cooling zone (10), a second cooling zone (11), and a preheating zone (12) on its outer side. The first cooling zone (10), the second cooling zone (11), and the preheating zone (12) are all composed of a support frame and several semiconductor cooling chips (13).

2. The vacuum semiconductor welding apparatus according to claim 1, characterized in that: The first cooling zone (10) and the second cooling zone (11) are installed at the end of the welding device (6), and the preheating zone (12) is installed at the beginning of the welding device (6).

3. The vacuum semiconductor welding apparatus according to claim 1, characterized in that: The welding device (6) includes a three-axis machining table (601) on which a welding gun (602) is mounted.

4. The vacuum semiconductor welding apparatus according to claim 1, characterized in that: Several of the semiconductor cooling chips (13) are arranged in an equidistant rectangular array on the support frame, and the front side of the device housing (1) is provided with an access port (5) and an observation window (4).

5. The vacuum semiconductor welding apparatus according to claim 1, characterized in that: In the first-stage cooling zone (10) and the second-stage cooling zone (11), the cooling surface of the semiconductor cooling chip (13) is installed facing the slide rail (7), and in the preheating zone (12), the heating surface of the semiconductor cooling chip (13) is installed facing the slide rail (7).

6. The vacuum semiconductor welding apparatus according to claim 3, characterized in that: The linear motor and the semiconductor cooling chip (13) in the three-axis machining table (601) are both electrically connected to an external power source through the control center.

7. The vacuum semiconductor welding apparatus according to claim 1, characterized in that: The sliding seat (8) includes a mounting plate (801), and a drive wheel (802) and two sets of limit wheels (803) are installed below the mounting plate (801) to drive the sliding seat (8) to slide inside the slide rail (7).

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