Lead wire connecting end mounting and assembling device

Abstract

The utility model discloses a lead wire connecting end mounting and assembling device, and mainly relates to the field of lead wire tin soldering equipment. Comprising a bearing substrate, a placement position matched with a patch is arranged on the bearing substrate, a first fixing part is arranged in the placement position, and the patch is limited relative to the position of the bearing substrate through the first fixing part; a threading position is arranged at the placing position in a matched mode, and the inner end position of the threading position is communicated with the placing position. The lead wire fixing device has the advantages that an operator can conveniently and effectively fix the position of the patch relative to the lead wire, the operator can stably carry out tin soldering operation on the patch and the lead wire, the patch and the lead wire are stably connected, and it is guaranteed that the prepared blood sample detection equipment meets the preparation requirement.

Description

Technical Field

[0001] This utility model relates to the field of lead wire soldering equipment, specifically a lead wire connection end installation and assembly device. Background Technology

[0002] For pulse oximetry devices, the installation of the lead wires on the skin is crucial. The stability of this installation directly affects the detection rate and lifespan of the blood sample analyzer. Therefore, careful attention must be paid to the connection of the lead wires within the analyzer. Because a patch is installed at the end of the lead wire, a stable connection between the lead wire and the patch is essential. However, most current installations are done manually, which cannot guarantee stability. Furthermore, the connection between the patch and the lead wire requires soldering. Soldering under unstable conditions further destabilizes the connection, resulting in a lead wire connection that does not meet installation requirements, ultimately rendering the pulse oximetry device inoperable.

[0003] Therefore, a lead wire connection end mounting device is needed to facilitate the operator in effectively fixing the position of the patch relative to the lead wire, enabling the operator to stably solder the two together, ensuring a stable connection between the patch and the lead wire, and ensuring that the prepared blood sample testing equipment meets the preparation requirements. Utility Model Content

[0004] The purpose of this invention is to provide a lead wire connection end mounting device, which allows the operator to effectively fix the position of the patch relative to the lead wire, enabling the operator to stably perform soldering operations on both, ensuring a stable connection between the patch and the lead wire, and ensuring that the prepared blood sample testing equipment meets the preparation requirements.

[0005] To achieve the above objectives, this utility model employs the following technical solution:

[0006] A lead wire connection end mounting and assembly device includes a carrier substrate, on which a patch is provided with a placement position, and a first fixing member is provided in the placement position to limit the position of the patch relative to the carrier substrate; a wire threading position is provided at the placement position, and the inner end of the wire threading position is connected to the placement position.

[0007] A second fixing member is provided at the upper end of the threading position to fix the position of the lead wire relative to the threading position.

[0008] The placement position is a placement groove, the size of which is adapted to the size of the patch; the first fixing member is a pressure cover plate, which is located at one end of the placement groove. When the first fixing member cooperates with the placement groove, it limits a portion of the patch.

[0009] The threading position is a threading groove, and the second fixing member is a second cover plate. The second cover plate provides non-pressurized shielding for the conductor wire in the threading groove.

[0010] The supporting substrate is made of high-temperature resistant material, and a heat insulation board is filled inside the supporting substrate.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] During setup, this device uses a carrier substrate as the base for supporting the conductive wires and the patch. A placement position is established, and a first fixing member is installed in conjunction with the placement position. This allows the patch within the placement position to be effectively held in place by the first fixing member, thus achieving effective fixation of the patch. Secondly, the wire threading position is connected to the placement position, allowing for partial restriction of the fixed end of the conductive wire. This better limits the position between the conductive wire and the patch, facilitating soldering operations. Attached Figure Description

[0013] Appendix Figure 1 This is a schematic diagram of the structure of this utility model.

[0014] Appendix Figure 2 This is a partial structural schematic diagram of the present invention.

[0015] Appendix Figure 3 This is a simplified diagram of the connection wire and patch of this utility model.

[0016] The labels shown in the attached diagram:

[0017] 1. Supporting substrate; 2. Placement position; 3. First fixing member; 4. Wiring position; 5. Second fixing member; 6. Placement groove; 7. Holding cover plate; 8. Wiring groove; 9. Second cover plate; 10. Patch; 11. Conductor wire. Detailed Implementation

[0018] The present invention will be further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that after reading the teachings of this invention, those skilled in the art can make various alterations or modifications to the present invention, and these equivalent forms also fall within the scope defined in this application.

[0019] Since the connection between the lead wire 11 and the patch 10 of a pulse oximeter is mostly achieved by soldering, whether manually or automatically, it is essential to ensure a stable connection between the lead wire 11 and the patch 10 to prevent detachment. During the soldering operation, it is crucial to maintain a stable positional relationship between the lead wire 11 and the patch 10 to prevent misalignment and ensure effective soldering. Therefore, the following structural configuration is required:

[0020] This utility model describes a wire connection end mounting device. The main structure includes a carrier substrate 1. A placement position 2 is provided on the carrier substrate 1 to accommodate a patch 10, and a first fixing member 3 is provided within the placement position 2. The first fixing member 3 limits the position of the patch 10 relative to the carrier substrate 1. A wire threading position 4 is provided at the placement position 2, and the inner end of the wire threading position 4 is connected to the placement position 2. During installation, the placement position 2 is set, and the first fixing member 3 is also set, so that the patch 10 within the placement position 2 can be effectively held by the first fixing member 3, thereby achieving effective fixation of the patch 10. Furthermore, the wire threading position 4, being connected to the placement position 2, can partially restrict the fixed end of the wire 11, thereby better restricting the position between the wire 11 and the patch 10, facilitating soldering operations. To ensure ease of soldering, the patch 10 must first be placed inside the placement position 2, and then a section of the lead wire 11 must be threaded through the wire insertion position 4 into the placement position 2. This ensures that the position between the patch 10 and the lead wire 11 is effectively limited, while facilitating the soldering operation of the lead wire 11 relative to the patch 10.

[0021] The above structure will be further configured and optimized as follows:

[0022] 1. The placement position 2 is a placement groove 6, the size of which is adapted to the size of the patch 10; the first fixing member 3 is a pressure cover plate 7, which is located at one end of the placement groove 6. When the first fixing member 3 cooperates with the placement groove 6, it limits a portion of the patch 10. Because after setting the first fixing member 3, it is necessary to ensure that the patch 10 is effectively limited by the first fixing member 3 without affecting the normal soldering operation of the operator. Therefore, the first fixing member 3 needs to be set as a pressure cover plate 7, and the pressure cover plate 7 limits a portion of the patch 10, so as not to restrict the entire part of the patch 10, thus leaving operating space for the operator to perform normal soldering operations.

[0023] 2. A second fixing member 5 is provided at the upper end of the wire threading position 4 to fix the position of the lead wire 11 relative to the wire threading position 4. The wire threading position 4 is a wire threading groove 8, and the second fixing member 5 is a second cover plate 9. The second cover plate 9 provides non-pressurizing protection for the lead wire 11 in the wire threading groove 8. The purpose of the second fixing member 5 is to ensure that the lead wire 11 will not easily detach from the wire threading groove 8 during soldering operations. However, the second cover plate 9 does not press or limit the lead wire 11, because after the lead wire 11 is soldered to the patch 10, the lead wire 11 can be pulled out of the wire threading groove 8 at the same time as the patch 10 is removed through one end of the placement groove 6. Therefore, the second cover plate 9 is provided to prevent the lead wire 11 from detaching from the wire threading groove 8. At the same time, when the lead wire 11 is difficult to remove during the removal of the patch 10, the second cover plate 9 can be removed to facilitate further disassembly.

[0024] 3. The carrier substrate 1 is made of a high-temperature resistant material, and a heat insulation plate is filled inside the carrier substrate 1. Because the welding temperature is high during the welding operation, it is necessary to ensure that the carrier substrate 1 can effectively withstand the high temperature while providing a welding environment for the welding of the patch 10 and the lead wire 11, so as to avoid the problem of heat melting of the carrier substrate 1 during welding.

[0025] Therefore, a lead wire connection end mounting device can facilitate the operator to effectively fix the position of the patch 10 relative to the lead wire 11, enabling the operator to stably perform soldering operations on the two, so as to ensure a stable connection between the patch 10 and the lead wire 11, and thus ensure that the prepared blood sample testing equipment meets the preparation requirements.

Claims

1. A lead wire connection end mounting and assembly device, characterized in that: Includes a carrier substrate (1), on which a patch (10) is provided with a placement position (2), and a first fixing member (3) is provided in the placement position (2), and the position of the patch (10) relative to the carrier substrate (1) is limited by the first fixing member (3). A threading position (4) is provided at the placement position (2), and the inner end of the threading position (4) is connected to the placement position (2).

2. The lead wire connection end mounting and assembly device according to claim 1, characterized in that: A second fixing member (5) is provided at the upper end of the threading position (4) to fix the position of the lead wire (11) relative to the threading position (4).

3. The lead wire connection end mounting and assembly device according to claim 2, characterized in that: The placement position (2) is a placement groove (6), and the size of the placement groove (6) is adapted to the size of the patch (10); The first fixing member (3) is a pressing cover plate (7), which is located at one end of the placement groove (6). When the first fixing member (3) cooperates with the placement groove (6), it limits a portion of the patch (10).

4. The lead wire connection end mounting and assembly device according to claim 3, characterized in that: The threading position (4) is a threading groove (8), and the second fixing member (5) is a second cover plate (9). The second cover plate (9) provides non-pressurized shielding for the lead wire (11) in the threading groove (8).

5. The lead wire connection end mounting and assembly device according to claim 1, characterized in that: The carrier substrate (1) is made of high temperature resistant material, and a heat insulation board is filled inside the carrier substrate (1).

Images