Die

Abstract

The utility model discloses a mold. The mold comprises a lower mold part, an upper mold part, a cooling block and a heat conduction layer. A cavity used for containing a product is formed in one side of the lower die piece. The upper mold part can move relative to the lower mold part and is used for covering the cavity. The cooling block is arranged in the upper die piece and located on the side, facing the lower die piece, of the upper die piece, and cooling liquid flows through the cooling block. The heat conduction layer is arranged on the side, facing the lower mold piece, of the cooling block, has elasticity and is used for making elastic contact with the product. When the upper mold drives the cooling block and the heat conduction layer to be close to the lower mold and enables the product on the lower mold and the cooling block to jointly extrude the heat conduction layer, the heat conduction layer elastically deforms and is attached to the surface of the product, so that the gap between the heat conduction layer and the product is reduced, the contact area between the cooling block and the product is increased, and the production efficiency is improved. And therefore, the cooling uniformity of the cooling block on the product is improved.

Description

Technical Field

[0001] This application relates to the field of manufacturing technology, and more particularly to a mold. Background Technology

[0002] Some products require molds for processing during the molding process. The temperature of the rubber material injected into the mold is generally high, so cooling blocks are installed inside the mold to cool the product. However, existing cooling blocks do not make good elastic contact with the product, resulting in a small contact area between the product and the cooling block. Utility Model Content

[0003] In view of this, this application provides a module to solve the problem of small contact area between the product and the cooling block.

[0004] Embodiments of this application provide a mold, including a lower mold part, an upper mold part, a cooling block, and a heat-conducting layer. A cavity for accommodating a product is provided on one side of the lower mold part. The upper mold part is movable relative to the lower mold part and is used to cover the cavity. The cooling block is disposed within the upper mold part and located on the side of the upper mold part facing the lower mold part; coolant flows through the cooling block. The heat-conducting layer is disposed on the side of the cooling block facing the lower mold part; the heat-conducting layer is elastic and is used to elastically contact the product.

[0005] In the above embodiments, since the heat-conducting layer is elastic, when the upper mold moves the cooling block and the heat-conducting layer close to the lower mold, and the product and the cooling block on the lower mold jointly squeeze the heat-conducting layer, the heat-conducting layer undergoes elastic deformation and adheres to the surface of the product, thereby reducing the gap between the heat-conducting layer and the product and the gap between the heat-conducting layer and the cooling block. This helps to increase the contact area between the cooling block and the product, thereby improving the uniformity of cooling the product by the cooling block.

[0006] In some embodiments, the cooling block is detachably connected to the upper mold, the cooling block has an extending direction, and the length of the cooling block and the heat-conducting layer in the extending direction is greater than or equal to 1 / 3 of the length of the upper mold in the extending direction. This facilitates the replacement and maintenance of the upper mold and the cooling block, and the longer contact length between the cooling block and the heat-conducting layer in its extending direction helps to increase the heat dissipation efficiency of the cooling block on the heat-conducting layer.

[0007] In some embodiments, a groove for accommodating a heat-conducting layer is provided on the side of the cooling block facing the lower module. The heat-conducting layer contacts the bottom wall and side wall of the groove, and the length of the groove in the extending direction is greater than or equal to 1 / 2 of the length of the cooling block in the extending direction.

[0008] By setting grooves, the heat-conducting layer can utilize the thickness of the cooling block, which helps to reduce the space occupied by the heat-conducting layer. In addition, the length of the groove in the extending direction is greater than or equal to 1 / 2 of the length of the cooling block in the extending direction, which helps to increase the contact area between the heat-conducting layer and the groove. The heat-conducting layer can fully contact the perimeter of the cooling block, improving the heat conduction efficiency.

[0009] In some embodiments, the groove has sidewalls parallel to the arrangement direction of the upper and lower mold members, and the sidewalls are in contact with the thermally conductive layer. Suppressing the deformation of the thermally conductive layer in the horizontal direction by using the sidewalls helps to improve the effect of the thermally conductive layer deforming in the same direction as the arrangement direction of the upper and lower mold members, thereby reducing the gap between the thermally conductive layer and the product.

[0010] In some embodiments, the depth of the groove in the arrangement direction of the upper and lower mold members is less than the thickness of the thermally conductive layer. The depth of the groove is 40% to 70% of the thickness of the thermally conductive layer. Avoiding the cooling block restricting the relative movement distance between the thermally conductive layer and the product helps to increase the interaction force between the thermally conductive layer and the product, enabling the cooling block and the product to jointly compress the thermally conductive layer and achieve full contact between the thermally conductive layer and the product.

[0011] In some embodiments, the cooling block is provided with cooling channels for coolant flow. A portion of the cooling channels is located on one side of the groove in a direction perpendicular to the arrangement direction of the upper and lower mold parts. A heat insulation layer is provided between the cooling block and the upper mold part. Increasing the range of coolant flow through the heat-conducting layer helps improve the cooling effect of the cooling block, and the heat insulation layer reduces heat transfer between the cooling block and the upper mold part.

[0012] In some embodiments, when the upper mold part covers the cavity, the heat-conducting layer is located between the product inside the cavity and another portion of the cooling channel, along the arrangement direction of the upper and lower mold parts. Increasing the range of coolant passing through the heat-conducting layer helps to improve the cooling effect of the cooling block.

[0013] In some embodiments, the cooling block further includes a plurality of heat-conducting pillars disposed in the groove, the plurality of heat-conducting pillars being connected to the bottom wall of the groove, at least a portion of the cooling flow channel corresponding to the region between two adjacent heat-conducting pillars, and the heat-conducting pillars extending within the heat-conducting layer.

[0014] Using multiple heat-conducting pillars not only improves the fixation of the cooling block to the heat-conducting layer, but also improves the heat conduction efficiency. In addition, the cooling channels are set in the area between two adjacent heat-conducting pillars, which can quickly cool the heat conducted from the two adjacent heat-conducting pillars and improve the cooling efficiency of the cooling channels.

[0015] In some embodiments, the length of the heat-conducting pillar in the arrangement direction of the upper and lower mold parts is greater than or equal to 1 / 3 of the depth of the groove. This reduces the risk of the heat-conducting pillar coming into contact with the lower mold part.

[0016] In some embodiments, the thermally conductive layer is made of thermally conductive silicone or thermally conductive grease, and its thickness is 1 mm to 5 mm. By ensuring sufficient contact between the elastic, corrosion-resistant, and chemically stable thermally conductive layer and the product, the risk of a potential reaction between the thermally conductive layer and the product is reduced. Furthermore, by limiting the thickness of the thermally conductive layer, the elasticity of the layer is prevented from decreasing, and the heat exchange efficiency between the cooling block and the product is maintained. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the working state of a mold according to an embodiment of this application.

[0018] Figure 2 for Figure 1 A schematic diagram after being cut along line II-II.

[0019] Figure 3 for Figure 2 Enlarged diagram of point A in the middle.

[0020] Figure 4 for Figure 1 A schematic diagram after being cut along line IV-IV.

[0021] Figure 5 for Figure 4 Enlarged diagram of point B in the middle.

[0022] Figure 6 for Figure 2 A schematic diagram of the cooling block in the middle.

[0023] Explanation of main component symbols

[0024] 10. Mold; 11. Lower mold part; 111. Cavity; 12. Upper mold part; 13. Cooling block; 131. Groove; 132. Cooling channel; 133. Heat-conducting pillar; 14. Heat-conducting layer; 20. Product. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0026] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also have an intervening component. When a component is considered to be "placed" on another component, it can be directly placed on the other component or may also have an intervening component. The terms "top," "above," "below," "front," "back," and similar expressions used in this article are for illustrative purposes only.

[0027] The terms “first”, “second”, etc., are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implying the number, order of designation, or primary or secondary relationship of the indicated technical features.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0029] Embodiments of this application provide a mold, including a lower mold part, an upper mold part, a cooling block, and a heat-conducting layer. A cavity for accommodating a product is provided on one side of the lower mold part. The upper mold part is movable relative to the lower mold part and is used to cover the cavity. The cooling block is disposed within the upper mold part and located on the side of the upper mold part facing the lower mold part; coolant flows through the cooling block. The heat-conducting layer is disposed on the side of the cooling block facing the lower mold part; the heat-conducting layer is elastic and is used to elastically contact the product.

[0030] In the above embodiments, since the heat-conducting layer is elastic, when the upper mold moves the cooling block and the heat-conducting layer close to the lower mold, and the product and the cooling block on the lower mold jointly squeeze the heat-conducting layer, the heat-conducting layer undergoes elastic deformation and adheres to the surface of the product, thereby reducing the gap between the heat-conducting layer and the product and the gap between the heat-conducting layer and the cooling block. This helps to increase the contact area between the cooling block and the product, thereby improving the uniformity of cooling the product by the cooling block.

[0031] Some embodiments of this application will now be described with reference to the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0032] In some embodiments, please refer to Figures 1 to 5 A mold 10 includes a lower mold part 11, an upper mold part 12, a cooling block 13, and a heat-conducting layer 14. The top of the lower mold part 11 has a cavity 111 for containing adhesive material. The upper mold part 12 is movable relative to the lower mold part 11, and the upper mold part 12 and the lower mold part 11 can be closed and opened / closed. During operation, the upper mold part 12 moves relative to the lower mold part 11 under the drive of an external power device, and the upper mold part 12 closes onto the cavity 111. The upper mold part 12 and the lower mold part 11 cooperate to form a product 20 within the cavity 111 from the adhesive material.

[0033] The upper mold part 12 and the lower mold part 11 are arranged at intervals in the Z-axis direction, with the upper mold part 12 located on the side of the lower mold part 11 facing the positive direction of the Z-axis.

[0034] In some embodiments, the positive direction of the Z-axis is the vertically upward direction of gravity.

[0035] In other embodiments, the Z-axis is arranged to intersect with the direction of gravity.

[0036] In some embodiments, please refer to Figures 2 to 5 Cooling block 13 is disposed inside upper mold 12 and located at the bottom of upper mold 12, and coolant (not shown) flows through cooling block 13.

[0037] When the upper mold 12 drives the cooling block 13 to cover the lower mold 11, the cooling block 13 comes into contact with the product 20 in the cavity 111 and the coolant carries away the heat of the product 20, thereby achieving the effect of cooling the product 20.

[0038] In some embodiments, the mold 10 further includes a heat-conducting layer 14 disposed at the bottom of the cooling block 13, and the heat-conducting layer 14 is elastic. During operation, the upper mold part 12 moves downward close to the lower mold part 11, and simultaneously drives the cooling block 13 and the heat-conducting layer 14 to move. Under the action of the upper mold part 12, the cooling block 13 presses the heat-conducting layer 14 down toward the product 20 in the cavity 111. At the same time, the product 20 provides support for the heat-conducting layer 14. Under the combined action of the cooling block 13 and the product 20, the heat-conducting layer 14 undergoes elastic deformation and makes full contact with the surface of the product 20, thereby reducing the thermal resistance between the product 20 and the cooling block 13. This allows the cooling block 13 to cool the surface of the product 20 quickly and uniformly, helping to avoid the risk of reduced cooling effect of the product 20 due to gaps between the cooling block 13 and the product 20.

[0039] In some embodiments, the thermally conductive layer 14 is made of thermally conductive silicone or thermally conductive grease, which are elastic, corrosion-resistant, and chemically stable. This ensures that the thermally conductive layer 14 is in full contact with the product 20, while also reducing the risk of the thermally conductive layer 14 reacting with the product 20. Furthermore, it meets the requirement that the thermally conductive layer 14 can work for a long time in an environment above room temperature in the mold 10.

[0040] In some embodiments, the cooling block 13 is detachably connected to the upper mold 12, facilitating the replacement and maintenance of the upper mold 12 and the cooling block 13. The cooling block 13 has an extending direction, and the contact length between the cooling block 13 and the heat-conducting layer 14 in the extending direction is greater than or equal to 1 / 3 of the length of the upper mold 12 in the extending direction, so that the cooling block 13 has a longer contact length with the heat-conducting layer 14 in its extending direction, which is beneficial to increasing the heat dissipation efficiency of the cooling block 13 on the heat-conducting layer 14.

[0041] In some embodiments, the thickness of the heat-conducting layer 14 is 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, or 5 mm. When the thickness of the heat-conducting layer 14 is less than 1 mm, its elasticity decreases, which is not conducive to sufficient contact between the heat-conducting layer 14 and the surface of the product 20. When the thickness of the heat-conducting layer 14 is greater than 5 mm, its thickness is too large, and the heat from the product 20 cannot be easily transferred quickly through the heat-conducting layer 14 to the cooling block 13, which is not conducive to the rapid cooling of the product 20 by the cooling block 13. As an example, the thickness of the heat-conducting layer 14 is 3 mm to maintain good elasticity while meeting the requirement of rapid heat dissipation from the product 20 by the cooling block 13.

[0042] Furthermore, the thermal conductivity of the thermal conductive layer 14 is greater than or equal to 11 W / mK, which helps the cooling block 13 to quickly dissipate heat from the product 20.

[0043] In some embodiments, the cooling block 13 is slidably connected to the upper mold 12. An elastic element is provided between the cooling block 13 and the upper mold 12 along the Z-axis. The elastic element buffers the cooling block 13 to achieve full contact between the cooling block 13 and the product 20 while reducing the risk of the cooling block 13 damaging the product 20.

[0044] For further details, please refer to Figures 2 to 5 The cooling block 13 is fixedly connected to the upper mold 12 by welding or interference fit to reduce the risk of jamming when the cooling block 13 slides relative to the upper mold 12.

[0045] In some embodiments, please refer to Figures 2 to 6 A groove 131 is provided on the side of the cooling block 13 facing the lower mold 11. A heat-conducting layer 14 is disposed in the groove 131. The heat-conducting layer 14 is in contact with the bottom wall and side wall of the groove 131. The length of the groove 131 in the extension direction is greater than or equal to 1 / 2 of the length of the cooling block 13 in the extension direction.

[0046] By setting the groove 131, the heat-conducting layer 14 can utilize the thickness of the cooling block 13, which helps to reduce the space occupied by the heat-conducting layer 14. In addition, the length of the groove 131 in the extending direction is greater than or equal to 1 / 2 of the length of the cooling block 13 in the extending direction, which helps to increase the contact area between the heat-conducting layer 14 and the groove 131. The heat-conducting layer 14 can fully contact the periphery of the cooling block 13, thereby improving the heat conduction efficiency.

[0047] Furthermore, by accommodating the heat-conducting layer 14 in the groove 131, the risk of a gap between the upper mold 12 and the lower mold 11 caused by the excessively large distance between the heat-conducting layer 14 and the bottom surface of the cooling block 13 protruding towards the lower mold 11 can be reduced.

[0048] In some embodiments, the depth of the groove 131 in the Z-axis direction is less than the thickness of the heat-conducting layer 14 in the Z-axis direction, so that the heat-conducting layer 14 protrudes toward the lower mold 11 relative to the bottom surface of the upper mold 12 and the bottom surface of the lower mold 11. The arrangement of the heat-conducting layer 14 being completely within the groove 131 reduces the distance by which the cooling block 13 restricts the relative movement of the heat-conducting layer 14 and the product 20 when the upper mold 12 and the cooling block 13 are in contact with the lower mold 11, thus facilitating the joint compression of the heat-conducting layer 14 by the cooling block 13 and the product 20 and ensuring sufficient contact between the heat-conducting layer 14 and the product 20.

[0049] In some embodiments, the depth of the groove 131 in the Z-axis direction is 40% to 70% of the thickness of the heat-conducting layer 14 in the Z-axis direction. When the depth of the groove 131 is less than 40% of the thickness of the heat-conducting layer 14, the stability of the heat-conducting layer 14 within the groove 131 decreases. When the depth of the groove 131 is greater than 70% of the thickness of the heat-conducting layer 14, it is difficult to fully compress the heat-conducting layer 14 when the cooling block 13 contacts the lower mold 11. Exemplarily, the depth of the groove 131 in the Z-axis direction is 40%, 45%, 50%, 55%, 60%, 65%, or 70% of the thickness of the heat-conducting layer 14 in the Z-axis direction, which helps to achieve joint compression of the heat-conducting layer 14 by the cooling block 13 and the product 20 and to ensure full contact between the heat-conducting layer 14 and the product 20.

[0050] In some embodiments, please refer to Figures 2 to 5 The groove 131 has a sidewall (not marked) parallel to the Z-axis, i.e., the sidewall is perpendicular to the horizontal direction and contacts the heat-conducting layer 14. When the cooling block 13 and the product 20 jointly compress the heat-conducting layer 14, the sidewall inhibits the deformation of the heat-conducting layer 14 in the horizontal direction, which helps to improve the deformation effect of the heat-conducting layer 14 in the Z-axis direction. This allows the heat-conducting layer 14 to fully exert force on the product 20 under its own elastic recovery, thereby reducing the gap between the heat-conducting layer 14 and the product 20 and increasing the contact area between the heat-conducting layer 14 and the product 20.

[0051] In some embodiments, please refer to Figure 6 A heat-conducting pillar 133 is provided in the groove 131. The heat-conducting pillar 133 is connected to the side wall, and a portion of the heat-conducting pillar 133 extends into the heat-conducting layer 14. By having the heat-conducting pillar 133 extend into the heat-conducting layer 14, it helps to improve the fixation of the heat-conducting layer 14 on the cooling block 13, thereby reducing the risk of the heat-conducting layer 14 falling off the cooling block 13.

[0052] In some embodiments, the heat-conducting pillar 133 extends in a direction perpendicular to the Z-axis.

[0053] In some embodiments, the heat-conducting post 133 extends in a direction parallel to the Z-axis, and the length of the heat-conducting post 133 in the Z-axis direction is less than the depth of the groove 131, so as to reduce the risk of the heat-conducting post 133 extending out of the groove 131 and contacting the product 20, thereby causing damage to the product 20.

[0054] In some embodiments, a portion of the heat-conducting pillar 133 extends in a direction perpendicular to the Z-axis, while the remaining heat-conducting pillar 133 extends in a direction parallel to the Z-axis.

[0055] In some embodiments, please refer to Figures 2 to 5 The cooling block 13 is provided with cooling channels 132 for coolant to flow through. In the horizontal direction, part of the cooling channels 132 is located on one side of the sidewall of the groove 131, that is, part of the cooling channels 132 flows through the groove 131 along the Y-axis and X-axis. The remaining cooling channels 132 are located on the side of the groove 131 away from the heat-conducting layer 14 along the Z-axis, so that the cooling channels 132 surround the groove 131, which helps to increase the range of coolant flow through the heat-conducting layer 14, thereby improving the cooling effect of the cooling block 13.

[0056] In some implementations, please refer to Figure 5 The cooling block 13 also includes a plurality of heat-conducting pillars 133 disposed in the groove 131. The plurality of heat-conducting pillars 133 are connected to the bottom wall of the groove 131. At least a portion of the cooling channel 132 corresponds to the area between two adjacent heat-conducting pillars 133. The heat-conducting pillars 133 extend into the heat-conducting layer 14.

[0057] The multiple heat-conducting pillars 133 not only improve the fixation of the cooling block 13 to the heat-conducting layer 14, but also improve the heat conduction efficiency. In addition, the cooling channel 132 is located in the area between two adjacent heat-conducting pillars 133, which can quickly cool the heat conducted from the two adjacent heat-conducting pillars 133 and improve the cooling efficiency of the cooling channel 132.

[0058] In some embodiments, the Z-axis, Y-axis, and X-axis are perpendicular to each other.

[0059] It is understood that the mold 10 also includes a pipe (not shown), one end of which passes through the upper mold 12 and is connected to an external cooling source, and the other end is connected to a cooling channel 132, so that the coolant from the external cooling source flows into the cooling channel 132 through one of the pipes and flows out through the other pipe.

[0060] In some embodiments, a heat insulation layer (not shown) is provided between the cooling block 13 and the upper mold 12. The heat insulation layer reduces the heat exchange between the cooling block 13 and the upper mold 12, thereby reducing the heat absorbed by the cooling block 13 from the upper mold 12 and helping to improve the heat exchange effect between the cooling block 13 and the heat-conducting layer 14.

[0061] In some embodiments, the cooling block 13 is a cuboid component. This facilitates the processing of the cooling block 13 and helps reduce production costs.

[0062] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the substantive scope of this application fall within the scope of this application.

Claims

1. A mold, characterized in that, The mold includes: The lower mold has a cavity on one side for accommodating the product. An upper mold, which is movable relative to the lower mold, is used to cover the cavity; A cooling block is disposed inside the upper mold and located on the side of the upper mold facing the lower mold, and coolant flows through the cooling block; A thermally conductive layer is disposed on the side of the cooling block facing the lower mold, the thermally conductive layer is elastic, and the thermally conductive layer is designed to make elastic contact with the product.

2. The mold according to claim 1, characterized in that: The cooling block is detachably connected to the upper mold, the cooling block has an extending direction, and the length of the cooling block and the heat-conducting layer in the extending direction is greater than or equal to 1 / 3 of the length of the upper mold in the extending direction.

3. The mold according to claim 2, characterized in that: The cooling block has a groove on the side facing the lower mold for accommodating the heat-conducting layer. The heat-conducting layer is in contact with the bottom wall and side wall of the groove. The length of the groove in the extending direction is greater than or equal to 1 / 2 of the length of the cooling block in the extending direction.

4. The mold according to claim 3, characterized in that: The groove has a sidewall parallel to the arrangement direction of the upper mold and the lower mold, and the sidewall is in contact with the heat-conducting layer.

5. The mold according to claim 3, characterized in that: The depth of the groove in the arrangement direction of the upper and lower molds is less than the thickness of the heat-conducting layer; The depth of the groove is 40% to 70% of the thickness of the heat-conducting layer.

6. The mold according to claim 3, characterized in that, The cooling block is provided with cooling channels for the flow of the coolant; Part of the cooling channel is located on one side of the groove in a direction perpendicular to the arrangement direction of the upper mold and the lower mold; A heat insulation layer is provided between the cooling block and the upper mold.

7. The mold according to claim 6, characterized in that, When the upper mold covers the cavity, along the arrangement direction of the upper mold and the lower mold, the heat-conducting layer is located between the product inside the cavity and another part of the cooling channel.

8. The mold according to claim 3, characterized in that: The cooling block also includes a plurality of heat-conducting pillars disposed in the groove, the plurality of heat-conducting pillars being connected to the bottom wall of the groove, at least a portion of the cooling channels corresponding to the area between two adjacent heat-conducting pillars, and the heat-conducting pillars extending within the heat-conducting layer.

9. The mold according to claim 8, characterized in that: The length of the heat-conducting pillar in the arrangement direction of the upper and lower mold parts is greater than or equal to 1 / 3 of the depth of the groove.

10. The mold according to any one of claims 1 to 9, characterized in that: The thermal conductive layer is made of thermally conductive silicone or thermally conductive grease. The thickness of the thermally conductive layer is 1 mm to 5 mm.

Images