Transfer mechanism for chip testing

Abstract

The utility model relates to a transfer mechanism for chip testing, which belongs to the field of chip testing and comprises an electric slide rail and a supporting seat fixedly connected to the top of a mover of the electric slide rail, and a storage assembly for protecting transferred chips is arranged at the top of the supporting seat. And the storage assembly comprises a storage box arranged at the top of the supporting seat, a chip placement pad and two electric push rods which are fixedly connected to the inner side of the storage box, and clamping cushion blocks fixedly connected to the tail ends of movable rods of the electric push rods. According to the transfer mechanism for chip testing, a chip is accurately clamped through the clamping cushion block driven by the two electric push rods, shaking and falling of the chip in the transfer process are effectively prevented, meanwhile, a pressure sensor arranged in the clamping cushion block can monitor the clamping force in real time, it is ensured that the chip is not damaged due to too tight clamping, and the chip is prevented from being damaged due to too tight clamping. And falling caused by too loose clamping is avoided, so that the transfer safety is greatly improved.

Description

Technical Field

[0001] This utility model relates to a transfer mechanism for chip testing, belonging to the field of chip testing. Background Technology

[0002] In the highly precise and competitive semiconductor manufacturing industry, chip testing plays a crucial role, serving as the cornerstone for ensuring that the final product meets established quality and performance standards. However, the chip transfer process, from the busy production line to the sophisticated testing equipment, often becomes the weakest link in the entire process. Currently, the industry's commonly used transfer methods still rely primarily on manual handling or the use of simple mechanized devices. These methods are not only inefficient and unable to meet the high-paced, high-efficiency demands of modern semiconductor production, but also have significant shortcomings in terms of chip transfer stability and security.

[0003] Specifically, manual hand-held transfer relies on the operator's individual skills and attention, making it difficult to guarantee ideal stability and consistency in every transfer. While simple mechanized devices can alleviate the burden of manpower to some extent, they often lack the necessary intelligent and automated control, failing to accurately handle the various complex situations during chip transfer. This instability can not only lead to physical damage to chips during transfer but also cause safety accidents due to improper operation, resulting in unnecessary losses for companies and employees. More importantly, chips, as high-precision, high-value electronic products integrating countless tiny circuits and components, are extremely sensitive to dust, impurities, and other contaminants on their surface and internal structure. During transfer, even tiny particles can cause fatal damage to chips, leading to testing errors, performance degradation, or even complete failure. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] In view of the shortcomings of the prior art, this utility model provides a transfer mechanism for chip testing, which has the advantages of ensuring the stability and safety of transfer.

[0006] (II) Technical Solution

[0007] To achieve the above-mentioned goal of ensuring the stability and safety of the transfer, this utility model provides the following technical solution: a transfer mechanism for chip testing, including an electric slide rail and a support base fixedly connected to the top of the electric slide rail mover, wherein the top of the support base is provided with a storage component for protecting the transferred chip;

[0008] The storage assembly includes a storage box disposed on the top of the support base, a chip placement pad fixedly connected to the inside of the storage box, two electric push rods, and a clamping pad block fixedly connected to the end of the movable rod of the electric push rod.

[0009] The inner side of the support base is equipped with a dust-collecting component for keeping the inside of the storage box clean.

[0010] Furthermore, the dust collection assembly includes a fan fixedly connected to the bottom wall of the support base, a connecting pipe fixedly connected to the suction end of the fan, a collection box fixedly connected to the other end of the connecting pipe, a dust collection pipe fixedly connected to the collection port of the collection box, and a sleeve sleeved over the outside of the dust collection pipe.

[0011] Furthermore, the inner side of the chip placement pad is provided with a fixing port that is compatible with the sleeve, the sleeve is fixedly connected to the inner side of the fixing port, the upper surface of the support base is provided with a through-hole that is compatible with the sleeve, the bottom of the storage box is provided with a connection port that is compatible with the sleeve, and the bottom end of the sleeve passes through the connection port and the through-hole in sequence and extends to the inner side of the support base.

[0012] Furthermore, a maintenance door is hinged to the front of the support base, and a ventilation opening is provided on the front of the maintenance door. A baffle is fixedly connected to the inside of the collection box.

[0013] Furthermore, the storage box has four fixedly connected plugs at its bottom corners, and the support base has four openings at its upper surface that are compatible with the plugs.

[0014] Furthermore, the two electric push rods are respectively arranged on the inner left and inner right walls of the storage box, and the chip placement pad is arranged on the inner bottom wall of the storage box and located between the left and right clamping pads.

[0015] Furthermore, the top of the storage box is hinged with a sealing box cover, and the clamping pads on both the left and right sides are equipped with pressure sensors.

[0016] (III) Beneficial Effects

[0017] Compared with the prior art, the present invention provides a transfer mechanism for chip testing, which has the following advantages:

[0018] This transfer mechanism for chip testing uses two electrically driven clamping pads to precisely hold the chip, effectively preventing the chip from shaking or falling off during transfer. At the same time, the pressure sensors built into the clamping pads can monitor the clamping force in real time, ensuring that the chip is neither damaged by excessive clamping nor falls off by excessive clamping, thus greatly improving the safety of transfer. In addition, the dust collection component ensures that the inside of the storage box remains highly clean, preventing dust from contaminating the chip surface. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a perspective view of the support base in the structure of this utility model;

[0021] Figure 3 This is a perspective view of the storage box in the structure of this utility model;

[0022] Figure 4 This is a front view of the present utility model.

[0023] In the diagram: 1. Electric slide rail; 2. Support base; 3. Storage box; 301. Sealing box cover; 4. Chip placement pad; 5. Electric push rod; 6. Clamping pad; 7. Fan; 8. Connecting pipe; 9. Collection box; 10. Dust suction pipe; 11. Sleeve; 12. Baffle; 13. Insert block. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figures 1 to 4 This utility model provides a technical solution: a transfer mechanism for chip testing, including an electric slide rail 1 and a support base 2 fixedly connected to the top of the mover of the electric slide rail 1. The top of the support base 2 is provided with a storage component for protecting the transferred chip.

[0026] like Figure 1 As shown, the storage assembly includes a storage box 3 disposed on the top of the support base 2, a chip placement pad 4 fixedly connected to the inside of the storage box 3, two electric push rods 5, and a clamping pad block 6 fixedly connected to the end of the movable rod of the electric push rod 5.

[0027] The inside of the support base 2 is equipped with a dust-collecting component for keeping the inside of the storage box 3 clean.

[0028] It should be noted that the dust collection assembly includes a suction fan 7 fixedly connected to the inner bottom wall of the support base 2, a connecting pipe 8 fixedly connected to the suction end of the suction fan 7, a collection box 9 fixedly connected to the other end of the connecting pipe 8, a dust collection pipe 10 fixedly connected to the collection port of the collection box 9, and a sleeve 11 sleeved on the outside of the dust collection pipe 10. Through the setting of the dust collection assembly, dust and impurities inside the storage box 3 can be effectively removed, ensuring that the transferred chips are in a clean environment and avoiding test errors or chip damage caused by dust and other factors.

[0029] The chip placement pad 4 has a fixing port on its inner side that is compatible with the sleeve 11. The sleeve 11 is fixedly connected to the inner side of the fixing port. The upper surface of the support base 2 has a through-hole that is compatible with the sleeve 11. The bottom of the storage box 3 has a connection port that is compatible with the sleeve 11. The bottom end of the sleeve 11 passes through the connection port and the through-hole in sequence and extends to the inner side of the support base 2. This design allows the suction pipe 10 to be stably connected to the sleeve 11, ensuring the continuity and stability of the suction effect. At the same time, it also facilitates the installation and maintenance of the suction components.

[0030] The support base 2 has a maintenance door hinged to its front, and a ventilation opening is provided on the front of the maintenance door. A baffle 12 is fixedly connected to the inside of the collection box 9. The maintenance door facilitates the inspection and maintenance of the dust collection components. The design of the ventilation opening ensures that the fan 7 receives sufficient airflow during operation, thereby improving dust collection efficiency. The baffle 12 prevents debris from entering the fan 7.

[0031] The storage box 3 has four corners at the bottom that are fixedly connected to the plug 13. The four corners of the upper surface of the support base 2 are respectively provided with sockets that are compatible with the plug 13. This design allows the storage box 3 to be stably fixed on the support base 2, preventing it from shaking or falling off during transportation and ensuring the safe transportation of the chip.

[0032] Two electric push rods 5 are respectively arranged on the inner left and inner right walls of the storage box 3. The chip placement pad 4 is arranged on the inner bottom wall of the storage box 3 and located between the left and right clamping pads 6. The top of the storage box 3 is hinged with a sealing box cover 301. The left and right clamping pads 6 are all equipped with pressure sensors. The arrangement of the electric push rods 5 and the clamping pads 6 can achieve stable clamping of the chip and prevent damage caused by shaking during transportation. At the same time, the pressure sensors built into the clamping pads 6 can monitor the clamping force in real time to ensure the safety of the chip.

[0033] The working principle of the above embodiments is as follows:

[0034] To ensure the cleanliness of the storage box 3, a negative pressure is first generated by the suction fan 7 to draw dust and impurities inside the storage box 3 into the collection box 9 through the sleeve 11 and the suction pipe 10. After the suction is completed, the chip is placed on the chip placement pad 4 of the storage box 3. At this time, the electric push rod 5 is activated. When the electric push rod 5 is activated, its movable rod will push the clamping pad 6 closer to the chip placement pad 4 until a stable clamping is formed on the chip. The clamping pads 6 on both the left and right sides are equipped with pressure sensors. These sensors can monitor the clamping force in real time to ensure that the chip will not be damaged due to excessive clamping or fall off due to excessive clamping during the transfer process. Finally, the sealing box cover 301 is closed to seal and protect the chip during the transfer process, and the electric slide rail 1 is activated to start the transfer process.

[0035] All electrical components mentioned in the text are electrically connected to the main controller and power supply. The main controller can be a conventional and known device such as a computer, and the existing publicly available power connection technology will not be elaborated in the text.

[0036] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A transfer mechanism for chip testing, comprising an electric slide rail (1) and a support base (2) fixedly connected to the top of the mover of the electric slide rail (1), characterized in that: The top of the support base (2) is provided with a storage component for protecting the transferred chip; The storage assembly includes a storage box (3) disposed on the top of the support base (2), a chip placement pad (4) fixedly connected to the inside of the storage box (3), two electric push rods (5), and a clamping pad block (6) fixedly connected to the end of the movable rod of the electric push rod (5). The inner side of the support base (2) is provided with a dust-collecting component for keeping the inside of the storage box (3) clean.

2. The transfer mechanism for chip testing according to claim 1, characterized in that: The dust collection assembly includes a fan (7) fixedly connected to the bottom wall of the support base (2), a connecting pipe (8) fixedly connected to the suction end of the fan (7), a collection box (9) fixedly connected to the other end of the connecting pipe (8), a dust collection pipe (10) fixedly connected to the collection port of the collection box (9), and a sleeve (11) sleeved on the outside of the dust collection pipe (10).

3. The transfer mechanism for chip testing according to claim 1, characterized in that: The chip placement pad (4) has a fixing port that matches the sleeve (11) on its inner side. The sleeve (11) is fixedly connected to the inner side of the fixing port. The upper surface of the support base (2) has a through-hole that matches the sleeve (11). The bottom of the storage box (3) has a connection port that matches the sleeve (11). The bottom end of the sleeve (11) passes through the connection port and the through-hole in sequence and extends to the inner side of the support base (2).

4. The transfer mechanism for chip testing according to claim 2, characterized in that: The support base (2) has a maintenance door hinged to its front, and a ventilation opening is provided on the front of the maintenance door. A baffle (12) is fixedly connected to the inside of the collection box (9).

5. The transfer mechanism for chip testing according to claim 1, characterized in that: The storage box (3) has four corners at the bottom that are fixedly connected to inserts (13), and the support base (2) has four corners at the top that are adapted to the inserts (13).

6. The transfer mechanism for chip testing according to claim 1, characterized in that: The two electric push rods (5) are respectively arranged on the inner left side wall and the inner right side wall of the storage box (3), and the chip placement pad (4) is arranged on the inner bottom wall of the storage box (3) and located between the left and right side clamping pads (6).

7. The transfer mechanism for chip testing according to claim 1, characterized in that: The top of the storage box (3) is hinged with a sealing box cover (301), and the clamping pads (6) on both the left and right sides are equipped with pressure sensors.

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