Communication signal transmission circuit, control panel and clothes processing equipment

Abstract

The utility model provides a communication signal transmission circuit, a control board and clothes processing equipment. A bus signal pin in the communication signal transmission circuit is used for receiving a first bus signal or outputting a second bus signal; the first signal pin and the second signal pin are jointly connected to a bus signal pin, and the first signal pin is configured to output a first communication signal under the condition that a first bus signal is received; the second signal pin is used for receiving a second communication signal, and the bus signal pin is configured to output a second bus signal under the condition that the second communication signal is received; the at least one high-speed optical coupling element is arranged between the bus signal pin and the first signal pin or the second signal pin, so that the bus signal pin can be isolated from the first signal pin or the second signal pin; the high-speed optocoupler element is beneficial to improving the communication efficiency between the first signal pin and the bus signal pin or improving the communication efficiency between the second signal pin and the bus signal pin.

Description

Technical Field

[0001] This application belongs to the field of load communication technology, and in particular relates to a communication signal transmission circuit, a control board, and a clothing processing device. Background Technology

[0002] In electronic devices, control boards often use half-duplex communication for signal communication. However, in related technologies, half-duplex communication circuits suffer from low communication efficiency. Summary of the Invention

[0003] The purpose of this application is to provide a communication signal transmission circuit, a control board, and a garment processing device, which aims to solve the problem of low communication efficiency in traditional communication signal transmission circuits.

[0004] A first aspect of this application provides a communication signal transmission circuit, the communication signal transmission circuit comprising:

[0005] Bus signal pin, first signal pin, second signal pin, and at least one high-speed optocoupler;

[0006] The first signal pin and / or the second signal pin are connected to the bus signal pin via the high-speed optocoupler element;

[0007] The first signal pin is configured to output a first communication signal when the bus signal pin receives the first bus signal, and the bus signal pin is configured to output a second bus signal when the second signal pin receives the second communication signal.

[0008] In some embodiments of this application, the high-speed optocoupler includes a light-emitting diode and a photodiode;

[0009] The high-speed optocoupler is disposed between the first signal pin and the bus signal pin; the light-emitting diode is configured to emit light when the bus signal pin receives the first bus signal to conduct the photodiode, and when the photodiode is conducted, the first signal pin outputs the first communication signal;

[0010] Alternatively, the high-speed optocoupler may be disposed between the second signal pin and the bus signal pin; the light-emitting diode may be configured such that when the second signal pin receives the second communication signal, the bus signal pin outputs the second bus signal.

[0011] In some embodiments of this application, the high-speed optocoupler further includes a first switch, one end of which is grounded and the other end is used to output a first signal when the first switch is turned on;

[0012] When the first signal is output, the bus signal pin outputs the second bus signal;

[0013] Alternatively, when the first signal is output, the first signal pin outputs the first communication signal.

[0014] In some embodiments of this application, the communication signal transmission circuit further includes a first power supply. When the photodiode is turned on, the first power supply is connected to the control electrode of the first switching element to turn on the first switching element.

[0015] In some embodiments of this application, the communication signal transmission circuit further includes a second switch, one end of which is grounded and the other end is connected to the bus signal pin, and the control electrode of the second switch is connected to the end of the first switch that outputs the first signal.

[0016] In some embodiments of this application, the communication signal transmission circuit further includes a second power supply, which is connected to the positive terminal of the light-emitting diode;

[0017] When the high-speed optocoupler is positioned between the first signal pin and the bus signal pin, the negative terminal of the light-emitting diode is connected to the bus signal pin;

[0018] When the high-speed optocoupler is positioned between the second signal pin and the bus signal pin, the negative terminal of the light-emitting diode is grounded.

[0019] In some embodiments of this application, the communication signal transmission circuit further includes a third switch, one end of which is grounded, the other end of which is connected to the second power supply, and the control electrode of which is connected to the second signal pin.

[0020] In some embodiments of this application, the high-speed optocoupler element is configured as at least two, and the at least two high-speed optocoupler elements include a first high-speed optocoupler element and a second high-speed optocoupler element. The first high-speed optocoupler element is disposed between the first signal pin and the bus signal pin, and the second high-speed optocoupler element is disposed between the second signal pin and the bus signal pin.

[0021] A second aspect of this application also provides a control board, on which the communication signal transmission circuit described above is integrated.

[0022] A third aspect of this application also provides a garment processing device, the garment processing device including the control board as described above.

[0023] The beneficial effects of this application are as follows: In the communication signal transmission circuit, control board, and garment processing equipment of this application, the communication signal transmission circuit includes a bus signal pin, a first signal pin, a second signal pin, and at least one high-speed optocoupler. The first signal pin and / or the second signal pin are connected to the bus signal pin via the high-speed optocoupler. The first signal pin is configured to output a first communication signal when the bus signal pin receives the first bus signal, and the bus signal pin is configured to output a second bus signal when the second signal pin receives the second communication signal. Placing at least one high-speed optocoupler between the first signal pin and the bus signal pin is beneficial for isolating the first signal pin and the bus signal pin, or placing at least one high-speed optocoupler between the second signal pin and the bus signal pin is beneficial for isolating the second signal pin and the bus signal pin. The high-speed optocoupler is beneficial for improving the communication efficiency between the first signal pin and the bus signal pin, or for improving the communication efficiency between the second signal pin and the bus signal pin. Attached Figure Description

[0024] Figure 1 A schematic diagram of the framework structure of a communication signal transmission circuit provided in an embodiment of this application;

[0025] Figure 2 A schematic diagram of the framework structure of a communication signal transmission circuit provided in another embodiment of this application;

[0026] Figure 3 This is a schematic diagram of the circuit structure of a communication signal transmission circuit provided in an embodiment of this application.

[0027] Specific element symbol explanation: 100-bus signal pin, 200-first signal pin, 300-second signal pin, 400-high-speed optocoupler, 410-light-emitting diode, 420-photodiode, N1-second switch, N2-third switch, OP3-second high-speed optocoupler, OP4-first high-speed optocoupler. Detailed Implementation

[0028] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0029] It should be noted that when a component is referred to as being "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0031] It's important to understand that in the modern home appliance industry, washing machines and dryers, as indispensable household appliances in daily life, are increasingly trending towards smarter and more efficient designs. The controller, as the core component of these devices, is responsible for receiving user commands, controlling machine operation, and displaying relevant information; its performance directly affects the overall user experience.

[0032] In related technologies, the controller of a washing machine or dryer typically consists of multiple modules, including a display board, a drive board, a frequency converter board, and a fan drive board. These modules are functionally divided through a modular design and transmit data via communication methods. Common communication methods include simplex, half-duplex, and full-duplex. Simplex communication refers to a mode where messages can only be transmitted in one direction. Half-duplex communication is a mode that can transmit data in both directions; in half-duplex communication, both parties can send and receive data, but not simultaneously. Full-duplex communication refers to a mode where both parties can transmit messages simultaneously.

[0033] Half-duplex communication is often used for signal transmission due to its cost advantage. However, current half-duplex communication signal transmission circuits require isolation devices to isolate different signal pins. Common isolation devices are ordinary optocouplers, which can ensure signal transmission reliability to a certain extent. However, with the increasing intelligence of home appliances, especially the growing popularity of OTA (Over-The-Air) technology, the demand for data transmission speed, update efficiency, and production line program updates is increasing. The communication efficiency of single-wire half-duplex communication based on ordinary optocouplers is insufficient to support the needs of rapid transmission and update of user programs, and it also limits the efficiency of production line program updates.

[0034] Based on this, this application addresses traditional communication signal transmission circuits, control boards, and garment processing equipment.

[0035] Please see Figure 1 , Figure 1This is a schematic diagram of the framework structure of the communication signal transmission circuit provided in this embodiment. The communication signal transmission circuit of this embodiment includes a bus signal pin 100, a first signal pin 200, a second signal pin 300, and at least one high-speed optocoupler element 400. The bus signal pin 100, the first signal pin 200, the second signal pin 300, and at least one high-speed optocoupler element 400 are connected to the bus signal pin 100 via the high-speed optocoupler element 400. The first signal pin 200 is configured to output a first communication signal when the bus signal pin 100 receives a first bus signal, and the bus signal pin 100 is configured to output a second bus signal when the second signal pin 300 receives a second communication signal.

[0036] It should be explained that bus signal pin 100 is used to receive a first bus signal (RX signal, receive signal) from the outside, or to output a second bus signal (TX signal, transmit signal). When the communication signal transmission circuit is in the transmit state, the second signal pin 300 outputs the required second communication signal (TXD signal, transmit data signal) to bus signal pin 100, and bus signal pin 100 outputs the second bus signal according to the second communication signal. When the communication signal transmission circuit is in the receive state, bus signal pin 100 receives the first bus signal, and first signal pin 200 outputs the first communication signal according to the first bus signal.

[0037] It is understood that the high-speed optocoupler 400 can be disposed between the first signal pin 200 and the bus signal pin 100, or between the second signal pin 300 and the bus signal pin 100. When the first signal pin 200 and the bus signal pin 100 are disposed together, electrical isolation is provided between them to reduce mutual interference. When the high-speed optocoupler 400 is disposed between the second signal pin 300 and the bus signal pin 100, electrical isolation is provided between them to reduce mutual interference. In particular, if two high-speed optocouplers 400 are provided, one between the first signal pin 200 and the bus signal pin 100, and the other between the second signal pin 300 and the bus signal pin 100, signal interference between the first signal pin 200 and the second signal pin 300 can also be reduced.

[0038] In related technologies, only ordinary optocouplers are used to isolate signals, which reduces the communication efficiency of the communication signal transmission circuit. However, in this application, a high-speed optocoupler 400 is used, which is beneficial to improving the communication efficiency between the first signal pin 200 and the bus signal pin 100, or to improving the communication efficiency between the second signal pin 300 and the bus signal pin 100.

[0039] In some embodiments of this application, please refer to Figure 2 , Figure 2 A schematic diagram of the framework structure of the communication signal transmission circuit provided in this embodiment is shown. The high-speed optocoupler 400 in this embodiment includes a light-emitting diode 410 and a photodiode 420. The high-speed optocoupler 400 is disposed between the first signal pin 200 and the bus signal pin 100. The light-emitting diode 410 is configured to emit light when the bus signal pin 100 receives the first bus signal, so as to conduct the photodiode 420. When the photodiode 420 is conducting, the first signal pin 200 outputs the first communication signal.

[0040] Alternatively, a high-speed optocoupler 400 may be disposed between the second signal pin 300 and the bus signal pin 100; the light-emitting diode 410 may be configured such that when the second communication signal is received at the second signal pin 300, the bus signal pin 100 outputs the second bus signal.

[0041] It should be explained that the photodiode 420 is a semiconductor device composed of a PN junction. Under forward bias, the charge carriers (electrons and holes) in the PN junction are directionally moved by the electric field, thereby forming a current and turning the diode on. During this process, the migration rate of the charge carriers is relatively fast, resulting in a short conduction response time for the diode. Especially when used as a photoelectric conversion element, the photodiode 420 exhibits high sensitivity and fast response speed, with rise and fall times both on the order of nanoseconds.

[0042] In related technologies, common optocouplers use phototransistors as photoelectric conversion elements. However, a phototransistor is a semiconductor device composed of three differently doped semiconductor regions (emitter, base, and collector). Its working principle is to adjust the amplification factor of the collector current by controlling the base current. When the base current changes, the collector current changes accordingly, but this change process takes a certain amount of time because charge carriers need to undergo a series of recombination and diffusion processes inside the transistor to reach a stable state. Therefore, the conduction response time of a phototransistor is relatively long. Especially when a phototransistor is used as a photoelectric conversion element, its response speed is slow, typically on the order of microseconds.

[0043] It is understood that the high-speed optocoupler 400 in this embodiment selects a photodiode 420 as the photoelectric conversion element, which is beneficial to speeding up the photoelectric signal conversion process, thereby improving the signal transmission speed between the first signal pin 200 / second signal pin 300 and the bus signal pin 100, so as to improve the communication efficiency of the communication signal transmission circuit.

[0044] In some embodiments of this application, please refer to Figure 3 , Figure 3 A schematic diagram of the communication signal transmission circuit provided in this embodiment is shown. The high-speed optocoupler 400 in this embodiment also includes a first switch, one end of which is grounded, and the other end is used to output a first signal when the first switch is turned on. If the high-speed optocoupler 400 is disposed between the second signal pin 300 and the bus signal pin 100, then when the first signal is output, the bus signal pin 100 outputs a second bus signal. If the high-speed optocoupler 400 is disposed between the second signal pin 300 and the bus signal pin 100, then when the first signal is output, the first signal pin 200 outputs a first communication signal.

[0045] It should be explained that when the high-speed optocoupler 400 receives an optical signal, it can output a specific electrical signal through the coordinated action of the photodiode 420 and the first switching element.

[0046] It is understandable that when the photodiode 420 is blocked, the collector of the first switching device can output a high-level signal. When the photodiode 420 is turned on, the collector and emitter of the first switching device are connected. Since the emitter is grounded, the signal at the collector is pulled down to a low-level signal (corresponding to the first signal).

[0047] In some embodiments, the first switching element is a transistor, the emitter of the first switching element is grounded, and the first switching element is configured to output a first signal at the collector of the first switching element when the photodiode 420 is turned on.

[0048] In some embodiments, the first switching element is an NPN transistor.

[0049] In some embodiments, the first switching element may also be other switching devices such as a MOSFET.

[0050] Please refer to the embodiments described in this application. Figure 3 The communication signal transmission circuit in this embodiment also includes a first power supply. When the photodiode 420 is turned on, the first power supply is connected to the control electrode of the first switching element to turn on the first switching element.

[0051] like Figure 3As shown, the first power supply can be either H5V connected to pin 7 of OP4 or +12V connected to pin 7 of OP3. It can be understood that after the photodiode 420 is turned on, the first power supply directly outputs a control signal to the control electrode of the first switching element to enable the first switching element to conduct.

[0052] In some embodiments, the high-speed optocoupler 400 may further include an AND gate, the output of which is connected to the control electrode of the first switch, the first input of which is connected to a photodiode 420, which is connected to a power supply Vcc, and the second input of which is connected to the first power supply. Specifically, after the light-emitting diode 410 emits light, the optical signal is transmitted to the photodiode 420 through the optical channel, and the photodiode 420 is turned on. When the second input is high, the AND gate outputs a high-level signal, which, after being inverted by the first switch, causes the high-speed optocoupler 400 to output a low-level signal.

[0053] In some embodiments, a pull-up resistor (e.g., ...) is provided between the first power supply and the photodiode 420. Figure 3 (R111 and R113 in the text).

[0054] Please refer to the embodiments described in this application. Figure 3 The communication signal transmission circuit of this embodiment also includes a second switch N1. One end of the second switch N1 is grounded, and the other end is connected to the bus signal pin 100. The control electrode of the second switch N1 is connected to the end of the first switch that outputs the first signal.

[0055] In some embodiments, the second switch N1 is a MOSFET, transistor, or similar switching device. Taking an NPN transistor as an example, the emitter of the second switch N1 is grounded, the base of the second switch N1 is connected to the collector of the first switch, and the collector of the second switch N1 is connected to bus signal pin 100. When the first signal (low-level signal) is output, the second switch N1 is turned off. When the first signal is not output, pin 6 will still output a fixed high-level signal to turn on the second switch N1, thereby realizing signal transmission.

[0056] Please refer to the embodiments described in this application. Figure 3 The communication signal transmission circuit of this embodiment also includes a second power supply, which is connected to the positive terminal of the light-emitting diode 410. When the high-speed optocoupler 400 is disposed between the first signal pin 200 and the bus signal pin 100, the negative terminal of the light-emitting diode 410 is connected to the bus signal pin 100. When the high-speed optocoupler 400 is disposed between the second signal pin 300 and the bus signal pin 100, the negative terminal of the light-emitting diode 410 is grounded.

[0057] It is understandable that the second power supply is a power supply device used to power the LED 410 so that the LED 410 emits light. For example... Figure 3 Connect the +12V pin of OP4 to pin 2 and the H5V pin of OP3 to pin 2.

[0058] In some embodiments of this application, the communication signal transmission circuit further includes a third switch N2, one end of which is grounded, the other end of which is connected to the second power supply, and the control electrode of which is connected to the second signal pin 300.

[0059] In some embodiments, the third switch N2 is a switching device such as a MOSFET or a transistor. Taking an NPN transistor as an example, the emitter of the third switch N2 is grounded, the base of the third switch N2 is connected to the second signal pin 300, and the collector of the third switch N2 is connected to the second power supply. When the second communication signal is input, the third switch N2 is turned on / off according to the level of the second communication signal. When the third switch N2 is on, the second power supply is disconnected to power the LED 410; when the third switch N2 is off, the second power supply powers the LED 410.

[0060] Please refer to the embodiments described in this application. Figure 3 In this embodiment, at least two high-speed optical couplers 400 are configured. The at least two high-speed optical couplers 400 include a first high-speed optical coupler 400 and a second high-speed optical coupler 400. The first high-speed optical coupler 400 is disposed between the first signal pin 200 and the bus signal pin 100, and the second high-speed optical coupler 400 is disposed between the second signal pin 300 and the bus signal pin 100.

[0061] It is understandable that by setting up the first high-speed optocoupler 400 and the second high-speed optocoupler 400, signal interference among the first signal pin 200, bus signal pin 100, and second signal pin 300 can be reduced. Furthermore, since the high-speed optocoupler 400 has a better response speed, it helps to improve the transmission rate of both transmitted and received signals. In addition, the high-speed optocoupler 400 also has superior voltage withstand performance and a higher common-mode rejection ratio, which helps to improve the suppression of interference signals and eliminate noise.

[0062] To better implement the communication signal transmission circuit in any of the above embodiments, this embodiment also provides a control board, on which the communication signal transmission circuit is integrated.

[0063] In some embodiments, the control board may be one or more of a display board, a drive board, a frequency converter board, and a fan drive board.

[0064] To better implement the control board in any of the above embodiments, this embodiment also provides a garment processing device based on the control board described above. The garment processing device includes the control board as described above.

[0065] In some embodiments, the garment processing device can be a household garment processing device such as a cleaning device.

[0066] In some embodiments, the clothing handling equipment is a washing machine, a dryer, etc.

[0067] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0068] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0069] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0070] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0071] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A communication signal transmission circuit, characterized in that, The communication signal transmission circuit includes: a bus signal pin, a first signal pin, a second signal pin, and at least one high-speed optocoupler. The first signal pin and / or the second signal pin are connected to the bus signal pin via the high-speed optocoupler element; The first signal pin is configured to output a first communication signal when the bus signal pin receives a first bus signal, and the bus signal pin is configured to output a second bus signal when the second signal pin receives a second communication signal.

2. The communication signal transmission circuit according to claim 1, characterized in that, The high-speed optocoupler includes a light-emitting diode and a photodiode; The high-speed optocoupler is disposed between the first signal pin and the bus signal pin; the light-emitting diode is configured to emit light when the bus signal pin receives the first bus signal to conduct the photodiode, and when the photodiode is conducted, the first signal pin outputs the first communication signal; Alternatively, the high-speed optocoupler element can be disposed between the second signal pin and the bus signal pin; The light-emitting diode is configured such that when the second communication signal is received at the second signal pin, the bus signal pin outputs the second bus signal.

3. The communication signal transmission circuit according to claim 2, characterized in that, The high-speed optocoupler also includes a first switch, one end of which is grounded and the other end is used to output a first signal when the first switch is turned on. When the first signal is output, the bus signal pin outputs the second bus signal; Alternatively, when the first signal is output, the first signal pin outputs the first communication signal.

4. The communication signal transmission circuit according to claim 3, characterized in that, The communication signal transmission circuit also includes a first power supply. When the photodiode is turned on, the first power supply is connected to the control electrode of the first switching element to turn on the first switching element.

5. The communication signal transmission circuit according to claim 4, characterized in that, The communication signal transmission circuit further includes a second switch, one end of which is grounded and the other end is connected to the bus signal pin. The control electrode of the second switch is connected to the end of the first switch that outputs the first signal.

6. The communication signal transmission circuit according to claim 3, characterized in that, The communication signal transmission circuit also includes a second power supply, which is connected to the positive terminal of the light-emitting diode; When the high-speed optocoupler is positioned between the first signal pin and the bus signal pin, the negative terminal of the light-emitting diode is connected to the bus signal pin; When the high-speed optocoupler is positioned between the second signal pin and the bus signal pin, the negative terminal of the light-emitting diode is grounded.

7. The communication signal transmission circuit according to claim 6, characterized in that, The communication signal transmission circuit further includes a third switch, one end of which is grounded, the other end of which is connected to the second power supply, and the control electrode of which is connected to the second signal pin.

8. The communication signal transmission circuit according to any one of claims 1 to 7, characterized in that, The high-speed optocoupler is configured to be at least two, including a first high-speed optocoupler and a second high-speed optocoupler. The first high-speed optocoupler is disposed between the first signal pin and the bus signal pin, and the second high-speed optocoupler is disposed between the second signal pin and the bus signal pin.

9. A control board, characterized in that, The communication signal transmission circuit as described in any one of claims 1 to 8 is integrated on the control board.

10. A garment processing device, characterized in that, The garment processing equipment includes the control panel as described in claim 9.

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