Heat transfer system and coating workshop

Abstract

The utility model discloses a heat transfer system and a coating workshop. The heat transfer system includes: a heating circuit in which a heating fluid circulates; a cooling circuit in which a cooling fluid circulates; and a heat exchange assembly coupled to the heating circuit and the cooling circuit for heat exchange between the heating circuit and the cooling circuit. The heat transfer system also includes a cooling device disposed in the heating circuit to cool the heating fluid.

Description

TECHNICAL FIELD

[0001] The present application relates generally to the field of vehicle engineering, and in particular, the present application relates to a heat transfer system and a painting plant. BACKGROUND

[0002] In the current thriving manufacturing industry, the painting process plays an extremely important role in improving product appearance, enhancing protection performance, and endowing products with special functions, and is widely used in many fields such as automobiles, machinery manufacturing, furniture, and electronic equipment. The painting plant, as the core carrier for realizing this process, its technical level and production efficiency are directly related to product quality and market competitiveness. Currently, the painting plant technology is constantly evolving, but still faces many difficult problems.

[0003] Energy consumption is particularly prominent in the painting plant. Inside the plant, different stations have completely different temperature requirements based on process requirements. For example, in the pre-treatment station, in order to ensure good adhesion and film quality of the paint, the environment temperature needs to be maintained within a certain range, which relies on heating devices to increase the temperature. In the subsequent electrocoating station, in order to timely process the workpiece, avoid the influence of high temperature on the coating performance, it is urgent to quickly reduce the temperature, and at this time the cooling device needs to be put into operation.

[0004] The conventional solution is to equip the heating and cooling stations with independent heating and cooling devices. However, this approach has great drawbacks. When the heating device is running, it consumes a large amount of electrical or thermal energy to increase the temperature, while the cooling device is consuming an equal or even greater amount of energy to reduce the temperature in another area. This not only causes a double increase in equipment purchase and maintenance costs, but more importantly, the two sets of devices cannot effectively recover and reuse energy, resulting in a large amount of wasted energy. In the current environment of rising energy costs and increasingly stringent environmental protection requirements, this energy waste has become a bottleneck restricting the efficient and sustainable development of the painting plant. SUMMARY

[0005] One of the objects of the present application is to provide a heat transfer system and a painting plant that overcomes at least one of the drawbacks of the prior art.

[0006] One object of the present application is to provide a heat transfer system and a painting plant that integrates heating and cooling in the painting plant to reduce energy consumption.

[0007] Another object of the present application is to provide a heat transfer system and a painting plant that can balance the operation of the heat transfer system.

[0008] According to a first aspect of the present application, a heat transfer system is provided, comprising:

[0009] a heating circuit in which a heating fluid circulates;

[0010] a cooling circuit in which a cooling fluid circulates; and

[0011] a heat exchange assembly coupled to the heating circuit and the cooling circuit to exchange heat between the heating circuit and the cooling circuit;

[0012] wherein the heat transfer system further comprises a cooling device disposed in the heating circuit to cool the heating fluid.

[0013] By providing the heat exchange assembly, the heat released in the cooling process of the equipment to be cooled in the painting workshop can be used to heat the equipment to be heated, the energy consumption of each station in the painting workshop is fully and efficiently utilized, energy waste is avoided, and the need for independent heating equipment and cooling equipment is eliminated, the structure is simplified, and the cost is further reduced. The provision of the cooling device can balance the operation of the heat transfer system and ensure the smooth operation of the heat transfer system.

[0014] In some embodiments of the heat transfer system, the heat exchange assembly contains a heat exchange medium configured to exchange heat with the heating fluid in the heating circuit to heat the heating fluid and exchange heat with the cooling fluid in the cooling circuit to cool the cooling fluid during operation of the heat transfer system.

[0015] The heat exchange medium in the heat exchange assembly can exchange heat between the heating circuit and the cooling circuit without the need for communication between the two, which is conducive to the separate control and operation of the heating circuit and the cooling circuit.

[0016] In some embodiments of the heat transfer system, the heating circuit includes a heating fluid inflow line and a heating fluid outflow line, and the cooling device is disposed on the heating fluid outflow line.

[0017] By disposing the cooling device on the heating fluid outflow line, the heat exchange between the heating circuit and the cooling circuit can be balanced, and the operation requirements at the heat exchange assembly can be met.

[0018] In some embodiments of the heat transfer system, the heat transfer system includes a pressure stabilizing tank disposed in the heating circuit and / or the cooling circuit. The pressure stabilizing tank is used to stabilize the pressure in the heating circuit and / or the cooling circuit.

[0019] In some embodiments of the heat transfer system, the heat transfer system includes a cooling fluid containing device disposed in the heating circuit downstream of the cooling device.

[0020] Heating fluid containment devices can be used to control the amount of heating fluid in the heating circuit, which is beneficial for controlling the heating operation of the equipment to be heated and the heat exchange operation of the heat exchange components.

[0021] In some embodiments of the heat transfer system, a cooling fluid replenishment device is provided in the cooling circuit, the cooling fluid replenishment device being configured to replenish the cooling fluid in the cooling circuit.

[0022] Cooling fluid replenishment devices can be used to replenish cooling fluid and ensure the normal operation of the cooling circuit.

[0023] In some embodiments of the heat transfer system, the cooling device is a cooling tower.

[0024] In some embodiments of the heat transfer system, the heat exchange component is a heat pump.

[0025] According to a second aspect of this application, a painting workshop is provided, comprising a device to be heated, a device to be cooled, and a heat transfer system as described above, the heat transfer system being disposed between the device to be heated and the device to be cooled and configured to perform heat transfer between the device to be heated and the device to be cooled.

[0026] In some embodiments of the painting workshop, the equipment to be heated includes pre-painting treatment equipment.

[0027] In some embodiments of the painting workshop, the equipment to be cooled includes an electrophoresis tank.

[0028] The heat transfer system and painting workshop according to this application can make full and efficient use of the energy consumption of each workstation in the painting workshop, avoid energy waste, eliminate the need for independent heating and cooling equipment, simplify the structure, and further reduce costs. Attached Figure Description

[0029] A better understanding of various aspects of this application will be achieved by reading the following detailed description in conjunction with the accompanying drawings, in which:

[0030] Figure 1 This is a schematic diagram of a heat transfer system according to some embodiments of this application;

[0031] Figure 2 These are schematic diagrams of heat transfer systems according to some embodiments of this application; and

[0032] Figure 3 This is a schematic diagram of a heat transfer system according to some embodiments of this application.

[0033] List of reference numerals

[0034] Heat transfer system 1; equipment to be heated 11; equipment to be cooled 12;

[0035] Heating circuit 20; heating fluid inlet pipe 21; heating fluid outlet pipe 22; arrow 211; arrow 221;

[0036] Cooling circuit 30; Cooling fluid inlet pipe 31; Cooling fluid outlet pipe 32; Arrow 311; Arrow 321;

[0037] Heat exchange component 40;

[0038] Cooling device 50;

[0039] Pressure stabilizing tank 61; heating fluid containing device 62; cooling fluid replenishment device 63. Detailed Implementation

[0040] The present application will now be described with reference to the accompanying drawings, which illustrate several embodiments of the present application. However, it should be understood that the present application can be presented in many different ways and is not limited to the embodiments described below; in fact, the embodiments described below are intended to make the disclosure of the present application more complete and to fully illustrate the scope of protection of the present application to those skilled in the art. It should also be understood that the embodiments disclosed herein can be combined in various ways to provide more additional embodiments.

[0041] It should be understood that the same reference numerals denote the same elements in all the accompanying drawings. For clarity, the dimensions of certain features may be modified in the drawings.

[0042] It should be understood that the terminology used in this specification is for describing specific embodiments only and is not intended to limit this application. All terms used in this specification (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. For the sake of brevity and / or clarity, well-known functions or structures may not be described in detail.

[0043] Unless otherwise specified, the singular forms “a,” “the,” and “the” used in this specification include the plural forms. The terms “comprising,” “including,” and “containing” used in this specification indicate the presence of the claimed feature but do not exclude the presence of one or more other features. The term “and / or” used in this specification includes any and all combinations of one or more of the related listed items. The terms “between X and Y” and “between approximately X and Y” used in this specification should be interpreted as including both X and Y. The term “between approximately X and Y” used in this specification means “between approximately X and approximately Y,” and the term “from approximately X to Y” used in this specification means “from approximately X to approximately Y.”

[0044] In the specification, when an element is described as being "on," "attached," "connected," "coupled," or "in contact" with another element, the element can be directly located on, attached to, connected to, coupled to, or in contact with the other element, or there may be intermediate elements present. Conversely, when an element is described as being "directly" located on, directly attached to, directly connected to, directly coupled to, or directly in contact with another element, no intermediate elements are present. In the specification, the description of a feature being arranged "adjacent" to another feature can mean that a feature has a portion overlapping with the adjacent feature or a portion located above or below the adjacent feature.

[0045] In the specification, spatial relation terms such as "up," "down," "left," "right," "front," "back," "high," and "low" describe the relationship between one feature and another in the accompanying drawings. It should be understood that spatial relation terms include not only the orientation shown in the drawings but also the different orientations of the device during use or operation. For example, when the device in the drawings is inverted, a feature previously described as "below" other features can now be described as "above" other features. The device can also be oriented in other ways (rotated 90 degrees or in other orientations), in which case the relative spatial relationships will be explained accordingly.

[0046] In today's booming modern manufacturing industry, coating processes play a crucial role in enhancing product appearance, improving protective performance, and endowing products with special functions, permeating numerous fields such as automobiles, machinery manufacturing, furniture, and electronic equipment. As the core platform for realizing this process, the coating workshop's technological level and production efficiency directly impact product quality and market competitiveness. Currently, coating workshop technology is constantly evolving, but it still faces many challenging problems.

[0047] Energy consumption is a particularly prominent issue in painting workshops. Within these workshops, different workstations have drastically different temperature requirements based on their respective processes. For example, at the pre-coating treatment station, maintaining the ambient temperature within a specific range is often necessary to ensure good paint adhesion and film quality, which relies on heating devices to raise the temperature. However, at the subsequent electrophoretic coating application station, rapid temperature reduction is urgently needed to allow for timely processing of the workpiece and prevent high temperatures from affecting coating performance; in this case, cooling devices must be put into operation.

[0048] The conventional approach is to equip the heating and cooling stations with separate heating and cooling devices. This not only increases both the cost of equipment purchase and maintenance, but more importantly, the two systems operate independently, making it impossible to effectively recover and reuse energy, resulting in a significant waste of energy.

[0049] To address this issue, this application proposes integrating heating and cooling operations in a painting workshop. Heating requires heat absorption, while cooling releases heat. By utilizing the heat released during cooling for heating, this heat can be fully utilized without waste, resulting in significant energy savings.

[0050] Vehicle painting workshops are typically used for painting vehicle bodies. In a vehicle painting workshop, equipment to be heated typically includes, for example, pre-coating treatment equipment, while equipment to be cooled includes, for example, an electrophoresis tank. Pre-coating treatment equipment requires heating during operation, such as heating its bath solution, to facilitate subsequent operations. Electrophoresis tanks generate a large amount of heat during operation and therefore require cooling. The following description is primarily directed to vehicle painting workshops, but those skilled in the art will understand that the basic principles of this application can also be applied to other painting workshops.

[0051] The following will describe in detail, with reference to the accompanying drawings, some embodiments of a heat transfer system and a painting workshop according to this application, wherein the drawings are merely schematic.

[0052] According to some embodiments of this application, a heat transfer system 1 is provided, which may include: a heating circuit 20 in which a heating fluid circulates; a cooling circuit 30 in which a cooling fluid circulates; and a heat exchange assembly 40, which may be connected to the heating circuit 20 and the cooling circuit 30 to perform heat exchange between the heating circuit 20 and the cooling circuit 30. The heat transfer system 1 also includes a cooling device 50, which may be disposed in the heating circuit 20 to cool the heating fluid.

[0053] refer to Figure 1 The diagram illustrates a heat transfer system 1 according to some embodiments of the present application. The heat transfer system 1 is used to transfer heat between one or more heating stations and one or more cooling stations in a painting workshop, so as to transfer the heat released by the cooling station during cooling to the heating station for heating.

[0054] The heat transfer system 1 may include a heating circuit 20, a cooling circuit 30, and a heat exchange assembly 40 disposed between the heating circuit 20 and the cooling circuit 30. A heating fluid circulates in the heating circuit 20, and the device 11 to be heated is connected to the heating circuit 20 to be heated by the heating fluid in the heating circuit 20. A cooling fluid circulates in the cooling circuit 30, and the device 12 to be cooled is connected to the cooling circuit 30 to be cooled by the cooling fluid in the cooling circuit 30.

[0055] The heat exchange assembly 40 can be connected to the heating circuit 20 and the cooling circuit 30 to facilitate heat exchange between them. Specifically, it transfers heat released by the cooling circuit 30 during the cooling of the device 12 to the heating circuit 20, thereby heating the device 11 located on the heating circuit 20. In some embodiments, the heating circuit 20 and the cooling circuit 30 are not connected; heat exchange occurs solely through the heat exchange assembly 40. The heating fluid does not flow to the cooling circuit 30, and the cooling fluid does not flow to the heating circuit 20. According to some embodiments, the heat exchange assembly 40 can be a heat pump or any other suitable heat exchange device known in the art.

[0056] like Figure 1 As shown, the heating circuit 20 may include a heating fluid inlet line 21 and a heating fluid outlet line 22. After the heating fluid is heated in the heat exchange assembly 40, it flows through the heating fluid inlet line 21 in the direction shown by arrow 211 (solid arrow) to the device to be heated 11, so as to heat the device to be heated 11. After that, the temperature of the heating fluid drops, and then it flows through the heating fluid outlet line 22 in the direction shown by arrow 221 (dashed arrow) back to the heat exchange assembly 40 to be heated again, and so on.

[0057] The cooling circuit 30 may include a cooling fluid inlet line 31 and a cooling fluid outlet line 32. After the cooling fluid is cooled in the heat exchange assembly 40, it flows through the cooling fluid inlet line 31 in the direction shown by arrow 311 (hollow arrow) to the device 12 to be cooled, so as to cool the device 12. The cooling process releases heat, causing the temperature of the cooling fluid to rise. Then, it flows through the cooling fluid outlet line 32 in the direction shown by arrow 321 (solid arrow) back to the heat exchange assembly 40 to be cooled again, and so on.

[0058] According to embodiments of this application, the heat transfer system 1 may further include a cooling device 50, which may be disposed in the heating circuit 20 to cool the heating fluid. In painting workshops, the demand for cooling is often greater than the demand for heating, resulting in the heat released during cooling potentially exceeding the heat required for heating. In such cases, a cooling device 50 may be disposed in the heating circuit 20 to cool the heating fluid in the heating circuit 20, thereby balancing the heat exchange between the heating circuit 20 and the cooling circuit 30. According to some embodiments, the cooling device 50 may be a cooling tower or any other suitable cooling device known in the art.

[0059] By installing the heat exchange component 40, the heat released during the cooling process of the equipment to be cooled in the painting workshop can be used to heat the equipment to be heated, making full and efficient use of the energy consumption of each workstation in the painting workshop, avoiding energy waste, and eliminating the need for independent heating and cooling equipment, simplifying the structure and further reducing costs. The installation of the cooling device can balance the operation of the heat transfer system and ensure the stable operation of the heat transfer system.

[0060] According to some embodiments of this application, the heat exchange assembly 40 may include a heat exchange medium that, during operation of the heat transfer system 1, can be configured to exchange heat with a heating fluid in the heating circuit 20 to heat the heating fluid, and with a cooling fluid in the cooling circuit 30 to cool the cooling fluid.

[0061] The heat exchange assembly 40 enables heat exchange between the heating circuit 20 and the cooling circuit 30 via a heat exchange medium. When the cooling fluid in the cooling circuit 30 circulates to the heat exchange assembly 40, it exchanges heat with the heat exchange medium, transferring heat to the medium and raising its temperature while the cooling fluid itself cools down. The cooled fluid can then be used to cool the device 12. When the heating fluid in the heating circuit 20 circulates to the heat exchange assembly 40, it exchanges heat with the heat exchange medium, receiving heat from it and raising its temperature while the medium cools down. The heated fluid can then be used to heat the device 11. In this process, the heat exchange medium in the heat exchange assembly 40 exchanges heat with the cooling fluid in the cooling circuit 30 to raise its temperature, and with the heating fluid in the heating circuit 20 to lower its temperature, repeating this cycle to achieve heat exchange between the heating circuit 20 and the cooling circuit 30.

[0062] The heat exchange medium in the heat exchange assembly 40 can achieve heat exchange between the heating circuit 20 and the cooling circuit 30 without them needing to be connected, which is beneficial for the independent control and operation of the heating circuit 20 and the cooling circuit 30.

[0063] According to some embodiments of this application, the heating circuit 20 may include a heating fluid inflow pipeline 21 and a heating fluid outflow pipeline 22, and the cooling device 50 may be disposed on the heating fluid outflow pipeline 22.

[0064] As described above, the heating circuit 20 may include a heating fluid inlet line 21 and a heating fluid outlet line 22. After the heating fluid is heated in the heat exchange assembly 40, it flows through the heating fluid inlet line 21 in the direction shown by arrow 211 (solid arrow) to the device to be heated 11 so as to heat the device to be heated 11. After that, the temperature of the heating fluid drops, and then it flows through the heating fluid outlet line 22 in the direction shown by arrow 221 (dashed arrow) back to the heat exchange assembly 40 to be heated again, and so on.

[0065] In some embodiments, a cooling device 50 may be provided on the heating fluid inflow line 21 to cool the heated fluid flowing out of the heat exchange assembly 40 and whose temperature has increased, so that the temperature of the heated fluid flowing through the heating fluid inflow line 21 to the device to be heated 11 is reduced. On the one hand, this balances the heat exchange between the heating circuit 20 and the cooling circuit 30, and on the other hand, it meets the heating requirements of the device to be heated 11 in some cases, for example, the temperature of the heating fluid can be reduced to meet the temperature requirements of the heating device 11.

[0066] In some embodiments, a cooling device 50 may be provided on the heating fluid outlet line 22 to cool the heating fluid that has been heated to the device to be heated and whose temperature has decreased. This further reduces the temperature of the heating fluid flowing through the heating fluid outlet line 22 to the heat exchange assembly 40, balancing the heat exchange between the heating circuit 20 and the cooling circuit 30, and in some cases, meeting the operational requirements of the heat exchange assembly 40. For example, if the heat exchange assembly 40 is a heat pump, if the temperature of the heating fluid entering the heat pump is too high, it may be impossible to further increase the temperature of the heating fluid through heat exchange. Therefore, by reducing the temperature of the heating fluid circulating in the heating circuit 20 to the heat exchange assembly 40, the normal operation of the heat exchange assembly 40 can be ensured.

[0067] By placing the cooling device 50 on the heating fluid outlet pipeline 22, the heat exchange between the heating circuit 20 and the cooling circuit 30 can be balanced, and the operational requirements of the heat exchange assembly 40 can be met.

[0068] According to some embodiments of this application, the heat transfer system 1 may include a pressure stabilizing tank 61, which may be disposed in the heating circuit 20 and / or the cooling circuit 30.

[0069] refer to Figure 2The illustrated diagram shows a heat transfer system 1 according to some embodiments of this application. In the illustrated embodiment, a pressure stabilizing tank 61 is provided in both the heating circuit 20 and the cooling circuit 30; however, those skilled in the art will understand that the pressure stabilizing tank 61 may also be provided only in the heating circuit 20 or only in the cooling circuit 30. The pressure stabilizing tank 61 is used to stabilize the pressure in the heating circuit 20 and / or the cooling circuit 30, and may be provided in the heating circuit 20 between the cooling device 50 and the heat exchange assembly 40, or in the cooling circuit between the device 12 to be cooled and the heat exchange assembly 40.

[0070] According to some embodiments of this application, the heat transfer system 1 may include a heating fluid containment device 62, which may be disposed downstream of the cooling device 50 in the heating circuit 20.

[0071] refer to Figure 3 The illustration shows a schematic diagram of a heat transfer system 1 according to some embodiments of this application. When the cooling device 50 is provided on the heating fluid inflow line 21 of the heating circuit 20, the heating fluid receiving device 62 is also provided on the heating fluid inflow line 21, located between the cooling device 50 and the device to be heated 11. In the illustrated embodiment, when the cooling device 50 is provided on the heating fluid outflow line 22 of the heating circuit 20, the heating fluid receiving device 62 is also provided on the heating fluid outflow line 22, located between the cooling device 50 and the heat exchange assembly 40. After being cooled by the cooling device 50, the heating fluid flows into the heating fluid receiving device 62 and then flows out from the heating fluid receiving device 62 to the device to be heated 11 or the heat exchange assembly 40.

[0072] The heating fluid containment device 62 can be used to control the amount of heating fluid in the heating circuit 20, which is beneficial for controlling the heating operation of the device to be heated 11 and the heat exchange operation of the heat exchange component 40.

[0073] According to some embodiments of this application, a cooling fluid replenishment device 63 may be provided in the cooling circuit 30, which can be configured to replenish the cooling fluid in the cooling circuit 30.

[0074] In painting workshops, the cooling process may result in the consumption of some cooling fluid, such as through evaporation, reducing the amount of cooling fluid in the cooling circuit. This is detrimental to the continuous operation of the cooling process. In some embodiments, such as Figure 3As shown, a cooling fluid replenishment device 63 can be installed in the cooling circuit 30 to replenish the cooling fluid and compensate for any losses in the cooling circuit 30. In the illustrated embodiment, the cooling fluid replenishment device 63 is configured to communicate with a pressure stabilizing tank 61 in the cooling circuit 30, allowing the replenished cooling fluid to flow into the pressure stabilizing tank 61 and subsequently replenish the cooling circuit 30. Those skilled in the art will understand that the cooling fluid replenishment device 63 can also be installed at any other suitable location within the cooling circuit 30. The cooling fluid replenishment device 63 can be connected to a water source within the painting workshop, directly replenishing the cooling circuit 30 with fluid from the water source. Alternatively, the cooling fluid replenishment device 63 can be a storage device for storing cooling fluid, replenishing the cooling circuit 30 as needed.

[0075] The cooling fluid replenishment device 63 can be used to replenish the cooling fluid to ensure the normal operation of the cooling circuit 30.

[0076] According to some embodiments of this application, a painting workshop is provided, which may include a heating device 11, a cooling device 12, and a heat transfer system 1 as described above. The heat transfer system 1 is disposed between the heating device 11 and the cooling device 12 and is configured to perform heat transfer between the heating device 11 and the cooling device 12.

[0077] like Figures 1 to 3 As shown above, the heat transfer system 1 is disposed between the device to be heated 11 and the device to be cooled 12. Heat exchange is performed between the heating circuit 20 and the cooling circuit 30 via the heat exchange assembly 40, thereby achieving heat transfer between the device to be heated 11 and the device to be cooled 12. The device to be heated 11 may include pre-treatment equipment, such as a pre-treatment bath solution that can be heated by a heating fluid in the heating circuit 20. The device to be cooled 12 includes an electrophoresis tank, and the electrophoresis tank can be cooled by a cooling fluid in the cooling circuit 30 absorbing the heat released by the electrophoresis tank during operation.

[0078] The heat transfer system and painting workshop according to this application can make full and efficient use of the energy consumption of each workstation in the painting workshop, avoid energy waste, eliminate the need for independent heating and cooling equipment, simplify the structure, and further reduce costs.

[0079] While exemplary embodiments of this application have been described, those skilled in the art will understand that various changes and modifications can be made to the exemplary embodiments of this application without departing from the spirit and scope thereof. Therefore, all changes and modifications are included within the scope of protection of this application as defined by the claims. This application is defined by the appended claims, and equivalents of those claims are also included.

Claims

1. A heat transfer system (1), characterized in that, The heat transfer system (1) includes: Heating circuit (20), in which heating fluid circulates; Cooling circuit (30), in which cooling fluid circulates; and A heat exchange assembly (40) is connected to the heating circuit (20) and the cooling circuit (30) to exchange heat between the heating circuit (20) and the cooling circuit (30); The heat transfer system (1) further includes a cooling device (50) disposed in the heating circuit (20) to cool the heating fluid.

2. The heat transfer system (1) according to claim 1, characterized in that, The heat exchange assembly (40) includes a heat exchange medium that, during operation of the heat transfer system (1), is configured to exchange heat with a heating fluid in the heating circuit (20) to heat the heating fluid, and to exchange heat with a cooling fluid in the cooling circuit (30) to cool the cooling fluid.

3. The heat transfer system (1) according to claim 1, characterized in that, The heating circuit (20) includes a heating fluid inflow pipeline (21) and a heating fluid outflow pipeline (22), and the cooling device (50) is disposed on the heating fluid outflow pipeline (22).

4. The heat transfer system (1) according to claim 1, characterized in that, The heat transfer system (1) includes a pressure stabilizing tank (61), which is disposed in the heating circuit (20) and / or the cooling circuit (30).

5. The heat transfer system (1) according to claim 1, characterized in that, The heat transfer system (1) includes a cooling fluid containment device (62) disposed downstream of the cooling device (50) in the heating circuit (20).

6. The heat transfer system (1) according to claim 1, characterized in that, A cooling fluid replenishment device (63) is provided in the cooling circuit (30), and the cooling fluid replenishment device (63) is configured to replenish the cooling fluid in the cooling circuit (30).

7. The heat transfer system (1) according to claim 1, characterized in that, The cooling device (50) is a cooling tower.

8. The heat transfer system (1) according to claim 1, characterized in that, The heat exchange component (40) is a heat pump.

9. A painting workshop, characterized in that, The painting workshop includes a heating device (11), a cooling device (12), and a heat transfer system (1) according to any one of claims 1 to 8, the heat transfer system (1) being disposed between the heating device (11) and the cooling device (12) and configured to perform heat transfer between the heating device (11) and the cooling device (12).

10. The painting workshop according to claim 9, characterized in that, The equipment to be heated (11) includes a pre-coating treatment device.

11. The painting workshop according to claim 9, characterized in that, The cooling equipment (12) includes an electrophoresis tank.

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