SMT (Surface Mount Technology) multiple patch detection jig

Abstract

The utility model discloses an SMT multiple patch detection jig, including: placing plate and external display equipment, the top of placing plate is provided with placing groove and main chute, the bottom of placing plate is provided with bottom hole, the top of placing plate is fixedly connected with fixed mount. During detection, the main electric rod, the upper electric rod and the lower electric rod are started, so that the measuring block moves above the printed circuit board, the micro camera transmits an image to an external display device in the moving process, infrared rays emitted by the infrared emission sensor irradiate the photosensitive plate, and the patch height can be measured. In the up-and-down and left-and-right moving process of the infrared emission sensor, patches on the printed circuit board are measured one by one, and measurement results are displayed on external display equipment, so that observation and detection by operators are facilitated, the omission ratio is reduced, and the detection efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit board testing technology, specifically to an SMT multi-layer surface mount testing fixture. Background Technology

[0002] SMT (Surface Mount Technology) is a surface mounting technology performed on printed circuit boards, and it is one of the most popular technologies and processes in the electronics assembly industry. During production, it occasionally happens that multiple SMT components are stacked together in one mounting area. If these are not detected and selected in time and are directly applied to the product, it may cause some functions of the product to malfunction or fail, affecting the yield rate of the entire batch.

[0003] Because the thickness of the patches on printed circuit boards varies, it is difficult to use a uniform inspection fixture for inspection. Currently, the inspection of such multi-patch devices is mostly done manually by eye or by visual inspection with a microscope. This is not only inefficient, but also prone to missed inspections due to fatigue during long-term visual inspection. Utility Model Content

[0004] The purpose of this invention is to provide an SMT multi-layer surface mount inspection fixture. During inspection, the main electric rod, upper electric rod, and lower electric rod are activated to move the measuring block above the printed circuit board. During the movement, a miniature camera transmits the image to an external display device. Simultaneously, infrared light emitted by an infrared emitting sensor illuminates the photosensitive board, allowing the height of the surface mount to be measured. As the infrared emitting sensor moves up, down, left, and right, each surface mount on the printed circuit board is measured, and the measurement results are displayed on the external display device. This not only facilitates operator observation and inspection but also reduces the missed detection rate and improves inspection efficiency.

[0005] To achieve the above objectives, an SMT multi-layer placement inspection fixture is provided, comprising: a placement board and an external display device. The placement board has a placement slot and a main slide groove on its top, and a bottom hole on its bottom. A fixing frame is fixedly connected to the top of the placement board. Two main electric rods are fixedly connected to the left side wall of the fixing frame, symmetrically distributed front and back on the fixing frame. A movable frame is fixedly connected to the left side wall of each main electric rod. A main slider is fixedly connected to the bottom of the movable frame. A main slide block is fixedly connected to the inner rear side wall of the movable frame. An upper electric rod is provided, with a movable block fixedly connected to its front side wall. An upper slider is fixedly connected to the top of the movable block, and a lower electric rod is fixedly connected to its bottom. A measuring block is fixedly connected to the bottom of the lower electric rod. An infrared emission sensor and a miniature camera are fixedly connected to the front side wall of the measuring block. A photosensitive plate is fixedly connected to the inner front side wall of the moving frame, and multiple photosensitive sensors are fixedly connected to the photosensitive plate in a matrix arrangement. An electronic scale is fixedly connected to the photosensitive plate.

[0006] According to the SMT multi-piece placement inspection fixture, both the fixed frame and the movable frame are inverted "U" shape, and there are two main sliders, which are symmetrically distributed at the bottom of the movable frame. The main sliders are located inside the main slide groove.

[0007] According to the SMT multi-piece placement inspection fixture, the upper sliding groove is provided on the inner top surface of the moving frame, and the upper sliding block is located inside the upper sliding groove.

[0008] According to the SMT multi-layer placement inspection fixture, an air pump is fixedly connected to the bottom of the placement plate, and the top input end of the air pump communicates with the bottom hole.

[0009] According to the aforementioned SMT multi-layer surface mount inspection fixture, the miniature camera, photosensitive plate, and electronic ruler are all electrically connected to an external display device.

[0010] According to the aforementioned SMT multi-layer surface mount inspection fixture, the infrared emission sensor and the photosensitive plate are arranged opposite each other.

[0011] According to the aforementioned SMT multi-layer placement inspection fixture, the bottom hole is located inside the placement groove, and the number of main slides is set to two, which are symmetrically distributed on the front and rear sides of the placement groove.

[0012] According to the aforementioned SMT multi-layer placement inspection fixture, the electronic ruler is a right-angle ruler.

[0013] Compared with existing technologies, the beneficial effects of this utility model are as follows: By setting up a fixed frame, a main electric rod, a moving frame, a main slider, an upper electric rod, a moving block, an upper slider, a lower electric rod, a measuring block, an infrared emitting sensor, a miniature camera, a photosensitive plate, a photosensitive sensor, and an electronic scale, during detection, the main electric rod, the upper electric rod, and the lower electric rod are activated, causing the measuring block to move above the printed circuit board. During the movement, the miniature camera transmits the image to an external display device, while the infrared light emitted by the infrared emitting sensor illuminates the photosensitive plate, allowing the patch height to be measured. During the up-down-left-right movement of the infrared emitting sensor, each patch on the printed circuit board is measured, and the measurement results are displayed on the external display device. This not only facilitates operator observation and detection but also reduces the missed detection rate and improves detection efficiency.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0016] Figure 1 This is a front view of an SMT multi-layer surface mount inspection fixture according to the present invention;

[0017] Figure 2 This is a side view of an SMT multi-chip placement inspection fixture according to the present invention;

[0018] Figure 3 This is a structural diagram of a movable frame for an SMT multi-chip placement inspection fixture according to the present invention;

[0019] Figure 4 This is a structural diagram of the measuring block of an SMT multi-chip placement inspection fixture according to the present invention;

[0020] Figure 5 This is a structural diagram of the photosensitive plate of an SMT multi-layer surface mount testing fixture according to the present invention.

[0021] In the diagram: 1. Placement plate; 2. Placement slot; 3. Main slide rail; 4. Bottom hole; 5. Fixing frame; 6. Main electric rod; 7. Moving frame; 8. Main slider; 9. Upper electric rod; 10. Moving block; 11. Upper slider; 12. Lower electric rod; 13. Measuring block; 14. Infrared emission sensor; 15. Miniature camera; 16. Photosensitive plate; 17. Photosensitive sensor; 18. Electronic ruler; 19. Vacuum pump. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figures 1-5 This utility model provides a technical solution: an SMT multi-layer surface mount inspection fixture, comprising: a placement plate 1 and an external display device. The top of the placement plate 1 is provided with a placement groove 2 and a main slide groove 3. The bottom of the placement plate 1 is provided with a bottom hole 4 located inside the placement groove 2. Two main slide grooves 3 are provided, symmetrically distributed on the front and rear sides of the placement groove 2. A fixing frame 5 is fixedly connected to the top of the placement plate 1. Two main electric rods 6 are fixedly connected to the left side wall of the fixing frame 5, symmetrically distributed on the fixing frame 5. A movable frame 7 is fixedly connected to the left side wall of the movable rod 6. A main slider 8 is fixedly connected to the bottom of the movable frame 7. An upper electric rod 9 is fixedly connected to the inner rear side wall of the movable frame 7. A movable block 10 is fixedly connected to the front side wall of the upper electric rod 9. An upper slider 11 is fixedly connected to the top of the movable block 10. A lower electric rod 12 is fixedly connected to the bottom of the movable block 10. A measuring block 13 is fixedly connected to the bottom of the lower electric rod 12. When the main electric rod 6, the upper electric rod 9, and the lower electric rod 12 are activated, the measuring block 13 can move freely above the printed circuit board. The front of the measuring block 13... An infrared emitting sensor 14 and a miniature camera 15 are fixedly connected to the side wall. The miniature camera 15 is used to detect the patch. A photosensitive plate 16 is fixedly connected to the front side wall inside the moving frame 7. A photosensitive sensor 17 is fixedly connected to the photosensitive plate 16. Multiple photosensitive sensors 17 are arranged in a matrix on the photosensitive plate 16. The infrared emitting sensor 14 is arranged opposite to the photosensitive plate 16. An electronic scale 18 is fixedly connected to the photosensitive plate 16. The electronic scale 18 is a right-angle scale. The infrared light emitted by the infrared emitting sensor 14 illuminates the patch. When the infrared light moves out of the patch and shines on the photosensitive plate 16, the electronic scale 18 can measure the current height of the patch. The miniature camera 15, the photosensitive plate 16, and the electronic scale 18 are all electrically connected to an external display device. When the measuring block 13 moves freely above the printed circuit board, the infrared light emitted by the infrared emission sensor 14 measures the patches on the printed circuit board one by one, and measures the height of the currently illuminated patch on the photosensitive plate 16. This height is displayed on the external display along with the miniature camera 15, which is convenient for operators to observe and detect, reduces the missed detection rate, and improves detection efficiency.

[0024] Both the fixed frame 5 and the movable frame 7 are inverted "U" shape. There are two main sliders 8, which are symmetrically distributed at the bottom of the movable frame 7. The main sliders 8 are located inside the main slide groove 3. The upper slide groove is provided on the top surface inside the movable frame 7, and the upper slider 11 is located inside the upper slide groove.

[0025] An air pump 19 is fixedly connected to the bottom of the placement plate 1. The top input end of the air pump 19 is connected to the bottom hole 4. When the printed circuit board is placed inside the placement slot 2, the air pump 19 is started to remove the air from the bottom of the printed circuit board, so that the printed circuit board is tightly attached to the inside of the placement slot 2.

[0026] Working principle: The printed circuit board is placed inside the placement slot 2. The air pump 19 is started to remove the air from the bottom of the printed circuit board, so that the printed circuit board is tightly attached to the inside of the placement slot 2. When the main electric rod 6, the upper electric rod 9 and the lower electric rod 12 are started, the measuring block 13 can move freely above the printed circuit board. When the measuring block 13 moves freely above the printed circuit board, the infrared emission sensor 14 emits infrared light to measure the patches on the printed circuit board one by one, and measures the height of the currently irradiated patch on the photosensitive plate 16. The height is displayed on the external display along with the miniature camera 15, which is convenient for operators to observe and detect, reduces the missed detection rate and improves detection efficiency.

[0027] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. An SMT multi-layer placement inspection fixture, comprising: The placement plate (1) and the external display device are characterized in that the top of the placement plate (1) is provided with a placement groove (2) and a main slide groove (3), the bottom of the placement plate (1) is provided with a bottom hole (4), the top of the placement plate (1) is fixedly connected to a fixing frame (5), the left side wall of the fixing frame (5) is fixedly connected to a main electric rod (6), the number of the main electric rods (6) is set to two, and they are symmetrically distributed on the fixing frame (5) front and back, the left side wall of the main electric rod (6) is fixedly connected to a moving frame (7), the bottom of the moving frame (7) is fixedly connected to a main slider (8), the inner rear side wall of the moving frame (7) is fixedly connected to an upper electric rod (9), and the front side wall of the upper electric rod (9) is fixedly connected to a main slide groove (8). A movable block (10) is fixedly connected to the top of the movable block (10), an upper slider (11) is fixedly connected to the top of the movable block (10), a lower electric rod (12) is fixedly connected to the bottom of the movable block (10), a measuring block (13) is fixedly connected to the bottom of the lower electric rod (12), an infrared emission sensor (14) and a miniature camera (15) are fixedly connected to the front side wall of the measuring block (13), a photosensitive plate (16) is fixedly connected to the inner front side wall of the movable frame (7), a photosensitive sensor (17) is fixedly connected to the photosensitive plate (16), a plurality of photosensitive sensors (17) are provided and distributed in a matrix on the photosensitive plate (16), and an electronic scale (18) is fixedly connected to the photosensitive plate (16).

2. The SMT multi-layer placement inspection fixture as described in claim 1, characterized in that: Both the fixed frame (5) and the movable frame (7) are inverted "U" shape. There are two main sliders (8), which are symmetrically distributed at the bottom of the movable frame (7). The main sliders (8) are located inside the main slide groove (3).

3. The SMT multi-layer placement inspection fixture as described in claim 1, characterized in that: The upper sliding groove is provided on the inner top surface of the movable frame (7), and the upper sliding block (11) is located inside the upper sliding groove.

4. The SMT multi-layer placement inspection fixture as described in claim 1, characterized in that: A vacuum pump (19) is fixedly connected to the bottom of the placement plate (1), and the top input end of the vacuum pump (19) is connected to the bottom hole (4).

5. The SMT multi-layer placement inspection fixture as described in claim 1, characterized in that: The miniature camera (15), photosensitive plate (16), and electronic ruler (18) are all electrically connected to an external display device.

6. The SMT multi-layer placement inspection fixture as described in claim 1, characterized in that: The infrared emitting sensor (14) and the photosensitive plate (16) are arranged opposite each other.

7. The SMT multi-layer placement inspection fixture as described in claim 1, characterized in that: The bottom hole (4) is located inside the placement groove (2), and there are two main sliding grooves (3), which are symmetrically distributed on the front and back sides of the placement groove (2).

8. The SMT multi-layer placement inspection fixture as described in claim 1, characterized in that: The electronic ruler (18) is a right-angle ruler.

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