Heat dissipation system and projection equipment
By separating the heat dissipation system from the projection device and using heat-conducting components, water-cooling modules, and liquid-cooled circulation pipes, the problems of large size and high noise of the projection device are solved, achieving high brightness output and a quiet user experience.
Patent Information
- Application Number
- CN202520345488.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-02-28
AI Technical Summary
Existing heat dissipation solutions for projection devices result in excessively large device sizes, high noise levels, and reduced brightness in high-temperature environments, making it difficult to balance miniaturization, quiet operation, and high-brightness output.
The heat dissipation system is separated from the projection device body. It uses heat-conducting components, a water-cooled radiator module and a liquid-cooled circulation pipeline. It uses a cooling fan and a liquid pump for efficient heat dissipation. A leak-proof agent is added to the coolant to prevent leakage. The liquid pump is located outside the device.
This achieves reduced device size, lower noise, improved user experience, and ensured heat dissipation efficiency and device stability while maintaining high brightness specifications.
Smart Images

Figure CN223784615U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of projection equipment technology, specifically to a heat dissipation system and a projection device. Background Technology
[0002] As projection devices increasingly demand higher brightness, the temperature of the light source and DMD area rises sharply, leading to the risk of burn-out of the optical engine and a shortened lifespan. Currently, the industry mainly adopts a combination of active and passive heat dissipation methods. This involves reducing thermal resistance through a thermally conductive medium, transferring heat to the copper substrate, then rapidly conducting it to the heat sink fins via heat pipes, and finally having the heat dissipated by a fan.
[0003] However, this heat dissipation solution has significant drawbacks: the heat dissipation components are placed directly around the optical engine, resulting in an excessively large overall device size; simultaneously, the noise generated by the high-speed fan directly impacts the user experience. Furthermore, in high ambient temperatures, the device typically reduces brightness through software-adjusted power to protect the optical engine, but this directly affects the projection device's output brightness and the user experience. Utility Model Content
[0004] The purpose of this invention is to provide a heat dissipation system and a projection device that can separate the heat dissipation system from the projection device body, thereby reducing the size of the projection device, lowering the noise of the projection device, and improving the user experience.
[0005] To achieve the above objectives, according to a first aspect of the present invention, a heat dissipation system is provided, comprising:
[0006] A heat-conducting component is disposed inside the projection device body, including a heat-conducting medium disposed at the heat source of the projection device body and a copper tube substrate module for conducting heat from the heat source.
[0007] A water-cooling radiator module is installed outside the camera body and includes heat dissipation fins installed inside the water-cooling radiator module and a cooling fan installed on one side of the heat dissipation fins.
[0008] A liquid cooling circulation pipeline is installed between the heat-conducting component and the heat dissipation water cooling module to conduct heat from the inside of the projection device body to the outside of the projection device body for heat dissipation.
[0009] Optionally, the liquid cooling circulation pipeline includes:
[0010] The first liquid cooling flow channel is located inside the copper tube substrate module;
[0011] The second liquid cooling flow channel is located inside the heat dissipation water cooling radiator module;
[0012] A liquid-cooled water inlet pipe, one end of which is connected to the input end of the first liquid-cooled flow channel, and the other end of which is connected to the output end of the second liquid-cooled flow channel;
[0013] A liquid-cooled water outlet pipe, one end of which is connected to the output end of the first liquid-cooled flow channel, and the other end of which is connected to the input end of the second liquid-cooled flow channel.
[0014] Optionally, a liquid pump for circulating coolant is provided on the liquid cooling circulation pipeline, and the liquid pump is located outside the projection device body.
[0015] Optionally, a leak-proof agent is added to the coolant in the liquid-cooled circulation pipeline.
[0016] Optionally, there is at least one cooling fan.
[0017] According to a second aspect of the present invention, a projection device is provided, including a projection device body and a heat dissipation system as described above.
[0018] The beneficial effects of this utility model are as follows: by separating the heat dissipation system, including the cooling fan, from the projection device body, it is possible to ensure heat dissipation efficiency while meeting high brightness specifications, thereby reducing the size of the projection device, reducing the noise of the projection device, and improving the user experience.
[0019] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description
[0020] Figure 1 This is a schematic structural diagram of a heat dissipation system according to an embodiment of the present invention;
[0021] Figure 2 This is a schematic structural diagram of a heat dissipation system water cooling radiator module according to an embodiment of the present invention;
[0022] Figure 3 This is a schematic structural diagram of a copper tube substrate module of a heat dissipation system according to an embodiment of the present invention;
[0023] In the diagram: 1. Heat-conducting component; 11. Copper tube substrate module; 2. Water cooling radiator module; 21. Heat dissipation fins; 22. Cooling fan; 3. Liquid cooling circulation pipeline; 31. Liquid cooling inlet pipe; 32. Liquid cooling outlet pipe; 4. Liquid pump. Detailed Implementation
[0024] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0025] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.
[0027] Please see Figures 1 to 3 This application discloses a preferred embodiment of a heat dissipation system and projection device. The heat dissipation system includes a heat-conducting component 1, a water-cooled radiator module 2, and a liquid-cooled circulation pipeline. The heat-conducting component 1 is disposed inside the projection device body and includes a heat-conducting medium disposed at the heat source of the projection device body and a copper tube substrate module 11 for conducting heat from the heat source. The water-cooled radiator module 2 is disposed outside the projection device body and includes heat dissipation fins 21 disposed within the water-cooled radiator module 2 and a cooling fan disposed on one side of the heat dissipation fins 21. The liquid-cooled circulation pipeline is disposed between the heat-conducting component 1 and the water-cooled radiator module 2 for conducting heat from the inside of the projection device body to the outside of the projection device body for heat dissipation.
[0028] Today's users have higher demands for the size, brightness, and noise of projection devices, hoping for devices that are as compact and quiet as possible while maintaining high brightness output. However, existing heat dissipation technologies struggle to meet these requirements. Heat dissipation modules occupy a significant amount of space, fan noise is a major issue, and heat dissipation efficiency is closely related to brightness specifications. To balance heat dissipation performance and user experience, the industry typically uses software-based brightness adjustment, but this is not a fundamental solution.
[0029] Therefore, according to the solution of this utility model embodiment, by separating the heat dissipation system, including the cooling fan, from the projection device body, it is possible to ensure heat dissipation efficiency while meeting high brightness specifications, thereby reducing the size of the projection device, reducing the noise of the projection device, and improving the user experience.
[0030] It should be noted that the heat dissipation system and projection equipment in this application are used in scenarios with strict requirements on equipment size, and the heat dissipation system includes a water cooling radiator module 2 with a cooling fan and the projection equipment body, which are not located in the same space. Therefore, separating the two can significantly reduce the noise generated by the projection equipment.
[0031] The following detailed description uses specific examples:
[0032] Please see Figure 1 The liquid cooling circulation pipeline includes a first liquid cooling flow channel, a second liquid cooling flow channel, a liquid cooling inlet pipe, and a liquid cooling outlet pipe. The first liquid cooling flow channel is located inside the copper tube substrate module 11, and the second liquid cooling flow channel is located inside the heat dissipation water cooling radiator module 2. One end of the liquid cooling inlet pipe is connected to the input end of the first liquid cooling flow channel, and the other end of the liquid cooling inlet pipe is connected to the output end of the second liquid cooling flow channel. One end of the liquid cooling outlet pipe is connected to the output end of the first liquid cooling flow channel, and the other end of the liquid cooling outlet pipe is connected to the input end of the second liquid cooling flow channel.
[0033] Please see Figure 1 The liquid cooling circulation pipeline is equipped with a liquid pump for coolant circulation, which is located outside the projection device body. This external placement of the liquid pump reduces the size of the projection device body and prevents noise and vibration generated during operation from being transmitted into the projection device body, thereby reducing perceived noise and improving the user experience.
[0034] The coolant in this liquid cooling circulation pipeline contains a leak-proof agent. By adding the leak-proof agent to the coolant, minor leaks that may occur in the liquid cooling circulation pipeline can be prevented, ensuring the long-term stable operation of the heat dissipation system, reducing the risk of heat dissipation failure due to leaks, and extending the service life of the heat dissipation system.
[0035] In this embodiment, there is at least one cooling fan. When the projection device is powered on, the drive circuit drives the cooling fan and liquid pump located outside the projection device body to power on. The liquid pump enables the coolant to flow at high speed between the heat source and the water cooling radiator module 2. The heat is mainly concentrated on the back of the projection device body, the light source and the back of the DMD chip. The heat from the heat source is quickly conducted from the heat source to the copper tube substrate module 11 through the thermally conductive medium (thermal conductive silicone, etc.). Then, through the operation of the liquid pump and the liquid cooling circulation pipeline, the coolant quickly transfers the heat near the heat source to the water cooling radiator module 2 located outside the projection device body. The coolant then transfers the heat to the heat dissipation fins 21 on the water cooling radiator module 2. The cooling fan then quickly removes the heat from the heat dissipation fins 21, thereby reducing the overall temperature of the coolant and ultimately reducing the temperature of the heat source.
[0036] This embodiment also provides a projection device, including a projection device body and a heat dissipation system separate from the photography device body.
[0037] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0038] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A heat dissipation system, characterized in that, include: A heat-conducting component is disposed inside the projection device body, including a heat-conducting medium disposed at the heat source of the projection device body and a copper tube substrate module for conducting heat from the heat source. A water-cooling radiator module is installed outside the camera body and includes heat dissipation fins installed inside the water-cooling radiator module and a cooling fan installed on one side of the heat dissipation fins. A liquid cooling circulation pipeline is installed between the heat-conducting component and the heat dissipation water cooling module to conduct heat from the inside of the projection device body to the outside of the projection device body for heat dissipation.
2. The heat dissipation system according to claim 1, characterized in that, The liquid cooling circulation pipeline includes: The first liquid cooling flow channel is located inside the copper tube substrate module; The second liquid cooling flow channel is located inside the heat dissipation water cooling radiator module; A liquid-cooled water inlet pipe, one end of which is connected to the input end of the first liquid-cooled flow channel, and the other end of which is connected to the output end of the second liquid-cooled flow channel; A liquid-cooled water outlet pipe, one end of which is connected to the output end of the first liquid-cooled flow channel, and the other end of which is connected to the input end of the second liquid-cooled flow channel.
3. The heat dissipation system according to claim 1, characterized in that, A liquid pump for circulating coolant is installed on the liquid cooling circulation pipeline, and the liquid pump is located outside the projection device body.
4. The heat dissipation system according to claim 3, characterized in that, The coolant in the liquid cooling circulation pipeline contains a leak-proof agent.
5. The heat dissipation system according to claim 1, characterized in that, There is at least one cooling fan.
6. A projection device, characterized in that, It includes the projection device body and the heat dissipation system as described in any one of claims 1 to 5.