Chip assembly and process cartridge

Abstract

The utility model relates to a chip assembly and a processing box, the chip assembly is used in the processing box comprising a developing box and a drum box which are arranged in a split manner, and the processing box is detachably arranged in imaging equipment provided with a contact pin; the drum box comprises a drum shell and a containing cavity formed by the drum shell, the developing box can be detachably installed in the containing cavity, the drum shell is provided with an inner surface facing the containing cavity and an outer surface opposite to the containing cavity, and the outer surface is provided with an installation face used for installing the chip assembly. The drum box further comprises a protruding part protruding from the drum shell towards the direction away from the containing cavity. The chip assembly is provided with an electric contact part used for being in contact with the contact pin, the electric contact part is arranged on the drum box and located between the tail end of the protruding part and the mounting surface, the electric contact part is farther away from the containing cavity than the mounting surface, and the chip assembly further comprises a bearing part directly or indirectly connected with the electric contact part and a fool-proof part arranged on the bearing part; the fool-proof part is used for being matched with the protruding part; therefore, the chip assembly is prevented from being scratched by the developing box to be damaged or fall off.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of electrophotographic imaging, and particularly relates to a chip assembly and a process cartridge. BACKGROUND

[0002] To establish a communication connection between the developing cartridge and the image forming device, usually, a chip storing parameter information of the developing cartridge needs to be arranged in the developing cartridge, and when the developing cartridge is installed to the image forming device in a detachable manner, the chip is in electrical contact with a stylus in the image forming device.

[0003] A developing cartridge and a drum cartridge combined in a detachable manner are known, and the developing cartridge and the drum cartridge need to be combined with each other outside the image forming device to form a process cartridge, and the process cartridge is installed to the image forming device in a detachable manner; the drum cartridge forms a receiving cavity for accommodating the developing cartridge, and has an inner surface facing the receiving cavity and an outer surface opposite to the inner surface.

[0004] Usually, to distinguish drum cartridges of different regions or different service lives, there are various types of drum cartridges on the market, and most of these types of drum cartridges have the same structure, and only a small number of regions are different. When these different regions are related to a chip storing information of at least one of the developing cartridge and the drum cartridge, both the manufacturer and the user need to produce and select different types, which is not conducive to reducing the use cost of the user. UTILITY MODEL CONTENT

[0005] Therefore, the utility model provides at least a chip assembly adopting the following technical scheme, which can be used for various types of drum cartridges to reduce the use cost of the user, and the specific scheme is as follows:

[0006] The chip assembly is used in a process cartridge including a developing cartridge and a drum cartridge arranged separately, and the process cartridge is detachably installed in an image forming device provided with a stylus;

[0007] The drum cartridge includes a drum shell and a receiving cavity formed by the drum shell, the developing cartridge can be installed to the receiving cavity in a detachable manner, the drum shell has an inner surface facing the receiving cavity and an outer surface facing away from the receiving cavity, the outer surface has a mounting surface for mounting the chip assembly, and the drum cartridge further includes a protruding portion protruding from the drum shell away from the receiving cavity;

[0008] The chip assembly has an electrical contact portion for contacting the stylus, the electrical contact portion is arranged on the drum cartridge and located between the mounting surface and the end of the protruding portion, the electrical contact portion is farther away from the receiving cavity than the mounting surface, the chip assembly further includes a carrier directly or indirectly connected with the electrical contact portion and a foolproof portion arranged on the carrier, and the foolproof portion is used for cooperating with the protruding portion.

[0009] In some embodiments, the chip assembly includes a substrate having a substrate first surface and a substrate second surface oppositely arranged along a thickness direction of the substrate, the electrical contact is arranged on the substrate first surface; wherein, when the chip assembly is mounted to the drum cartridge, the substrate second surface is opposite to the outer surface, and the substrate second surface is detachably connected to the outer surface.

[0010] In some embodiments, the drum cartridge includes a paper path for allowing the imaging medium to reach a position opposite to the photoconductive drum from outside of the drum cartridge, and an outer side plate is located at a left side of the paper path along a first direction, and at least a portion of the outer side plate overlaps with the paper path; the chip assembly further includes a heightening member for connecting to the substrate; wherein, when the chip assembly is mounted to the drum cartridge, the heightening member is opposite to the outer side plate, so that the electrical contact is in contact with the stylus.

[0011] In some embodiments, at least a portion of the heightening member is integrally formed with the carrier.

[0012] In some embodiments, the carrier has a carrier front empty area in front of the electrical contact and a carrier rear empty area behind the electrical contact, the carrier front empty area has a size greater than that of the carrier rear empty area along a second direction, and at least a portion of the fool-proof part further overlaps with the carrier front empty area along a direction intersecting with the second direction.

[0013] In some embodiments, the drum cartridge includes a conductive assembly for receiving power from the image forming device, the conductive assembly includes a first conductive member and a second conductive member electrically connected to each other, the first conductive member receives power from the image forming device and transmits to the second conductive member, and the second conductive member is used to supply power to at least one of a developing roller, a powder feeding roller and a powder outlet knife.

[0014] In some embodiments, the first conductive member includes a first portion, a second portion and a third portion, wherein the first portion is located at a non-driving end, the third portion is located at a driving end, and the second portion extends along a first direction and connects the first portion and the third portion.

[0015] In some embodiments, the drum cartridge further includes a paper pressing roller extending along a first direction, the paper pressing roller is rotatably arranged in the drum housing, wherein the paper pressing roller serves as the second portion.

[0016] In some embodiments, the chip assembly includes at least one protrusion, and at least one of the protrusions is used to engage with the drum cartridge to enable the chip assembly to be snap-connected to the drum cartridge.

[0017] The application also provides a processing box comprising the chip assembly of any one of the above.

[0018] The chip assembly and the processing box provided by the application can be used for various drum boxes, so as to reduce the use cost of users. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1A And Figure 1B is a perspective view of the processing box related to the application.

[0020] Figure 2 is a perspective view of the developing box related to the application.

[0021] Figure 3 is an exploded view of the processing box related to the first embodiment of the application, in which the developing box, the drum box and the chip assembly are separated from each other.

[0022] Figure 4 is a state diagram of the chip assembly related to the first embodiment of the application before being installed into the drum box.

[0023] Figure 5 is a state diagram of the chip assembly related to the first embodiment of the application after being installed into the drum box.

[0024] Figure 6 is a side view of the processing box related to the first embodiment of the application, viewed along the first direction.

[0025] Figure 7 is an exploded view of the chip and the carrier in the chip assembly related to the second embodiment of the application.

[0026] Figure 8 is a state diagram of the chip assembly related to the second embodiment of the application after being installed into the drum box.

[0027] Figure 9 is an exploded view of part of the drum box related to the third embodiment of the application.

[0028] Figure 10 is a state diagram of the chip assembly related to the third embodiment of the application after being installed into the drum box.

[0029] Figure 11 is a side view of the processing box related to the third embodiment of the application, viewed along the first direction.

[0030] Figure 12 is a perspective view of the developing box related to the third embodiment of the application when being in contact with the conductive assembly.

[0031] Figure 13This is an exploded view of some components in the drum box according to Embodiment 4 of this utility model.

[0032] Figure 14A and Figure 14B This is a perspective view of the chip assembly involved in Embodiment 5 of this utility model.

[0033] Figure 15 This is a diagram showing the state of the chip assembly according to Embodiment 5 of this utility model after it has been installed in the drum housing.

[0034] Figure 16 This is a diagram showing the state of the chip assembly installed after the first type of drum box according to Embodiment Six of this utility model.

[0035] Figure 17 This is a perspective view of the first type of drum box involved in Embodiment Six of this utility model.

[0036] Figure 18A This is a partial perspective view of the first type of drum box according to Embodiment Six of this utility model.

[0037] Figure 18B This is a plan view taken along a third direction after the chip assembly is installed into the first type of drum box involved in Embodiment Six of this utility model.

[0038] Figure 19 This is an exploded view of the chip assembly involved in Embodiment Six of this utility model.

[0039] Figure 20 It is along Figure 16 Cross-sectional view after being cut along the AA direction.

[0040] Figure 21 This is an exploded view of the second type of drum box and chip assembly after separation, according to Embodiment Six of this utility model.

[0041] Figure 22 This is a side view of the chip assembly involved in Embodiment Six of this utility model, viewed along the first direction after being installed into the second type of drum box.

[0042] Figure 23 This is a schematic diagram of the overall structure of the processing box provided in another embodiment of the present invention.

[0043] Figure 24 yes Figure 23 A schematic diagram of the overall structure of the chip component. Detailed Implementation

[0044] The embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0045] like Figure 1A and Figure 1BAs shown, the process cartridge C includes a developing cartridge 100 and a drum cartridge 200 arranged separately, and before the process cartridge C is mounted to the image forming device in a detachable manner, the developing cartridge 100 needs to be mounted to the drum cartridge 200 in a detachable manner. Figure 14A 、 Figure 14B As shown) of the image forming device.

[0046] The drum cartridge 200 includes a drum housing 201 and a photosensitive drum 202 rotatably arranged in the drum housing 201, and the drum housing 201 is further formed with a receiving cavity 203 for accommodating the developing cartridge 100, and has an inner surface 201a facing the receiving cavity 203 and an outer surface 201b facing away from the receiving cavity 203; due to the irregular shape of the outer contour of the drum housing 201, the outer surface 201b will be non-planar, but it should be understood that the outer surface 201b referred to in the present application refers to the outer contour surface of the drum housing 201 opposite the receiving cavity 203.

[0047] The developing cartridge 100 includes a developing housing 1 for storing a developer, a rotating member 2 rotatably arranged in the developing housing 1, the rotating member 2 including a developing roller 21 (as shown) and a powder feeding roller 22 (as shown), wherein the powder feeding roller 22 is used to deliver the developer to the developing roller 21, the developing roller 21 is used to carry the developer and supply the developer to the photosensitive drum 202, a driving force receiving member 3 arranged at one end of the housing 1 for receiving driving force from the image forming device to drive the rotating member 2 to rotate, and a power receiving member 4 for receiving power from the image forming device to supply to the rotating member 2. Figure 2 Figure 12 Further, the developing cartridge 100 further includes a powder discharge blade 13 fixedly mounted on the developing housing 1, the powder discharge blade 13 being in contact with the outer surface of the developing roller 21 to adjust the thickness of the developer carried on the surface of the developing roller 21; when the developing cartridge 100 is detachably mounted to the receiving cavity 203, the developing roller 21 and the photosensitive drum 202 are opposite, and during the developing process of the process cartridge C in the image forming device, the developer carried by the developing roller 21 reaches the surface of the photosensitive drum 202 from the surface of the developing roller 21 under the action of the electric field force between the developing roller 21 and the photosensitive drum 202, and thus in the rotating member 2, the power received by the power receiving member 4 needs to be at least directly or indirectly supplied to the developing roller 21.

[0048] In some embodiments, the power received by the power receiving member 4 can also be supplied to at least one of the powder feeding roller 22 and the powder discharge blade 13 to further improve the image forming quality of the process cartridge C.

[0049] In some embodiments, the power received by the power receiving member 4 can also be supplied to at least one of the powder feeding roller 22 and the powder discharge blade 13 to further improve the image forming quality of the process cartridge C.

[0050] ​Further, the developing cartridge 100 further comprises an end cover 11 connected with the developing housing 1, the driving force receiving member 3 is exposed through the end cover 11, meanwhile, the driving force receiving member 3 can also be protected by the end cover 11.

[0051] For the sake of making the following description clearer, the extending direction of the developing roller 21 is defined as the first direction, the direction intersecting with the first direction is defined as the second direction, and the direction intersecting with the first direction and the second direction is defined as the third direction. Along the second direction, the developing roller 21 is located at one end of the developing housing 1, and the accommodating cavity 203 is open in the third direction. Preferably, the first direction, the second direction and the third direction are perpendicular to each other.

[0052] Accordingly, the extending direction of the developing cartridge 100, the extending direction of the drum cartridge 200 and the extending direction of the process cartridge C are all parallel to the first direction. Along the first direction, the side where the driving force receiving member 3 is located is the driving side F, which can also be referred to as the left side, and the opposite side is the non-driving side E, which can also be referred to as the right side. The power receiving member 4 is arranged on the right side. The rotating member 2 and the photosensitive drum 202 all rotate around the rotating axis extending along the first direction, as shown in Figure 2 the figure, the rotating axis of the developing roller 21 is L. The process cartridge C is installed towards the image forming device along the second direction. Along the second direction, the installation direction of the process cartridge C is the front direction, and the extraction direction of the process cartridge C is the rear direction. Along the third direction, the open direction of the accommodating cavity 203 is the upper direction, and the opposite direction is the lower direction.

[0053] [Embodiment One]

[0054] As shown in Figures 3-6 the figure, the drum cartridge 200 further comprises a through hole 205 arranged on the drum housing 201. Along the first direction, the through hole 205 is located at the left end of the drum housing 201. Along the second direction, the photosensitive drum 202 is located at the front end of the drum housing 201 and is arranged close to the photosensitive drum 202. Along the third direction, the through hole 205 penetrates through the drum housing 201.

[0055] In some embodiments, the developing cartridge 100 further comprises a positioning protrusion 14 arranged on the developing housing 1 or the end cover 11. The positioning protrusion 14 can cooperate with the through hole 205 to position the developing cartridge 100 relative to the drum housing 201.

[0056] The process cartridge C further comprises a chip assembly 300 arranged separately from the developing cartridge 100. The chip assembly 300 stores at least the parameter information of the developing cartridge 100. When the process cartridge C is installed into the image forming device, the chip assembly 300 is in electrical contact with the stylus 9. Specifically, the chip assembly 300 comprises a substrate 304 and an electrical contact part 302. The electrical contact part 302 is used to contact the stylus to enable the chip assembly 300 / process cartridge C to establish a communication connection with the image forming device. The substrate 304 is used to carry the electrical contact part 302.

[0057] As shown in Figure 3 The substrate 304 has oppositely arranged substrate first surface 304a and substrate second surface 304b, and the electrical contact 302 is arranged on the substrate first surface 304a, i.e. the orientation of the substrate first surface 304a is the same as that of the electrical contact 302. Figure 4 As shown in

[0058] In some developing cartridges provided with the positioning protrusion 14, when the positioning protrusion 14 in the developing cartridge 100 cooperates with the through hole 205 to realize the positioning of the developing cartridge 100, the impact on the chip assembly 300 can be reduced even if the process cartridge C shakes in the image forming device; when the chip assembly 300 is installed to the drum cartridge 200, the substrate second surface 304b is opposite to the outer surface 201b, and the two surfaces can be connected by adhesion, buckling, magnetic connection, etc., or the carrier 301 is clamped / interference fitted with the through hole 205, as long as the carrier 301 can be fixedly connected with the drum shell 201, for example, by arranging double-sided adhesive tape on the substrate second surface 304b, the user only needs to tear off the adhesive tape to paste the chip assembly 300 on the drum shell 201.

[0059] In the outer surface 201b, a part used to be opposite to the substrate second surface 304b can be referred to as a mounting surface, and the mounting surface is arranged around the through hole 205, and the chip assembly 300 is mounted on the mounting surface.

[0060] In this embodiment, the chip assembly 300 is installed outside the accommodating cavity 203, or in other words, the chip assembly 300 is connected with the outer surface 201b of the drum shell 201, so that during the process of installing the developing cartridge 100 to the accommodating cavity 203 and during the process of taking out the developing cartridge 100 from the accommodating cavity 203, the developing cartridge 100 will not scratch the chip assembly 300 / electrical contact 302.

[0061] Further, the drum cartridge 200 further comprises a protrusion 206 arranged on the drum housing 201, as shown, along the third direction, the protrusion 206 protrudes from the drum housing 201 towards a direction away from the accommodating cavity 203, along a direction intersecting the third direction, the protrusion 206 is arranged adjacent to the through hole 205 / the electrical contact portion 302, for this purpose, the chip assembly 300 further comprises a fool-proof portion 303 arranged on the substrate 304, on one hand, the positioning of the substrate 304 is realized by the mutual abutment of the fool-proof portion 303 and the protrusion 206, on the other hand, the problem of incorrect installation of the chip assembly 300 / the substrate 304 can be solved, specifically, the fool-proof portion 303 can be a special-shaped portion arranged on the substrate 304, or a protrusion / indentation, etc., the arrangement of the fool-proof portion 303 can realize the direct installation of the substrate 304 of the chip assembly 300 to the drum cartridge 200, without the need to first install the substrate 304 to other components, and then install the other components to the drum cartridge 200, thereby the installation mode of the chip assembly 300 can be simplified.

[0062] As shown in Figure 6 when the chip assembly 300 is installed to the drum cartridge 200, along the third direction, at least a portion of the electrical contact portion 302 coincides with the driving force receiving member 3, this structure can reduce the size of the process cartridge C (e.g. the second direction), at the same time, along the third direction, by arranging at least a portion of the electrical contact portion 302 to coincide with the positioning protrusion 14 / the through hole 205, the influence of the vibration generated by the driving force receiving member 13 can be effectively reduced.

[0063] Further, along the third direction, the electrical contact portion 302 is located between the end of the protrusion 206 and the installation surface 201c, or in other words, along the third direction, the electrical contact portion 302 is farther away from the rotation axis L of the developing roller 21 / the driving force receiving member 3 than the installation surface 201c, or in other words, along the third direction, the electrical contact portion 302 is closer to the rotation axis L of the developing roller 21 / the driving force receiving member 3 than the protrusion 206, for example, along the third direction, the protruding size of the protrusion 206 is greater than the size of the substrate 304, by such arrangement, both the stable contact of the electrical contact portion 302 with the stylus 9 and the protection of the electrical contact portion 302 by the protrusion 206 can be ensured, and the risk of the electrical contact portion 302 being scratched by the components in the image forming device during the installation or removal of the process cartridge C to / from the image forming device can be effectively reduced.

[0064] In some embodiments, along a direction intersecting the first direction, the size of the substrate 304 is greater than the size of the through hole 205, to ensure that the substrate 304 can be stably installed on the drum housing 201.

[0065] In some embodiments, along a direction parallel to the first direction, the size of the substrate 304 is greater than the size of the through hole 205, to ensure that the substrate 304 can be stably installed on the drum housing 201.

[0066] As shown in the figure, in the state that the chip assembly 300 is installed to the drum cartridge 200, the electrical contact portions 302 include a plurality of electrical contact portions arranged at intervals along a first direction, each of the electrical contact portions has a dimension extending along the first direction and a dimension extending along a second direction, wherein the dimension extending along the first direction of each of the electrical contact portions is smaller than the dimension extending along the second direction, thus the second direction can be regarded as the length direction of the electrical contact portions.

[0067] Along the second direction, the substrate 304 has a substrate front empty area 3041 in front of the electrical contact portions 302 and a substrate rear empty area 3042 behind the electrical contact portions 302, preferably, along the second direction, the dimension of the substrate front empty area 3041 is larger than the dimension of the substrate rear empty area 3042, thus, in the process of installing the drum cartridge 200 to the image forming device, the stylus 9 is forced to retract by contacting the substrate front empty area 3041, which can reduce the friction opportunity between the stylus 9 and the electrical contact portions 302; as Figure 22 shown, after the chip assembly 300 is installed to the drum cartridge, the front empty area 3041 is closer to the photosensitive drum 202 than the rear empty area 3042 in the arrangement direction of the front empty area 3041 and the rear empty area 3042.

[0068] In some embodiments, at least a part of the foolproof portion 303 also coincides with the substrate front empty area 3041 along a direction intersecting the second direction, compared with the substrate rear empty area 3042, the substrate front empty area 3041 has a larger space for designing the foolproof portion 303, and the larger substrate front empty area 3041 can also be used as a gripping portion for the user to install the chip assembly 300.

[0069] In some embodiments, a conductive connecting piece can also be provided in the chip assembly 300, thus, according to the design requirement, the substrate 304 can be arranged at other positions of the drum shell 201, one end of the conductive connecting piece can be regarded as the electrical contact portion 302, and the one end of the conductive connecting piece also has the above-mentioned positional relationship with respect to the drum shell 201. Generally, the service life of the drum cartridge 200 is much longer than the service life of the developing cartridge 100, which makes the user only need to replace a new developing cartridge when the developer in the developing cartridge 100 is consumed, and the drum cartridge 200 can continue to be used; the chip assembly 300 in the embodiment is installed on the drum cartridge 200, thus, when the user replaces the developing cartridge 100, the chip assembly that can continue to be used is retained, and the use cost of the user can be reduced.

[0070] [Embodiment Two]

[0071] The structure of the chip assembly 300 in the embodiment is different from that of Embodiment One, and the same structure will not be repeated. For the convenience of understanding, the same parts will use the same numbers.

[0072] like Figure 7 As shown, the electrical contact portion 302 is disposed on the substrate 2304. The chip assembly 300 in this embodiment also includes a carrier 301 for supporting the substrate 2304. The carrier 301 is provided with a mounting portion 301c, and the substrate 2304 is mounted in the mounting portion 301c. In this structure, the chip including the substrate 2304 and the electrical contact portion 302 can be universal. Manufacturers of developing cartridges / drum cartridges / processing cartridges only need to prepare different carriers 301 according to the product model. The chip does not need to be specially made according to different products, thereby reducing production costs.

[0073] Furthermore, the carrier 301 also has a first carrier surface 301a facing the same direction as the electrical contact portion 302 and a second carrier surface 301b opposite to the first carrier surface 301a, such as... Figure 8 As shown, when the chip assembly 300 is installed in the drum housing 200, the first surface 301a of the carrier and the electrical contact 302 both face downwards, and the second surface 301b of the carrier is opposite to the outer surface 201b of the drum housing. The two can be connected by means of adhesive, snap-fit, magnetic connection, etc. Alternatively, the carrier 301 can be snapped / interference-fitted with the through hole 205, as long as the carrier 301 is fixedly connected to the drum housing 201. For example, by setting double-sided adhesive on the second surface 301b of the carrier, the user only needs to peel off the double-sided adhesive paper to stick the chip assembly 300 to the drum housing 201. Similarly, the drum housing 201 involved in this embodiment also has a mounting surface opposite to the second surface 301a of the carrier, and this mounting surface is arranged around the through hole 205.

[0074] like Figure 7 As shown, along the second direction, the carrier 301 has a front empty area 3011 located in front of the electrical contact 302 and a rear empty area 3012 located behind the electrical contact 302. In the second direction, the size of the front empty area 3011 is larger than the size of the rear empty area 3012. A foolproof part 303 is provided on the carrier 301, and along the direction intersecting with the second direction, at least a portion of the foolproof part 303 also coincides with the front empty area 3011.

[0075] Similar to Embodiment 1, along a third direction, at least a portion of the electrical contact 302 coincides with the driving force receiver 3, and the positioning protrusion 14 / through hole 205 coincides with at least a portion of the chip assembly 300 (e.g., the electrical contact 302). The electrical contact 302 is located between the end of the protrusion 206 and the mounting surface 201c.

[0076] In this embodiment, the electrical contact 302 is supported by the substrate 2304. Then, the substrate 2304 is mounted onto the carrier 301. Finally, the electrical contact 302 is indirectly supported by the carrier 301, and the electrical contact 302 is mounted onto the drum housing 201 together with the carrier 301. In Embodiment 1, the electrical contact 302 is directly supported by the substrate 2304 and is directly mounted onto the drum housing 201 along with the substrate 2304. Overall, the substrate 304 in Embodiment 1 can also be regarded as a carrier. In this case, the first surface 304a of the substrate is the first surface 301a of the carrier, the second surface 304b of the substrate is the second surface 301b of the carrier, the front empty area 3041 of the substrate is the front empty area 3011 of the carrier, and the rear empty area 3042 of the substrate is the rear empty area 3012 of the carrier. As for the electrical contact 302, the carrier (substrate 304) in Embodiment 1 directly supports the electrical contact 302, while the carrier 301 in Embodiment 2 indirectly supports the electrical contact 302.

[0077] [Example 3]

[0078] Based on the inventive concept of the chip component 300 involved in Embodiments 1 and 2, this embodiment further improves the structure of the developing cartridge 100 receiving power, in order to further reduce the user's usage cost.

[0079] like Figure 9 As shown, the drum cartridge 200 also includes a conductive component 5 for receiving power from the imaging device. The conductive component 5 is used to receive power from the imaging device and supply power to the developing cartridge 100. Specifically, the conductive component 5 supplies power from the imaging device to at least one of the developing roller 21, the toner delivery roller 22, and the toner exit blade 13 by establishing an electrical connection directly or indirectly with at least one of them. Especially when the power received by the conductive component 5 is not directly supplied to the developing roller 21, since the toner delivery roller 22 and the toner exit blade 13 are both in contact with the developing roller 21, at least one of the toner delivery roller 22 and the toner exit blade 13 can still supply power to the developing roller 21. In this case, the power receiving component 4 originally provided in the developing cartridge 100 can be omitted.

[0080] In some embodiments, the power receiver 4 in the developing cartridge 100 may also be retained, with the conductive component 5 in contact with the power receiver 4. In this case, the power receiver 4 receives power from the imaging device, and the conductive component 5 then supplies the power received by the power receiver 4 to at least one of the developing roller 21, the powder delivery roller 22, and the powder exit blade 13. Optionally, the power receiver 4 may be located at the left end or the right end of the developing cartridge. When the power receiver 4 is located at the right end, the impact of the vibration of the drive head on the electrical connection between the power receiver 4 and at least one of the developing roller 21, the powder delivery roller 22, and the powder exit blade 13 can be reduced.

[0081] In this embodiment, since the conductive component 5 is detachably disposed in the drum cartridge 200, the user will not replace the conductive component 5 when replacing the developing cartridge 100. The cost of the developing cartridge 100 can be further reduced. Even if either the drum cartridge 200 or the conductive component 5 reaches the end of its lifespan or fails, only one of them needs to be replaced.

[0082] The conductive component 5 includes a first conductive element 51 and a second conductive element 52 that are electrically connected to each other. The first conductive element 51 is used to transfer power from the imaging device to the second conductive element 52, and the second conductive element 52 is used to supply power to at least one of the developing roller 21, the powder feeding roller 22, and the powder exiting blade 13.

[0083] Both the first conductive element 51 and the second conductive element 52 are made of conductive material, and so on... Figure 9 As shown, the first conductive element 51 includes a first portion 511, a second portion 512, and a third portion 513. The first portion 511 is located at the non-driving end, the third portion 513 is located at the driving end, the second portion 512 extends along a first direction and connects the first portion 511 and the third portion 513. The first portion 511 is used to receive power from the imaging device. Therefore, the first portion 511 can be regarded as the aforementioned power receiving element 4. The third portion 513 is electrically connected to the second conductive element 52. In some embodiments, the first conductive element 51 may not need to extend from the non-driving end to the driving end, but may only be provided at the non-driving end. In this case, the first conductive element 51 is the power receiving part 4, but the first conductive element 51 is still not provided on the developing cartridge 100. In this way, the cost of the developing cartridge 100 can still be reduced, and correspondingly, the user's operating cost is also reduced. Furthermore, the design space of the developing cartridge 100 can be improved.

[0084] As described above, the first conductive element 51 can also extend from the non-driving end E to the driving end F via the second portion 512. This structure also helps to reduce the material cost of the developing cartridge 100; specifically, see [link to documentation]. Figure 12 The developing cartridge 100 also includes a driving force transmission component 31 disposed on the same side as the driving force receiving component 3. The driving force received by the driving force receiving component 3 is transmitted to the rotating component 2 through the driving force transmission component 31. Generally, the driving force transmission component 31 is configured as a gear, which requires the rotating component 2 to protrude a portion at the driving end F for mounting the gear. To improve the rotational stability of the rotating component 2, the protruding portion is made of metal. Correspondingly, at the non-driving end E, the rotating component 2 does not need to be provided with a portion for mounting the gear. Therefore, after the conductive component 5 receives power at the non-driving end, the power is transmitted to the driving end F through the second portion 512. The metal portion of the rotating component for mounting the gear contacts the second conductive component 52, thereby the power can be transmitted to the rotating component. At the same time, the material cost of the rotating component is also reduced.

[0085] In some embodiments, the second conductive element 52 is disposed on the carrier 301, that is, the second conductive element 52 and the electrical contact portion 302 are supported by the same component. Therefore, the second conductive element 52 and the chip assembly 300 can be used as a whole. Even if the drum box 200 is damaged or the drum box 200 needs to be replaced due to the expiration of its service life, the second conductive element 52 and the chip assembly 300 can be removed at the same time to continue to be used in the next drum box 200.

[0086] In some embodiments, the first conductive element 51 and the second conductive element 52 can be integrally formed. In this case, the conductive component 5 can be installed as an independent part in a detachable manner to the drum cassette 200, which can also achieve the purpose of facilitating the replacement of the conductive component 5. In this modified mode, the second conductive element 52 can also be regarded as non-existent, and the first conductive element 51 directly transmits the power from the imaging device to the developing cartridge 100.

[0087] In some embodiments, the first conductive element 51 and the second conductive element 52 are both disposed on the carrier 301, or the conductive component 5 can be integrally formed with the carrier 301. This design can further improve the convenience of removing the conductive component 5 and the chip component 300 from the drum 200.

[0088] In some embodiments, with the conductive component 5 installed in the drum housing 200, the second conductive component 52 can be positioned between the left and right ends of the drum housing 200, for example, at the middle of the drum housing 200 along the first direction.

[0089] like Figure 10 As shown, in the chip assembly 300 involved in this embodiment, at least the electrical contact portion 302 is further away from the receiving cavity 203 than the mounting surface 201c. Both the first surface 301a and the electrical contact portion 302 face downwards. Figure 11 As shown, along a third direction, at least a portion of the electrical contact 302 coincides with the driving force receiver 3, and the positioning protrusion 14 / through hole 205 coincides with at least a portion of the chip assembly 300 (e.g., the electrical contact 302). The electrical contact 302 is located between the end of the protrusion 206 and the mounting surface 201c.

[0090] [Example 4]

[0091] Based on the inventive concept of Embodiment 3, this embodiment further improves the structure of the first conductive element 51. In Embodiment 3, the first conductive element 51 uses its own components to transfer power from one end (non-driving end) of the processing box C to the other end (driving end). This embodiment will describe how the first conductive element 51 uses the components in the drum box to transfer power from one end (non-driving end) of the processing box C to the other end (driving end or the position between the driving end and non-driving end).

[0092] like Figure 13 As shown, the drum housing 200 also includes a pressure roller 204 extending along a first direction. Along a second direction, the through hole 205 is located in front of the pressure roller 204 and closer to the photosensitive drum 202. When the processing cartridge C performs imaging in the imaging device, the imaging medium (e.g., printing paper) moves forward from below the drum housing 201 through the pressure roller 204. The pressure roller 204 can apply a certain pressure to the printing paper using its own weight to prevent the movement trajectory of the printing paper from changing, thereby avoiding problems such as paper jams or imaging deviation. For this purpose, the pressure roller 204 is generally made of a relatively high-density material such as metal. Preferably, the pressure roller 204 is rotatably disposed in the drum housing 201.

[0093] When the pressure roller 204 is made of metal, it can serve as the second part 512 in the first conductive element 51, thereby simplifying the structure of the conductive component 5 and the drum 200, and reducing the cost of the first conductive element 51.

[0094] The drum housing 200 also includes a paper path 207 for connecting the receiving cavity 203 and the outside of the drum housing. Along the second direction, the paper path 207 is located in front of the pressure roller 204. The paper path 207 allows imaging media (e.g., printing paper) to enter the receiving cavity 203 from the outside of the drum housing and reach a position opposite the photosensitive drum 202. Figure 13 In the drum box 200 shown, along the first direction, the through hole 205 and the paper feeding channel 207 are arranged adjacent to each other, and the protrusion 206 is located between the through hole 205 and the paper feeding channel 207.

[0095] Continue as Figure 13 As shown, the first conductive element 51 still includes a first part 511, a second part 512, and a third part 513. The first part 511 is located at the non-driving end and is used to receive power from the imaging device. The paper pressure roller 204 serves as the second part 512 and is used to transfer power from the non-driving end to the driving end, or in other words, to transfer power from the first part 511 to the third part 513. The third part 513 is electrically connected to the second conductive element 52.

[0096] In this embodiment, the first part 511 and the third part 513 are formed separately from the second part 512 (pressure roller 204), which facilitates the manufacturer to modify at least one of the first part 511 and the third part 513 to fit the product model. Since the pressure roller 204 is already pre-installed in the drum box 200, in the conductive component 5 involved in this embodiment, the manufacturer does not need to produce the second part 512 anymore, but only needs to produce the first part 511, the second part 512, and the second conductive component 52, and sell them separately or together. When the conductive component 5 does not have a second conductive element 52, the manufacturer only needs to produce the first part 511 and the second part 512 and sell them separately or together. Furthermore, when the pressure roller 204 / the second part 512 directly transmits electricity to the developing cartridge 100, the manufacturer only needs to produce the first part 511 and sell it. Furthermore, the third part 513 is also connected to the carrier 301. Preferably, the third part 513 is integrally formed with the carrier 301, and its beneficial effects are as described in Embodiment 2.

[0097] [Example 5]

[0098] like Figure 14A , Figure 14B and Figure 15 As shown, based on the inventive concept of the above embodiments, in this embodiment, the chip assembly 300 is also provided with a substrate 304, but the electrical contact portion 302 is directly connected to the carrier 301. Overall, the chip assembly 300 includes a separately provided contact portion 300a and a storage portion 300b. The contact portion 300a includes a carrier 301 and an electrical contact portion 302 for contacting the stylus 9. The carrier 301 and the electrical contact portion 302 are directly or indirectly connected. The storage portion 300b includes a substrate 304 and a wafer 307. The substrate 304 is fixedly disposed in the developing cartridge 100 or the drum cartridge 200. The wafer 307 is at least used to store parameter information of the developing cartridge 100.

[0099] Furthermore, the contact portion 300a also includes a first signal processing unit 305 electrically connected to the electrical contact portion 302, and the storage portion 300b also includes a second signal processing unit 306 electrically connected to the wafer 307. The first signal processing unit 305 and the second signal processing unit 306 do not contact each other, but transmit signals between them through electromagnetic induction. That is, the first signal processing unit 305 can process the signal emitted by the imaging device and then, through electromagnetic induction, enable the second signal processing unit 306 to receive it and transmit it to the wafer 307. Conversely, the second signal processing unit 306 can also process the signal emitted by the wafer 307 and then, through electromagnetic induction, enable the first signal processing unit 305 to receive it. Finally, through the contact between the stylus 9 and the electrical contact portion 302, the imaging device receives the signal from the wafer 307.

[0100] In some embodiments, the first signal processor 305 may also be installed in the imaging device, or the first signal processor 305 may be a component of the imaging device itself.

[0101] [Other Notes]

[0102] As described above, the chip assembly 300 in this invention is separately disposed from the developing cartridge 100 and also separately disposed from the drum cartridge 200. However, in the chip assembly 300, at least the electrical contact portion 302 is disposed / attached to the drum cartridge 200, and the electrical contact portion 302 is further away from the receiving cavity 203 than the mounting surface 201c. In this way, during the process of the developing cartridge 100 being installed toward the receiving cavity 203 and during the process of the developing cartridge 100 being removed from the receiving cavity 203, the electrical contact portion 302 will not be scratched by the developing cartridge. Therefore, at least the electrical contact portion 302 in the chip assembly 300 can be effectively protected, and the chip assembly 300 will not be scratched and fall off by the developing cartridge.

[0103] Furthermore, along a third direction, the drum housing 200 is also provided with a protrusion 206 that is further away from the mounting surface 201c than the electrical contact portion 302. Therefore, the electrical contact portion 302 can be protected by the protrusion 206, and the electrical contact portion 302 will not be scratched by the components in the imaging device during the process of installing the drum housing 200 / processing box C toward the imaging device or during the process of removing it from the imaging device.

[0104] Based on the above description, this utility model can also provide a method of using the processing cartridge C, which includes the steps of preparing the developing cartridge 100, the drum cartridge 200 and the chip assembly 300, installing the chip assembly 300 onto the drum cartridge 200, installing the developing cartridge 100 onto the drum cartridge 200, and installing the drum cartridge 200 with the developing cartridge 100 onto the imaging device; in this method, the chip assembly 300 only needs to be installed before the processing cartridge C / drum cartridge 200 is installed onto the imaging device.

[0105] When the conductive component 5 is also set independently of the developing cartridge 100 and the drum cartridge 200, the method of using the processing cartridge C includes the following steps: preparing the developing cartridge 100, the conductive component 5, the drum cartridge 200 and the chip assembly 300; installing the chip assembly 300 and the conductive component 5 simultaneously or sequentially onto the drum cartridge 200; installing the developing cartridge 100 onto the drum cartridge 200; and installing the drum cartridge 200 with the developing cartridge 100 onto the imaging device.

[0106] It should be noted that the chip assembly 300 only needs to be installed before the processing cartridge C / drum cartridge 200 is installed into the imaging device. Therefore, the chip assembly 300 can be installed into the drum cartridge 200 at the same time as the conductive component 5, or it can be installed into the drum cartridge 200 earlier or later than the conductive component 5. When the chip assembly 300 is installed later than the conductive component 5, the installation step of the chip assembly 300 can be performed before or after the developing cartridge 100 is installed into the drum cartridge 200.

[0107] Accordingly, this utility model can also provide a method for using a developing cartridge assembly, which includes a separately configured developing cartridge 100 and a chip assembly 300. Relative to the drum housing 201, the developing cartridge 100 and the chip assembly 300 are respectively opposite to the inner surface 201a and the outer surface 201b of the drum housing 201. Therefore, the installation steps of the developing cartridge 100 and the chip assembly 300 do not need to be distinguished in sequence. It is only necessary to ensure that the developing cartridge 100 and the chip assembly 300 are both installed in the drum housing 200 before the drum housing 200 / processing cartridge C is installed in the imaging device.

[0108] In some embodiments, the conductive component 5 may also be disposed independently of the developing cartridge 100 and the drum housing 200. As described above, when the conductive component 5 is integrally disposed with the chip assembly 300, since at least a portion of the conductive component 5 extends in the receiving cavity 203 (inner surface 201a of the drum housing), the conductive component 5 and the chip assembly 300 need to be installed before the developing cartridge 100 is installed into the drum housing 200. Consequently, the conductive component 5 may also be disposed to extend outside the receiving cavity 203 (outer surface 201b of the drum housing). As both the conductive component 5 and the developing cartridge 100 are installed into the drum housing 200, the conductive component 5 can transfer power to the developing cartridge 100. In this variant, the conductive component 5 is not limited to being installed before the developing cartridge 100 is installed into the drum housing 200; it is only necessary to ensure that the drum housing 200 / processing cartridge C is installed before the imaging device is installed. Since the chip assembly 300 stores at least the parameter information of the developing cartridge 100, the chip assembly 300 and the developing cartridge 100 can also be sold together as at least part of a developing cartridge assembly. The two are separately set and packaged separately. The developing cartridge assembly is used in conjunction with the drum cartridge 200. After the two are in conjunction, they are installed into the imaging device in a detachable manner. Before the user starts using the developing cartridge 100, he or she can either install the chip assembly 300 into the drum cartridge 200 first and then install the developing cartridge 100 into the drum cartridge 200, or she can install the developing cartridge 100 into the drum cartridge 200 first and then install the chip assembly 300 into the drum cartridge 200.

[0109] In some embodiments, the chip assembly 300 may also be sold together with the drum cartridge 200 as at least part of a drum cartridge assembly, which is used in conjunction with the developing cartridge. After the two are assembled, they are detachably installed into the imaging device. In this case, the chip assembly 300 may be pre-installed into the drum cartridge 200, or the chip assembly 300 and the drum cartridge 200 may be packaged separately, and finally the user installs the chip assembly 300 into the drum cartridge 200. However, regardless of whether the chip assembly 300 is sold together with the developing cartridge 100 as a developing cartridge assembly or together with the drum cartridge 200 as a drum cartridge assembly, the processing box C includes the developing cartridge 100, the drum cartridge 200, and the chip assembly 300.

[0110] In some embodiments, the conductive component 5 can be part of the developing cartridge assembly, with the two components being separately arranged and packaged, or it can be part of the drum cartridge assembly, with the two components also being separately arranged and packaged, or it can be pre-installed into the drum cartridge 200 before leaving the factory.

[0111] In some implementations, the chip assembly can be assembled independently within the imaging device.

[0112] In some implementations, the conductive components can be assembled independently within the imaging device.

[0113] [Example 6]

[0114] Based on the inventive concept of the above embodiments, this embodiment provides a universal chip component 300. That is to say, the chip component 300 involved in this utility model can not only achieve the universality described below, but also has the various beneficial effects of the above embodiments.

[0115] There are two types of drum boxes, both with largely the same structure. The through-hole 205 and the paper feed channel 207 are adjacent to each other. The main difference lies in whether or not a protrusion 206 is provided. In other words, the main difference is whether the through-hole 205 and the paper feed channel 207 are connected. In the drum box described above, along the first direction, the protrusion 206 is located between the through-hole 205 and the paper feed channel 207, thus preventing the through-hole 205 and the paper feed channel 207 from being connected in the first direction. Figure 17 As shown, the protrusion 206 is no longer provided in the drum box, and the through hole 205 and the paper feeding channel 207 are connected in the first direction. In this drum box, it can also be considered that the through hole 205 is not provided. That is to say, the through hole 205 is not a necessary structure for the drum box. For example, the above-mentioned through hole 205 is closed.

[0116] For clarity in the following description, a drum box having a through hole 205 connected to the paper path 207 along the first direction, or a drum box without a through hole 205, is referred to as a first type of drum box. A drum box having a through hole 205 but not connected to the paper path 207 along the first direction is referred to as a second type of drum box. However, since the first type of drum box and the second type of drum box are basically the same in terms of structure, the first type of drum box and the second type of drum box will use the same number.

[0117] like Figure 16 , Figure 17 , Figure 18A and Figure 18B As shown, in the first type of drum housing, along a first direction, the drum housing 201 is further provided with an outer side plate 2014. Along the first direction, the outer side plate 2014 is located on the left side of the paper feeding channel 207, and at least a portion of the outer side plate 2014 overlaps with the paper feeding channel 207. Further, the drum housing 201 is also provided with a positioning groove 208 adjacent to the outer side plate 2014. Along a second direction, the positioning groove 208 is located in front of at least a portion of the paper feeding channel 207 and the outer side plate 2014. The positioning groove 208 is formed by at least a right limiting plate 2081, a left limiting plate 2082, and a lower limiting plate 2083. Along the first direction, the right limiting plate 2081 and the left limiting plate 2082 are located on both sides of the positioning groove 208, and the left limiting plate 2082 is closer to the left end of the drum housing than the right limiting plate 2081. Along a third direction, the lower limiting plate 2083 is located below the positioning groove 208.

[0118] The chip assembly 300 includes a substrate 304, an electrical contact portion 302, and a heightening member. The substrate 304 has a first surface 304a and a second surface 304b opposite to each other in the thickness direction. The orientation of the electrical contact portion 302 is the same as the orientation of the first surface 304a, or in other words, the electrical contact portion 302 is disposed on the first surface 304a. The electrical contact portion 302 is used to contact a stylus, so that the chip assembly 300 / processing cartridge C establishes a communication connection with the imaging device. The substrate 304 is used to support the electrical contact portion 302. After the chip assembly 300 is installed, the heightening member is used to make the electrical contact portion 302 form a stable electrical contact with the stylus.

[0119] In some embodiments, the heightening member is fixedly connected to the substrate 304. For example, the heightening member can be fixedly connected to the second surface 304b, or any surface between the first surface 304a and the second surface 304b can be fixedly connected to the heightening member. Specifically, methods such as bonding, welding, snap-fitting, and riveting can be used.

[0120] In some embodiments, the heightening member and the substrate 304 can also be movably connected. For example, the heightening member can be movably connected to the second surface 304b, or any surface between the first surface 304a and the second surface 304b can be movably connected to the heightening member. Specifically, at least a portion of the heightening member can be made elastic, or an elastic member can be provided between the heightening member and the substrate 304, or an elastic member can be provided between the heightening member and the component used to support it, etc.

[0121] The heightening component includes a first support member 308, such as... Figure 16 As shown, when the chip assembly 300 is installed into the first type of drum box / second type of drum box, one side of the first support member 308 abuts against the second surface 304b of the substrate, and the other side is opposite to the outer plate 2014 and the two abut against each other and are supported. Preferably, the other side of the first support member 308 and the outer plate 2014 can be glued together to facilitate the user to install and remove the chip assembly 300.

[0122] In some embodiments, the first support member 308 protrudes from the substrate 304 along the first direction, so that even if the size of the substrate 304 in the first direction is reduced, the substrate 304 can still be supported by the first support member 308; specifically, the first support member 308 protrudes from the substrate 304 along the direction from the paper path 207 to the outer plate 2014.

[0123] When the chip assembly 300 is installed into the first type of drum box / second type of drum box, the front empty area 3041 of the substrate 304 enters the positioning groove 208 and is fixed therein. The specific fixing method can be the existing adhesive, snap-fit, etc. In one embodiment, along the first direction, the substrate 304 can be installed and positioned in the positioning groove 208 by abutting against the left limiting plate 2082 and the right limiting plate 2081. In another embodiment, the front empty area 3041 can also be installed and positioned in the positioning groove 208 by attaching double-sided tape to the second surface 304b corresponding to the front empty area 3041, or by coating the second surface 304b / lower limiting plate 2083 with adhesive.

[0124] Along the first direction, the total size of the substrate 304 and the first support member 308 is d1, and the maximum size of the positioning groove 208 is d3, satisfying d1>d3. When the user installs the substrate 304 with the first support member 308 installed together toward the positioning groove 208, the substrate 304 or the first support member 308 will interfere with the left limiting plate 2082 or the right limiting plate 2081, thereby reminding the user of the installation error. It can be seen that the first support member 308 can also play a role in preventing the chip assembly 300 from being installed in the wrong position. That is, the first support member 308 is also an embodiment of the error prevention part 303.

[0125] Furthermore, along the first direction, the size of the front empty area 3041 is d2, which satisfies d2≤d3<d1, so that the front empty area 3041 can be installed into the positioning groove 208.

[0126] Preferably, along the arrangement direction of the front empty area 3041 and the rear empty area 3042, the first support member 308 is disposed close to the rear empty area 3042. For example, in the thickness direction of the substrate 304, the first support member 308 is opposite to at least a portion of the electrical contact portion 302, or in the thickness direction of the substrate 304, the first support member 308 is opposite to the rear empty area 3042. This arrangement not only enables the first support member 308 to play the aforementioned foolproof role, but also allows the electrical contact portion 302 to be further away from the outer plate 2014 without changing the size of the first support member 308, thereby making the electrical contact portion 302 contact the stylus 9 more tightly.

[0127] In some embodiments, the heightening member further includes a second support member 309. Along the arrangement direction of the front and rear empty areas / second direction / length direction of the substrate 304, the first support member 308 and the second support member 309 are spaced apart. Generally, along the thickness direction of the substrate 304, the size of the first support member 308 is larger than the size of the second support member 309. Finally, the substrate 304 is mounted at an angle relative to the outer side plate 2014 or the lower limiting plate 2083. The rear empty area 3042 is further away from the outer side plate 2014 or the lower limiting plate 2083 or the rotation axis L than the front empty area 2083. Figure 22 (As shown).

[0128] Preferably, the second support member 309 is opposite to the second surface 304b. More preferably, the second support member 309 is opposite to the front empty area 3041. Therefore, the second support member 309 will enter the positioning groove 208 along with the front empty area 3041. Similarly, the second support member 309 and the substrate 304 can be combined in any of the above-mentioned ways. The second support member 309 can also be installed and positioned in the positioning groove 208 by abutting against the left limiting plate 2082 and the right limiting plate 2081. In addition, the second support member 309 can also be installed and positioned in the positioning groove 208 by the above-mentioned bonding, snap-fit, or other methods.

[0129] In some embodiments, the projected area of ​​the second support 309 is larger than the projected area of ​​the first support 308 along the thickness direction of the substrate 304. When the second support 309 is fixed by adhesive bonding, the second support 309 can obtain a larger adhesive area.

[0130] In some embodiments, the chip assembly 300 is also provided with the aforementioned foolproof part 303. As shown in the figure, the foolproof part 303 is a protrusion formed from the substrate 304. Alternatively, the foolproof part 303 can also be a groove provided on the substrate 304. The first support member 308 cooperates with the protrusion or the groove to enable the chip assembly 300 to be installed more accurately.

[0131] like Figure 21 As shown, the second type of drum box also includes a stop block 2015 disposed on the drum housing 201. Along the second direction, the stop block 2015 is located on the rear side of the outer side plate 2014. The stop block 2015 and the positioning groove 208 are spaced apart. The through hole 205 is located between the stop block 2015 and the positioning groove 208. At least a portion of the through hole 205 is opposite to the positioning groove 208. When the through hole 205 is not provided in the drum box, the stop block 2015 is still located on the rear side of the outer side plate 2014. The chip assembly 300 involved in this embodiment can also be applied to the second type of drum box.

[0132] like Figure 22 As shown, after the chip assembly 300 is installed, along the second direction, the first support member 308 is located in front of the stop block 2015. The substrate 304 can be supported by at least one of the first support member 308 and the stop block 2015. Therefore, along the thickness direction of the substrate 304, there is no strict size relationship between the size of the first support member 308 and the protruding size of the stop block 2015, which allows for more options for the first support member 308. In a preferred embodiment, along the thickness direction of the substrate 304, the size of the first support member 308 is not smaller than the protruding size of the stop block 2015.

[0133] In some embodiments, when the through hole 205 is no longer provided in the drum housing, the chip assembly 300 can be directly mounted toward the drum housing, and the size of the substrate 304 can be reduced, and the front empty area 3041 can no longer enter the positioning groove 208.

[0134] In some embodiments, the chip assembly 300 involved in this embodiment may further include the carrier 301 involved in the above embodiments. In this case, the chip is carried by the carrier 301, and the carrier 301 is mounted on the drum housing. In this design, the size of the substrate 304 can be significantly reduced, which is beneficial to reducing the cost of the chip. The carrier 301 can be mounted on the drum housing by adhesive bonding or snap-fit. Preferably, the dimension of the end of the carrier 301 away from the positioning groove 208 is larger in the first direction than the dimension of the end of the carrier 301 near the positioning groove 208.

[0135] Similarly, in the chip assembly 300 of this modified mode, the first support member 308 and / or the second support member 309 can also be provided, and the first support member 308 and the second support member 309 are connected to the carrier member 301. Preferably, at least one of the first support member 308 and the second support member 309 is integrally formed with the carrier member 301, which can reduce the assembly process of the chip assembly and make the positioning of the first support member 308 and / or the second support member 309 more accurate.

[0136] In some embodiments, such as Figure 23 and Figure 24 As shown, the chip assembly 300 can be installed on the drum box 200 by means of a snap-fit ​​connection; specifically, the chip assembly 300 includes a first protrusion 61, a second protrusion 62, a third protrusion 63, a fourth protrusion 64, and a fifth protrusion 65, wherein the first protrusion 61, the second protrusion 62, the third protrusion 63, the fourth protrusion 64, and the fifth protrusion 65 can engage with the drum box 200 to make the chip assembly 300 and the drum box 200 snap-fit ​​connected.

[0137] Based on the above description, the chip component 300 involved in this embodiment has the following beneficial effects:

[0138] 1. The chip component 300 is compatible with both the first and second drum boxes. Regardless of which drum box the user is using, the chip component 300 can be directly installed, thereby reducing the user's difficulty of use and improving the user experience.

[0139] 2. For manufacturers, it eliminates the need to design compatible chip components for each type of drum unit, which helps reduce their costs.

[0140] 3. When the chip assembly 300 is installed, along the third direction, its rear empty area 3042 is farther away from the axis of rotation L than the front empty area 3041, which makes the electrical contact 302 and the contact pin 9 able to make closer contact.

[0141] 4. In the chip assembly 300 of this utility model, a plurality of electrical contacts 302 are arranged at intervals along a predetermined direction. When the chip assembly 300 is installed in the drum, the plurality of electrical contacts 302 are arranged at intervals along a first direction. Along the first direction, or in other words, along the arrangement direction of the plurality of electrical contacts 302, the size of the substrate 304 does not exceed the size of the positioning groove 208. In this way, the size of the substrate 304 can be effectively controlled, thereby controlling the cost of the chip assembly 300.

[0142] 5. To enable the chip assembly 300 to use both a first drum box and a second drum box, the thickness of the substrate 304 can be increased. Obviously, compared with this method, the cost of the chip assembly 300 provided by this utility model will be lower.

Claims

1. A chip assembly, characterized in that, For use in a processing cartridge comprising a separate developing cartridge and a drum cartridge, the processing cartridge being detachably mounted in an imaging device equipped with a stylus; The drum box includes a drum housing and a receiving cavity formed by the drum housing. The developing cartridge can be detachably mounted to the receiving cavity. The drum housing has an inner surface facing the receiving cavity and an outer surface facing away from the receiving cavity. The outer surface has a mounting surface for mounting the chip assembly. The drum box also includes a protrusion projecting from the drum housing away from the receiving cavity. The chip assembly has an electrical contact portion for contacting the stylus, the electrical contact portion being disposed on the drum housing and located between the end of the protrusion and the mounting surface, the electrical contact portion being further away from the receiving cavity than the mounting surface, the chip assembly further includes a carrier member directly or indirectly connected to the electrical contact portion and a foolproof portion disposed on the carrier member, the foolproof portion being used to cooperate with the protrusion.

2. The chip assembly according to claim 1, characterized in that, The chip assembly includes a substrate having a first substrate surface and a second substrate surface disposed opposite to each other along its thickness direction, and the electrical contact portion is disposed on the first substrate surface; wherein, when the chip assembly is mounted to the cassette, the second substrate surface and the outer surface face each other, and the second substrate surface and the outer surface are detachably connected.

3. The chip assembly according to claim 2, characterized in that, The drum housing includes a paper feed channel and an outer side plate. The paper feed channel allows the imaging medium to reach a position opposite the photosensitive drum from outside the drum housing. Along a first direction, the outer side plate is located to the left of the paper feed channel, and at least a portion of the outer side plate overlaps with the paper feed channel. The chip assembly also includes a riser for connecting to the substrate. When the chip assembly is mounted to the drum housing, the riser is opposite to the outer side plate, causing the electrical contact portion to contact the stylus.

4. The chip assembly according to claim 3, characterized in that, At least a portion of the heightening member is integrally formed with the support member.

5. The chip assembly according to claim 1, characterized in that, The carrier has a front empty area in front of the electrical contact and a rear empty area behind the electrical contact. In a second direction, the size of the front empty area is larger than the size of the rear empty area, and along a direction intersecting the second direction, at least a portion of the anti-mistake part also coincides with the front empty area.

6. The chip assembly according to claim 1, characterized in that, The drum unit includes a conductive component for receiving power from the imaging device. The conductive component includes a first conductive element and a second conductive element that are electrically connected to each other. The first conductive element receives power from the imaging device and transmits it to the second conductive element. The second conductive element is used to supply power to at least one of the developing roller, the toner feeding roller, and the toner exiting blade.

7. The chip assembly according to claim 6, characterized in that, The first conductive element includes a first part, a second part, and a third part, wherein the first part is located at the non-driving end, the third part is located at the driving end, and the second part extends along a first direction and connects the first part and the third part.

8. The chip assembly according to claim 6, characterized in that, The drum housing also includes a pressure roller extending along a first direction, the pressure roller being rotatably disposed within the drum housing, wherein the pressure roller serves as a second part.

9. The chip assembly according to claim 1, characterized in that, The chip assembly includes at least one protrusion for engaging with the drum case to connect the chip assembly to the drum case.

10. A processing box, characterized in that, The processing box includes the chip assembly as described in any one of claims 1-9.

Images