Graphene epoxy heating substrate

Abstract

The utility model discloses a graphene epoxy heating substrate which comprises a graphene heating chip, a first insulating film, a second insulating film, a first epoxy resin plate, a heat preservation layer and a second epoxy resin plate. The graphene heating chip is provided with a front surface and a back surface; the first insulating film covers the front surface of the graphene heating chip; the second insulating film covers the back surface of the graphene heating chip; the first epoxy resin plate covers the outer surface of the first insulating film; the thermal insulation layer covers the outer surface of the second insulating film; the second epoxy resin plate covers the outer surface of the thermal insulation layer; therefore, the electric heating conversion efficiency is high, heating is rapid and uniform, the service life is long, the compression resistance and the tensile property can be improved, and large mechanical stress and impact can be borne.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field technology of heating substrate, especially to a graphene epoxy heating substrate. BACKGROUND

[0002] With the improvement of people's living standards, in order to meet the different needs of people's life, various household appliances emerge as the times require, many household appliances have heating, heat preservation and other functions, and the household appliances with heating and heat preservation functions are mostly heated by microcrystalline glass substrate or tempered glass substrate.

[0003] Microcrystalline glass is also called microcrystalline jade or ceramic glass, which is quite different from the glass we usually see. It has the dual characteristics of glass and ceramic. Microcrystalline glass has the advantages of good heat resistance and low thermal expansion coefficient, can adapt to higher heating temperature and larger temperature change, and has good thermal shock resistance. However, due to its own material quality, the impact resistance of this microcrystalline glass is poor, and it is easy to break if it is hit during use, resulting in scrap. In addition, the production cost of the glass heating plate is high, which is not conducive to large-scale popularization and use.

[0004] Tempered glass belongs to safety glass, which forms a compressive stress layer on the surface of the glass after strengthening treatment, so it has good impact resistance. Tempered glass is a kind of prestressed glass. In order to improve the strength of the glass, chemical or physical method is usually used to form compressive stress on the surface of the glass. When the glass bears external force, it first offsets the surface stress, thereby improving the carrying capacity and enhancing the impact resistance of the glass. However, the thermal expansion coefficient of tempered glass is high, which cannot adapt to large temperature change. It cannot work in harsh environment with large temperature difference between cold and hot, has poor heat resistance and is easy to burst at high temperature, which threatens personal safety.

[0005] Therefore, it is necessary to study a new technical scheme to solve the above problems. CONTENT OF THE UTILITY MODEL

[0006] Therefore, the utility model provides a graphene epoxy heating substrate, which is designed and matched between the graphene heating chip, the first insulating film, the second insulating film, the first epoxy resin plate, the heat preservation layer and the second epoxy resin plate, so that the electric heating conversion efficiency is high, the heating is rapid, uniform, the service life is long, the compression and tensile resistance can be improved, and the mechanical stress and impact can be borne.

[0007] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0008] The graphene epoxy heating substrate comprises a graphene heating chip, a first insulating film, a second insulating film, a first epoxy resin plate, a heat preservation layer and a second epoxy resin plate; the graphene heating chip has a front surface and a back surface; the first insulating film is arranged on the front surface of the graphene heating chip; the second insulating film is arranged on the back surface of the graphene heating chip; the first epoxy resin plate is arranged on the outer surface of the first insulating film; the heat preservation layer is arranged on the outer surface of the second insulating film; and the second epoxy resin plate is arranged on the outer surface of the heat preservation layer.

[0009] As a preferred solution, the first insulating film and the second insulating film are made of PI material.

[0010] As a preferred solution, the graphene heating chip is made by mixing graphene paste and conductive powder and then integrally formed by heating and pressing, so that the materials can be fully combined and the conductive graphene can be uniformly dispersed, and the heating effect of each part of the heating substrate is uniform.

[0011] As a preferred solution, the front surface and the back surface of the graphene heating chip are further provided with a first Teflon layer and a second Teflon layer; the first Teflon layer is arranged between the front surface of the graphene heating chip and the first insulating film; and the second Teflon layer is arranged between the back surface of the graphene heating chip and the second insulating film, thereby effectively improving the high-temperature resistance of the heating substrate itself, so that it can provide higher temperature to the outside, and the functionality is more advanced, and more use scenarios can be met.

[0012] As a preferred solution, the heat preservation layer is heat preservation cotton, so that the heat preservation effect is good.

[0013] As a preferred solution, the first epoxy resin plate and the second epoxy resin plate are arranged on the front surface and the back surface of the first insulating film and the second insulating film by means of hot pressing or adhesion.

[0014] As a preferred solution, the graphene heating chip, the first insulating film, the second insulating film, the first epoxy resin plate, the heat preservation layer and the second epoxy resin plate are covered with a metal edge, so that the whole heating sheet blocks the moisture and humidity in the outside from entering the inside of the heating sheet.

[0015] As a preferred solution, the thickness of the first epoxy resin plate and the second epoxy resin plate is 0.5-0.8mm.

[0016] As a preferred solution, the thickness of the first insulating film and the second insulating film is 0.05-0.08mm.

[0017] As a preferred solution, the thickness of the heat preservation layer is 1.0-3.0mm.

[0018] The utility model discloses an improved structure of graphene heating chip, and the graphene heating chip is provided with first Teflon layer, second Teflon layer, metal edge covering, first insulating film, second insulating film, first epoxy resin plate, heat preservation layer and second epoxy resin plate, and the graphene heating chip is provided with first Teflon layer, second Teflon layer, metal edge covering, first insulating film, second insulating film, first epoxy resin plate, heat preservation layer and second epoxy resin plate.

[0019] To make the utility model more clear in structure characteristics and function, the following will be combined with the specific embodiment to the utility model in detail. DRAWINGS

[0020] Figure 1 It is the structure diagram of the embodiment of the utility model;

[0021] Figure 2 It is the sectional view of the embodiment of the utility model;

[0022] Figure 3 It is Figure 2 The local enlarged view of A in the middle;

[0023] Figure 4 It is another sectional view of the embodiment of the utility model.

[0024] Drawing mark explanation:

[0025] 10, graphene heating chip 20, first insulating film

[0026] 11, first Teflon layer 12, second Teflon layer

[0027] 13, metal edge covering

[0028] 30, second insulating film 40, first epoxy resin plate

[0029] 50, second epoxy resin plate 60, heat preservation layer. Specific implementation

[0030] Please refer to Figures 1 to 4 It shows the specific structure of the embodiment of the utility model.

[0031] In the description of the utility model, it needs to explain, for the direction word, if there are terms '' above '' '' below '' '' front '' '' behind '' '' left '' '' right '' etc. Indicate the direction and position relation as the direction or position relation shown based on the drawing or normal wearing uses, only for the convenience of narrating the utility model and simplifying the description, and not indicate or imply that the device or element must have a specific direction, construct and operate in a specific direction, and cannot be understood as limiting the specific protection scope of the utility model.

[0032] A graphene epoxy heating substrate, comprising a graphene heating chip 10, a first insulating film 20, a second insulating film 30, a first epoxy resin plate 40, a heat preservation layer 60 and a second epoxy resin plate 50.

[0033] The graphene heating chip 10 has a front surface and a back surface; preferably, the graphene heating chip 10 is integrally formed by mixing graphene paste and conductive powder and pressing by heating, so that the materials can be fully combined, the conductive graphene can be uniformly dispersed, and the heating effect of each part of the heating substrate is uniform.

[0034] Preferably, the front surface and the back surface of the graphene heating chip 10 are further provided with a first Teflon layer 11 and a second Teflon layer 12; the first Teflon layer 11 is covered between the front surface of the graphene heating chip 10 and the first insulating film 20; the second Teflon layer 12 is covered between the back surface of the graphene heating chip 10 and the second insulating film 30, thereby effectively improving the high-temperature resistance of the heating substrate itself, so that it can provide higher temperature to the outside, and the functionality is more advanced, and more use scenarios can be met.

[0035] Alternatively, in the embodiment, the graphene heating chip 10 is integrally formed by mixing Teflon, graphene paste and conductive powder and pressing by heating, so that it effectively improves the high-temperature resistance of the heating film itself, so that it can provide higher temperature to the outside, and the functionality is more advanced, and more use scenarios can be met.

[0036] The Teflon selects Teflon powder with appropriate particle size, preferably the finer the powder particle size, which is beneficial to uniform mixing, and the common particle size is between 10-50 microns; the graphene selects the type of graphene according to the required performance, such as graphene oxide, reduced graphene oxide, etc., and ensures that it has good dispersibility, and the graphene product after surface modification or functionalization treatment can be selected to improve its compatibility in the mixed system.

[0037] The conductive powder selects appropriate conductive powder according to specific conductive performance requirements, such as metal powder (such as silver powder, copper powder, etc.), carbon nanotube, conductive carbon black, etc.

[0038] The drying and pre-dispersion are carried out before mixing; during drying, the Teflon, graphene and conductive powder are respectively subjected to drying treatment at appropriate temperature and conditions to remove water and other volatile impurities, so as to avoid affecting the mixing effect or causing the performance of the materials to decrease during mixing; during pre-dispersion, the graphene and conductive powder are respectively added into an appropriate amount of solvent, and are uniformly dispersed in the solvent by ultrasonic dispersion, mechanical stirring and the like to form a stable dispersion liquid or slurry.

[0039] Alternatively, a melting blending method can be used; the Teflon is heated to a molten state, and then the graphene and conductive powder are added, and are mixed by high-speed stirring or an extruder and the like to uniformly disperse the graphene and conductive powder in the Teflon matrix; the mixing mode can be selected according to actual needs, and will not be described here.

[0040] The first insulating film 20 is arranged on the front surface of the graphene heating chip 10; the second insulating film 30 is arranged on the back surface of the graphene heating chip 10; preferably, the thickness of the first epoxy resin plate 40 and the second epoxy resin plate 50 is 0.5-0.8 mm. Preferably, the thickness of the first insulating film 20 and the second insulating film 30 is 0.05-0.08 mm. Preferably, the first insulating film 20 and the second insulating film 30 are made of PI material. The PI material has the characteristics of high mechanical properties such as tensile strength, bending strength and impact strength, and has high thermal stability, and the thermal decomposition temperature is usually higher than 500℃, and the excellent performance can be maintained at 450℃ for a long time, and the long-term use temperature range is between -200℃ and +300℃, and the short-term can withstand higher temperature.

[0041] The first epoxy resin plate 40 is arranged on the outer surface of the first insulating film 20; the heat preservation layer 60 is arranged on the outer surface of the second insulating film 30; and the second epoxy resin plate 50 is arranged on the outer surface of the heat preservation layer 60. Preferably, the first epoxy resin plate 40 and the second epoxy resin plate 50 are arranged on the front surface and the back surface of the first insulating film 20 and the second insulating film 30 by hot pressing or bonding.

[0042] Preferably, the heat preservation layer 60 is heat preservation cotton, so that it has good heat preservation effect. Preferably, the thickness of the heat preservation layer 60 is 1.0-3.0 mm.

[0043] Preferably, the outer periphery of the graphene heating chip 10, the first insulating film 20, the second insulating film 30, the first epoxy resin plate 40, the heat preservation layer 60 and the second epoxy resin plate 50 is covered with a metal edge 13, so that the whole heating sheet blocks the water vapor and moisture in the outside from entering the inside of the heating sheet.

[0044] The utility model discloses a design emphasis lies in, it mainly is through the structure design and cooperation between graphene heating chip, first insulating film, second insulating film, first epoxy plate, thermal insulation layer and second epoxy plate, thus, utilize graphene heating chip's design, make its electric heating conversion efficiency high, heat rapidly, evenly and long service life, utilize the design of first epoxy plate and second epoxy plate, improve the compression resistance, tensile property, can bear greater mechanical stress and impact, utilize the design of first insulating film, second insulating film, make have outstanding high temperature resistance, in addition is the design of thermal insulation layer, make its heat preservation effect is good.

[0045] The above is only the preferred embodiment of the utility model, and does not limit the technical range of the utility model in any way, so any slight modification, equivalent change and modification made according to the technical essence of the utility model to the above embodiment still belong to the range of the technical scheme of the utility model.

Claims

1. A graphene epoxy heating substrate, characterized by: The graphene heating chip, the first insulating film, the second insulating film, the first epoxy resin plate, the thermal insulation layer and the second epoxy resin plate are included; the graphene heating chip has a front surface and a back surface; the first insulating film is arranged on the front surface of the graphene heating chip; the second insulating film is arranged on the back surface of the graphene heating chip; the first epoxy resin plate is arranged on the outer surface of the first insulating film; the thermal insulation layer is arranged on the outer surface of the second insulating film; The second epoxy resin plate is arranged on the outer surface of the thermal insulation layer.

2. The graphene epoxy heating substrate according to claim 1, characterized in that: The first insulating film and the second insulating film are made of PI material.

3. The graphene epoxy heating substrate of claim 1, wherein: The graphene heating chip is made by mixing graphene paste and conductive powder and then integrally formed by heating and pressing.

4. The graphene epoxy heating substrate of claim 3, wherein: The front surface and the back surface of the graphene heating chip are further provided with a first Teflon layer and a second Teflon layer; the first Teflon layer is arranged between the front surface of the graphene heating chip and the first insulating film; the second Teflon layer is arranged between the back surface of the graphene heating chip and the second insulating film.

5. The graphene epoxy heating substrate of claim 1, wherein: The thermal insulation layer is thermal insulation cotton.

6. The graphene epoxy heating substrate of claim 1, wherein: The first epoxy resin plate and the second epoxy resin plate are arranged on the front surface and the back surface of the first insulating film and the second insulating film by means of hot pressing or adhesion.

7. The graphene epoxy heating substrate of claim 1, wherein: The graphene heating chip, the first insulating film, the second insulating film, the first epoxy resin plate, the thermal insulation layer and the second epoxy resin plate are covered with a metal edge.

8. The graphene epoxy heating substrate of claim 1, wherein: The thickness of the first epoxy resin plate and the second epoxy resin plate is 0.5-0.8mm.

9. The graphene epoxy heating substrate of claim 1, wherein: The thickness of the first insulating film and the second insulating film is 0.05-0.08mm.

10. The graphene epoxy heating substrate of claim 1, wherein: The thickness of the thermal insulation layer is 1.0-3.0mm.

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