Circulating heat dissipation type integrated power supply based on liquid medium
By optimizing the coolant flow channel design and intelligent heat dissipation control, the problem of insufficient heat dissipation efficiency of integrated power supplies with liquid medium circulation cooling under high power density has been solved, achieving efficient and stable heat dissipation management, extending equipment life and improving system reliability.
Patent Information
- Application Number
- CN202520275066.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-20
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-02-20
AI Technical Summary
Existing liquid-medium circulating cooling integrated power supplies have insufficient heat dissipation efficiency in high power density and high heat load applications, resulting in high system complexity and low reliability. Natural convection cannot respond in time, leading to local overheating and affecting system stability.
The coolant flow channel design employs a spiral main channel and a mesh branch channel, combined with intelligent control of the coolant pump, radiator fan and temperature sensor. Heat conduction is enhanced through heat-conducting plates and microporous structures, ensuring unidirectional flow of coolant and real-time heat dissipation management.
It improves heat dissipation efficiency, ensures that rectifier components are fully cooled under high power density, extends equipment life, realizes intelligent heat dissipation management, and improves system stability and safety.
Smart Images

Figure CN223786381U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of power management technology, specifically a liquid-medium circulating heat dissipation integrated power supply. Background Technology
[0002] With the continuous advancement of integrated power supply technology based on liquid-medium circulating cooling, such power systems have been widely applied in data centers, industrial control, and new energy fields. However, existing technical solutions still have some problems in practical applications. For example, traditional liquid-medium circulating cooling systems typically rely on external pumping equipment to circulate the coolant, which not only increases the system's complexity and energy consumption but also makes it prone to pumping equipment failure during long-term operation, affecting the system's stability and reliability. To address these issues, some researchers and companies have attempted to improve heat dissipation efficiency and reduce dependence on external power sources by optimizing coolant flow channel design and rectifier component layout. Although these methods improve cooling performance to some extent, they still have limitations, especially in high power density and high heat load applications, where natural coolant circulation may not meet the demand for rapid heat dissipation, thus limiting the improvement of overall system performance.
[0003] Specifically, a search revealed a liquid-medium circulating cooling integrated power supply with publication number CN219269421U, published on June 27, 2023. This design, through the rational configuration of the rectifier components and coolant flow channels, utilizes the principle of coolant density reduction after heat absorption to automatically form coolant circulation within the containment cavity, thereby improving the cooling effect on the rectifier components. However, this design relies on natural convection of the coolant. When the system heat load increases sharply, natural convection may not respond in time, leading to localized overheating and affecting the stable operation of the power supply system.
[0004] Therefore, existing technologies suffer from insufficient heat dissipation efficiency, high system complexity, and low reliability when dealing with high power density and high heat load applications. To address these issues, this invention proposes an integrated power supply with liquid-medium circulating cooling, aiming to improve heat dissipation efficiency and system stability by optimizing the coolant circulation mechanism and rectifier component layout, thus adapting to a wider range of application scenarios. Utility Model Content
[0005] An integrated power supply with circulating cooling based on a liquid medium includes a power supply casing, a coolant circulation system, a rectifier element, and coolant channels. The power supply casing has an internal cavity containing the rectifier element. The coolant circulation system includes a coolant pump, coolant piping, and a coolant radiator. The coolant piping passes through the power supply casing and connects to the coolant pump and radiator. The coolant channels are arranged around the rectifier element and include a main channel and branch channels. The main channel spirals around the rectifier element. The branch channels are distributed in a mesh pattern on the upper and lower surfaces of the rectifier element. The branch channels are connected to the main channel through connecting pipes. A one-way valve is installed inside the connecting pipe. The coolant pump is installed at the inlet end of the coolant pipe. The coolant radiator is installed at the outlet end of the coolant pipe. A cooling fan is installed inside the coolant radiator. A temperature sensor is installed inside the power supply housing. The temperature sensor is electrically connected to the coolant pump and the cooling fan. A support foot is provided at the bottom of the power supply housing. A shock-absorbing spring is installed inside the support foot. An anti-slip pad is provided at the bottom of the support foot.
[0006] The main channel and branch channels of the coolant flow channel are both made of copper and coated with an anti-corrosion coating. The spiral angle of the main channel is 30°, the mesh distribution spacing of the branch channels is 5mm, the diameter of the connecting pipe between the branch channels and the main channel is 3mm, the opening pressure of the one-way valve is 0.1MPa, the flow rate of the coolant pump is 10L / min, the heat dissipation area of the coolant radiator is 0.5 square meters, the air volume of the cooling fan is 1000m³ / h, the measurement range of the temperature sensor is 0℃ to 100℃, the compression stroke of the shock-absorbing spring is 10mm, and the anti-slip pad is made of rubber with a thickness of 3mm.
[0007] A heat-conducting plate is provided between the main channel and the branch channels of the coolant flow channel. The heat-conducting plate is made of aluminum and has a thickness of 1 mm. The surface of the heat-conducting plate is coated with thermal grease. There are 4 heat-conducting plates, which are evenly distributed on the upper and lower surfaces of the rectifier element. The contact surface between the heat-conducting plate and the rectifier element has a microporous structure with a pore diameter of 0.1 mm and a pore density of 100 pores / cm². A sealing ring is provided at the connection between the heat-conducting plate and the coolant flow channel. The sealing ring is made of silicone rubber and has a thickness of 1 mm.
[0008] The heat sink fins of the coolant radiator are made of aluminum alloy, with a thickness of 1mm and a spacing of 5mm. The surface of the heat sink is coated with a heat-dissipating coating with a thickness of 0.1mm. The blades of the cooling fan are made of plastic, with a thickness of 2mm and a diameter of 100mm. There are 5 blades, and the blade tilt angle is 15°. The motor of the cooling fan is a DC motor with a rated voltage of 12V and a rated power of 50W.
[0009] The power supply casing is made of aluminum alloy and has a thickness of 2mm. The surface of the casing is coated with an antistatic coating with a thickness of 0.1mm. An internal heat insulation layer made of polyurethane foam has a thickness of 5mm. The bottom of the casing has 100 heat dissipation holes with a diameter of 5mm and a spacing of 10mm. These holes are arranged in a matrix, and the edges of the holes are chamfered with a radius of 1mm.
[0010] The top of the power supply casing is equipped with a control panel, which includes a display screen and operation buttons. The display screen is a 5-inch LCD screen with an active matrix TFT resolution. There are 5 operation buttons, which are touch-sensitive and coated with a waterproof coating with a thickness of 0.1mm. A sealing ring made of silicone rubber with a thickness of 1mm is provided at the connection between the control panel and the power supply casing.
[0011] The temperature sensor is model DS18B20, with a measurement accuracy of ±0.5℃, a response time of 750ms, a power supply voltage of 3.3V, and a digital output signal. It has three pins with a pin pitch of 2.54mm, gold-plated pins, and a pin length of 5mm.
[0012] The coolant pump is model DC12V-10L, with a rated voltage of 12V, a rated power of 30W, a flow rate of 10L / min, a head of 1.5m, an inlet diameter of 10mm, an outlet diameter of 10mm, a stainless steel casing with a thickness of 1mm, an internal filter screen with a pore size of 0.1mm, and a DC motor with a rated voltage of 12V and a rated power of 30W.
[0013] The coolant radiator is model HS-050, with a heat dissipation area of 0.5 square meters. The heat sink fins are made of aluminum alloy, with a thickness of 1 mm and a spacing of 5 mm. The surface of the heat sink fins is coated with a heat-dissipating coating with a thickness of 0.1 mm. The cooling fan is model DF12025, with an airflow of 1000 m³ / h. The fan motor is a DC motor with a rated voltage of 12V and a rated power of 50W. The fan blades are made of plastic, with a thickness of 2 mm and a diameter of 100 mm. There are 5 blades, and the blade tilt angle is 15°.
[0014] The heat-conducting sheet between the main channel and the branch channels of the coolant flow channel is made of aluminum and has a thickness of 1 mm. The surface of the heat-conducting sheet is coated with thermal grease. There are 4 heat-conducting sheets, which are evenly distributed on the upper and lower surfaces of the rectifier element. The contact surface between the heat-conducting sheet and the rectifier element has a microporous structure with a pore diameter of 0.1 mm and a pore density of 100 pores / cm². A sealing ring is provided at the connection between the heat-conducting sheet and the coolant flow channel. The sealing ring is made of silicone rubber and has a thickness of 1 mm.
[0015] The structure and implementation principle of this utility model are as follows: A rectifier element is installed in the cavity inside the power supply casing. The coolant circulation system pumps coolant from the coolant radiator into the coolant pipeline via a coolant pump. The coolant then enters the coolant flow channel through the coolant pipeline. The main flow channel spirals around the rectifier element, while the branch channels are distributed in a mesh pattern on the upper and lower surfaces of the rectifier element. The coolant circulates through the connecting pipes between the branch channels and the main flow channel. The coolant absorbs heat as it flows through the rectifier element. A one-way valve controls the flow direction of the coolant to prevent backflow. After absorbing heat, the coolant, driven by the coolant pump, enters the coolant radiator. The cooling fan inside the radiator dissipates the heat into the air, thus cooling the coolant. A temperature sensor monitors the temperature inside the power supply casing in real time. When the temperature exceeds a preset value, the temperature sensor sends a signal to the coolant pump and cooling fan, activating them to increase the coolant flow rate and the fan airflow, thereby improving heat dissipation efficiency. The shock-absorbing springs inside the support feet and the anti-slip pads on the bottom can reduce the vibration of the power supply during operation, improving the stability and safety of the equipment.
[0016] The beneficial effects of this utility model are:
[0017] The design of the spiral main channel and mesh branch channels of the coolant flow channel increases the contact area between the coolant and the rectifier components, improves heat dissipation efficiency, ensures that the rectifier components can be adequately cooled in high power density applications, and extends the service life of the equipment.
[0018] Through real-time monitoring by temperature sensors and coordinated control of coolant pumps and cooling fans, intelligent heat dissipation management is achieved. It can automatically adjust the coolant flow rate and cooling fan airflow according to actual temperature changes, ensuring stable operation of the equipment under different environmental conditions.
[0019] The design of heat-conducting plates and microporous structures enhances the heat conduction between the rectifier components and the coolant, further improving the heat dissipation effect. At the same time, the use of sealing rings ensures the sealing of the coolant flow channels, preventing coolant leakage and improving the safety and reliability of the equipment. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0021] Figure 2 This is a schematic diagram of the coolant circulation system of this utility model;
[0022] Figure 3 This is a cross-sectional view of the coolant flow channel of this utility model;
[0023] Figure 4This is a schematic diagram of the coolant radiator structure of this utility model;
[0024] Figure 5 This is a schematic diagram of the heat-conducting sheet and microporous structure of this utility model;
[0025] Figure 6 This is a schematic diagram of the support foot structure of this utility model.
[0026] The attached figures are labeled as follows:
[0027] 1. Power supply housing; 2. Housing cavity; 3. Rectifier element; 4. Coolant pump; 5. Coolant piping; 6. Coolant radiator; 7. Coolant flow channel; 8. Main flow channel; 9. Branch flow channel; 10. Connecting piping; 11. Check valve; 12. Temperature sensor; 13. Support foot; 14. Shock-absorbing spring; 15. Anti-slip pad; 16. Coolant pump motor; 17. Cooling fan; 18. Heat sink; 19. Thermal coating; 20. Blade; 21. Thermal conductive plate; 22. Thermal grease; 23. Microporous structure; 24. Sealing ring; 25. Thermal insulation layer; 26. Heat dissipation holes; 27. Control panel; 28. Display screen; 29. Operation buttons; 30. Antistatic coating; 31. Filter screen; 32. Top of power supply housing; 33. Bottom of power supply housing; 34. Motor; 35. Inside of power supply housing; 36. Coolant pump housing; 37. Temperature sensor pins. Detailed Implementation
[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0029] Please see Figure 1 This utility model provides an integrated power supply based on liquid medium circulation heat dissipation, including a power supply housing 1, a housing cavity 2, a rectifier element 3, a coolant pump 4, a coolant pipeline 5, a coolant radiator 6, a coolant flow channel 7, a temperature sensor 12, a support foot 13, and a control panel 27.
[0030] Please see Figure 1The power supply casing 1 is made of aluminum alloy with a thickness of 2mm and a 0.1mm thick anti-static coating 30. The power supply casing 1 has an internal cavity 2 for housing the rectifier element 3 and other related components. The power supply casing 1 also has a 5mm thick heat insulation layer 25 made of polyurethane foam to reduce the influence of external ambient temperature. The bottom of the power supply casing 1 has 100 ventilation holes 26, each 5mm in diameter and spaced 10mm apart, arranged in a matrix, with chamfered edges of 1mm radius to enhance heat dissipation. The top of the power supply casing 1 has a control panel 27, including a 5-inch LCD screen 28 and five touch-sensitive operation buttons 29.
[0031] Please see Figure 1 and Figure 2 Four evenly distributed heat-conducting fins 21 are provided between the main channel 8 and the branch channels 9 of the coolant flow channel 7. The heat-conducting fins 21 are made of 1mm thick aluminum and coated with thermal grease 22. The contact surface between the heat-conducting fins 21 and the rectifier element 3 has a microporous structure 23 with a pore size of 0.1mm and a pore density of 100 pores / cm² to enhance heat conduction. A 1mm thick silicone rubber sealing ring 24 is provided at the connection between the heat-conducting fins 21 and the coolant flow channel 7 to ensure the sealing of the coolant flow channel 7.
[0032] Please see Figure 4 The coolant circulation system includes a coolant pump 4, coolant piping 5, and a coolant radiator 6. The coolant pump 4 is a DC12V-10L model with a rated voltage of 12V, a rated power of 30W, a flow rate of 10L / min, and a head of 1.5m. The inlet and outlet diameters of the coolant pump 4 are both 10mm, and the casing is made of 1mm thick stainless steel. An internal filter screen 31 with a 0.1mm pore size is installed to prevent impurities from entering the coolant flow channel 7. The coolant pump 4 is installed at the inlet end of the coolant piping 5, and the coolant radiator 6 is installed at the outlet end of the coolant piping 5.
[0033] Please see Figure 1 and Figure 4 The coolant radiator 6 is model HS-050, with a heat dissipation area of 0.5 square meters. The heat sink fins 18 are made of 1mm thick aluminum alloy, spaced 5mm apart, and coated with a 0.1mm thick heat-dissipating coating 19. The cooling fan 17 is model DF12025, with an airflow of 1000m³ / h. The motor 34 is a 12V DC motor with a rated power of 50W. The blades 20 of the cooling fan 17 are made of 2mm thick plastic, with a diameter of 100mm, and there are 5 blades with a tilt angle of 15°.
[0034] Please see Figures 1-4The coolant flow channels 7 are arranged around the rectifier element 3, including a main flow channel 8 and branch channels 9. The main flow channel 8 is arranged in a 30° spiral angle around the rectifier element 3, and the branch channels 9 are distributed in a mesh pattern with a spacing of 5 mm on the upper and lower surfaces of the rectifier element 3. The branch channels 9 are connected to the main flow channel 8 through a connecting pipe 10 with a diameter of 3 mm. The connecting pipe 10 is equipped with a one-way valve 11 with an opening pressure of 0.1 MPa to ensure unidirectional flow of coolant. Both the main flow channel 8 and the branch channels 9 are made of copper and coated with an anti-corrosion coating, providing good thermal conductivity.
[0035] Please see Figure 1 The temperature sensor 12 is a DS18B20, with a measurement accuracy of ±0.5℃, a response time of 750ms, a power supply voltage of 3.3V, and a digital output signal. The pin spacing (37) is 2.54mm, and it is gold-plated. The pin length is 5mm. The temperature sensor 12 is installed inside the power supply housing 1 and is electrically connected to the coolant pump 4 and the cooling fan 17. It monitors the temperature inside the power supply housing 1 in real time and controls the operation of the coolant pump 4 and the cooling fan 17 based on temperature changes.
[0036] Please see Figure 1 and Figure 6 The support foot 13 is installed at the bottom of the power supply housing 1. Inside, there is a shock-absorbing spring 14 with a compression stroke of 10mm. The bottom is equipped with a 3mm thick rubber anti-slip pad 15 to reduce the vibration of the power supply during operation and improve the stability and safety of the equipment.
[0037] The working principle of this utility is as follows: A rectifier element 3 is installed in the cavity 2 inside the power supply casing 1. The coolant circulation system pumps coolant from the coolant radiator 6 into the coolant pipe 5 via the coolant pump 4. The coolant then enters the coolant flow channel 7 through the coolant pipe 5. The main flow channel 8 of the coolant flow channel 7 spirals around the rectifier element 3, while the branch channels 9 are distributed in a mesh pattern on the upper and lower surfaces of the rectifier element 3. The coolant circulates through the connecting pipe 10 between the branch channels 9 and the main flow channel 8. The coolant absorbs heat as it flows through the rectifier element 3. The flow direction of the coolant is controlled by the one-way valve 11 to ensure that backflow is avoided. After absorbing heat, the coolant is driven by the coolant pump 4 into the coolant radiator 6. The cooling fan 17 inside the radiator dissipates the heat into the air, thereby cooling the coolant. Temperature sensor 12 monitors the internal temperature of the power supply casing 1 in real time. When the temperature exceeds a preset value, temperature sensor 12 sends a signal to coolant pump 4 and cooling fan 17, which then activate to increase the coolant flow rate and airflow of cooling fan 17, thereby improving heat dissipation efficiency. The shock-absorbing springs 14 inside the support feet 13 and the anti-slip pads 15 on the bottom reduce vibration during operation, improving equipment stability and safety.
[0038] Specific application scenarios: This utility model's integrated power supply with liquid-medium circulating cooling is particularly suitable for high-power-density data centers, industrial control equipment, and high-performance computing devices. In data centers, this power supply, through an efficient liquid cooling system, ensures that the rectifier element 3 remains within a safe operating temperature range under high load conditions, thereby extending the equipment's lifespan and improving system stability and reliability. In industrial control equipment, this power supply can effectively cope with harsh industrial environments, reducing equipment failures caused by high temperatures and ensuring smooth production processes. In high-performance computing devices, this power supply can provide a stable power supply, while its efficient cooling system ensures stable operation of the computing device under high loads for extended periods.
[0039] If certain terms are used in the specification and claims to refer to specific components, those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" as used throughout the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to." "Approximately" means that within an acceptable margin of error, those skilled in the art can solve the technical problem and substantially achieve the technical effect within a certain margin of error.
[0040] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a product or system comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a product or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the product or system that includes that element.
[0041] The foregoing description illustrates and describes several preferred embodiments of the present invention. However, as previously stated, it should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the inventive concept described herein through the foregoing teachings or techniques or knowledge in related fields. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.
Claims
1. A liquid-medium circulating heat dissipation integrated power supply, comprising a power supply housing (1), a housing cavity (2), a rectifier element (3), a coolant pump (4), coolant piping (5), a coolant radiator (6), a coolant flow channel (7), a temperature sensor (12), support feet (13), and a control panel (27), characterized in that: The power supply housing (1) is made of aluminum alloy and coated with an antistatic coating (30). It has an internal cavity (2) and a rectifier (3) installed inside the cavity (2). The power supply housing (1) has an internal heat insulation layer (25), a heat dissipation hole (26) at the bottom, and a control panel (27) at the top. The coolant circulation system includes a coolant pump (4), a coolant pipeline (5), and a coolant radiator (6). The coolant pipeline (5) runs through the power supply housing (1) and is connected to the coolant pump (4) and the coolant radiator (6). The coolant flow channel (7) is set around the rectifier (3) and includes a main flow channel (8) and a branch flow channel (9). The temperature sensor (12) is installed inside the power supply housing (1) and is electrically connected to the coolant pump (4) and the cooling fan (17). The support foot (13) is installed at the bottom of the power supply housing (1), with a shock-absorbing spring (14) inside and a rubber anti-slip pad (15) at the bottom.
2. The integrated power supply based on liquid medium and circulating heat dissipation according to claim 1, characterized in that: The power supply housing (1) is made of aluminum alloy with a thickness of 2mm and is coated with a 0.1mm thick antistatic coating (30). The interior of the power supply housing (1) is provided with a 5mm thick heat insulation layer (25), which is made of polyurethane foam. The bottom of the power supply housing (1) is provided with 100 heat dissipation holes (26), which are 5mm in diameter, 10mm apart, arranged in a matrix, and have a 1mm radius chamfer on the edge.
3. The integrated power supply based on liquid medium and circulating heat dissipation according to claim 1, characterized in that: The coolant pump (4) is model DC12V-10L, rated voltage is 12V, rated power is 30W, flow rate is 10L / min, head is 1.5m, inlet and outlet diameters are both 10mm, the outer shell is made of 1mm thick stainless steel, and the inside is equipped with a 0.1mm pore size filter screen (31).
4. The integrated power supply based on liquid medium and circulating heat dissipation according to claim 1, characterized in that: The model of the coolant radiator (6) is HS-050, and the heat dissipation area is 0.5 square meters. The thickness of the heat dissipation fins (18) of the coolant radiator (6) is 1 mm, the spacing is 5 mm, and the surface is coated with a heat dissipation coating (19) with a thickness of 0.1 mm.
5. The integrated power supply based on liquid medium and circulating heat dissipation according to claim 1, characterized in that: The coolant flow channel (7) is arranged around the rectifier element (3), including the main flow channel (8) and the branch flow channel (9). The main flow channel (8) is arranged in a spiral angle of 30° around the rectifier element (3). The branch flow channels (9) are arranged in a mesh pattern with a spacing of 5 mm on the upper and lower surfaces of the rectifier element (3). The branch flow channels (9) are connected to the main flow channel (8) through a connecting pipe (10) with a diameter of 3 mm. The connecting pipe (10) is equipped with a one-way valve (11) with an opening pressure of 0.1 MPa. The main flow channel (8) and the branch flow channel (9) of the coolant flow channel (7) are both made of copper and coated with an anti-corrosion coating.
6. The integrated power supply based on liquid medium and circulating heat dissipation according to claim 1, characterized in that: Four heat-conducting plates (21) are provided between the main channel (8) and the branch channel (9) of the coolant flow channel (7). The heat-conducting plates (21) are made of 1mm thick aluminum material and coated with thermal grease (22). The heat-conducting plates (21) are evenly distributed on the upper and lower surfaces of the rectifier element (3). The contact surface between the heat-conducting plates (21) and the rectifier element (3) is provided with a microporous structure (23) with a pore diameter of 0.1mm and a pore density of 100 pores / cm². A 1mm thick silicone rubber sealing ring (24) is provided at the connection between the heat-conducting plates (21) and the coolant flow channel (7).
7. The integrated power supply based on liquid medium and circulating heat dissipation according to claim 1, characterized in that: The temperature sensor (12) is model DS18B20, with a measurement accuracy of ±0.5℃, a response time of 750ms, a power supply voltage of 3.3V, and an output signal of digital signal. The pin (37) spacing is 2.54mm, and it is gold-plated. The pin length is 5mm. The temperature sensor (12) is installed inside the power supply housing (1) and is electrically connected to the coolant pump (4) and the cooling fan (17).
8. The integrated power supply based on liquid medium and circulating heat dissipation according to claim 1, characterized in that: The support foot (13) is equipped with a shock-absorbing spring (14) with a compression stroke of 10mm, and the bottom is equipped with a 3mm thick rubber anti-slip pad (15).
9. The integrated power supply based on liquid medium and circulating heat dissipation according to claim 1, characterized in that: The cooling fan (17) is model DF12025 with an air volume of 1000m³ / h. The motor (34) is a 12V DC motor with a rated power of 50W. The blades (20) of the cooling fan (17) are made of 2mm thick plastic material with a diameter of 100mm. There are 5 blades and the tilt angle is 15°.
10. The integrated power supply based on liquid medium and circulating heat dissipation according to claim 1, characterized in that: The control panel (27) includes a 5-inch LCD screen (28) and 5 touch operation buttons (29). The operation buttons (29) are touch-sensitive and have a 0.1mm thick waterproof coating.
Citation Information
Patent Citations
Circulating heat dissipation type integrated power supply based on liquid medium
CN219269421U