Piezoelectric ceramic ball filling and sealing device

Abstract

The utility model discloses a piezoelectric ceramic ball filling and sealing device, and belongs to the field of piezoelectric ceramic packaging. A piezoelectric ceramic ball filling and sealing device comprises a mold, a spherical filling and sealing cavity is formed in the mold, a filling opening communicated with the filling and sealing cavity is formed in the mold, a winding shaft is arranged in the mold, the winding shaft penetrates through the filling and sealing cavity and penetrates through the sphere center of the filling and sealing cavity, two limiting grooves are formed in the two sides of the filling and sealing cavity in a symmetrical structure, and clamping blocks are arranged in the limiting grooves in a limiting mode. One end of the clamping block extends into the filling and sealing cavity, and the clamping block is arranged on the winding shaft in a sleeving mode and used for fixing the piezoelectric ceramic ball to the winding shaft and blocking a gap between the winding shaft and the filling and sealing cavity. The encapsulation structure of the piezoelectric ceramic ball is improved, so that the winding shaft and the clamping block in the encapsulation structure can be used for glass fiber winding and high-temperature curing processes of the piezoelectric ceramic ball, the situation that the piezoelectric ceramic ball needs to be fixed and disassembled repeatedly in different processes is avoided, and the time consumption of the whole processing process of the piezoelectric ceramic ball is shortened.

Description

Technical Field

[0001] This application relates to the field of piezoelectric ceramic encapsulation, and more specifically, to a piezoelectric ceramic ball potting apparatus. Background Technology

[0002] As a core component of precision sensing elements such as ultrasonic transducers and piezoelectric galvanometers, the electromechanical coupling characteristics and long-term reliability of piezoelectric ceramic spheres largely depend on the geometric accuracy, interfacial bonding strength, and the density and integrity of the potting compound. The winding process aims to tightly wrap the fiber prepreg tape around the ceramic sphere surface at a designed angle using controlled tension, forming a uniformly distributed pre-stress to suppress tensile stress cracking during high-frequency vibrations. The potting process, through vacuum-pressure injection of epoxy resin, solidifies the wound sphere and epoxy resin into a single unit, providing impact protection and a moisture barrier for the fiber layer while ensuring a smooth transition of acoustic impedance. These two processes together determine the component's Q-value, electromechanical coupling coefficient, and service life.

[0003] In the winding process, general cylindrical clamps or three-jaw chucks are often used to fix ceramic balls. In the potting process, the ceramic balls need to be removed from the clamps before potting, which results in low winding and potting efficiency of ceramic balls. In order to increase the winding and potting efficiency of ceramic balls and avoid repeated fixing of ceramic balls, we propose a piezoelectric ceramic ball potting device. Utility Model Content

[0004] 1. Technical problems to be solved

[0005] The purpose of this application is to provide a piezoelectric ceramic ball potting device to solve the problems mentioned in the background art.

[0006] 2. Technical Solution

[0007] This application is achieved through the following technical solution:

[0008] A piezoelectric ceramic ball potting device includes a mold with a spherical potting cavity inside the mold and a filling port communicating with the potting cavity. A winding shaft is provided inside the mold, which passes through the potting cavity and through the center of the ball in the potting cavity. Two limiting grooves are provided on both sides of the potting cavity in a symmetrical structure. A clamping block is limited in the limiting groove. One end of the clamping block extends into the potting cavity. The clamping block is sleeved on the winding shaft to fix the piezoelectric ceramic ball on the winding shaft and seal the gap between the winding shaft and the potting cavity.

[0009] As an optional solution to the technical solution of this application, the mold is composed of an upper mold and a lower mold, and the central axis of the winding shaft is located within the interface between the upper mold and the lower mold.

[0010] As an optional solution to the technical solution of this application, the clamping block is slidably sleeved on the outside of the winding shaft. Both ends of the winding shaft are provided with threads, and both ends of the winding shaft are threadedly connected with nuts. The nuts are located on the outside of the clamping block and are used to push the clamping block.

[0011] As an optional solution to the technical solution of this application, the clamping block includes an assembly part, an insertion part and a clamping part. The clamping part is sleeved on the outside of the insertion part. One end of the insertion part is connected and fixed to the assembly part, and the other end extends to the outside of the clamping part and is inserted into the through hole in the middle of the piezoelectric ceramic ball. One end of the clamping part abuts against the assembly part, and the other end extends into the potting cavity.

[0012] As an optional solution to the technical solution of this application, the assembly part is provided with a through mounting hole, the central axis of the mounting hole is perpendicular to the central axis of the winding shaft, and the assembly part is installed and fixed to the external winding wheel through the mounting hole.

[0013] As an optional solution to the technical solution in this application, the plug-in part and the assembly part are made of polytetrafluoroethylene material.

[0014] As an optional solution to the technical solution in this application, the plug-in part is made of nylon material.

[0015] As an optional solution to the technical solution of this application, a plurality of positioning pins are provided between the upper mold and the lower mold, and the upper mold and the lower mold are fixedly connected by bolts. The outer surfaces of the upper mold and the lower mold are provided with grooves to facilitate gripping.

[0016] 3. Beneficial effects

[0017] Compared with the prior art, the beneficial effects of this application are:

[0018] This application improves the potting structure of piezoelectric ceramic balls, enabling the winding shaft and clamping block within the potting structure to be used for the glass fiber winding and high-temperature curing process of the piezoelectric ceramic balls. This avoids the need to repeatedly fix and disassemble the piezoelectric ceramic balls in different processes, thus shortening the overall processing time of the piezoelectric ceramic balls. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of a piezoelectric ceramic ball potting device;

[0020] Figure 2 This is a schematic diagram of the winding shaft structure of a piezoelectric ceramic ball potting device;

[0021] Figure 3 This is a schematic diagram of the clamping block structure of a piezoelectric ceramic ball potting device;

[0022] In the figure: 1. Mold; 101. Filling cavity; 102. Limiting groove; 103. Filling port; 2. Winding shaft; 3. Clamping block; 301. Assembly part; 3011. Mounting hole; 302. Insertion part; 303. Clamping part; 4. Nut. Detailed Implementation

[0023] The technical solution of this application will now be clearly and completely described in conjunction with the accompanying drawings.

[0024] Please see Figure 1 This application provides a piezoelectric ceramic ball potting device, including a mold 1, a spherical potting cavity 101 inside the mold 1, a filling port 103 communicating with the potting cavity 101 on the mold 1, a winding shaft 2 inside the mold 1, the winding shaft 2 passing through the potting cavity 101 and through the center of the ball in the potting cavity 101, two limiting grooves 102 with a symmetrical structure on both sides of the potting cavity 101, a clamping block 3 limiting in the limiting groove 102, one end of the clamping block 3 extending into the potting cavity 101, the clamping block 3 being sleeved on the winding shaft 2, used to fix the piezoelectric ceramic ball on the winding shaft 2 and seal the gap between the winding shaft 2 and the potting cavity 101.

[0025] In this solution, the user can pass the winding shaft 2 through the piezoelectric ceramic ball and fit the clamping blocks 3 onto the winding shaft 2 from both sides of the piezoelectric ceramic ball. This allows the clamping blocks 3 to limit the ends of the piezoelectric ceramic ball, preventing relative movement between the piezoelectric ceramic ball and the winding shaft 2. The assembled components are then installed into the winding equipment for glass fiber stress layer winding. After winding, the components are removed from the winding equipment, and the clamping blocks 3 are assembled with the external winding wheel. This allows the external curing equipment to drive the piezoelectric ceramic ball between the two clamping blocks 3 to rotate via the winding wheel. The piezoelectric ceramic ball is then fixed at 150°C for 2 hours using the curing equipment. After curing, the piezoelectric ceramic ball is removed by the winding wheel, and then the winding shaft 2 moves the piezoelectric ceramic ball into the potting cavity 101 of the mold 1. The two clamping blocks 3 are placed in the two limiting grooves 102 respectively to achieve potting and positioning of the piezoelectric ceramic ball. Finally, the mold 1 is closed and the glue is poured. The clamping blocks 3 can seal the gap between the winding shaft 2 and the potting cavity 101 to prevent the potting glue poured into the potting cavity 101 through the pouring port 103 from leaking outward.

[0026] As a preferred embodiment of this application, the mold 1 is composed of an upper mold and a lower mold. The central axis of the winding shaft 2 is located within the interface between the upper mold and the lower mold. Multiple positioning pins are provided between the upper mold and the lower mold for aligning the upper mold and the lower mold. The upper mold and the lower mold are fixed together by bolts. Grooves are provided on the outer surfaces of both the upper mold and the lower mold for easy gripping.

[0027] like Figure 2 and Figure 3As shown, the clamping block 3 is slidably sleeved on the outside of the winding shaft 2. Both ends of the winding shaft 2 are threaded, and both ends of the winding shaft 2 are threadedly connected to nuts 4. The nuts 4 are located on the outside of the clamping block 3 and are used to push the clamping block 3. The clamping block 3 includes an assembly part 301, an insertion part 302 and a clamping part 303. The clamping part 303 is sleeved on the outside of the insertion part 302. One end of the insertion part 302 is connected and fixed to the assembly part 301, and the other end extends to the outside of the clamping part 303 and is inserted into the through hole in the middle of the piezoelectric ceramic ball. One end of the clamping part 303 abuts against the assembly part 301, and the other end extends into the potting cavity 101.

[0028] In this design, the insertion part 302 is pushed to the through hole in the center of the piezoelectric ceramic ball by rotating the nut 4, allowing the clamping part 303 to abut against the surface of the piezoelectric ceramic ball and clamp it. Preferably, the insertion part 302 and the assembly part 301 are made of polytetrafluoroethylene (PTFE). The PTFE material has a compatible coefficient of thermal expansion with the glass fiber stress layer wrapped around the outside of the piezoelectric ceramic ball, eliminating the risk of cracking during high-temperature curing of the glass fiber stress layer. Because PTFE itself has anti-stick properties, there is no need to worry about it sticking to the ceramic ball during curing, thus preventing damage to the ceramic ball during removal. The insertion part 302 is made of nylon material, which has high strength, preventing deformation when tightening the clamping block 3 with the nut 4, and also preventing deformation during high-temperature curing, ensuring the positioning accuracy of the piezoelectric ceramic ball.

[0029] As a preferred embodiment of this application, the assembly part 301 has a through mounting hole 3011, the central axis of which is perpendicular to the central axis of the winding shaft 2. The assembly part 301 is installed and fixed to the external winding wheel through the mounting hole 3011. The winding wheel has a slot in the middle that is the same as the outer contour of the assembly part 301, and a through hole on the side. After the assembly part 301 is assembled with the winding wheel, bolts are passed through the through hole on the winding wheel and the mounting hole 3011 on the assembly part 301 and tightened, which makes it convenient for the user to perform high-temperature curing of the piezoelectric ceramic balls.

Claims

1. A piezoelectric ceramic ball potting device, characterized in that: The device includes a mold (1), which has a spherical filling cavity (101) and a filling port (103) communicating with the filling cavity (101). The mold (1) has a winding shaft (2) inside, which passes through the filling cavity (101) and through the center of the ball in the filling cavity (101). The filling cavity (101) has two limiting grooves (102) on both sides in a symmetrical structure. A clamping block (3) is limited in the limiting groove (102). One end of the clamping block (3) extends into the filling cavity (101). The clamping block (3) is sleeved on the winding shaft (2) to fix the piezoelectric ceramic ball on the winding shaft (2) and seal the gap between the winding shaft (2) and the filling cavity (101).

2. The piezoelectric ceramic ball potting device according to claim 1, characterized in that: The mold (1) is composed of an upper mold and a lower mold, and the central axis of the winding shaft (2) is located within the interface between the upper mold and the lower mold.

3. The piezoelectric ceramic ball potting device according to claim 1, characterized in that: The clamping block (3) is slidably sleeved on the outside of the winding shaft (2). Both ends of the winding shaft (2) are threaded, and both ends of the winding shaft (2) are threaded with nuts (4). The nuts (4) are located on the outside of the clamping block (3) and are used to push the clamping block (3).

4. The piezoelectric ceramic ball potting device according to claim 1, characterized in that: The clamping block (3) includes an assembly part (301), a plug-in part (302) and a clamping part (303). The clamping part (303) is sleeved on the outside of the plug-in part (302). One end of the plug-in part (302) is connected and fixed to the assembly part (301), and the other end extends to the outside of the clamping part (303) and is plugged into the through hole in the middle of the piezoelectric ceramic ball. One end of the clamping part (303) abuts against the assembly part (301), and the other end extends into the potting cavity (101).

5. The piezoelectric ceramic ball potting device according to claim 4, characterized in that: The assembly part (301) has a through mounting hole (3011) on its upper and lower sides. The central axis of the mounting hole (3011) is perpendicular to the central axis of the winding shaft (2). The assembly part (301) is installed and fixed to the external winding wheel through the mounting hole (3011).

6. The piezoelectric ceramic ball potting device according to claim 4, characterized in that: The insertion part (302) and the assembly part (301) are made of polytetrafluoroethylene material.

7. The piezoelectric ceramic ball potting device according to claim 4, characterized in that: The connector (302) is made of nylon material.

8. The piezoelectric ceramic ball potting device according to claim 2, characterized in that: Multiple positioning pins are provided between the upper mold and the lower mold, and the upper mold and the lower mold are fixed together by bolts. The outer surfaces of the upper mold and the lower mold are provided with grooves to facilitate gripping.

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