Wet etching equipment
By designing a multi-layer recovery cup assembly in the wet etching equipment, with a baffle at the top of each cup to block the flow channel, the problem of cross-contamination of chemical liquid recovery in the wet etching process is solved, thereby improving the etching rate and wafer quality.
Patent Information
- Application Number
- CN202423158045.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2034-12-19
AI Technical Summary
In wet etching processes, cross-contamination issues can occur during chemical liquid recovery, affecting etching rate and wafer quality.
Design a wet etching apparatus comprising a rotatable wafer stage and a multi-layered recovery cup assembly surrounding it, each cup having a baffle at its top that blocks the flow channel between adjacent cups to prevent liquid from entering the flow channel.
It effectively solves the problem of cross-contamination in chemical liquid recycling, ensures stable etching rate, and improves wafer quality.
Smart Images
Figure CN223786446U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of semiconductor technology, and more particularly to a wet etching apparatus. Background Technology
[0002] In some wet etching processes, chemical solutions are often recycled to save costs. During the process, the wafer rotates at high speed, and some of the liquid is thrown onto the sidewalls of different recycling cups, causing cross-contamination of the recycled solution. This can affect the etching rate and even the quality of the wafer.
[0003] In this context, how to provide a technical solution to solve the liquid cross-contamination problem has become an urgent technical issue to be addressed. Utility Model Content
[0004] In view of this, the present disclosure provides a wet etching apparatus that can effectively address the cross-contamination problem of chemical liquid recovery in wet etching processes.
[0005] This disclosure provides a wet etching apparatus, including: an etching chamber; a rotatable wafer stage located within the etching chamber for placing a wafer; and a recovery cup assembly disposed around the wafer stage to collect liquid ejected during wafer rotation; wherein the recovery cup assembly comprises multiple layers of cups, with flow channels between adjacent cups; each layer of cups has a baffle at its top, and each baffle is used to block a portion of the flow channel between the cup to which the baffle belongs and the adjacent cup.
[0006] Optionally, each cup body includes: a columnar cylindrical portion surrounding the wafer stage; and an annular top connected to the cylindrical portion and extending obliquely upward from the upper end of the cylindrical portion toward the axial direction of the wafer stage.
[0007] Optionally, the top of each cup layer is flush with the top of the wafer stage surface in a direction perpendicular to the wafer stage surface.
[0008] Optionally, there is a first gap between the tops of adjacent cups, the first gap being selected from [0.5mm, 1mm].
[0009] Optionally, the baffle satisfies one or more of the following: the baffle is annular; the baffle is connected to the top of the top.
[0010] Optionally, the baffle may be made of PTFE.
[0011] Optionally, the baffle extends perpendicularly to the surface of the wafer stage.
[0012] Optionally, the baffle is selected from one or more of the following:
[0013] Part or all of the baffles extend upward from the top of the cup body to block at least a portion of the adjacent and outer flow channel;
[0014] Part or all of the baffles extend downward from the top of the cup body to block at least a portion of the adjacent and inner flow channel;
[0015] Part or all of the baffles extend upward and downward from the top of the cup body to block at least a portion of the adjacent flow channel.
[0016] Optionally, the baffle is selected from one or more of the following:
[0017] The upwardly extending baffle is the baffle of the cup body other than the outermost layer of cup body;
[0018] The downward-extending baffle is the baffle of the cup body other than the innermost layer of cup body;
[0019] The downward-extending baffle is the outermost baffle, and it blocks part or all of the flow channel;
[0020] The upward and downward extending baffles are as follows: the outermost baffle extends downward, the innermost baffle extends upward, and the middle baffle extends upward and / or downward.
[0021] Optionally, there is a first gap between the tops of adjacent cups;
[0022] There is a second gap between the baffles of adjacent cups, and the ratio of the second gap to the first gap is selected from [1%, 50%].
[0023] Optionally, it also includes a drive device coupled to the recycling cup assembly for driving the cup layers to rise and fall.
[0024] Optionally, the driving device includes a group of cylinders, each group of cylinders being coupled to the same layer of cup body to drive the layer of cup body to rise and fall independently.
[0025] Optionally, the first to Nth cup layers are raised from the outside to collect liquid using a flow channel adjacent to and located inside the Nth cup layer from the outside; where N is a positive integer and N≥2.
[0026] Optionally, the flow channel further includes: an innermost flow channel between the innermost cup and the wafer stage; wherein, when all cups rise, the innermost flow channel is used to collect liquid.
[0027] Compared with the prior art, the technical solution of the present disclosure has the following advantages:
[0028] In the wet etching apparatus provided in this embodiment, each cup has a baffle at its top, and each baffle is used to block a portion of the flow channel between the cup to which the baffle belongs and the adjacent cup. When the wafer rotates at high speed and throws some liquid towards the recovery cup, the baffle of the recovery cup can effectively block the liquid from entering the corresponding flow channel, thus effectively solving the problem of cross-contamination of chemical liquid recovery in the wet etching process. Attached Figure Description
[0029] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments of this disclosure or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0030] Figure 1 A cross-sectional schematic diagram of a wet etching apparatus according to an embodiment of the present disclosure is shown;
[0031] Figure 2 A schematic diagram of the structure of a recycling cup assembly according to an embodiment of this disclosure is shown;
[0032] Figure 3 A schematic diagram of another recycling cup assembly in an embodiment of this disclosure is shown;
[0033] Figure 4 A schematic diagram of another recycling cup assembly in an embodiment of this disclosure is shown;
[0034] Figure 5 A schematic diagram of another recycling cup assembly in an embodiment of this disclosure is shown. Detailed Implementation
[0035] The technical solutions of this utility model will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of this utility model, used to illustrate the concept of this utility model; these descriptions are explanatory and exemplary, and should not be construed as limiting the implementation methods or the scope of protection of this utility model. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.
[0036] It should be noted that the accompanying drawings in this embodiment are schematic diagrams, used to illustrate the concept of this utility model and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of this utility model, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.
[0037] As described in the background section, wet etching processes can lead to cross-contamination issues related to chemical liquid recovery. This is because, during wet etching, the high-speed rotation of the wafer causes some liquid to be thrown onto the sidewalls of different recovery cups. This liquid then flows along the guide channels into these different recovery cups. After the corresponding chemical liquid is recovered through the guide tubes, different liquids are present in the recovered solution, resulting in cross-contamination. Reusing this recovered liquid can affect the etching rate and even the quality of the wafer.
[0038] To address the aforementioned technical problems, this disclosure provides a wet etching apparatus, comprising: an etching chamber; a rotatable wafer stage located within the etching chamber for placing a wafer; and a recovery cup assembly disposed around the wafer stage to collect liquid ejected during wafer rotation; wherein the recovery cup assembly comprises multiple layers of cups, with flow channels between adjacent cups; each layer of cups has a baffle at its top, and each baffle is used to block a portion of the flow channel between the cup to which it belongs and the adjacent cup.
[0039] The wet etching apparatus described in this embodiment has a baffle at the top of each cup, with each baffle blocking a portion of the flow channel between the cup to which it belongs and the adjacent cup. When the liquid from the high-speed rotating wafer is thrown onto the sidewall of the recovery cup, the baffle effectively prevents the liquid from entering the flow channel, thus effectively addressing the problem of cross-contamination during chemical liquid recovery in the wet etching process.
[0040] To make the above-described objects, features, and advantages of this disclosure more apparent and understandable, a clear and complete illustrative description of this disclosure is provided below with reference to the accompanying drawings. See also Figure 1 The diagram shown is a cross-sectional view of a wet etching apparatus according to an embodiment of this disclosure, as follows: Figure 1 As shown, wet etching equipment may include:
[0041] Etching chamber 11, rotatable wafer stage 2, located inside etching chamber 11, for placing wafer W;
[0042] A recovery cup assembly 1 is arranged around the wafer stage 2 to collect the liquid ejected when the wafer W rotates;
[0043] The recycling cup assembly 1 includes multiple cup bodies 12, with flow channels 122 between adjacent cup bodies;
[0044] Each cup body has a baffle at its top, and each baffle is used to block a portion of the flow channel 122 between the cup body to which the baffle belongs and the adjacent cup body, for example Figure 1 The baffle 121 is shown in the diagram.
[0045] The flow channel can be a channel used to define the flow of liquid, and may include channel sidewalls on both sides of the channel and a bottom surface at the bottom of the channel.
[0046] It should be noted that this embodiment is intended to illustrate the structure shown in the accompanying drawings, and not to limit the specific protective structure. The number of cups can be at least 2, and can also be 3, 4, or 5, depending on the actual process requirements. The number of baffles can be at least 1, and can also be 2 or 3, depending on the number of cups. The number of baffles can be less than the total number of cups, or it can be equal to the number of cups.
[0047] Specifically, during the wafer fabrication process, the wafer stage 2 rotates the wafer W, causing liquid to contact the wafer surface and be ejected. Most of the liquid is recycled through the corresponding flow channel 122. Some of the ejected liquid is blocked by the baffle 121 of each recycling cup and the cup body 12 of the corresponding recycling cup, preventing it from entering the blocked flow channel 122. Thus, when the flow channel 122 collects the corresponding liquid, there is no other liquid inside the flow channel 122, which is then collected by the corresponding recycling cup. This effectively addresses the problem of different liquids in the recycled solution, preventing cross-contamination.
[0048] It should be noted that, Figure 1 The structure and dimensions of the etching chamber 11, the recovery cup assembly 1, and the wafer stage 2 shown are merely illustrative examples used to illustrate how the position of the baffle 121 on the recovery cup assembly 1 can be flexibly set to block the path between the liquid and the flow channel 122, and should not be construed as a limitation of this disclosure.
[0049] In some embodiments of this disclosure, see Figure 1 The recycling cup assembly 1 includes: a cylindrical portion surrounding the wafer stage 2; and an annular top connected to the cylindrical portion and extending obliquely upward from the upper end of the cylindrical portion toward the axis of the wafer stage.
[0050] In some embodiments, the column structure may include at least one of a cylindrical structure, an elliptical column structure, and a square column structure.
[0051] In some embodiments, the ring structure may include at least one of a circular ring structure, an elliptical ring structure, and a square ring structure.
[0052] This embodiment of the invention does not limit the cup structure; those skilled in the art can adjust and set it according to the actual situation.
[0053] In one specific embodiment, the cylindrical section and the annular top structure can effectively accommodate the circular wafer W and the rotatable wafer stage 2, occupying less internal space of the device, and also achieving the purpose of collecting and recycling liquid.
[0054] In some embodiments of this disclosure, see Figure 1 The top of the cup body 12 is flush with the surface of the wafer stage 2 in a direction perpendicular to the surface of the wafer stage 2.
[0055] The top of the recycling cup body 12 can be a ring with a certain width, and the top of the recycling cup body 12 can be used to indicate the top opening of the ring.
[0056] In this embodiment of the invention, by adopting a flush top, the recycling cup assembly can achieve a better shielding effect with the smallest possible space. This structure also facilitates the handling of wafer W.
[0057] In some embodiments, the top of the top of the recycling cup body 12 may not be completely flush with the surface of the wafer stage 2 in a direction perpendicular to the surface of the wafer stage 2.
[0058] In some embodiments of this disclosure, see Figure 1 When the flow channels 122 between adjacent cups of the recycling cup assembly 1 are not open, there is a first gap between the tops of adjacent cups, for example: Figure 1 The first interval between the tops of cups 12a and 12b ranges from 0.5mm to 1mm. This structure is designed to prevent collisions between adjacent cups during actual manufacturing, which could cause cup deformation, damage the equipment, and affect production.
[0059] In some embodiments of this disclosure, see Figure 1 The baffle 121 is connected to the top of the cup body 12 for better protection of the liquid.
[0060] In some embodiments of this disclosure, see Figure 1 The baffle 121 is in the shape of a ring, surrounding the wafer stage 2, which can block liquid from the direction of the wafer stage to the maximum extent, and reduce the waste of space and materials by adopting the same shape as the wafer.
[0061] In some embodiments of this disclosure, the baffle 121 is made of PTFE, which is inexpensive and not easily corroded by the liquid used in the etching process, thus achieving the purpose of blocking the liquid while taking into account the equipment manufacturing cost.
[0062] In some embodiments, the baffle 121 is made of the same material as the cup body and is integrally molded, which can reduce the difficulty of equipment manufacturing.
[0063] In some embodiments of this disclosure, see Figure 1 The extension direction of the baffle 121 is perpendicular to the surface of the wafer stage 2. This angle can block the flow channel 122 corresponding to the baffle 121 to the greatest extent.
[0064] In some embodiments, the extension direction of the baffle 121 may not be perpendicular to the surface of the wafer stage 2, and the baffle may have concave and convex variations, as long as it can block the flow channel 122 and prevent liquid from entering the blocked flow channel 122. For example, if the baffle 121 extends upward perpendicular to the cup body 12, it can also effectively block liquid from entering the flow channel.
[0065] In some embodiments of this disclosure, the inventors have discovered that the baffle 121 extends in different directions perpendicular to the surface of the wafer stage 2, which can effectively address the problem of different liquids appearing in the recovered solution and causing cross-contamination. The baffle 121 can extend partially or entirely from the top of its respective cup body 12 upwards to block at least a portion of the adjacent and outer guide channel 122;
[0066] The baffle 121 may extend downward from the top of the cup body 12 in part or in whole to block at least a portion of the adjacent and inner flow channel 122.
[0067] The baffle 121 may extend upward and downward from the top of the cup body 12, either partially or completely, to block at least a portion of the adjacent flow channel 122.
[0068] In some embodiments of this disclosure, see Figure 2 The baffles 121a and 121b corresponding to the cups 12a and 12b extend upward and the direction of extension is perpendicular to the surface of the wafer stage 2. The cup 12c is not equipped with a baffle. The baffle 12b blocks the liquid from entering the flow channel between the cups 12b and 12c, so as to effectively deal with the cross-contamination problem.
[0069] In some embodiments, the inventors also discovered that the cup body 12c can also be provided with a baffle extending upwards, with the extension direction perpendicular to the surface of the wafer stage 2. This structure is beneficial for shielding the liquid and preventing it from splashing out of the recovery cup.
[0070] In some embodiments of this disclosure, see Figure 3The baffles 121b and 121c corresponding to the cups 12b and 12c extend downward and the direction of extension is perpendicular to the surface of the wafer stage 2, while the cup 12a is not provided with baffles. Thus, the liquid is blocked from entering the corresponding flow channel by the baffles 121b and 121c, so as to effectively deal with the cross-contamination problem.
[0071] In some other embodiments, the cup body 12a may also be provided with a baffle extending downwards, with the extension direction perpendicular to the surface of the wafer stage 2.
[0072] In some embodiments of this disclosure, see Figure 4 The baffle 121c corresponding to cup 12c extends downward and the direction of extension is perpendicular to the surface of wafer stage 2, and blocks part or all of the flow channel. Cups 12a and 12b are not equipped with baffles, and the baffle 121c blocks the liquid from entering cups 12a and 12b and the flow channel between cups 12b and 12c, so as to effectively deal with the cross-contamination problem.
[0073] Furthermore, in embodiments where baffles are not provided on cup bodies 12a and 12b, the manufacturing difficulty of the device is also reduced.
[0074] In some embodiments of this disclosure, see Figure 5 The outermost baffle corresponding to cup body 12c extends downward, the middle baffle corresponding to cup body 12b extends upward and / or downward, and the innermost baffle corresponding to cup body 12a extends upward. This can also achieve the purpose of blocking liquid from entering the corresponding guide channel, and can effectively deal with the problem of different liquids entering the same recovery cup.
[0075] In some embodiments of this disclosure, when the flow channel 122 between adjacent cups of the recycling cup assembly 1 is not open, there is a first gap between the tops of adjacent cups.
[0076] Specifically, when the flow channel 122 between adjacent cups 12 is not collecting liquid, there is a buffer distance between the adjacent cups to prevent damage from collisions. This is referred to as a first gap between the tops of the adjacent cups. For example: Figure 1 The first interval at the top of cups 12a and 12b ranges from [0.5mm, 1mm].
[0077] Furthermore, in some embodiments of this disclosure, there is a second gap between adjacent baffles 121, and the ratio of the second gap to the first gap is selected from [1%, 50%]. This structure is designed to prevent collisions between adjacent cups during actual processing, which could lead to cup deformation, equipment damage, and disruption to production.
[0078] It should be noted that by using a ratio of the second interval to the first interval selected from [1%, 50%], the first interval can be doubled, ten times, or even a hundred times larger than the second interval. Thus, by setting a difference of half, one order of magnitude, or two orders of magnitude, the effectiveness and feasibility of the setting can be further improved.
[0079] In some embodiments of this disclosure, there is also a driving device (not shown in the figure) coupled to the recycling cup assembly 1 for driving each layer of cup 12 to rise and fall.
[0080] In some embodiments of this disclosure, the driving device includes a cylinder that can be coupled to the same layer of cup 12 to drive the layer of cup 12 to rise and fall independently.
[0081] The cylinders can be in groups, with two cylinders in each group coupled to the same layer of cup 12 to drive the cup 12 to rise and fall independently. This further improves stability during independent rising and falling.
[0082] For example Figure 1 The recycling cup assembly 1 has a total of six cylinders coupled to their respective cup bodies 12.
[0083] It should be noted that in some embodiments, the driving device may include an air pump; the air pump may be coupled to the same layer of cup 12 to drive the layer of cup 12 to rise and fall independently.
[0084] The air pumps can be in groups, with each group consisting of two cylinders coupled to the same layer of the cup 12 to drive the cup 12 to rise and fall independently. This further improves stability during the independent rising and falling process.
[0085] It should be noted that in some embodiments, each layer of cylinder can be a single cylinder, and each cylinder is coupled to the same layer of cup 12 to drive the layer of cup 12 to rise and fall independently.
[0086] Each layer of cylinders can be multiple and evenly distributed around the wafer stage and coupled to the same layer of cup body.
[0087] In some embodiments of this disclosure, the multi-layered cup body 12 rises from the outermost first cup body to the Nth cup body to collect liquid using a flow channel adjacent to the Nth cup body from the outermost side and located on the inner side (where N is a positive integer and N≥2). For example: Reference Figure 1 When all cups 12 are raised, the liquid is collected through the innermost flow channel 122 between the innermost cup 12a and the wafer stage 2, and finally discharged from the flow tube 13.
[0088] like Figure 1In the illustrated embodiment, N is 3 as an example, including one or more of the following cases:
[0089] (I) All three floors rose
[0090] In one specific embodiment, when all cups are raised, the liquid is collected using the innermost flow channel between the innermost cup and the wafer stage.
[0091] (II) The outer two layers rise
[0092] In one specific embodiment, when the outer two layers rise, the liquid is collected using a flow channel between the middle cup and the innermost cup.
[0093] (III) The outermost layer rises
[0094] In one specific embodiment, when the outermost cup rises, the liquid is collected using the flow channel between the outermost cup and the middle cup.
[0095] It should be noted that for cases where N is any other integer greater than or equal to 2, the settings and execution can be performed in accordance with the previous text and the case where N is 3, and will not be repeated here.
[0096] In some embodiments of this disclosure, the guide tube 13 is connected to a two-way valve to determine whether the collected liquid is to be recycled.
[0097] The first end of the two-way valve can be connected to the guide pipe 13; the second end can be coupled to the liquid storage tank; and the third end can be coupled to the waste liquid tank.
[0098] In some embodiments of this disclosure, when all cups 12 are raised, the liquid is collected through the innermost flow channel 122 between the innermost cup 12a and the wafer stage 2. Then, depending on the process, different cups 12 are lowered, and the liquid is collected through the outer flow channel 122 of the adjacent lowered cups 12. When all cups 12 are lowered, the process ends.
[0099] In some disclosed embodiments, different flow channels 122 are opened depending on the type of liquid being recovered, rather than in the order of flow channels 122 from the inside out. For example, when isopropanol (IPA) or deionized water (DIW) needs to be collected, cup 12c is in its highest position, while other cups are in their lowest position.
[0100] Specifically, see Figure 1At the start of the process, all cups 12 are raised, and the liquid falls onto the wafer W. The wafer stage 2 drives the wafer W to rotate rapidly, throwing the liquid out. Most of the liquid falls into the innermost guide channel, and some liquid is blocked by the baffle 121 perpendicular to the surface of the wafer stage and flows into the innermost guide channel 122. The liquid is collected between the cup and the wafer stage and discharged through the guide tube. The guide tube is connected to a two-way valve, which controls whether the collected liquid is recycled. When the (N-1)th flow channel is operating, the innermost cup 12 is controlled by a set of cylinders to be in its lowest position. Liquid falls onto the wafer W, and the wafer stage 2 drives the wafer W to rotate rapidly, throwing the liquid out. Most of the liquid falls into the (N-1)th flow channel, while some is blocked by a baffle 121 perpendicular to the wafer stage surface and flows into the (N-1)th flow channel. Below this flow channel is an annular groove where the liquid is collected. A flow guide pipe is also connected to the bottom of the groove for draining the liquid. When the outermost flow channel is operating, all cups except the outermost cup are in their lowest position. Liquid is collected by the flow channel inside the outermost cup and flows into the groove. Each groove has a flow guide pipe connected to its bottom. At the end of the process, all cups are in their lowest position.
[0101] In some embodiments, the cross-sectional shape of the trench may include any one of the following: U-shaped, right-angled U-shaped, semi-circular, semi-elliptical, etc. This disclosure does not impose any limitations on the shape of the trench, as long as it can accommodate the collected liquid.
[0102] It should be noted that the wet etching equipment provided in this disclosure may also include other components, such as a liquid supply system. To facilitate the description of the technical solution and highlight the innovative aspects of this specification, components of the wafer stage and recovery cup assembly that can be implemented using existing technologies have been omitted in this disclosure.
[0103] While the embodiments disclosed herein are as described above, this utility model is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of this utility model; therefore, the scope of protection of this utility model should be determined by the scope defined in the claims.
Claims
1. A wet etching apparatus, characterized in that, include: Etching chamber; A rotatable wafer stage, located within the etching chamber, is used to place the wafer; A recovery cup assembly is arranged around the wafer stage to collect liquid ejected during wafer rotation; The recycling cup assembly comprises multiple layers of cups, with flow channels between adjacent cups; Each cup has a baffle at the top, and each baffle is used to block part of the flow channel between the cup to which the baffle belongs and the adjacent cup.
2. The wet etching apparatus according to claim 1, characterized in that, Each cup layer includes: A columnar cylindrical portion surrounds the wafer stage; The annular top is connected to the cylindrical portion and extends obliquely upward from the upper end of the cylindrical portion toward the axis of the wafer stage.
3. The wet etching apparatus according to claim 2, characterized in that, The top of each cup is flush with the surface of the wafer stage in a direction perpendicular to the top of the cup.
4. The wet etching apparatus according to claim 2, characterized in that, There is a first gap between the tops of adjacent cups, the first gap being selected from [0.5mm, 1mm].
5. The wet etching apparatus according to claim 2, characterized in that, The baffle satisfies one or more of the following: The baffle is circular in shape; The baffle is connected to the top of the top.
6. The wet etching apparatus according to claim 1, characterized in that, The baffle is made of PTFE.
7. The wet etching apparatus according to claim 1, characterized in that, The baffle extends perpendicularly to the surface of the wafer stage.
8. The wet etching apparatus according to claim 1, characterized in that, The baffle is selected from one or more of the following: Part or all of the baffles extend upward from the top of the cup body to block at least a portion of the adjacent and outer flow channel; Part or all of the baffles extend downward from the top of the cup body to block at least a portion of the adjacent and inner flow channel; Part or all of the baffles extend upward and downward from the top of the cup body to block at least a portion of the adjacent flow channel.
9. The wet etching apparatus according to claim 8, characterized in that, The baffle is selected from one or more of the following: The upwardly extending baffle is the baffle of the cup body other than the outermost layer of cup body; The downward-extending baffle is the baffle of the cup body other than the innermost layer of cup body; The downward-extending baffle is the outermost baffle, and it blocks part or all of the flow channel; The upward and downward extending baffles are as follows: the outermost baffle extends downward, the innermost baffle extends upward, and the middle baffle extends upward and / or downward.
10. The wet etching apparatus according to claim 8, characterized in that, There is a first gap between the tops of adjacent cups; There is a second gap between the baffles of adjacent cups, and the ratio of the second gap to the first gap is selected from [1%, 50%].
11. The wet etching apparatus according to claim 1, characterized in that, Also includes: A drive unit, coupled to the recycling cup assembly, is used to drive each layer of cups to rise and fall.
12. The wet etching apparatus according to claim 11, characterized in that, The driving device includes a group of cylinders, each group of cylinders being coupled to the same layer of cup body to drive the layer of cup body to rise and fall independently.
13. The wet etching apparatus according to claim 1, characterized in that, The first cup body from the outside to the Nth cup body rises to collect liquid using a flow channel that is adjacent to the Nth cup body from the outside and located on the inside. Where N is a positive integer and N≥2.
14. The wet etching apparatus according to claim 13, characterized in that, The flow channel also includes: the innermost flow channel between the innermost cup and the wafer stage; When all the cups rise, the innermost guide channel is used to collect the liquid.