Positioning device for wafer film pasting

Abstract

The utility model provides a positioning device for wafer film pasting, which comprises a pair of positioning mechanisms, each positioning mechanism comprises a horizontally moving clamping piece, the clamping piece is movably connected with a traction seat through an elastic mechanism, and the traction seat is movably connected with a pair of correction mechanisms through a guide structure. The driving mechanism drives the connecting seat to horizontally and linearly move, at the moment, the traction seat can be driven by the elastic mechanism to synchronously move, the pair of swing arms is driven by the guide structure to get close to each other, the swing arms can extrude a wafer with a position offset from the two sides until the wafer is exactly located between the two clamping pieces, then the swing arms stop moving, and the wafer is clamped by the two clamping pieces. And the two clamping pieces continue to horizontally and linearly move from the two sides until the two clamping pieces abut against the side faces of the wafer, so that positioning of the wafer is achieved, and the wafer is always kept at the accurate film pasting position for film pasting.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer film pasting technical field, concretely is a kind of positioning device for wafer film pasting. BACKGROUND

[0002] Semiconductor wafer needs to be pasted on the surface of semiconductor wafer when working, improve the protection effect of semiconductor wafer;

[0003] Publication number "CN213026053U" provides a kind of semiconductor wafer fast film pasting table, including film pasting device ontology, workbench is installed at the top of film pasting device ontology, second hydraulic cylinder is installed at the four corners of workbench, the top of second hydraulic cylinder is installed with top plate, first electric telescopic rod is installed in the bottom end middle part of top plate, the bottom of first electric telescopic rod is installed with pressing plate, glass outer cover is installed at the bottom of top plate, and sealing gasket is installed at the bottom of glass outer cover.The device can be quickly fixed to semiconductor wafer, can realize automatic film pasting, can clean dust on semiconductor wafer, and also provide illumination when film pasting, convenient for operator to use;

[0004] But the above scheme still has the following defects:

[0005] In the above patent, the film pasting table has strong overall stability, can be quickly moved to the appropriate position, has strong flexibility, can quickly fix semiconductor wafer, can realize automatic film pasting, since the diameter of wafer is different, the position of wafer in the slot is offset, so that wafer is difficult to be placed in the accurate film pasting position, thereby affecting the film pasting of wafer. UTILITY MODEL CONTENTS

[0006] The utility model aims at providing a kind of positioning device for wafer film pasting to solve the problems raised in the above background.

[0007] To achieve the above object, the utility model provides the following technical scheme:

[0008] A kind of positioning device for wafer film pasting, including a pair of positioning mechanism, the positioning mechanism includes horizontally moving clamping piece, the clamping piece is movably connected with traction seat by elastic mechanism, the traction seat is movably connected with a pair of correction mechanism by guide structure;

[0009] The clamping piece includes connecting seat and first roller, the first roller is rotatably connected to the surface of connecting seat, and the connecting seat is connected with driving mechanism;

[0010] The correction mechanism comprises a mounting base, a torsional spring, a rotating shaft, a swing arm and a second roller, the rotating shaft is vertically fixedly connected to the bottom of the mounting base, one end of the swing arm is rotationally connected to the tail end of the rotating shaft, the torsional spring is fixedly connected between the swing arm and the mounting base and is sleeved on the surface of the rotating shaft, and the second roller is rotationally connected to the other end of the swing arm.

[0011] Preferably, the elastic mechanism comprises a spring and a telescopic rod, and the spring and the telescopic rod are fixedly connected between the traction base and the connecting base, and the spring is sleeved on the surface of the telescopic rod.

[0012] Preferably, the guide structure comprises a sliding groove and a sliding block, the sliding block is fixedly connected to the surface of the traction base, the sliding groove is arranged on the surface of the swing arm along the extension direction of the swing arm, and the sliding block is slidingly connected to the inside of the sliding groove.

[0013] Preferably, the driving mechanism comprises a threaded rod, a sleeve and a motor, the sleeve is fixedly mounted on the surface of the connecting base, one end of the threaded rod is threadedly connected to the surface of the sleeve, and the other end of the threaded rod is connected with the output end of the motor.

[0014] Preferably, the bottom of the traction base is provided with a notch, the lower portion of the traction base is provided with a T-shaped track, and the traction base is slidingly connected to the surface of the T-shaped track through the notch.

[0015] Preferably, the swing arm is initially arranged to be inclined, and the sliding block is located at the tail end of the sliding groove.

[0016] Compared with the prior art, the beneficial effects of the present application are:

[0017] The utility model discloses a drive mechanism drives the horizontal linear motion of connecting base, at this time, the traction base can be driven to move synchronously under the drive of the elastic mechanism, and a pair of swing arms are driven to approach each other through the guide structure, the swing arms can extrude the wafer with position deviation from both sides until the wafer is just located between the two clamping pieces, then the swing arms stop moving, and the two clamping pieces continue to move horizontally and linearly from both sides until abutting against the side surface of the wafer, so that the positioning of the wafer is realized, and the wafer can always be kept in the accurate film pasting position for film pasting. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the main body structure schematic diagram of the utility model;

[0019] Figure 2 It is the connecting structure schematic diagram of the traction base and the swing arm of the utility model;

[0020] Figure 3 It is the connecting structure schematic diagram of the traction base and the T-shaped track of the utility model;

[0021] Figure 4The utility model discloses a connecting structure of workbench and positioning mechanism.

[0022] In the drawing: 1, traction seat, 2, connecting seat, 3, first gyro wheel, 4, mounting seat, 5, torsional spring, 6, pivot, 7, swing arm, 8, second gyro wheel, 9, spring, 10, telescopic link, 11, sliding slot, 12, sliding block, 13, threaded rod, 14, sleeve, 15, motor, 16, notch, 17, T-shaped track, 18, workbench, 19, film pasting cover plate, 20, cavity, 21, through hole. DETAILED DESCRIPTION

[0023] The utility model discloses a connecting structure of workbench and positioning mechanism.

[0024] Please refer to Figures 1-4 The utility model provides a kind of positioning device for wafer film pasting, including a pair of positioning mechanism, positioning mechanism includes the clamping piece of horizontal motion, clamping piece is movably connected with traction seat 1 by elastic mechanism, traction seat 1 is movably connected with a pair of correction mechanism by guide structure, clamping piece includes connecting seat 2 and first gyro wheel 3, first gyro wheel 3 is rotatably connected to the surface of connecting seat 2, connecting seat 2 is connected with drive mechanism, correction mechanism includes mounting seat 4, torsional spring 5, pivot 6, swing arm 7 and second gyro wheel 8, pivot 6 is vertically fixedly connected to the bottom of mounting seat 4, one end of swing arm 7 is rotatably connected to the end of pivot 6, torsional spring 5 is fixedly connected between swing arm 7 and mounting seat 4 and is set on the surface of pivot 6, and second gyro wheel 8 is rotatably connected to the other end of swing arm 7.

[0025] Please refer to Figure 1 And 4 Drive mechanism can drive connecting seat 2 to carry out horizontal straight line motion in the inside of workbench 18, at this time, two clamping pieces gradually approach each other, in this process, connecting seat 2 can drive traction seat 1 synchronous motion by elastic mechanism, and traction seat 1 can drive one end of two swing arms 7 to approach each other by guide structure, when one of second gyro wheel 8 first contacts wafer, the second gyro wheel 8 can push wafer synchronous motion, until wafer just stays between four second gyro wheels 8 at this time, after second gyro wheel 8 is hindered by wafer, swing arm 7 cannot continue to rotate, thus traction seat 1 stops motion, and connecting seat 2 can break through the elastic force of elastic mechanism and continue horizontal straight line motion at this time, until first gyro wheel 3 contacts the side surface of wafer, to realize the positioning clamping of wafer, and the position correction of wafer after position deviation can be carried out.

[0026] The elastic mechanism comprises a spring 9 and a telescopic rod 10, both of which are fixedly connected between the traction seat 1 and the connecting seat 2, and the spring 9 is sleeved on the surface of the telescopic rod 10.

[0027] Please refer to Figure 1 When the traction seat 1 stops moving, the connecting seat 2 still moves horizontally and linearly, so the connecting seat 2 can stretch the telescopic rod 10 and the spring 9 at the same time, so that the spring 9 is deformed to store energy. When the traction seat 1 is not hindered, the movement of the connecting seat 2 and the traction seat 1 is synchronous, so the spring 9 is not stretched to deform.

[0028] The guide structure comprises a sliding groove 11 and a sliding block 12, the sliding block 12 is fixedly connected to the surface of the traction seat 1, the sliding groove 11 is arranged on the surface of the swing arm 7 along the extension direction of the swing arm 7, and the sliding block 12 is slidingly connected to the inside of the sliding block 12. Initially, the swing arm 7 is arranged obliquely, and the sliding block 12 is located at the end of the sliding groove 11.

[0029] Please refer to Figure 1 and 2 Because the swing arm 7 is initially arranged obliquely and the sliding block 12 is located at the end of the sliding groove 11, when the traction seat 1 moves horizontally and linearly, the traction seat 1 can drive the sliding block 12 to move synchronously. Because the size of the traction seat 1 is fixed, the horizontal distance between the two sliding blocks 12 is also fixed. When the sliding block 12 moves horizontally, the inclined sliding groove 11 can drive the swing arm 7 to gradually move towards the direction of the first roller 3. When the swing arm 7 moves, it can drive the second roller 8 to move synchronously, and the second roller 8 can push the wafer with a position offset to the accurate film bonding position.

[0030] It should be noted that the swing arm 7 will drive the torsional spring 5 to deform and store energy during the swinging process. Therefore, when the connecting seat 2 is reset, the telescopic rod 10 can first push the traction seat 1 to reset, and then, with the reset of the traction seat 1, the elastic force of the torsional spring 5 can gradually drive the swing arm 7 to reset, so as to facilitate the subsequent clamping of the wafer.

[0031] The driving mechanism comprises a threaded rod 13, a sleeve 14 and a motor 15. The sleeve 14 is fixedly installed on the surface of the connecting seat 2, one end of the threaded rod 13 is threadedly connected to the surface of the sleeve 14, and the other end of the threaded rod 13 is connected to the output end of the motor 15.

[0032] Please refer to Figure 3 and 4 The motor 15 is installed on the side surface of the workbench 18, and the threaded rod 13 is rotatably connected to the workbench 18. When the motor 15 drives the threaded rod 13 to rotate, the threaded rod 13 can drive the sleeve 14 to move linearly on the surface of the workbench 18, thereby driving the traction seat 1 and the connecting seat 2 to move synchronously.

[0033] It needs explanation, the workbench 18 is rotationally arranged with the film pasting cover plate 19, the film pasting cover plate 19 and the workbench 18 are both the more mature technical scheme in prior art, its structure and principle do not repeat here, the inside of the workbench 18 is provided with the cavity 20, the top of the workbench 18 is provided with the through-hole 21, the through-hole 21 is communicated with the inside of the cavity 20, the inside of the through-hole 21 can install the hose, and in the inside of the cavity 20 installs the negative pressure equipment, connects the hose to the output end of the negative pressure equipment, i.e. can be fixed in the accurate film pasting position on the workbench 18 through negative pressure wafer.

[0034] The bottom of the traction seat 1 is provided with a notch 16, and the lower portion of the traction seat 1 is provided with a T-shaped track 17. The traction seat 1 is slidably connected to the surface of the T-shaped track 17 through the notch 16.

[0035] Please refer to Figure 3 and 4 When the traction seat 1 moves, it can slide on the surface of the T-shaped track 17 through the notch 16. The T-shaped track 17 and the notch 16 can limit the movement of the traction seat 1, so that it always moves in a straight line.

[0036] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A positioning device for wafer film sticking, characterized in that, Including a pair of positioning mechanism, the positioning mechanism includes horizontal motion clamping piece, the clamping piece is connected with traction seat (1) through elastic mechanism, the traction seat (1) is movably connected with a pair of correction mechanism through guide structure; The clamping piece includes connecting seat (2) and first roller (3), the first roller (3) is rotatably connected to the surface of connecting seat (2), and the connecting seat (2) is connected with the driving mechanism; The correction mechanism includes mounting seat (4), torsional spring (5), rotating shaft (6), swing arm (7) and second roller (8), the rotating shaft (6) is vertically fixedly connected to the bottom of mounting seat (4), one end of the swing arm (7) is rotatably connected to the end of the rotating shaft (6), the torsional spring (5) is fixedly connected between the swing arm (7) and the mounting seat (4) and is sleeved on the surface of the rotating shaft (6), and the second roller (8) is rotatably connected to the other end of the swing arm (7).

2. The positioning device for wafer film sticking according to claim 1, wherein: The elastic mechanism includes spring (9) and telescopic rod (10), and the spring (9) and the telescopic rod (10) are fixedly connected between the traction seat (1) and the connecting seat (2), and the spring (9) is sleeved on the surface of the telescopic rod (10).

3. The positioning device for wafer film sticking according to claim 2, wherein: The guide structure includes sliding groove (11) and sliding block (12), the sliding block (12) is fixedly connected to the surface of the traction seat (1), the sliding groove (11) is arranged on the surface of the swing arm (7) along the extension direction of the swing arm (7), and the sliding block (12) is slidably connected to the inside of the sliding block (12).

4. The positioning device for wafer film sticking according to claim 3, characterized in that: The driving mechanism includes threaded rod (13), sleeve (14) and motor (15), the sleeve (14) is fixedly installed on the surface of the connecting seat (2), one end of the threaded rod (13) is threadedly connected to the surface of the sleeve (14), and the other end of the threaded rod (13) is connected with the output end of the motor (15).

5. The positioning device for wafer film sticking according to claim 1, wherein: The bottom of the traction seat (1) is provided with a notch (16), the lower portion of the traction seat (1) is provided with a T-shaped track (17), and the traction seat (1) is slidably connected to the surface of the T-shaped track (17) through the notch (16).

6. The positioning device for wafer film sticking according to claim 3, wherein: Initially, the swing arm (7) is arranged obliquely, and the sliding block (12) is located at the end of the sliding groove (11).

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